JPH10289432A - Protective film material for hdd suspension, hdd suspension and its production - Google Patents
Protective film material for hdd suspension, hdd suspension and its productionInfo
- Publication number
- JPH10289432A JPH10289432A JP9885797A JP9885797A JPH10289432A JP H10289432 A JPH10289432 A JP H10289432A JP 9885797 A JP9885797 A JP 9885797A JP 9885797 A JP9885797 A JP 9885797A JP H10289432 A JPH10289432 A JP H10289432A
- Authority
- JP
- Japan
- Prior art keywords
- resin layer
- polyimide precursor
- protective film
- film material
- photosensitive resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Laminated Bodies (AREA)
- Adjustment Of The Magnetic Head Position Track Following On Tapes (AREA)
- Supporting Of Heads In Record-Carrier Devices (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、ＨＤＤサスペンシ
ョンの導体層を保護するのに好適な感光性を有するＨＤ
Ｄサスペンション用保護膜材料、それを用いたＨＤＤサ
スペンション及びその製造方法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a photosensitive HD which is suitable for protecting a conductor layer of an HDD suspension.
The present invention relates to a protective film material for a D suspension, an HDD suspension using the same, and a method of manufacturing the same.
【０００２】[0002]
【従来の技術】近年、マルチメディアの浸透とともにパ
ソコンが扱うデータ量は飛躍的に増加し、それにあわせ
てＨＤＤ（ハードディスクドライブ）の大容量化も急速
に進んでいる。大容量化を進める技術の一つとして、ヘ
ッドを支えるサスペンションに関しては特開昭６０−２
４６０１５号公報等に見られるように、従来のワイヤ線
による信号線接続方式に代わる技術としてサスペンショ
ン上に直接信号線を形成する方式が提案、試行されてい
る。この方式において、サスペンション上に形成された
導体層を絶縁、保護するための保護膜が必須であり、現
在この部分に好適な材料が探索されている。2. Description of the Related Art In recent years, with the spread of multimedia, the amount of data handled by personal computers has increased dramatically, and the capacity of HDDs (hard disk drives) has been rapidly increasing. As one of the technologies for increasing the capacity, the suspension supporting the head is disclosed in
As disclosed in Japanese Patent No. 46015, a method of forming a signal line directly on a suspension has been proposed and tried as a technique that replaces the conventional signal line connection method using a wire line. In this method, a protective film for insulating and protecting the conductor layer formed on the suspension is indispensable, and a material suitable for this portion is currently being searched for.
【０００３】これまでの検討では、保護膜の材料として
感光性ポリイミドが主に用いられてきた。しかしなが
ら、このような感光性ポリイミドは光の透過性が劣ると
いう本質的な問題を一般的に抱えており、そのため厚膜
でのパターニングを行い難いという問題がある。また、
このような感光性ポリイミドは一般的に有機溶剤を用い
て現像を行わなければならないため、作業環境上の問題
もあり、さらには熱処理時における感光性基の揮発等に
よりポリイミド本来の耐熱性が発揮できないなどの問題
点もあった。In the studies so far, photosensitive polyimide has been mainly used as a material for the protective film. However, such a photosensitive polyimide generally has an essential problem of inferior light transmittance, and thus has a problem that it is difficult to perform patterning with a thick film. Also,
Such photosensitive polyimides generally have to be developed using an organic solvent, so there is a problem in the working environment, and furthermore, the inherent heat resistance of the polyimide is exhibited by volatilization of the photosensitive groups during heat treatment. There were also problems such as inability to do so.
【０００４】[0004]
【本発明が解決しようとする課題】したがって、本発明
の目的は、作業性と信頼性に優れ、かつ加工精度に優れ
たＨＤＤサスペンション用保護膜材料、それを用いたＨ
ＤＤサスペンション及びその製造方法を提供することに
ある。SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide a protective film material for an HDD suspension which is excellent in workability and reliability, and which is excellent in processing accuracy.
An object of the present invention is to provide a DD suspension and a method of manufacturing the same.
【０００５】[0005]
【課題を解決するための手段】すなわち、本発明は、少
なくとも感光性樹脂層とポリイミド前駆体樹脂層の２層
を有してなるＨＤＤサスペンション用保護膜材料であ
る。That is, the present invention relates to a protective film material for an HDD suspension having at least two layers of a photosensitive resin layer and a polyimide precursor resin layer.
【０００６】また、本発明は、ステンレス箔上に絶縁層
及び信号線となる導体層が逐次に形成されたサスペンシ
ョン基板の表面に、上記ＨＤＤサスペンション用保護膜
材料をラミネートしてなるＨＤＤサスペンションであ
る。The present invention is also an HDD suspension obtained by laminating the above-mentioned protective film material for an HDD suspension on the surface of a suspension board in which an insulating layer and a conductor layer serving as a signal line are sequentially formed on a stainless steel foil. .
【０００７】さらに、本発明は、必須工程として下記工
程を有することを特徴とするＨＤＤサスペンションの製
造方法である。 （１）ステンレス箔上に絶縁層及び信号線となる導体層
が逐次に形成されたサスペンション基板を準備する工程 （２）上記基板に少なくとも感光性樹脂層とポリイミド
前駆体樹脂層の２層を有するＨＤＤサスペンション用保
護膜材料を導体層とポリイミド前駆体樹脂層が接するよ
うにラミネートする工程 （３）感光性樹脂層に任意のパターンが描かれたマスク
を介して露光する工程 （４）酸水溶液により感光性樹脂層を現像処理する工程 （５）露出したポリイミド前駆体樹脂層をアルカリ水溶
液でエッチング処理する工程 （６）酸水溶液により感光性樹脂層を剥離除去する工程 （７）熱処理によりポリイミド前駆体樹脂層をイミド化
する工程Further, the present invention is a method for manufacturing an HDD suspension, comprising the following steps as essential steps. (1) Step of preparing a suspension substrate in which an insulating layer and a conductor layer to be a signal line are sequentially formed on a stainless steel foil (2) The substrate has at least two layers of a photosensitive resin layer and a polyimide precursor resin layer. A step of laminating the protective film material for HDD suspension so that the conductor layer and the polyimide precursor resin layer are in contact with each other. (3) A step of exposing the photosensitive resin layer through a mask on which an arbitrary pattern is drawn (4) An acid aqueous solution Step of developing the photosensitive resin layer (5) Step of etching the exposed polyimide precursor resin layer with an aqueous alkali solution (6) Step of peeling and removing the photosensitive resin layer with an aqueous acid solution (7) Heat treatment to prepare the polyimide precursor Step of imidizing the resin layer
【０００８】以下、本発明について詳細に説明する。本
発明のサスペンション用保護膜材料に用いる感光性樹脂
層としては、任意の構造のものが選択可能であり、ネガ
型、ポジ型いずれも可能である。通常、感光性樹脂は紫
外線反応型や電子線反応型等があり、その構成として
は、一般に反応性モノマー、反応性オリゴマー、反応性
希釈剤、光開始剤及び増感剤等により成り立っている。
この反応性オリゴマーとしては、例えばエポキシアクリ
レート、ウレタンアクリレート、ポリエステルアクリレ
ートなどが挙げられる。特に、感光性樹脂として紫外線
硬化型のアクリル型樹脂が、ポリイミド前駆体樹脂層の
エッチングの際の耐アルカリ性と耐水侵透性の点で好ま
しい。Hereinafter, the present invention will be described in detail. The photosensitive resin layer used for the suspension protective film material of the present invention may have any structure, and may be either a negative type or a positive type. Usually, the photosensitive resin is of an ultraviolet reaction type, an electron beam reaction type, or the like, and its constitution is generally constituted by a reactive monomer, a reactive oligomer, a reactive diluent, a photoinitiator, a sensitizer and the like.
Examples of the reactive oligomer include epoxy acrylate, urethane acrylate, and polyester acrylate. In particular, an ultraviolet curable acrylic resin is preferable as the photosensitive resin in terms of alkali resistance and water permeation resistance when etching the polyimide precursor resin layer.
【０００９】感光性樹脂の現像、剥離方式としては、通
常のドライフィルムにおけるアルカリ水溶液によるもの
の他に任意の方式を選択でき、ポリイミド前駆体樹脂層
のエッチングをアルカリで行う都合上、好ましくは酸に
より現像、剥離できる感光性樹脂がよい。As the method of developing and peeling the photosensitive resin, any method can be selected in addition to the method using an aqueous alkali solution in a normal dry film. For convenience of etching the polyimide precursor resin layer with an alkali, it is preferable to use an acid. A photosensitive resin that can be developed and peeled is preferable.
【００１０】この感光性樹脂層の厚みとしては、２〜１
００μｍが好ましく、２μｍより薄いと加工精度は高い
ものの膜強度が不足し、感光性樹脂の現像の際やポリイ
ミド前駆体樹脂層をエッチングする際に剥がれ等を生じ
やすい。また、１００μｍを超えると膜強度が大きく信
頼性は高いものの加工精度が落ち、また経済性が損なわ
れる。The thickness of the photosensitive resin layer is 2 to 1
The thickness is preferably 00 μm, and if it is thinner than 2 μm, the processing accuracy is high, but the film strength is insufficient, and peeling or the like is likely to occur when developing the photosensitive resin or when etching the polyimide precursor resin layer. On the other hand, when the thickness exceeds 100 μm, the film strength is large and the reliability is high, but the processing accuracy is lowered and the economic efficiency is impaired.
【００１１】また、ポリイミド前駆体樹脂層を構成する
ポリイミド前駆体樹脂は、ジアミン化合物と酸無水物と
を極性溶媒中０〜２００℃で反応させて合成できる。こ
の際、イミド化反応が起きると溶解性が低下したり、パ
ターニングの際エッチング時間が長くなり好ましくな
い。The polyimide precursor resin constituting the polyimide precursor resin layer can be synthesized by reacting a diamine compound and an acid anhydride at 0 to 200 ° C. in a polar solvent. In this case, if an imidization reaction occurs, the solubility decreases, and the etching time for patterning becomes long, which is not preferable.
【００１２】合成反応に使用する極性溶媒としては、例
えばＮ−メチルピロリドン（ＮＭＰ）、ジメチルホルム
アミド（ＤＭＦ）、ジメチルアセトアミド（ＤＭＡ
ｃ）、ジメチルスルフォキシド（ＤＭＳＯ）、硫酸ジメ
チル、スルホラン、ブチロラクトン、クレゾール、フェ
ノール、ハロゲン化フェノール、シクロヘキサノン、ジ
オキサン、テトラヒドロフラン、ジグライムなどが挙げ
られる。As the polar solvent used in the synthesis reaction, for example, N-methylpyrrolidone (NMP), dimethylformamide (DMF), dimethylacetamide (DMA)
c), dimethyl sulfoxide (DMSO), dimethyl sulfate, sulfolane, butyrolactone, cresol, phenol, halogenated phenol, cyclohexanone, dioxane, tetrahydrofuran, diglyme and the like.
【００１３】また、ジアミン化合物としては、例えばｐ
−フェニレンジアミン、ｍ−フェニレンジアミン、２’
−メトキシ−４，４’−ジアミノベンズアニリド、ジア
ミノジフェニルエーテル、ジアミノトルエン、ジアミノ
ジフェニルメタン、ビス［（アミノフェノキシ）フェニ
ル］プロパン、ジアミノジフェニルスルフォン、ジアミ
ノベンズアニリド、ジアミノベンゾエート、ビスアミノ
フェノキシベンゼン、アミノフェノキシビフェニル、ビ
ス［（アミノフェノキシ）フェニル］スルフォンなどが
挙げられる。As the diamine compound, for example, p
-Phenylenediamine, m-phenylenediamine, 2 '
-Methoxy-4,4'-diaminobenzanilide, diaminodiphenyl ether, diaminotoluene, diaminodiphenylmethane, bis [(aminophenoxy) phenyl] propane, diaminodiphenylsulfone, diaminobenzanilide, diaminobenzoate, bisaminophenoxybenzene, aminophenoxybiphenyl , Bis [(aminophenoxy) phenyl] sulfone and the like.
【００１４】また、酸無水物としては、例えばピロメリ
ット酸二無水物、ビフェニルテトラカルボン酸二無水
物、ベンゾフェノンテトラカルボン酸二無水物、ジフェ
ニルスルフォンテトラカルボン酸二無水物、ジフェニル
エーテルテトラカルボン酸二無水物、ナフタレンテトラ
カルボン酸二無水物、シクロブタンテトラカルボン酸二
無水物、エチレングリコールビストリメリテート二無水
物などの他、トリメリット酸無水物などが挙げられる。Examples of the acid anhydride include pyromellitic dianhydride, biphenyltetracarboxylic dianhydride, benzophenonetetracarboxylic dianhydride, diphenylsulfonetetracarboxylic dianhydride, diphenylethertetracarboxylic dianhydride. , Naphthalenetetracarboxylic dianhydride, cyclobutanetetracarboxylic dianhydride, ethylene glycol bistrimellitate dianhydride, and the like, and trimellitic anhydride.
【００１５】そして、好ましいポリイミド前駆体樹脂と
しては、下記一般式（１）で表される繰り返し単位を有
するものを挙げることができる。このようなポリアミッ
ク酸を用いるとラミネート時のフィルムクラックが起こ
りにくく、また同時に良好な回路への充填性を確保する
ことができる。Preferred polyimide precursor resins include those having a repeating unit represented by the following general formula (1). When such a polyamic acid is used, film cracks are less likely to occur during lamination, and at the same time, good circuit filling properties can be ensured.
【化２】 （式中、Ｒ1 〜Ｒ8 は同一又は異なってもよい水素原
子、ハロゲン原子、アルキル基又はアルコキシ基を表
す）Embedded image (Wherein, R 1 to R 8 represent a hydrogen atom, a halogen atom, an alkyl group or an alkoxy group which may be the same or different)
【００１６】本発明において、ポリイミド前駆体樹脂層
の厚みは３〜３０μｍであることが好ましい。ポリイミ
ド前駆体樹脂層の厚みが３μｍより薄いと電気的絶縁の
信頼性が低下すると同時に機械物性が悪くなり、３０μ
ｍを超えると高精度のポリイミド前駆体樹脂層のパター
ニングが行いにくくなる。また、ポリイミド系樹脂層の
線膨張係数は、好ましくは１０〜３０×１０-6／℃、よ
り好ましくは１５〜２５×１０-6／℃である。ポリイミ
ド系樹脂層の線膨張係数が１０×１０-6／℃より小さく
ても３０×１０-6／℃より大きくても、製造後の基板に
反りが発生しやすくなる。In the present invention, the thickness of the polyimide precursor resin layer is preferably 3 to 30 μm. If the thickness of the polyimide precursor resin layer is less than 3 μm, the reliability of the electrical insulation is lowered, and at the same time, the mechanical properties are deteriorated.
If it exceeds m, it becomes difficult to pattern the polyimide precursor resin layer with high precision. The coefficient of linear expansion of the polyimide resin layer is preferably 10 to 30 × 10 −6 / ° C., and more preferably 15 to 25 × 10 −6 / ° C. If the coefficient of linear expansion of the polyimide-based resin layer is smaller than 10 × 10 −6 / ° C. or larger than 30 × 10 −6 / ° C., warpage tends to occur in the manufactured substrate.
【００１７】本発明のＨＤＤサスペンション用保護膜材
料の形成方法は、先ず離型フィルム上にポリイミド前駆
体樹脂溶液を塗工乾燥し、次に感光性樹脂を塗工乾燥す
る方法が最も一般的である。The most common method of forming a protective film material for an HDD suspension according to the present invention is to first coat a polyimide precursor resin solution on a release film and dry it, and then coat and dry a photosensitive resin. is there.
【００１８】このような離型フィルムとしては、ポリエ
ステルフィルム、ポリプロピレンフィルム、ポリイミド
フィルム等の一般のフィルムが選択可能であり、より離
型性を増すためにはシリコーン化合物等の離型剤を表面
にコートさせたフィルムが好ましい。As such a release film, a general film such as a polyester film, a polypropylene film, and a polyimide film can be selected. In order to further enhance the release property, a release agent such as a silicone compound is applied to the surface. Coated films are preferred.
【００１９】塗工後のポリイミド前駆体樹脂の乾燥温度
は、離型フィルムの劣化を起こさない範囲で選択可能で
あるが、好ましくは１８０℃以下である。１８０℃を超
えるとイミド化反応が起こり、その後の回路へのラミネ
ートの際樹脂の流れ性が落ちることにより充填性が低下
したり、あるいはパターニングの際エッチング時間が長
くなる。The drying temperature of the polyimide precursor resin after application can be selected within a range that does not cause deterioration of the release film, but is preferably 180 ° C. or less. When the temperature exceeds 180 ° C., an imidization reaction occurs, and the laminating property of the resin in the subsequent circuit decreases, so that the filling property decreases or the etching time in patterning increases.
【００２０】感光性樹脂の乾燥温度は、下地の離型フィ
ルム及びポリイミド前駆体樹脂に悪影響を及ぼさない範
囲で選択可能であるが、好ましくは１５０℃以下であ
る。１５０℃を超えると感光性樹脂自体が熱反応を起
し、その後のパターン形成の際に感光性樹脂の現像性が
低下する。The drying temperature of the photosensitive resin can be selected within a range that does not adversely affect the underlying release film and the polyimide precursor resin, but is preferably 150 ° C. or lower. When the temperature exceeds 150 ° C., the photosensitive resin itself causes a thermal reaction, and the developability of the photosensitive resin is reduced during the subsequent pattern formation.
【００２１】このようして積層体を形成した後、感光性
樹脂表面の異物対策として、感光性樹脂の塗工乾燥後に
保護フィルムを貼り合わせることがよい。保護フィルム
としては、例えばポリエステルフィルム、ポリプロピレ
ンフィルム、ポリイミドフィルム等の一般のフィルムが
選択可能である。After forming the laminate in this way, as a measure against foreign substances on the surface of the photosensitive resin, it is preferable to apply a protective film after coating and drying the photosensitive resin. As the protective film, for example, a general film such as a polyester film, a polypropylene film, and a polyimide film can be selected.
【００２２】このようにして得られたＨＤＤサスペンシ
ョン用保護膜材料は、ＨＤＤサスペンション基板の上に
ポリイミド前駆体樹脂層が接するように積層される。Ｈ
ＤＤサスペンション基板としては、厚みが１０〜７０μ
ｍのステンレス箔上に厚み３〜２０μｍのパターニング
された絶縁層、さらにその上に厚みが５〜１８μｍのパ
ターニングされた導体層が形成されたものである。絶縁
層としてはポリイミド樹脂、エポキシ樹脂などが使用さ
れ、導体層としては銅又は銅合金などが使用される。The HDD suspension protective film material thus obtained is laminated on the HDD suspension substrate so that the polyimide precursor resin layer is in contact therewith. H
As a DD suspension board, the thickness is 10 to 70 μm.
A patterned insulating layer having a thickness of 3 to 20 μm is formed on a stainless steel foil having a thickness of 3 to 20 μm, and a patterned conductor layer having a thickness of 5 to 18 μm is further formed thereon. A polyimide resin, an epoxy resin, or the like is used for the insulating layer, and copper or a copper alloy is used for the conductor layer.
【００２３】ＨＤＤサスペンション用保護膜材料の加工
方法としては、まずラミネーター又は熱プレスによって
サスペンション基板上に本材料を積層する。この際、ポ
リイミド前駆体樹脂の充填性を増すには２００℃以下に
加熱すればより好ましい。また、基板との密着性をより
向上させるために有機溶剤等の浸し液を用いても差し支
えない。As a method of processing the protective film material for HDD suspension, first, the present material is laminated on a suspension substrate by a laminator or a hot press. In this case, it is more preferable to heat to 200 ° C. or lower in order to increase the filling property of the polyimide precursor resin. Further, a dipping liquid such as an organic solvent may be used to further improve the adhesion to the substrate.
【００２４】次に、絶縁層であるポリイミド前駆体樹脂
層を任意の形状に加工するには、任意のネガパターン又
はポジパターンを、保護フィルム上又は感光性樹脂層に
直接重ね、露光を行う。更に感光性樹脂の現像を行った
後、アルカリ性の溶液によりポリイミド前駆体樹脂層の
エッチングを行う。最後に残っている感光性樹脂層を剥
離してパターン化されたポリイミド前駆体樹脂層が得ら
れる。パターニング後に水分等の除去を目的として乾燥
を行うこともできる。Next, in order to process the polyimide precursor resin layer, which is an insulating layer, into an arbitrary shape, an arbitrary negative pattern or a positive pattern is directly overlaid on the protective film or on the photosensitive resin layer and exposed. After the development of the photosensitive resin, the polyimide precursor resin layer is etched with an alkaline solution. Finally, the remaining photosensitive resin layer is peeled off to obtain a patterned polyimide precursor resin layer. After the patterning, drying can be performed for the purpose of removing moisture and the like.
【００２５】このようにして形成されたサスペンション
用保護膜材料は、イミド化反応で硬化させるため、高温
の熱処理が施される。最高熱処理温度としては、２００
℃以上、好ましくは２５０℃以上である。この加熱方法
としては、熱風オーブンなどを用いたバッチ熱処理でも
よく、またロールツーロール方式の加熱でもよい。The suspension protective film material thus formed is subjected to a high-temperature heat treatment so as to be cured by an imidization reaction. The maximum heat treatment temperature is 200
C. or higher, preferably 250 C. or higher. The heating method may be a batch heat treatment using a hot air oven or the like, or a roll-to-roll heating.
【００２６】[0026]
【実施例】以下、実施例に基づき本発明を具体的に説明
するが、本発明は以下の実施例に限定されるものではな
い。なお、本実施例に用いられる略号は以下のとおりで
ある。 ＭＡＢＡ： ４，４’−ジアミノ−２’−メトキシベン
ズアニリド ＤＡＰＥ： ４，４’−ジアミノジフェニルエーテル ＰＭＤＡ： ピロメリット酸二無水物 ＢＴＤＡ： ３，４，３’，４’−ベンゾフェノンテト
ラカルボン酸二無水物 ＤＭＡｃ： Ｎ，Ｎ−ジメチルアセトアミド ＮＭＰ ： Ｎ−メチル−２−ピロリドンEXAMPLES The present invention will be specifically described below based on examples, but the present invention is not limited to the following examples. The abbreviations used in this example are as follows. MABA: 4,4'-diamino-2'-methoxybenzanilide DAPE: 4,4'-diaminodiphenyl ether PMDA: pyromellitic dianhydride BTDA: 3,4,3 ', 4'-benzophenonetetracarboxylic dianhydride Compound DMAc: N, N-dimethylacetamide NMP: N-methyl-2-pyrrolidone
【００２７】合成例１ ＭＡＢＡ１５４．４ｇ（０．６０モル）及びＤＡＰＥ８
０．１ｇ（０．４０モル）を５リットルのセパラブルフ
ラスコ中で、撹拌しながら２５６０ｇのＤＭＡｃに溶解
させた。次に、その溶液を氷浴で冷却し、窒素気流中２
１８．１ｇ（１モル）のＰＭＤＡを加えた。その後、溶
液を室温に戻し、３時間撹拌を続けて重合反応を行い、
粘稠なポリイミド前駆体の溶液を得た。Synthesis Example 1 MABA (154.4 g, 0.60 mol) and DAPE8
0.1 g (0.40 mol) was dissolved in 2560 g of DMAc with stirring in a 5-liter separable flask. Then, the solution is cooled in an ice bath and placed in a stream of nitrogen for 2 hours.
18.1 g (1 mol) of PMDA was added. Thereafter, the solution was returned to room temperature, and the polymerization reaction was carried out by continuing stirring for 3 hours.
A viscous polyimide precursor solution was obtained.
【００２８】合成例２ ＤＡＰＥ２００．２ｇ（１モル）を５リットルのセパラ
ブルフラスコ中で撹拌しながら２６５０ｇのＤＭＡｃを
溶解させた。次に、その溶液を氷浴で冷却し、窒素気流
中で１６１．１ｇ（０．５モル）のＢＴＤＡ及び１０
９. １ｇ（０．５モル）のＰＭＤＡを加えた。その後、
溶液を室温に戻し、３時間撹拌を続けて重合反応を行
い、粘稠なポリイミド前駆体の溶液を得た。Synthesis Example 2 In a 5 liter separable flask, 2650 g of DMAc was dissolved while stirring 200.2 g (1 mol) of DAPE. The solution was then cooled in an ice bath and 161.1 g (0.5 mol) of BTDA and 10
9.1 g (0.5 mol) of PMDA was added. afterwards,
The solution was returned to room temperature and stirred for 3 hours to carry out a polymerization reaction to obtain a viscous polyimide precursor solution.
【００２９】実施例１ バーコーターを用いて合成例１で得られたポリイミド前
駆体樹脂を厚み１００μｍの離型ポリエステルフィルム
（ユニチカ株式会社製）に硬化後５μｍの厚みになるよ
うに塗布し１３０℃、４分間乾燥した後、その上に酸現
像・剥離型の感光性樹脂（東京プロセスサービス株式会
社製）を硬化後１０μｍの厚みになるように塗布し、８
０℃で８分間乾燥し、さらにその上に厚み１６μｍのポ
リエステルフィルムを貼り付け、離型ポリエステルフィ
ルム／ポリイミド前駆体樹脂／感光性樹脂／保護ポリエ
ステルフィルムの４層構造の積層体を得た。Example 1 The polyimide precursor resin obtained in Synthesis Example 1 was cured using a bar coater on a 100 μm-thick release polyester film (manufactured by Unitika Co., Ltd.). After drying for 4 minutes, an acid-developable / peelable photosensitive resin (manufactured by Tokyo Process Service Co., Ltd.) was applied thereon and cured to a thickness of 10 μm.
After drying at 0 ° C. for 8 minutes, a polyester film having a thickness of 16 μm was further adhered thereon to obtain a laminate having a four-layer structure of a release polyester film / polyimide precursor resin / photosensitive resin / protective polyester film.
【００３０】次に、被ラミネート体であるサスペンショ
ンの製作として、バーコーターを用い合成例２で得られ
たポリイミド前駆体樹脂を厚み２５μｍのステンレス箔
上に硬化後７μｍの厚みとなるように塗布し、１３０℃
で４分間乾燥した後、１６０℃で４分間、２００℃で２
分間、２７０℃で２分間、順次乾燥してイミド化させ
た。次いで、５μｍの電解銅箔をイミド化が終了したポ
リイミド層の上に重ね、３２０℃１時間の熱プレスによ
って圧着させ、ステンレス箔／ポリイミド／銅箔の３層
被ラミネート基板を得た。Next, as a manufacture of a suspension to be laminated, the polyimide precursor resin obtained in Synthesis Example 2 was applied on a 25 μm-thick stainless steel foil using a bar coater so as to have a thickness of 7 μm after being cured. , 130 ° C
After drying at 160 ° C for 4 minutes and 200 ° C for 2 minutes.
For 2 minutes at 270 ° C. for imidization. Next, an electrolytic copper foil of 5 μm was overlaid on the imidized polyimide layer and pressed by a hot press at 320 ° C. for 1 hour to obtain a three-layer laminated substrate of stainless steel foil / polyimide / copper foil.
【００３１】この被ラミネート基板を回路加工し、積層
体とラミネートした。導体層（銅）は線幅５０μｍ／線
間５０μｍの回路で、ラミネーター（大成ラミネーター
株式会社製、ＳＴラミネーター ８Ｂ−５５０ＩＤ）を
用い、ＮＭＰを霧吹で回路全体に吹き付け、６０℃のロ
ール温度で回路全面にラミネートした。ポリイミド前駆
体樹脂はきれいに回路間に充填され、気泡の巻き込みも
見られなかった。The substrate to be laminated was subjected to circuit processing and laminated with a laminate. The conductor layer (copper) is a circuit having a line width of 50 μm and a line interval of 50 μm. Using a laminator (manufactured by Taisei Laminator Co., Ltd., ST laminator 8B-550ID), NMP is sprayed on the entire circuit by spraying, and the circuit is heated at a roll temperature of 60 ° C. The entire surface was laminated. The polyimide precursor resin was cleanly filled between the circuits, and no entrapment of air bubbles was observed.
【００３２】更に、保護ポリエステルフィルムの上にネ
ガのパターンを置き、放電灯露光装置（ハイテック株式
会社、３０００ＮＥＬ）を用いて、積算光量で約１００
ｍＪ／ｃｍ2 の露光を行った後、保護ポリエステルフィ
ルムをはがし、横搬送型のシャワー装置を用いて０. １
％乳酸水溶液、液温２５℃、シャワー圧２Ｋｇｆ／ｃｍ
2 で６０秒間現像した。Further, a negative pattern was placed on the protective polyester film, and a discharge lamp exposing apparatus (Hitech Co., Ltd., 3000NEL) was used to obtain an integrated light amount of about 100.
After the exposure at mJ / cm 2 , the protective polyester film was peeled off, and 0.1 was applied using a horizontal transport type shower device.
% Lactic acid aqueous solution, liquid temperature 25 ° C, shower pressure 2Kgf / cm
2 for 60 seconds.
【００３３】更に、１００℃で２分程度乾燥した後、１
０％水酸化カリウム水溶液を用いて横搬送型のシャワー
装置により、液温１５℃、シャワー圧１Ｋｇｆ／ｃｍ2
で８秒間のエッチング加工を行った。引き続き、液温４
０℃の温水を用いて、横搬送型のシャワー装置によりシ
ャワー圧１Ｋｇｆ／ｃｍ2 で８秒間の処理を行った。パ
ターン化された感光性樹脂層から露出していたポリイミ
ド前駆体樹脂層は完全にエッチング除去されていた。After drying at 100 ° C. for about 2 minutes,
Liquid temperature 15 ° C., shower pressure 1 kgf / cm 2 by a horizontal transfer type shower device using 0% potassium hydroxide aqueous solution.
For 8 seconds. Continue with liquid temperature 4
Using hot water at 0 ° C., treatment was performed for 8 seconds at a shower pressure of 1 kgf / cm 2 by a horizontal transport type shower device. The polyimide precursor resin layer exposed from the patterned photosensitive resin layer was completely removed by etching.
【００３４】続いて、１０％乳酸水溶液を用いて、横搬
送型のシャワー装置により、液温３０℃、シャワー圧２
Ｋｇｆ／ｃｍ2 で３０秒間のシャワーを行い、残ってい
た感光性樹脂の除去を行った。得られた基板を熱風オー
ブンに入れ、１３０℃で１０分間、１６０℃で４分間、
２００℃で２分間、２７０℃で２分間の熱処理を順次行
った。Subsequently, using a 10% aqueous lactic acid solution, the liquid temperature was 30 ° C. and the shower pressure was 2 by a horizontal transport type shower device.
A shower was performed at Kgf / cm 2 for 30 seconds to remove the remaining photosensitive resin. The obtained substrate was placed in a hot air oven, at 130 ° C. for 10 minutes, at 160 ° C. for 4 minutes,
Heat treatment was performed sequentially at 200 ° C. for 2 minutes and at 270 ° C. for 2 minutes.
【００３５】得られたサスペンションは、導体層の保護
層として５μｍのポリイミド層を有し、その断面を顕微
鏡で観察したところ、回路を均一な厚みで空隙なく覆っ
ていた。さらに加工精度としては、１００μｍのライン
及び７０μｍのギャップが±８μｍ以内で精度よく加工
されていた。The obtained suspension had a polyimide layer having a thickness of 5 μm as a protective layer of the conductor layer. When the cross section was observed with a microscope, it was found that the circuit had a uniform thickness and no gap. Further, as for the processing accuracy, a line of 100 μm and a gap of 70 μm were accurately processed within ± 8 μm.
【００３６】[0036]
【発明の効果】本発明のＨＤＤサスペンション用保護膜
材料は、ＨＤＤサスペンションの導体層を安定的に被覆
し、細部まで良好な充填性を確保することができる。ま
た、高精度のポリイミドのパターニングも同時に行うこ
とができる。さらに、特性面では、本発明により得られ
るパターニングされたポリイミドは、感光性基等の高温
下で揮発する成分を実質的に含まないため耐熱性に優れ
ており、ＨＤＤサスペンション用途には最適である。し
たがって、本発明のＨＤＤサスペンション用保護膜材料
を用いたＨＤＤサスペンションは、電気特性等の信頼性
と耐久性が高く、アウトガスがほとんど発生しない。ま
た、その製造方法においては、パターニング精度の優れ
たサスペンション用保護層が簡便かつ低コストで形成可
能である。The protective film material for an HDD suspension of the present invention can stably cover the conductor layer of the HDD suspension, and can secure a good filling property to details. In addition, highly accurate polyimide patterning can be performed at the same time. Furthermore, in terms of characteristics, the patterned polyimide obtained by the present invention has excellent heat resistance because it does not substantially contain components that evaporate at high temperatures such as photosensitive groups, and is optimal for HDD suspension applications. . Therefore, the HDD suspension using the protective film material for an HDD suspension of the present invention has high reliability such as electric characteristics and durability, and hardly generates outgas. Further, in the manufacturing method, a suspension protective layer having excellent patterning accuracy can be formed easily and at low cost.
Claims (6)
駆体樹脂層の２層を有してなるＨＤＤサスペンション用
保護膜材料。1. A protective film material for an HDD suspension having at least two layers of a photosensitive resin layer and a polyimide precursor resin layer.
酸現像・酸剥離型である請求項１記載のＨＤＤサスペン
ション用保護膜材料。2. A photosensitive resin constituting a photosensitive resin layer,
2. The protective film material for an HDD suspension according to claim 1, which is of an acid developing / acid stripping type.
３０μｍである請求項１又は２記載のＨＤＤサスペンシ
ョン用保護膜材料。3. The polyimide precursor resin layer has a thickness of 3 to 3.
3. The protective film material for an HDD suspension according to claim 1, which has a thickness of 30 μm.
イミド前駆体樹脂が、下記一般式（１）で表される繰り
返し単位を有する請求項１〜３のいずれかに記載のＨＤ
Ｄサスペンション用保護膜材料。 【化１】 （式中、Ｒ1 〜Ｒ8 は同一又は異なってもよい水素原
子、ハロゲン原子、アルキル基又はアルコキシ基を表
す）4. The HD according to claim 1, wherein the polyimide precursor resin constituting the polyimide precursor resin layer has a repeating unit represented by the following general formula (1).
Protective film material for D suspension. Embedded image (Wherein, R 1 to R 8 represent a hydrogen atom, a halogen atom, an alkyl group or an alkoxy group which may be the same or different)
る導体層が逐次に形成されたサスペンション基板の表面
に、請求項１記載のＨＤＤサスペンション用保護膜材料
をラミネートしてなるＨＤＤサスペンション。5. An HDD suspension obtained by laminating the protective film material for an HDD suspension according to claim 1 on a surface of a suspension board in which an insulating layer and a conductor layer serving as a signal line are sequentially formed on a stainless steel foil.
特徴とするＨＤＤサスペンションの製造方法。 （１）ステンレス箔上に絶縁層及び信号線となる導体層
が逐次に形成されたサスペンション基板を準備する工程 （２）上記基板に少なくとも感光性樹脂層とポリイミド
前駆体樹脂層の２層を有するＨＤＤサスペンション用保
護膜材料を導体層とポリイミド前駆体樹脂層が接するよ
うにラミネートする工程 （３）感光性樹脂層に任意のパターンが描かれたマスク
を介して露光する工程 （４）酸水溶液により感光性樹脂層を現像処理する工程 （５）露出したポリイミド前駆体樹脂層をアルカリ水溶
液でエッチング処理する工程 （６）酸水溶液により感光性樹脂層を剥離除去する工程 （７）熱処理によりポリイミド前駆体樹脂層をイミド化
する工程6. A method for manufacturing an HDD suspension, comprising the following steps as essential steps. (1) Step of preparing a suspension substrate in which an insulating layer and a conductor layer to be a signal line are sequentially formed on a stainless steel foil (2) The substrate has at least two layers of a photosensitive resin layer and a polyimide precursor resin layer. A step of laminating the protective film material for HDD suspension so that the conductor layer and the polyimide precursor resin layer are in contact with each other. (3) A step of exposing the photosensitive resin layer through a mask on which an arbitrary pattern is drawn (4) An acid aqueous solution Step of developing the photosensitive resin layer (5) Step of etching the exposed polyimide precursor resin layer with an aqueous alkali solution (6) Step of peeling and removing the photosensitive resin layer with an aqueous acid solution (7) Heat treatment to prepare the polyimide precursor Step of imidizing the resin layer
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9885797A JPH10289432A (en) | 1997-04-16 | 1997-04-16 | Protective film material for hdd suspension, hdd suspension and its production |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9885797A JPH10289432A (en) | 1997-04-16 | 1997-04-16 | Protective film material for hdd suspension, hdd suspension and its production |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH10289432A true JPH10289432A (en) | 1998-10-27 |
Family
ID=14230909
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9885797A Pending JPH10289432A (en) | 1997-04-16 | 1997-04-16 | Protective film material for hdd suspension, hdd suspension and its production |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH10289432A (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002246708A (en) * | 2001-02-16 | 2002-08-30 | Dainippon Printing Co Ltd | Wet-etched insulator and electronic circuit component |
| JP2002246707A (en) * | 2001-02-16 | 2002-08-30 | Dainippon Printing Co Ltd | Wet-etched insulator and electronic circuit component |
| JP2002246709A (en) * | 2001-02-16 | 2002-08-30 | Dainippon Printing Co Ltd | Wet-etched insulator and electronic circuit component |
| JP2006054474A (en) * | 1999-10-21 | 2006-02-23 | Nippon Steel Chem Co Ltd | Laminate and process for producing the same |
| WO2006093064A1 (en) * | 2005-03-03 | 2006-09-08 | Nippon Steel Chemical Co., Ltd. | Laminate for suspension and method for producing same |
| JP2011142331A (en) * | 2011-02-14 | 2011-07-21 | Dainippon Printing Co Ltd | Method of manufacturing laminated body for electronic circuit component |
| JP2011211205A (en) * | 2011-04-25 | 2011-10-20 | Dainippon Printing Co Ltd | Method of manufacturing laminate and method of manufacturing insulator |
| JP2013171601A (en) * | 2012-02-20 | 2013-09-02 | Dainippon Printing Co Ltd | Substrate for suspension, suspension, suspension with head, hard disk drive, and method for manufacturing substrate for suspension |
| CN113736083A (en) * | 2021-09-02 | 2021-12-03 | 大同共聚(西安)科技有限公司 | Preparation method of hard disk drive suspension protection material |
-
1997
- 1997-04-16 JP JP9885797A patent/JPH10289432A/en active Pending
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006054474A (en) * | 1999-10-21 | 2006-02-23 | Nippon Steel Chem Co Ltd | Laminate and process for producing the same |
| JP4615401B2 (en) * | 1999-10-21 | 2011-01-19 | 新日鐵化学株式会社 | Laminated body |
| JP2002246708A (en) * | 2001-02-16 | 2002-08-30 | Dainippon Printing Co Ltd | Wet-etched insulator and electronic circuit component |
| JP2002246707A (en) * | 2001-02-16 | 2002-08-30 | Dainippon Printing Co Ltd | Wet-etched insulator and electronic circuit component |
| JP2002246709A (en) * | 2001-02-16 | 2002-08-30 | Dainippon Printing Co Ltd | Wet-etched insulator and electronic circuit component |
| WO2006093064A1 (en) * | 2005-03-03 | 2006-09-08 | Nippon Steel Chemical Co., Ltd. | Laminate for suspension and method for producing same |
| JP2006244599A (en) * | 2005-03-03 | 2006-09-14 | Nippon Steel Chem Co Ltd | Layered product for suspension and method for manufacturing thereof |
| JP2011142331A (en) * | 2011-02-14 | 2011-07-21 | Dainippon Printing Co Ltd | Method of manufacturing laminated body for electronic circuit component |
| JP2011211205A (en) * | 2011-04-25 | 2011-10-20 | Dainippon Printing Co Ltd | Method of manufacturing laminate and method of manufacturing insulator |
| JP2013171601A (en) * | 2012-02-20 | 2013-09-02 | Dainippon Printing Co Ltd | Substrate for suspension, suspension, suspension with head, hard disk drive, and method for manufacturing substrate for suspension |
| CN113736083A (en) * | 2021-09-02 | 2021-12-03 | 大同共聚(西安)科技有限公司 | Preparation method of hard disk drive suspension protection material |
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Effective date: 20061130 Free format text: JAPANESE INTERMEDIATE CODE: A523 |
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