JPH10284760A5 - - Google Patents

Info

Publication number
JPH10284760A5
JPH10284760A5 JP1997093562A JP9356297A JPH10284760A5 JP H10284760 A5 JPH10284760 A5 JP H10284760A5 JP 1997093562 A JP1997093562 A JP 1997093562A JP 9356297 A JP9356297 A JP 9356297A JP H10284760 A5 JPH10284760 A5 JP H10284760A5
Authority
JP
Japan
Prior art keywords
island
shaped pattern
thickness
aluminum
insulating film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1997093562A
Other languages
English (en)
Japanese (ja)
Other versions
JPH10284760A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP9356297A priority Critical patent/JPH10284760A/ja
Priority claimed from JP9356297A external-priority patent/JPH10284760A/ja
Priority to EP98103193A priority patent/EP0871226B1/en
Priority to US09/031,534 priority patent/US5972729A/en
Publication of JPH10284760A publication Critical patent/JPH10284760A/ja
Publication of JPH10284760A5 publication Critical patent/JPH10284760A5/ja
Pending legal-status Critical Current

Links

JP9356297A 1997-04-11 1997-04-11 受発光ダイオードアレイチップの製造方法 Pending JPH10284760A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP9356297A JPH10284760A (ja) 1997-04-11 1997-04-11 受発光ダイオードアレイチップの製造方法
EP98103193A EP0871226B1 (en) 1997-04-11 1998-02-24 Method of manufacturing light-receiving/emitting diode array chip
US09/031,534 US5972729A (en) 1997-04-11 1998-02-27 Method of manufacturing light-receiving/emitting diode array chip

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9356297A JPH10284760A (ja) 1997-04-11 1997-04-11 受発光ダイオードアレイチップの製造方法

Publications (2)

Publication Number Publication Date
JPH10284760A JPH10284760A (ja) 1998-10-23
JPH10284760A5 true JPH10284760A5 (cg-RX-API-DMAC7.html) 2004-09-24

Family

ID=14085700

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9356297A Pending JPH10284760A (ja) 1997-04-11 1997-04-11 受発光ダイオードアレイチップの製造方法

Country Status (3)

Country Link
US (1) US5972729A (cg-RX-API-DMAC7.html)
EP (1) EP0871226B1 (cg-RX-API-DMAC7.html)
JP (1) JPH10284760A (cg-RX-API-DMAC7.html)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4457427B2 (ja) * 1999-03-18 2010-04-28 ソニー株式会社 半導体発光装置とその製造方法
JP4002143B2 (ja) * 2002-07-10 2007-10-31 株式会社ルネサステクノロジ 半導体装置の製造方法
PL1617485T3 (pl) * 2004-07-12 2007-10-31 Haeberlein Lehr Ulla Modułowy system wtykowy do bezpiecznego składowania poziomo ułożonych w stosy modułów fotowoltaicznych podczas transportu
US20070012240A1 (en) * 2005-07-13 2007-01-18 Sia Chin H Light emitting diode with at least two light emitting zones and method for manufacture
JP4302720B2 (ja) * 2006-06-28 2009-07-29 株式会社沖データ 半導体装置、ｌｅｄヘッド及び画像形成装置
JP2009147352A (ja) * 2009-01-19 2009-07-02 Oki Data Corp 半導体装置、ｌｅｄヘッド及び画像形成装置
JP6358826B2 (ja) * 2014-03-27 2018-07-18 株式会社沖データ 半導体装置、露光ヘッド及び画像形成装置
US9429867B2 (en) * 2014-03-27 2016-08-30 Oki Data Corporation Semiconductor apparatus, exposing head, and image forming apparatus
US11710942B2 (en) * 2017-12-13 2023-07-25 Sony Corporation Method of manufacturing light-emitting module, light-emitting module, and device

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2536834Y2 (ja) * 1986-09-05 1997-05-28 ローム 株式会社 半導体素子チツプ
ES2007453A6 (es) * 1988-03-25 1989-06-16 Sinetics Sa Impresora versatil de textos y graficos.
US4997793A (en) * 1989-11-21 1991-03-05 Eastman Kodak Company Method of improving cleaving of diode arrays
US5053836A (en) * 1989-11-21 1991-10-01 Eastman Kodak Company Cleaving of diode arrays with scribing channels
JPH05259505A (ja) * 1992-03-16 1993-10-08 Nisshin Steel Co Ltd 発光ダイオードアレイチップ
JPH05294011A (ja) * 1992-04-17 1993-11-09 Nisshin Steel Co Ltd 発光ダイオードアレイチップ
US5430325A (en) * 1992-06-30 1995-07-04 Rohm Co. Ltd. Semiconductor chip having dummy pattern
JPH0685057A (ja) * 1992-09-02 1994-03-25 Nisshin Steel Co Ltd 半導体チップのダイシング方法
JPH0685320A (ja) * 1992-09-02 1994-03-25 Nisshin Steel Co Ltd 発光ダイオードアレイチップの製造方法
JPH0685318A (ja) * 1992-09-02 1994-03-25 Nisshin Steel Co Ltd 発光ダイオードアレイチップの製造方法
JPH0685319A (ja) * 1992-09-02 1994-03-25 Nisshin Steel Co Ltd 発光ダイオードアレイチップの製造方法
US5523590A (en) * 1993-10-20 1996-06-04 Oki Electric Industry Co., Ltd. LED array with insulating films
JPH08279479A (ja) * 1995-04-07 1996-10-22 Hitachi Cable Ltd 発光ダイオードアレイのダイシング方法

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