JPH10283863A - Epoxy resin insulating part - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent deterioration of peeling characteristic, mechanical strength, and electric characteristic in interfaces of inner electrodes and epoxy resin by forming a conductive layer containing a silane coupling agent having amino group or epoxy group on the surfaces of the inner electrodes. SOLUTION: Copper, aluminum, iron, and their alloys are used for inner electrodes 5, 6 and a conductive coating material is applied to the surfaces of the inner electrodes and dried to form conductive layers with 1-50 μm thickness. A silane coupling agent having amino group or epoxy group is added to the conductive layers. A mixture produced by dispersing a fine powder of silver, aluminum, copper, carbon, etc., in a vehicle in high concentration is used as the conductive coating material. Moreover, for example, γ- glycidoxypropylmethyldiethoxysilane is used as the silane coupling agent and added to the conductive coating material at 0.5-3 pts.wt. ratio to the 100 pts.wt. of the conductive coating material.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an epoxy resin insulated component used for an end of a power cable, an intermediate connection portion, and the like.

[0002]

2. Description of the Related Art Epoxy resin insulation parts have been widely used as electric insulation parts such as terminals of power cables and intermediate connection parts because of their good electrical insulation properties. These epoxy resin insulating parts will be described with reference to FIG.
FIG. 1 shows an example of an epoxy resin insulating component used for an intermediate connection portion of a power cable. In the figure, reference numeral 1 denotes a cable, which is inserted into a cylindrical epoxy resin insulation component 2 and fixed inside by a rubber mold stress cone 3. The rubber mold stress cone 3 is constantly pressed to the left in the figure by the coil spring 4. Further, cylindrical metal internal electrodes 5 and 6 are integrally embedded in the center portion and both end portions of the epoxy resin insulating component 2, respectively.

[0003] The epoxy resin insulating part 2 is such that, after the internal electrodes 5 and 6 are previously arranged in a molding die, an uncured epoxy resin is poured into the mold, and the epoxy resin is cured by heating. It is obtained by making a cured product. When manufacturing such an epoxy resin insulating part, a temperature change is applied to the epoxy resin and the internal electrodes when the epoxy resin is heated and cured or cooled. At this time, since the epoxy resin and the metal (copper, aluminum, iron, etc.) constituting the internal electrodes have different coefficients of thermal expansion, the difference causes a thermal stress to act on the interface between the two. Separation may occur at the interface between the electrode and the internal electrode. Due to the separation of the interface, the mechanical and electrical characteristics of the epoxy resin insulating component are significantly reduced. Conventionally, in order to prevent such interfacial peeling, a conductive paint is applied to the internal electrode surface, or the electrode surface is roughened to improve the adhesive strength between the epoxy resin and the internal electrode. However, a sufficient effect has not been obtained so as not to lower the mechanical and electrical characteristics of the epoxy resin insulating part.

[0004]

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances.
The purpose is to prevent peeling from occurring at the interface between the epoxy resin and the internal electrode, thereby preventing the mechanical and electrical properties thereof from deteriorating.

[0005]

According to the present invention, there is provided an epoxy resin insulated component which is provided with a conductive layer containing a silane coupling agent having an amino group or an epoxy group on the surface of an internal electrode. Is the solution.

[0006]

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, the present invention will be described in detail. The epoxy resin used in the present invention is not particularly limited, and a bisphenol A type, a phenol novolak type, a cresol novolak type, a brominated bisphenol A type, an alicyclic type and the like are used. The epoxy resin is mixed with a curing agent, a filler and the like. These compounding agents are not particularly limited, the type of epoxy resin used,
An appropriate compound is used depending on the use of the compounding agent, molding conditions, and the like. The amounts of these components are appropriately determined according to the epoxy equivalent of the epoxy resin. The curing agent is used to cure the epoxy resin, and examples thereof include an acid anhydride and an amine compound. The filler is used to lower the coefficient of thermal expansion of the epoxy resin so as to be close to that of a metal. For example, an inorganic filler such as alumina and silica is used. Further, a compounding agent such as a flame retardant or an antioxidant can be appropriately compounded in the epoxy resin.

The internal electrodes used in the present invention include:
Copper, aluminum, iron and their alloys are used. A conductive layer having a thickness of 1 to 50 μm formed by applying and drying a conductive paint is provided on the surface of the internal electrode,
The conductive layer is mixed with a silane coupling agent having an amino group or an epoxy group. As the conductive paint, one obtained by dispersing a fine powder of silver, aluminum, copper, carbon, or the like in a vehicle at a high concentration is used.

[0008] The silane coupling agent is generally X to Si
It is a known compound represented by (OR) ₃ (OR is generally an alkoxy group such as an ethoxy group and a methoxy group). The silane coupling agent used in the present invention is a compound represented by the above chemical formula wherein X represents an amino group or an epoxy group, for example, γ-glycidoxypropylmethyldiethoxysilane, γ-glycidoxypropyl tri Ethoxysilane, N-β (aminoethyl) γ-aminopropyltrimethoxysilane and the like can be mentioned. Further, it is desirable that this compounding amount is 0.5 to 3 parts by weight based on 100 parts by weight of the conductive paint. If the amount is less than 0.5 part by weight, the adhesiveness between the epoxy resin and the internal electrode is lowered, which is inconvenient. If the amount exceeds 3 parts by weight, unreacted groups of the silane coupling agent remain and agglomerate. It also takes.

The epoxy resin insulating part of the present invention is manufactured by a casting method. First, a molding die is prepared, an internal electrode provided with a conductive layer is provided at a predetermined position inside the molding die, and the above-mentioned uncured liquid epoxy resin is poured into the molding die, and this is heated and cured. After that, the mold is released. Thus, the desired epoxy resin insulating component can be obtained.

[0010] In order to further enhance the adhesion between the epoxy resin and the internal electrode, a silane coupling agent may be added to the epoxy resin. The amount of the silane coupling agent at this time is appropriately determined according to the epoxy equivalent of the epoxy resin.

In the epoxy resin insulating component of the present invention, since the conductive layer on the surface of the internal electrode contains a silane coupling agent having an amino group or an epoxy group, the epoxy resin and the internal electrode The adhesiveness between the two is increased, and the interface between the two does not peel off during heating and curing or cooling during the manufacturing process. Therefore, the mechanical and electrical characteristics of the epoxy resin insulating component do not deteriorate.

[0012]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below in detail with reference to embodiments. (Example 1) Bisphenol A type epoxy resin ("Araldite CT-200" manufactured by Ciba-Geigy Japan) 100
The acid anhydride-based curing agent (“Hardener HT
Epoxy resin was prepared by mixing 30 parts by weight (-903, manufactured by Nippon Ciba Geigy) and 200 parts by weight of dissolved silica powder.
Aluminum was used for the internal electrodes. In addition, three kinds of silane coupling agents are used in the conductive layer on the surface of the internal electrode, and γ-glycidoxypropylmethyldiethoxysilane is A, γ-glycidoxypropyltriethoxysilane is B, and N-β (Aminoethyl) γ-aminopropyltrimethoxysilane was designated as C. These are treated with a conductive paint (“Dotite SH-3A” manufactured by Fujikura Kasei Co., Ltd.) 1
With respect to 00 parts by weight, each was blended at a blending ratio shown in Table 1 to form a conductive paint, which was applied to the internal electrode. Using the epoxy resin and the internal electrodes provided with the respective conductive layers, molding was performed by a casting method, and Examples 1 to 6 and Comparative Example 1 were performed.
Epoxy resin insulation parts were obtained.

Regarding these epoxy resin insulating parts,
The mechanical and electrical properties were studied. Regarding the mechanical properties, the tensile strength of the epoxy resin insulating part was measured and its destructive behavior was evaluated. Table 1 shows the results.

[0014]

[Table 1]

[0015]

As described above, in the epoxy resin insulating part of the present invention, the conductive layer on the surface of the internal electrode
Since it is made by blending a silane coupling agent having an amino group or an epoxy group, the adhesive strength between the epoxy resin and the internal electrode is increased, and as a result, the temperature changes during heat curing or cooling during part production, In addition, the peeling does not occur at the interface between the two, and the mechanical and electrical characteristics thereof can be improved.

[Brief description of the drawings]

FIG. 1 is a schematic configuration diagram showing an example of an epoxy resin insulating component according to the present invention.

Claims (1)

[Claims] 1. An epoxy resin insulating component in which an internal electrode is embedded inside an epoxy resin molded product and a conductive layer is provided on the surface of the internal electrode, wherein an amino group or epoxy is added to the conductive layer on the internal electrode. An epoxy resin insulating component containing a silane coupling agent having a group.