JPH1027979A - Cooling device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To reduce heat transmission between electronic units by integrating a wind control part and a heat-absorbing fin so as to make them into a heat- absorbing part and permitting the endothermic part to absorb heat in an electronic device and to cool it. SOLUTION: A cooling device 3 has a radiating part 8 where multiple radiating fins are arranged. The endothermic part and the radiating part 8 are connected by a heat pipe 9. Air heated by the heat generation of the electronic unit 2 rises. Air touches the wind control part 4 or the endothermic fin 5 and heat is transmitted to the wind control part 4 or the endothermic fin 5. The endothermic part 6 absorbs the heat and it is transmitted to the radiating part 8 by the operation of the heat pipe 9. Then, it is discharged outside a rack 1 from the radiating fin 7 with a wide radiating area. Heat transmitted to the wind control part 4 is not discharged to air which the electronic unit 2 attracts but it is discharged outside the rack 1. Then, heat transmission between the electronic units can be reduced by integrating the wind control part 4 and the endothermic fin 5.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cooling device using a heat pipe structure, and more particularly to a cooling device for an electronic device in which electronic units are mounted in multiple stages on a frame.

[0002]

2. Description of the Related Art FIG. 4 is an explanatory view of a conventional example, and shows a side cross section of a conventional electronic device provided with cooling means. A large number of electronic units 2 each containing a large number of printed boards arranged in parallel in a box-shaped shelf are stacked on a rack 1 and mounted. Between each electronic unit, there is a baffle plate 10 inclined forward and downward, and a heat pipe 15 is attached to a rear portion thereof. The heat pipe 15 is a heat absorbing end 1 on which the heat absorbing fins 11 are arranged.
2 and a radiating end 14 in which the radiating fins 13 are arranged, and has a structure for reducing heat generation of the electronic unit 2 mounted thereunder.

[0003]

However, in the device having the above-described structure, the baffle plate heated by the heat generated by the electronic unit warms the suction air of the electronic unit mounted on the upper stage, and further reduces the temperature of the entire device. It was a factor to raise.

[0004]

SUMMARY OF THE INVENTION According to the present invention, a plurality of electronic units are mounted on an electronic device in multiple stages, a baffle for separating these electronic units is provided, and a plurality of heat absorbing fins are provided between the electronic units. In the cooling device that arranges the provided heat pipes and cools the electronic device, the wind control unit and the heat absorbing fins are integrated into a heat absorbing unit, and the heat absorbing unit absorbs heat inside the electronic device to perform cooling. It is characterized by.

[0005]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a side sectional view of an electronic device using the heat pipe structure of the embodiment, FIG. 2 is a perspective view showing the heat pipe structure of the embodiment, and FIG. 3 is an enlarged view of a heat absorbing fin of the embodiment. is there.

As shown in FIG. 1, an electronic unit 2 in which a number of printed boards are accommodated in parallel in a box-shaped shelf is mounted on a rack 1.
Is mounted in multiple layers. A cooling device 3 is provided between each electronic unit to cool the electronic unit 2. The cooling device 3 prevents the inflow of air between the electronic units by the wind control unit 4 inclined forward and downward. In the cooling device 3, heat absorbing fins 5 are arranged so as to be perpendicular to the wind control unit 4, and a large number of the heat absorbing fins 5 are connected to form a heat absorbing unit 6.

The cooling device 3 has a heat radiating portion 8 in which a number of heat radiating fins 7 are arranged, and the heat absorbing portion 6 and the heat radiating portion 8 are connected by a heat pipe 9. The air heated by the heat generated by the electronic unit 2 rises and touches the wind control unit 4 or the heat absorbing fins 5, and transfers the heat to the air control unit 4 or the heat absorbing fins 5.
To communicate. The heat is absorbed by the heat absorbing section 6, conveyed to the heat radiating section 8 by the action of the heat pipe 9, and released from the radiating fin 7 having a large heat radiating area to the outside of the frame 1.

Therefore, the heat transmitted to the wind control unit 4 is
The air is not released into the air sucked by the electronic unit 2 mounted on the upper stage, but is discharged outside the rack 1. As described above, by integrating the wind control unit 4 and the heat absorbing fins 5, heat transfer between the electronic units can be reduced. In the present embodiment, an example in which the present invention is applied to a general electronic device has been described. However, if the frame is a closed casing, the present invention is similarly applied to an electronic device installed outdoors. It is possible.

[0009]

As described in detail above, the integration of the wind control section and the heat absorbing fin has the effect of reducing heat transfer between the electronic units. Therefore, the temperature rise of the electronic unit is reduced, and further, the temperature rise value of the entire device can be reduced.

[Brief description of the drawings]

FIG. 1 is a side sectional view of an electronic device using a heat pipe structure according to an embodiment;

FIG. 2 is a perspective view showing a heat pipe structure according to the embodiment;

FIG. 3 is an enlarged view of a heat absorbing fin according to the embodiment;

FIG. 4 is an explanatory view of a conventional example.

[Explanation of symbols]

 2 Electronic unit 4 Suppression section 5 Heat absorption fin 6 Heat absorption section 7 Heat dissipation fin 8 Heat dissipation section 9 Heat pipe

Claims (2)

[Claims] 1. An electronic apparatus comprising a plurality of electronic units mounted in multiple stages, a baffle for partitioning the electronic units, a heat pipe provided with a plurality of heat absorbing fins between the electronic units, What is claimed is: 1. A cooling device for cooling an electronic device, wherein a cooling member and a heat absorbing fin are integrated to form a heat absorbing portion, and the heat absorbing portion absorbs heat inside the electronic device to perform cooling. 2. The heat pipe according to claim 1, wherein a plurality of radiating fins are arranged on a portion of the heat pipe outside the electronic device to form a heat radiating portion, and heat absorbed from the heat absorbing portion is discharged from the heat radiating portion. Cooling device.