JPH10275844A - Substrate-treating device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a substrate treating device by which delays in transfer are prevented, without restricting entry of substrates and decrease in the throughput can be prevented. SOLUTION: A substrate-treating pattern by which substrates pass through a chemical liquid bath CB1, a rinsing bath WB1, a rinsing bath FR and a drying part SD is set. The substrates are transferred by a substrate-transferring robot TR according to the treating pattern. When the treatment time in the water washing bath FR is long, transfer is delayed because the substrates after treatment in the rinsing bath WB1 cannot be transferred into the rinsing bath FR. In this case, treating pattern is changed in such a way that substrates after treatment in the water washing bath WB1 have been transferred into a water rinsing WB2, then into the rinsing bath FR. In this way, since the rinsing bath WB2 performs a function of a buffer, the delay in transfer can be prevented without restricting entry of substrates, and decrease in the throughput can be also prevented.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for immersing a thin plate-like substrate (hereinafter simply referred to as a "substrate") such as a semiconductor substrate, a liquid crystal glass substrate, a glass substrate for a photomask, and a substrate for an optical disk in a processing liquid. The present invention relates to a substrate processing apparatus that performs various processes such as cleaning and etching on a surface.

[0002]

2. Description of the Related Art Conventionally, a substrate processing apparatus as described above has a chemical tank for storing a chemical and a washing tank for storing pure water as processing tanks. At the time of substrate processing, a processing tank for performing processing is set in advance as a “processing procedure”, and a set of a plurality of substrates (hereinafter, referred to as “lot”) is circulated and transported to each processing tank according to the processing procedure. By a plurality of steps of immersing the substrate for a predetermined processing time in each processing tank of the transfer destination, a series of steps of removing contaminants on the substrate surface, etching an oxide film on the substrate surface, and stripping the resist film Substrate processing has been achieved.

[0003] Since the above-mentioned processing tanks have different purposes and processing contents, the processing conditions (for example, immersion processing time) generally differ for each processing tank. If the immersion processing time of the processing tank located on the downstream side in the set processing procedure is longer than the immersion processing time of the processing tank on the upstream side, the lot that has been processed in the processing tank on the upstream side is transferred to the downstream side. Cannot be conveyed to the processing tank, and the stagnation of the conveyance will occur.

[0004]

When stagnation of the transfer processing occurs, there is not much problem with the substrate immersed in the pure water of the washing tank. On the other hand, the surface treatment is performed more than necessary. In particular, the immersion treatment in an HF-based chemical solution is sensitive to the treatment time. If the substrate is immersed more than necessary, it will be in an excessively etched state (so-called over-etching), and the substrate will not be used anymore. Becomes impossible.

In order to prevent the occurrence of such defective substrates, it is necessary to regulate the introduction of lots into the substrate processing apparatus so as to prevent stagnation of transport. However, the regulation of introduction of lots naturally increases throughput. Will decrease.

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and an object of the present invention is to provide a substrate processing apparatus capable of eliminating a stagnation of transport without restricting the loading of substrates and preventing a decrease in throughput. Aim.

[0007]

According to a first aspect of the present invention, there is provided a substrate processing apparatus for performing immersion processing on a substrate, comprising: (a) a plurality of processing tanks including a washing tank; b) substrate transfer means for transferring the substrate between the plurality of processing tanks, (c) according to a predetermined processing pattern,
Transport control means for controlling the substrate transport means to transport the substrate, and (d) when a stagnation occurs in the transport, using a substantially unused washing tank before the stagnation occurs. Pattern changing means for changing the processing pattern.

According to a second aspect of the present invention, in the substrate processing apparatus according to the first aspect of the present invention, the pattern changing means includes a first transport trajectory constituting the processing pattern when the transport stagnation occurs. Is changed to a second transport trajectory including a washing tank not included in the first transport trajectory.

According to a third aspect of the present invention, in the substrate processing apparatus according to the first aspect of the present invention, the substantially unused rinsing tank is replaced with a rinsing tank for substantially rinsing the substrate. Separately, a specific washing tank is additionally specified in the processing pattern as a washing tank through which the substrate should temporarily pass, and the pattern changing unit is configured to perform the identification when the conveyance is stagnated. The immersion time of the substrate in the washing tank is changed.

[0010]

Embodiments of the present invention will be described below in detail with reference to the drawings.

A. Overall schematic configuration of substrate processing apparatus:
The overall configuration of the substrate processing apparatus according to the present invention will be described. FIG. 1 is a schematic front view showing an example of the substrate processing apparatus according to the present invention. The substrate processing apparatus 100 includes a chemical solution tank C
B1, CB2, washing tanks WB1, WB2, FR, a drying unit SD, and a substrate transport robot TR for transporting substrates. Further, the substrate processing apparatus 100 has, at both ends thereof,
A loader section LD on which a cassette 20 containing unprocessed substrates W is placed and a cassette 2 on which processed wafers W are stored
And an unloader unit ULD on which the 0 is placed.

The chemical tanks CB1 and CB2 are tanks capable of storing a chemical such as sulfuric acid, ammonia, hydrochloric acid, hydrofluoric acid, hydrogen peroxide or a mixture thereof (hereinafter simply referred to as "chemical"). This is a processing tank for performing an etching process or the like on the substrate. The washing tanks WB1 and WB2 are processing tanks that contain pure water and wash chemicals attached to the substrate W. The washing tank FR is also a washing tank containing pure water, and is mainly used for finishing washing.
Further, the drying unit SD rotates the substrate W while rotating the substrate W.
This is a processing unit that removes water drops adhering to the surface and dries it.

The substrate transfer robot TR is movable in the horizontal direction and the vertical direction, pays out unprocessed lots from the loader section LD, and sets the processing tanks according to a predetermined processing pattern (hereinafter, also referred to as “recipe”). This is a robot that circulates and transports lots between them and transfers processed lots to the unloader unit ULD. The substrate transport robot TR includes a pair of openable and closable hands 11, and a plurality of grooves for holding the substrate W are provided in the hand 11 in parallel at a constant pitch (shown in the figure). (Omitted), lots are held by the plurality of grooves. When the substrate transport robot TR receives the lot from the loader section LD, the cassette 2 is held by a holder (not shown) provided below the cassette 20.
This is performed by the pair of hands 11 of the substrate transport robot TR gripping the lot raised from 0. Also,
When transferring a lot to the unloader unit ULD, the lot is transferred from the hand 11 to a holder (not shown), and the lot is stored in the cassette 20 by lowering the holder. The example shown here is an apparatus of a type in which a lot is taken out from the cassette 20 and the lot is directly gripped and transported by the substrate transport robot TR. May be a so-called cassette transport type device for transporting the paper.

B. Control mechanism of substrate processing apparatus: Next, a control mechanism of the substrate processing apparatus 100 will be described. FIG.
FIG. 3 is a functional block diagram for explaining a control mechanism of the substrate processing apparatus 100. The substrate processing apparatus 100 incorporates a desktop computer 30. An operator can give commands to the apparatus and set processing patterns via the desktop computer 30.

The desktop computer 30 has a CPU 31 as a main body thereof and a ROM as a read-only memory.
32, a RAM 33 which is a readable and writable memory,
A magnetic disk 34 for storing control software, data, etc., an input / output port 35 as an interface with associated input / output devices, and a network port 36 as an interface with a device that directly controls the substrate processing apparatus 100. A communication port 3 for communicating with a host computer or the like provided outside the substrate processing apparatus 100
7 is provided. The desktop computer 30 is also provided with a display 38 and a keyboard 39 via an input / output port 35.
You can create a recipe by inputting commands and parameters from.

The command input to the desktop computer 30 is processed based on processing software, and is transmitted from the desktop computer 30 to the master controller 40 and the tank controller 50 via the network port 36 as necessary. Is done. The master controller 40 controls the operation of the substrate transport robot TR (see FIG. 1). Further, the master controller 40 has a function of changing the processing pattern when stagnation occurs in the transport processing, as described later.

The tank controller 50 controls operations such as injection and drainage and temperature adjustment in each processing tank. The bath controller 50 includes a timer 56, and uses the timer 56 to manage the immersion time of the substrate immersed in each processing bath.

C. Substrate processing procedure: Next, substrate processing apparatus 1
The substrate processing procedure at 00 will be described. FIG.
4 is a flowchart illustrating a substrate processing procedure in the substrate processing apparatus 100.

First, in step S1, a processing pattern is set. This is executed by the operator inputting a recipe representing the contents of the processing pattern from the keyboard 39. FIG. 4 is a diagram illustrating an example of a recipe.
The recipe set in step S1 has the contents shown in FIG. In other words, the contents are such that the lot is transported from the chemical solution tank CB1 to the drying unit SD in the order of steps 1 to 5 of the recipe, and the substrate processing is executed in each processing unit. The recipe also sets processing conditions in each processing unit, and as the processing conditions, immersion processing time, temperature of a chemical solution, and the like are set.

In the recipe shown in FIG. 4A, a dummy flag is provided, and the dummy flag of the washing tank WB2 in step 3 is set to "true". This means that it is used as a dummy washing tank.

Returning to FIG. 3, when the setting of the processing pattern is completed, the process proceeds to step S2, and the substrate processing is executed according to the processing pattern. Specifically, the master controller 40 refers to the recipe, and the substrate transfer robot TR
Is controlled, and lots are sequentially conveyed. The tank controller 50 controls each processing tank with reference to the processing conditions of the recipe.

Here, when the substrate processing is performed smoothly, the washing tank WB2 is recognized as a dummy washing tank, and the washing tank WB2 is not used. That is, the lot is directly conveyed to the washing tank FR via the chemical tank CB1 and the washing tank WB1, and finally carried into the drying unit SD.
Then, the process proceeds from step S3 in FIG. 3 to step S8, and returns to step S2 unless the processing of the planned number of lots is completed, and the process according to the recipe in FIG. 4A is continued.

However, since a plurality of lots are sequentially put into the substrate processing apparatus 100, for example, when the processing time of the washing tank FR is set longer than the processing time of the chemical tank CB1 or the washing tank WB1, Even if the processing in the chemical solution tank CB1 and the washing tank WB1 is completed, a situation in which it is not possible to transport to the next processing tank, that is, a stagnation of transport may occur. When the transportation is stopped, the lot is immersed in the chemical solution tank CB1 for a set time or longer, and the substrate is subjected to a surface treatment more than necessary and may become a defective substrate. Therefore, the process proceeds from step S3 to step S4. The processing pattern is changed. In the present embodiment, the master controller 40 detects the stagnation of the transport in step S3, and the master controller 40 also changes the recipe content in step S4.

FIG. 4B shows the recipe after the change, and the changed point is that the dummy flag of the washing tank WB2 is set to "false". Therefore, according to the modified recipe,
The washing tank WB2 is not recognized as a dummy washing tank.

Next, the process proceeds to step S5, and the process is continued according to the changed recipe. According to the modified recipe,
The washing tank WB2 is not regarded as a dummy, and the lot carried out of the washing tank WB1 is carried into the washing tank WB2 and then transferred to the washing tank FR. In other words, the lot of the washing tank WB1 is evacuated to the washing tank WB2, and as a result, the washing tank WB1 is released and the chemical tank CB1 is released.
Can be carried into the washing tank WB1.
This can prevent the substrate immersed in the chemical solution tank CB1 from becoming a defective substrate.

Next, the process proceeds to step S6, where the master controller 40 determines whether or not the stagnation of the conveyance has been resolved. If the stagnation of the transport has not been resolved, the process returns to step S5. That is, until the stagnation of the conveyance is resolved, the processing according to the changed recipe shown in FIG. 4B is executed.

On the other hand, when the stagnation of the conveyance is resolved, the process proceeds to step S7, and the master controller 40 returns to the original recipe (the recipe shown in FIG. 4A). Then, in step S8, the master controller 40 determines whether or not the processing of the planned number of lots has been completed. If the processing has not been completed, the process returns to step S2 again, and the series of processing is repeated until the processing is completed. Is repeated.

Incidentally, a problem that occurs when the stagnation occurs in the transport process is a lot immersed in the chemical solution tank CB1 as described above. Therefore, when the recipe is set in step S1, the recipe content as shown in FIG. 4C may be used. In the recipe shown in FIG. 4C, the washing tank WB2 is a dummy similarly to FIG. 4A, but the transfer order of the washing tank WB2 is positioned between the chemical tank CB1 and the washing tank WB1. Therefore, when the stagnation of the transport occurs, the lot of the chemical tank CB1 is directly transferred to the chemical tank WB.
1 will be saved. Even in this case, the chemical tank C
The substrate immersed in B1 can be prevented from becoming a defective substrate. However, in this case, the substrate transport robot TR
Transports the lot from the chemical solution tank CB1 to the washing tank WB2, and then transports the lot from the washing tank WB2 to the washing tank WB1. Therefore, it is better to set the recipe shown in FIG. Operation load is reduced.
In this case, since the lot is directly conveyed from the chemical tank CB1 to the washing tank WB2, unlike the case where the lot is conveyed from the washing tank WB1, it is preferable to perform normal washing processing also in the washing tank WB2.

When the above processing contents are summarized, the transport trajectory when the processing is being executed smoothly is defined as the chemical tank CB1, the washing tank WB1, the washing tank FR, and the drying unit SD. The transport trajectory includes the washing tank WB2. That is, by changing the transport trajectory of the processing pattern so as to use the washing tank WB2, the substrate can be evacuated to the washing tank WB2, and a buffer function is given to the washing tank WB2. It is possible to eliminate the stagnation of transport without restricting the loading of the substrate, and to prevent a decrease in throughput.

D. Modification: The processing pattern applied in the substrate processing apparatus 100 may be as follows. FIG. 5 is a diagram showing another example of the recipe. In addition,
The substrate processing procedure itself in the substrate processing apparatus 100 is the same as the procedure shown in FIG.

FIG. 5A shows a recipe created in step S1 of FIG. Unlike the recipe shown in FIG. 4A, the setting of the dummy flag is not performed, but the washing tank WB
The processing time t ₃ of No. 2 is set to “0”. That is,
In step S2, when the processing is being executed smoothly, the substrate transport robot TR temporarily immerses the lot carried out from the washing tank WB1 into the washing tank WB2, and then immediately carries it into the washing tank FR from the washing tank WB2. Therefore, when the processing is being performed smoothly, the washing tank WB2 is not substantially used, and the washing tank W for the substantial washing processing is used.
Apart from B1, it is merely a washing tank that is additionally designated in the processing pattern as a washing tank through which the substrate should temporarily pass.

When the processing is stagnant as described above, the master controller 40 changes the recipe contents. The change here is as shown in FIG.
This is to change the set processing time of the washing tank WB2. As the processing time after the change, the time at which the immersion processing of the washing tank FR is completed may be predicted, and a time calculated from the time may be set. Alternatively, the set time may be changed so that the washing tank FR is opened. You may set so that it may carry out from the washing tank WB2 gradually.

After the recipe is changed, the process is continued according to the changed recipe (step S5), and the immersion process is performed in the washing tank WB2 for a predetermined time. By doing so, the lot that should be immediately conveyed to the washing tank FR can be kept in the washing tank WB2 for a long time simply by dropping in the washing tank WB2. Similar effects can be obtained. Then, when the stagnation of conveyance is resolved, the original recipe (FIG. 5)
(Step S7).

The processing shown here is different from the above-described embodiment in that a rinsing tank for a substantial rinsing process is used instead of changing the transport trajectory of the processing pattern when the stagnation occurs in the processing. The difference is that the immersion processing time of the rinsing tank WB2 additionally specified in the processing pattern as a rinsing tank to which the substrate should temporarily pass is different from WB1. As a result, the substrate holding time in the washing tank WB2 is prolonged, and a buffer function is provided to the washing tank WB2. This eliminates the stagnation of transport without restricting lot input and prevents a decrease in throughput. it can.

Although the embodiment of the present invention has been described above, the present invention is not limited to the above example. For example, the substrate processing apparatus 100 in the above embodiment is an apparatus for processing a substrate W in lot units. But this was 1
It may be a single-wafer-type substrate processing apparatus that processes one by one.

Further, the setting and changing of the recipe are not limited to the above-mentioned example, and the mode in which the transport trajectory of the processing pattern is changed when the stagnation occurs in the processing or is substantially used. Any form may be used as long as the immersion time of the washing tank is changed.

[0037]

As described above, according to the first aspect of the present invention, when a stagnation occurs in the transport, the processing is performed such that a washing tank that is not used before the stagnation occurs is used. Since the pattern is changed, the substrate can be evacuated to the washing tank, and a buffer function is added to the washing tank. Can be prevented from decreasing.

According to the second aspect of the present invention, when a stagnation occurs in the transport, the first transport trajectory constituting the processing pattern is changed to the first transport trajectory including the washing tank not included in the first transport trajectory. Since the transfer trajectory is changed to 2, the processing pattern is changed so that the unused washing tank is used before the occurrence of stagnation, and the same effect as the first aspect of the invention can be obtained.

According to the third aspect of the present invention, when a stagnation occurs in the transport, the substrate may be used as a washing tank for the substrate to temporarily pass through separately from the washing tank for the substantial washing process. Since the immersion time of the substrate in the specific rinsing tank additionally specified is changed, the dwell time of the substrate in the rinsing tank is extended, and the buffer function is added to the rinsing tank. The same effect as the invention of Item 1 can be obtained.

[Brief description of the drawings]

FIG. 1 is a schematic front view showing an example of a substrate processing apparatus according to the present invention.

FIG. 2 is a functional block diagram for explaining a control mechanism of the substrate processing apparatus of FIG.

FIG. 3 is a flowchart showing a substrate processing procedure in the substrate processing apparatus of FIG. 1;

FIG. 4 is a diagram showing an example of a recipe.

FIG. 5 is a diagram showing another example of a recipe.

[Explanation of symbols]

 40 Master controller 50 Tank controller 100 Substrate processing device TR Substrate transfer robot CB1, CB2 Chemical tank WB1, WB2, FR Rinse tank W Substrate

Claims (3)

[Claims] 1. A substrate processing apparatus for performing immersion processing on a substrate, comprising: (a) a plurality of processing tanks including a water washing tank; and (b) a substrate transfer means for transferring the substrate between the plurality of processing tanks. (C) transport control means for controlling the substrate transport means so as to transport the substrate according to a predetermined processing pattern; and (d) when the stagnation occurs in the transport, before the stagnation occurs. And a pattern changing means for changing the processing pattern so as to use a substantially unused washing tank. 2. The substrate processing apparatus according to claim 1, wherein the pattern changing unit changes the first transport trajectory configuring the processing pattern into the first transport trajectory when the transport stagnation occurs. A substrate processing apparatus characterized by changing to a second transport trajectory including a washing tank not including a washing tank. 3. The substrate processing apparatus according to claim 1, wherein the substantially unused rinsing tank is provided in a state where the substrate is temporarily separated from a rinsing tank for substantially rinsing the substrate. A specific washing tank that is additionally specified in the processing pattern as a washing tank to be passed through, and the pattern changing unit, when a stagnation occurs in the transport, the substrate in the specific washing tank. A substrate processing apparatus characterized by changing an immersion time.