JPH10270822A - Lead connecting structure - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a lead connecting structure in which leads can be connected surely without being stripped off the solder by an external force such as the stress, etc. SOLUTION: In a circuit constituting device 8 in which a circuit board 3 mounted with electrodes 4 connected with leads 1 is housed in a case 6 and a filler 7 is injected into the case 6 so that the leads 1 may be exposed partially and, at the same time, the case 6 is coated with a synthetic resin 10, the electrode connecting sections 14 of the leads 1 are respectively connected to the electrodes 4 by soldering 5 by setting at least parts of the electrode connecting sections 14 at about right angles against the extracting directions of the extracting sections 2 of the leads 1 which are extended in the horizontal direction of the board 3.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a lead connection structure for connecting leads using solder to electrodes on a circuit board.

[0002]

2. Description of the Related Art A conventional lead connection structure is shown in FIGS.
As shown in FIG. 2, the linear lead 1 is connected to the electrode 4 of the circuit board 3 in the same direction as the lead-out part 2 of the lead 1.
And connected using solder 5.

[0003]

FIG. 1 shows the conventional technique.
As shown in FIG. 3, the circuit board 3 to which the leads 1 are connected is housed in a case 6, and a space inside the case 6 is filled with a filler 7 such as an epoxy resin and the like. It may be used for a module 8 which is a circuit configuration device covered with a filler 10 such as an epoxy resin harder than the agent 7. Reference numeral 11 denotes a terminal, and 12 denotes solder for connecting the lead 1 to the terminal 11.

When a conventional technique is used in such an apparatus, the filler 7, which is softer than the filler 10, is liable to be deformed because the respective members, especially the different fillers 7, 10, have different coefficients of thermal expansion. Lead 1 covered with agent 7
13, a stress is generated in the direction of the lead portion 2, that is, in the direction of the arrow in FIG.
Join the connection. Since the lead 1 is connected to the solder 5 in the same direction as the arrow, the lead 1 is
Even if the lead 1 does not come off or the lead 1 does not come off, the lead 1 itself may be deformed due to the linear shape of the lead portion 2 of the lead 1, which may adversely affect the connection between the lead 1 and the solder 5. Therefore, the present invention provides a lead connection structure capable of performing a reliable connection without peeling the lead from the solder by an external force such as a stress.

[0005]

In order to achieve the above object, the present invention provides a lead connecting structure for connecting leads to electrodes of a circuit board by using solder, wherein the leads extend in a horizontal direction of the circuit board. At least a part of the electrode connection portion of the lead connected by the solder with respect to the pull-out direction of the lead portion has an arbitrary angle other than parallel, and is connected to the electrode by soldering.

In a lead connection structure for connecting a lead to an electrode of a circuit board by using solder, the lead is connected to the lead of a lead extending in a horizontal direction of the circuit board by the solder. At least a part of the electrode connection portion to be formed has a substantially right angle, and is connected to the electrode by soldering.

Further, the lead is provided with a bent portion which is deformed by a force in a pull-out direction of the pull-out portion.

The circuit board having the leads connected to the electrodes is housed in a case, a filler is injected into the case so that a part of the leads is exposed, and the case is covered with a synthetic resin. In the lead connection structure of the circuit configuration device to be described, at least a part of the electrode connection portion connected by the solder of the lead to the lead-out direction of the lead lead-out portion extending in the horizontal direction of the circuit board is not parallel. It has an arbitrary angle and is connected to the electrode by soldering.

A circuit board having leads connected to the electrodes is housed in a case, a filler is injected into the case so that a part of the leads is exposed, and the case is covered with a synthetic resin. In the lead connection structure of the circuit configuration device described above, at least a part of the electrode connection part connected by the solder of the lead is substantially perpendicular to the lead-out direction of the lead lead-out part extending in the horizontal direction of the circuit board. It is an angle and is connected to the electrode by soldering.

Further, the lead is provided with a bent portion which is deformed by a force in a pulling direction of the pulling portion.

[0011]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A lead connection structure according to the present invention connects a lead 1 to an electrode 4 of a circuit board 3 by using solder 5, and a lead portion of the lead 1 extending in a horizontal direction of the circuit board 3. 2 lead 5 solder 5
At least a part of the electrode connection portion 14 connected by the above is set to an arbitrary angle other than parallel, and is connected to the electrode 4 using the solder 5.

Further, at least a part of the electrode connecting portion 14 connected by the solder 5 of the lead 1 to the drawing direction of the drawing portion 2 of the lead 1 extending in the horizontal direction of the circuit board 3 has a substantially right angle. 4 may be connected using solder 5.

Further, the lead 1 is provided with second, third, and fourth bent portions 16, 17, and 18.

The circuit board 3 having the leads 1 connected to the electrodes 4 is housed in a case 6, and a filler 7 is injected into the case 6 so that a part of the leads 1 is exposed. Device 8 covered with synthetic resin 10
At least a part of the electrode connection part 14 connected by the solder 5 of the lead 1 to the lead-out direction of the lead part 2 of the lead 1 extending in the horizontal direction of the circuit board 3 has an arbitrary angle other than parallel, and the electrode 4 Are connected using solder 5.

Further, at least a part of the electrode connecting portion 14 connected by the solder 5 of the lead 1 to the drawing direction of the drawing portion 2 of the lead 1 extending in the horizontal direction of the circuit board 3 has a substantially right angle. 4 may be connected using solder 5.

The lead 1 is provided with second, third, and fourth bent portions 16, 17, and 18.

[0017]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A first embodiment of the present invention will be described below with reference to FIGS. The same and corresponding parts as those in the conventional example are denoted by the same reference numerals, and detailed description thereof will be omitted.

The module 8 shown in FIGS. 1 to 3 is a circuit used for generating a high voltage on the secondary side by cutting off the primary current of an ignition coil called an igniter used in an ignition device for an internal combustion engine. It is a constituent device.

The module 8 of this embodiment includes a circuit board 3 made of aluminum, a plurality of electronic components 13 mounted on the circuit board 3 via an insulating layer (not shown), and a case for housing the circuit board 3. 6 and a filler 7 such as an epoxy resin filled in the case 6, and the lead 1 is used for input and output of signals with the outside. Module 8
Is housed in an outer case 9, and the space is filled with a filler 10 harder than the filler 7, and the module 8 is filled with the filler 1.
Covered with 0.

The connection between the lead 1 and the electrode 4 of the circuit board 3 is made by solder 5. The other end of the lead 1 is connected to the terminal 11 by solder 12.

As shown in FIGS. 4 to 6, the lead 1 of this embodiment has an electrode connecting portion 14 and first to fourth bent portions 1.
5, 16, 17, 18, an inclined portion 19, first and second linear portions 20, 21 and a drawer portion 2.

The shape of the lead 1 is such that an electrode 4
Is provided with a linear electrode connecting portion 14 connected with the solder 5. Then, from the electrode connection portion 14 to the first bent portion 15
Thus, an inclined portion 19 that is inclined obliquely in the vertical direction with respect to the circuit board 3 is provided.

The inclined portion 19 is bent again at the second bent portion 16 so as to be parallel to the circuit board 3, and the electrode connecting portion 14 including the inclined portion 19 and the first It is bent and formed so that the straight portion 20 is located at a right angle.

From the second bent portion 16 to the first straight portion 2
0 through the first straight portion 20 at the third bent portion 17.
And the second linear portion 21 are bent so as to be positioned at a right angle (the electrode connecting portion 14 including the inclined portion 19 and the second linear portion 21 are parallel).

Then, the second straight portion 21 and the lead portion 2 are perpendicular to each other at the fourth bent portion 18 from the third bent portion 17 via the second straight portion 21 (the electrode connection including the inclined portion 19). The portion 14 and the drawer 2 are bent so as to be positioned at a right angle.

The lead 1 having the above shape is connected to the electrode 4 of the circuit board 3.
Is connected to the electrode connection portion 1 of the lead 1 by using the solder 5.
Reference numeral 4 is connected to the electrode 4 at a substantially right angle with respect to the drawing direction (the direction of the arrow in the drawing) of the lead portion 2 of the lead 1 extending in the direction of the plate surface horizontal to the circuit board 3.

As described above, by connecting the lead 1 to the electrode 4 using the solder 5, the lead portion 2 of the lead 1 in the horizontal plate surface direction is mounted on the circuit board 3 as shown by the arrow in the drawing.
Even if stress is applied to the lead 1 and stress is applied to the lead 1, the electrode connection portion 14 is perpendicular to the direction of the lead portion 2 with respect to the stress in the direction of the arrow in the drawing.
The electrode connection portion 14 is in a direction in which the lead 5 is hard to be detached from the solder 5, is further held by the solder 5 around the electrode connection portion 14 of the lead 1, can withstand stress, and the lead 1 does not peel off from the solder 5.

The lead 1 of the present embodiment is provided with the second, third, and fourth bent portions 16, 17, and 18, so that when the lead 1 receives a stress in the direction of the arrow in FIG. 4
The bending portions 17 and 18 bend and bend to absorb stress, and absorb the stress in the direction of the arrow in the drawing. Therefore, the stress applied to the electrode connection portion 14 of the lead 1 and the solder 5 is suppressed. And the reliability of the connection structure of the lead 1 is further improved.

If the lead 1 is formed of a soft conductive material, the lead 1 can be further formed by the third and fourth bent portions 1.
Deformation is easy at 7 and 18, and the reliability of the connection between the lead 1 and the solder 5 is improved.

The second, third, and fourth bent portions 16,
The shapes of the members 17 and 18 are not limited to those of the above-described embodiment, and may be any shape as long as the bent portion absorbs the stress by deforming in the direction of the arrow in the figure.
The second, third and fourth bent portions 16, 17 and 18 may be continued without providing the second straight portions 20 and 21, and the arc may be continued in the S-shape. 4 bends 1
The stress can be absorbed by bending and bending 6, 17, 18.

The contact between the lead 1 and the electrode 4 may be made by contacting the electrode 4 at the entire electrode connecting portion 14 and connecting with the solder 5 as shown in the above embodiment, or as shown in FIG. A part of the electrode connecting portion 14 may be in contact with the electrode 4 and connected with the solder 5. Although not shown, a structure in which the lead 1 and the electrode 4 are not in contact with each other and are connected only by the solder 5 may be used.

The lead connection structure of the present embodiment can reliably connect the lead 1 even when used in a portion where the temperature of the use environment such as an igniter rapidly rises and falls.

In this embodiment, the circuit board 3 is provided with the inclined portion 19 formed so as to be inclined from the electrode connecting portion 14 to the circuit board 3 in the vertical direction. Even in the case of the substrate 3, a gap can be provided between the end 3 a of the circuit board 3 having no insulating layer and the lead 1, and there is no possibility that the lead 1 contacts the end 3 a of the circuit board 3. The structure is such that the lead 1 and the circuit board 3 are not short-circuited.

In the above embodiment, the electrode connecting portion 1 of the lead 1
4 is connected to the electrode 4 by solder 5 at a substantially right angle to the lead portion 2 of the lead 1 in the direction of the plate surface that is horizontal to the circuit board 3, but is not limited to the above-described embodiment. As shown in the second embodiment, the second bent portion 1
The lead 1 is formed by bending the lead 6 at 45 degrees.
Even if the electrode connection portion 14 is inclined by 45 degrees with respect to the lead portion 2 of the lead 1 and connected to the electrode 4 using the solder 5, the solder 5 around the electrode connection portion 14 of the lead 1 supports the electrode connection portion 14. The lead 1 can withstand the stress, and a good lead connection structure can be obtained.

In each of the above embodiments, the electrode connecting portion 14 of the lead 1 connected to the electrode 4 is a straight line. However, the present invention is not limited to this embodiment. As an example, for example, a first bent portion 22 is provided in the electrode connecting portion 14 connected to the solder 5 so that the electrode connecting portion 1
4 is formed at a substantially right angle with respect to the lead portion 2 so that a part of the electrode connecting portion 14 of the lead 1
The lead 1 is connected to the electrode 4 at a substantially right angle with respect to the lead-out direction (the direction of the arrow in the drawing) of the lead 1 of the lead 1 extending in the direction of the plate surface horizontal to the circuit board 3, and the same operational effects as those of the above-described embodiments are obtained. be able to.

The lead 1 of the present embodiment is connected to the electrode connecting portion 1.
An inclined portion 19 that is obliquely inclined in a vertical direction with respect to a circuit board (not shown) at the fourth to second bent portions 23 is provided. The inclined portion 19 is bent at the third bent portion 24 again so as to be parallel to the circuit board. When the second and third bent portions 23 and 24 receive stress in the direction of the arrow in the figure, the second and third bent portions 23 and 24
24 has a structure that absorbs stress by bending and bending, and absorbs the stress in the direction of the arrow in the figure, so that the stress applied to the electrode connection portion 14 of the lead 1 and the solder 5 can be suppressed, The reliability of the connection structure of the lead 1 is further improved.

Although a part of the electrode connecting portion 14 is bent at a substantially right angle, it is not limited to a right angle.
The angle may be 5 degrees or the like, or it may be bent by 90 degrees or more and a part of the electrode connecting portion 14 may be folded back.

In each of the above embodiments, the lead 1 is connected to the electrode 4.
Is accommodated in the case 6 and the case 6
The lead connection structure of the present invention is used for the module 8 in which the filler 7 is injected so that a part of the lead 1 is exposed in the module 8 and further covered with the filler 10. Instead, for example, the present invention may be applied to a module in which the circuit board 3 is covered with a synthetic resin without using the case 6 and further covered with a synthetic resin. This is also effective when it is necessary to firmly connect the lead 1 to the electrode 4 using the solder 5.

[0039]

As described above in detail, the present invention relates to a lead connecting structure for connecting leads to electrodes of a circuit board by using solder, and the lead-out portion of the lead extending in the horizontal direction of the circuit board. At least a part of the electrode connection portion of the lead connected by the solder with respect to the direction is set to an arbitrary angle other than parallel, and by soldering to the electrode, stress is applied in the lead-out direction of the lead lead-out portion. Even if it is applied, the lead is hard to come off from the solder, and the solder around the electrode connection portion holds the lead, so that a highly reliable lead connection structure can be obtained.

In a lead connection structure for connecting a lead to an electrode of a circuit board by using a solder, the lead is connected with the solder in a lead-out direction of a lead-out portion extending in a horizontal direction of the circuit board. At least a part of the electrode connection portion to be formed has a substantially right angle, and by soldering connection to the electrode, even if stress is applied in the lead-out direction of the lead-out portion of the lead, the lead is not easily removed from the solder, Further, since the solder around the electrode connection portion holds the lead, a highly reliable lead connection structure can be obtained.

In addition, since the lead is provided with a bent portion that is deformed by a force in the pull-out direction of the lead portion, the stress applied to the electrode connecting portion of the lead and the connection portion with the solder is reduced by the bending portion. As a result, the stress is absorbed by the deformation, so that a more reliable lead connection structure can be obtained.

A circuit board having leads connected to the electrodes is housed in a case, a filler is injected into the case so that a part of the leads is exposed, and the case is covered with a synthetic resin. In the lead connection structure of the circuit configuration device to be described, at least a part of the electrode connection portion connected by the solder of the lead to the lead-out direction of the lead lead-out portion extending in the horizontal direction of the circuit board is not parallel. The lead is connected to the electrode at an arbitrary angle, and even if a stress caused by a difference in thermal expansion coefficient between the filler and the synthetic resin is applied in the lead-out direction of the lead-out portion of the lead, It is difficult to remove from the solder, and the solder around the electrode connection portion holds the lead, so that a highly reliable lead connection structure can be obtained. Kill.

A circuit board having leads connected to the electrodes is housed in a case, a filler is injected into the case so that a part of the leads is exposed, and the case is further covered with a synthetic resin. In the lead connection structure of the circuit configuration device described above, at least a part of the electrode connection part connected by the solder of the lead is substantially perpendicular to the lead-out direction of the lead lead-out part extending in the horizontal direction of the circuit board. Angle, and by soldering connection to the electrode, even if stress caused by the difference in thermal expansion coefficient between the filler and the synthetic resin is applied in the lead-out direction of the lead-out portion of the lead, the lead is separated from the solder. Since the lead is not easily removed and the solder around the electrode connection portion holds the lead, a highly reliable lead connection structure can be obtained.

Further, the lead is provided with a bent portion which is deformed by a force in the pull-out direction of the lead portion, so that the stress applied to the electrode connection portion of the lead and the connection portion with the solder is reduced by the bending portion. As a result, the stress is absorbed by the deformation, so that a more reliable lead connection structure can be obtained.

[Brief description of the drawings]

FIG. 1 is a sectional view of a first embodiment of the present invention as viewed from above.

FIG. 2 is a sectional view taken along line AA in FIG.

FIG. 3 is a sectional view taken along line BB in FIG. 2;

FIG. 4 is a top view of the lead of the embodiment.

FIG. 5 is a side view seen from the direction of arrow C in FIG.

FIG. 6 is a side view seen from the direction of arrow D in FIG.

FIG. 7 is a side view showing a connection between a lead and an electrode according to another embodiment of the present invention.

FIG. 8 is a top view of a lead according to a second embodiment of the present invention.

FIG. 9 is a top view of a main part of a third embodiment of the present invention.

FIG. 10 is a sectional view of a main part of the embodiment of the present invention.

FIG. 11 is a top view of a conventional example.

FIG. 12 is a sectional view taken along line XX in FIG. 11;

FIG. 13 is a sectional view of another conventional example.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Lead 2 Lead-out part 3 Circuit board 4 Electrode 5,12 Solder 6 Case 7,10 Filler (synthetic resin) 8 Module 9 Outer case 11 Terminal 13 Electronic component 14 Electrode connection part 15,22 First bent part 16,23 Second bent portion 17, 24 Third bent portion 18 Fourth bent portion 19 Inclined portion 20 First straight portion 21 Second straight portion

Claims (6)

[Claims] In a lead connection structure for connecting leads to electrodes of a circuit board by using solder, the leads are connected by the solder in a lead-out direction of a lead lead-out portion extending in a horizontal direction of the circuit board. A lead connection structure, wherein at least a part of the electrode connection portion to be formed has an arbitrary angle other than parallel and is connected to the electrode by soldering. 2. A lead connection structure in which leads are connected to electrodes of a circuit board using solder by using the solder of the leads in a lead-out direction of a lead-out portion of the lead extending in a horizontal direction of the circuit board. A lead connection structure, wherein at least a part of the electrode connection portion to be formed has a substantially right angle and is connected by soldering to the electrode. 3. The lead connection structure according to claim 1, wherein the lead is provided with a bent portion that is deformed by a force in a pull-out direction of the pull-out portion. 4. A circuit board having leads connected to electrodes is housed in a case, a filler is injected into the case so that a part of the leads is exposed, and the case is further covered with a synthetic resin. In the lead connection structure of the circuit configuration device to be described, at least a part of the electrode connection portion connected by the solder of the lead to the lead-out direction of the lead lead-out portion extending in the horizontal direction of the circuit board is not parallel. A lead connection structure having an arbitrary angle and being connected to the electrode by soldering. 5. A circuit board having leads connected to electrodes is housed in a case, a filler is injected into the case so that a part of the leads is exposed, and the case is further covered with a synthetic resin. In the lead connection structure of the circuit configuration device described above, at least a part of the electrode connection part connected by the solder of the lead is substantially perpendicular to the lead-out direction of the lead lead-out part extending in the horizontal direction of the circuit board. A lead connection structure, wherein the lead is connected to the electrode by soldering. 6. The lead connection structure according to claim 4, wherein a bent portion is provided on the lead to be deformed by a force in a pull-out direction of the lead portion.