JPH10261689A - Substrate treating apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To fully provide a substrate treating apparatus which prevents specified different treatments from being affected with each other by the other atmosphere. SOLUTION: A substrate treating apparatus has two treatment spaces A and B partitioned by a bulkhead 200 extending in vertical direction. Each treatment space A and B includes a plurality of stories. In the treatment space A, a plurality of treatment units to perform the treatment before exposure are arranged. In the treatment space A, a carry unit 11 is arranged, and in the treatment space B, a carry unit 21 is arranged. A delivery chamber SH is arranged covering the treatment chamber A and the treatment chamber B. In the delivery chamber SH, a delivery unit 31 which performs the delivery of a substrate with the carry unit 11 in the treatment space A, and the carry unit 21 in the treatment chamber B is provided.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] 1. Field of the Invention [0002] The present invention relates to a substrate processing apparatus provided with a plurality of processing units for performing predetermined processing on a substrate.

[0002]

2. Description of the Related Art A substrate processing apparatus is used to perform various processes on substrates such as a semiconductor wafer, a glass substrate for liquid crystal glass display, a glass substrate for a photomask, and a glass substrate for an optical disk. For example, in a semiconductor device manufacturing process, a substrate processing apparatus in which each of a series of processes is unitized and a plurality of processing units are integrated is used in order to increase production efficiency.

FIG. 17 is a plan view showing an example of a conventional substrate processing apparatus. The substrate processing apparatus in FIG. 17 includes two transfer areas a and b. On the front side, a rotary coating unit (spin coater) SC for performing a coating process of a processing liquid such as a photoresist on the substrate and a rotary developing unit (spin developer) SD for performing a developing process on the substrate are provided side by side. Further, between the transfer area a and the transfer area b, an adhesion strengthening unit AH for performing the adhesion strengthening processing on the substrate, a heating unit (hot plate) HP for performing the heating processing for the substrate, and a cooling unit (for cooling the substrate) Cooling plate) C
P is arranged in a plurality of stages.

In the transfer area a, there is provided a transfer unit TR1 for transferring the substrate in the direction of the arrow S and for carrying the substrate in and out of the rotary coating unit SC and the rotary developing unit SD. Also, the transport area b
The substrate is transported in the direction of arrow S, and the adhesion strengthening unit AH, the heating unit HP, and the cooling unit C
Transport unit T for loading and unloading substrates to and from P
R2 is provided.

A loading / unloading device (indexer) IND for storing the substrate and loading and unloading the substrate is disposed at one end of the substrate processing apparatus. The loading / unloading device IND includes a plurality of cassettes 10 for accommodating the substrates and a transport unit 61 for loading and unloading the substrates. The transport unit 61 moves in the direction of the arrow U, takes out the substrate from the cassette 10, passes it to the transport unit TR2 in the transport area b, receives the substrate on which a series of processing has been performed from the transport unit TR2 in the transport area b, and Return to 10.

At the other end of the substrate processing apparatus, a transfer device (interface) IF for transferring a substrate to and from an external device is provided. Here, an exposure apparatus ST is arranged as an external apparatus. The transfer device IF includes a transport unit 62. Transport unit 6
2 moves in the direction of arrow U, passes the substrate received from the transport unit TR2 in the transport area b to the exposure apparatus ST, and passes the substrate received from the exposure apparatus ST to the transport unit TR2 in the transport area b.

Here, an example of processing in the substrate processing apparatus of FIG. 17 will be described. First, the substrate taken out of the cassette 10 is subjected to adhesion strengthening processing by the adhesion strengthening unit AH. In the adhesion strengthening process, HMDS (hexamethylene disilazane) is applied on the substrate as an adhesion enhancer in order to enhance the adhesion between the photoresist applied in the next step and the substrate.

Next, after the substrate subjected to the adhesion strengthening process is subjected to a cooling process in a cooling unit CP, a photoresist is applied in a rotary coating unit SC, and a heating process is performed in a heating unit HP. After performing the cooling process in the unit CP, it is transported to the exposure apparatus ST.

After the substrate exposed by the exposure apparatus ST is subjected to post-exposure baking, the rotary developing unit S
The developing process is performed in D, the heating process is performed in the heating unit HP, and the cooling process is performed in the cooling unit CP. Thereafter, the substrate is subjected to an etching process in another apparatus.

[0010]

In recent years, in order to achieve high integration of semiconductor devices, highly sensitive chemically amplified resists capable of forming fine patterns have been used. This chemically amplified resist is composed of a base resin, an acid generator and a solvent. When exposed to laser light during the exposure treatment, an acid is generated from the acid generator, and the acid reacts with the base resin to form a resist pattern. To form

When the chemically amplified resist comes into contact with an alkali component, the chemical catalytic reaction stops. Therefore, when the chemically amplified resist is exposed to the ammonia component in the atmosphere after exposure by the exposure apparatus ST, the acid generated by the exposure is neutralized, and the exposure pattern disappears or the exposure accuracy is impaired.

On the other hand, in the adhesion strengthening treatment by the adhesion strengthening unit AH, HMDS is used as an adhesion strengthening agent as described above. This HMDS has a property of generating ammonia (alkali component) when it comes into contact with moisture. Therefore, HMDS leaked to the outside from the adhesion strengthening unit AH
When ammonia comes in contact with moisture in the air, ammonia is generated.

For this reason, when the substrate exposed by the exposure apparatus ST passes near the adhesion strengthening unit AH, there is a problem in that the exposure pattern is lost or the exposure accuracy is reduced due to the ammonia component.

In the above-described conventional substrate processing apparatus, in addition to the transport unit 61 of the loading / unloading device IND and the transport unit 62 of the transfer device IF, the transport unit is used for loading and unloading the substrate to and from each processing unit. Units TR1 and TR2 are provided. As a result, there is a problem that the installation area (footprint) of the substrate processing apparatus becomes large.

Further, in the above-mentioned conventional substrate processing apparatus,
Since the transfer area a is provided in the center of the substrate processing apparatus, in order to perform maintenance of the transfer unit TR1, the surrounding processing units must be removed. Thus, there is a problem that maintenance of the transport unit TR1 cannot be easily performed.

An object of the present invention is to provide a substrate processing apparatus in which predetermined different processes are sufficiently prevented from being affected by the other atmosphere.

Another object of the present invention is to provide a substrate processing apparatus in which predetermined different processes are sufficiently prevented from being affected by the other atmosphere and the installation area can be reduced.

Still another object of the present invention is to provide a substrate processing apparatus in which predetermined different processes are sufficiently prevented from being affected by the other atmosphere and maintenance can be easily performed. is there.

[0019]

Means for Solving the Problems and Effects of the Invention A substrate processing apparatus according to a first aspect of the present invention includes first and second processing spaces whose atmospheres are shut off from each other, and a first processing space and a second processing space. A transfer chamber extending to the processing space is provided. In the transfer chamber, transfer means for transferring a substrate between the first processing space and the second processing space is provided, and the first processing space includes a substrate. And one or more first processing units for performing predetermined processing, and a first transfer unit for transferring a substrate between the first processing unit and the transfer unit, and a second processing space includes: One or a plurality of second processing units for performing predetermined processing on the substrate, and a second transfer unit for transferring the substrate between the second processing unit and the transfer unit are provided.

In the substrate processing apparatus according to the present invention, the atmosphere in the first processing space and the atmosphere in the second processing space are shut off from each other, and the transfer means is provided in a transfer chamber extending between the first processing space and the second processing space. Because it is provided, the first
The substrate can be transferred between the first processing space and the second processing space without affecting the atmosphere in the processing unit and the atmosphere in the second processing unit.

Therefore, it is possible to transfer a substrate between different processes while sufficiently preventing different processes from being affected by the other atmosphere. as a result,
A series of substrate processing can be performed efficiently while maintaining high quality.

A substrate processing apparatus according to a second aspect of the present invention is the substrate processing apparatus according to the first aspect of the invention, wherein the first processing space is provided with a substrate storage section for storing substrates before and after processing. In addition, the first transfer means carries the substrate in and out of the substrate storage unit, and an intermediate transfer unit for transferring the substrate to and from the outside is provided in the second processing space. In addition, the second transfer means transfers the substrate to and from the intermediate transfer section.

In this case, the substrate can be transferred between the substrate storage unit and the first processing unit, between the substrate storage unit and the transfer unit, and between the first processing unit and the transfer unit. The substrate can be transferred between the intermediate transfer unit and the second processing unit, between the intermediate transfer unit and the transfer unit, and between the second processing unit and the transfer unit.

Therefore, an arbitrary procedure can be performed between the substrate storage section, the first processing section, the intermediate transfer section and the second processing section without providing another transporting means in addition to the first and second transporting means. Can transfer the substrate.

According to a third aspect of the present invention, in the configuration of the substrate processing apparatus according to the first and second aspects of the present invention, the first processing section performs a pre-exposure process on the substrate and performs a second processing. The section performs post-exposure processing on the substrate.

In this case, in the first processing space, the substrate is subjected to the substrate processing before exposure in the first processing unit, and the processed substrate is sent to the second processing space through the transfer chamber, and the second processing space is processed. It can be transferred to an externally disposed exposure device. Then, the substrate received from the exposure apparatus is subjected to post-exposure substrate processing in the second processing section, and the processed substrate is sent to the first processing space through the transfer chamber to store the substrate.

Thus, the substrate processing before exposure and the substrate processing after exposure can be performed efficiently without being affected by the other atmosphere.

According to a fourth aspect of the present invention, in the substrate processing apparatus according to the first or second aspect, the first processing section performs the first cleaning process using the first cleaning liquid. The second processing unit performs a second cleaning process using a second cleaning liquid.

In this case, the first cleaning process using the first cleaning solution and the second cleaning process using the second cleaning solution can be performed efficiently without being affected by the other atmosphere. .

The substrate processing apparatus according to the fifth invention comprises
In the configuration of the substrate processing apparatus according to any one of the fourth aspects of the invention, the first processing space and the second processing space are arranged side by side in a horizontal direction, and the transfer chamber includes a first processing space and a second processing space. And are arranged in the horizontal direction.

In this case, since the first processing space and the second processing space are separated in the horizontal direction, it is possible to sufficiently prevent the first processing space and the second processing space from being affected by the other atmosphere.

The substrate processing apparatus according to a sixth aspect of the present invention is the substrate processing apparatus according to the fifth aspect, wherein the first processing section includes a first transfer means on a surface opposite to the second processing space. And a substrate entrance for transferring the substrate, and the second processing unit has a substrate entrance for transferring the substrate to and from the second transfer means on a surface opposite to the first processing space. It is.

In this case, since the substrate entrance and exit of the first processing unit and the substrate entrance and exit of the second processing unit are provided on the opposite surfaces, the substrate can be moved to the first and second processing units. At the time of loading and unloading, it is possible to sufficiently prevent the atmosphere of the other processing space from entering the processing section.

The substrate processing apparatus according to the seventh invention comprises:
In the configuration of the substrate processing apparatus according to any one of the sixth inventions, the first and second processing spaces each include a plurality of layers arranged in a vertical direction, and the first and second processing spaces are arranged in a lower layer of the first processing space. The first processing unit disposed is a processing unit that performs processing of the substrate using a predetermined processing liquid, and the first processing unit disposed in the upper layer of the first processing space is configured to A second processing unit disposed in a lower layer of the second processing space and performing processing on the substrate using a predetermined processing liquid; The second processing unit disposed in the upper layer of the processing space is a processing unit that performs temperature processing on the substrate.

In this case, the processing of the substrate is performed by using a predetermined processing liquid in the processing section of the lower layer of the first and second processing spaces, and the processing of the upper layer of the first and second processing spaces is performed. The part performs temperature processing on the substrate. As described above, since the plurality of processing units are hierarchically arranged for each processing function, the installation area can be reduced.

Further, since the processing section for processing the substrate using the processing liquid is arranged at the lower level, when a liquid leak or the like occurs, there is little influence on other processing sections, and the processing is not performed. The state can be checked visually.

The substrate processing apparatus according to the eighth invention comprises
In the configuration of the substrate processing apparatus according to any one of the fourth aspects of the invention, the first processing space and the second processing space are vertically stacked, and the transfer chamber includes the first processing space, the second processing space, Are arranged vertically.

In this case, since the first and second processing spaces are vertically stacked, the installation area can be reduced.

The substrate processing apparatus according to the ninth invention comprises
In the configuration of the substrate processing apparatus according to any one of the eighth inventions, the delivery chamber is disposed so as to face outside the first processing space and the second processing space.

In this case, since the transfer room faces the outside of the first and second processing spaces, maintenance of the transfer room can be easily performed.

[0041]

FIG. 1 is a perspective view of a substrate processing apparatus according to a first embodiment of the present invention, FIG. 2 is a side view of the substrate processing apparatus of FIG. 1 in the direction of arrow P, and FIG. FIG. 3 is a side view of the processing device in the direction of arrow Q. FIG. 4 corresponds to FIGS.
5 is a sectional view taken along the line YY in FIGS. 2 and 3. FIG. Further, FIGS. 6, 7, 8,
9 and 10 show Z in FIGS. 4 and 5, respectively.
It is the 1-Z1 line sectional view, the Z2-Z2 line sectional view, the Z3-Z3 line sectional view, the Z4-Z4 line sectional view, and the Z5-Z5 line sectional view.

The substrate processing apparatus shown in FIG. 1 has two processing spaces A, separated by a partition (partition) 200 extending in the vertical direction.
B. These processing spaces A and B include a first layer S1, a second layer S2, a third layer S3, a fourth layer S4, and a fifth layer S5 arranged in order from bottom to top.

In the first level S1 of the processing spaces A and B, chemical units CH1 and CH2 are arranged, respectively. The chemical units CH1 and CH2 store various processing liquids (chemical liquids), waste liquids, pumps, and exhaust systems.

In the second level S2 of the processing space A, a plurality of rotary coating units (spin coaters) SC for applying a processing liquid such as a photoresist to the substrate are arranged along the partition walls 200. In the second level S2 of the processing space B, a plurality of rotary developing units (spin developers) SD for performing a developing process on the substrate are arranged along the partition wall 200.

In the third layer S3 of the processing space A, ULP
A plurality of air adjustment units FF1 each including a filter 41 such as an A (Ultra Low Penetration Air) filter and a chemical adsorption filter and a fan 42 are arranged along the partition wall 200 (see FIG. 4). Third hierarchy S3 of processing space B
, A plurality of air adjustment units FF2 including a filter 51 such as an ULPA filter and a chemical adsorption filter and a fan 52 are arranged along the partition wall 200 (see FIG. 4).

On the front side of the fourth space S4 of the processing spaces A and B, a transfer room (shuttle) SH is arranged over the processing space A and the processing space B.

In the remaining area of the fourth level S4 of the processing space A, a plurality of cooling units (cooling plates) CP for performing a cooling process on the substrate and a plurality of heating units (hot plates) HP for performing a heating process on the substrate are provided. And a plurality of adhesion strengthening units AH for performing the adhesion strengthening treatment on the substrate are provided with the partition wall 200
(See FIG. 2).

A plurality of cooling units (cooling plates) C are provided in the remaining area of the fourth level S4 of the processing space B.
P, a plurality of heating units (hot plates) HP, a plurality of bake units (bake plate) PEB for performing post-exposure bake (post-exposure bake) on the substrate, and a peripheral exposure unit (edge exposure unit) EEW for performing a peripheral exposure process Are arranged in one or more steps along the partition wall 200 (see FIG. 3).

The chemical unit CH1 supplies the processing liquid to the upper rotary coating unit SC, discharges the waste liquid, and exhausts it. The chemical unit CH2 supplies the processing liquid to the upper rotary developing unit SD. Supply, discharge and exhaust of waste liquid. The air adjustment unit FF1 supplies clean air whose temperature and humidity have been adjusted to the lower rotary coating unit SC to adjust the atmosphere of the rotary coating unit SC, and the air adjustment unit FF2 has the temperature and humidity adjusted. Is supplied to the lower rotary developing unit SD to adjust the atmosphere of the rotary developing unit SD.

The rotary coating unit SC, the cooling unit CP, the heating unit HP and the adhesion strengthening unit AH in the processing space A have an opening 100 for taking in and out the substrate on the surface opposite to the partition wall 200 (see FIG. 2). ). Each opening 100 is provided with a shutter (not shown) that can be opened and closed freely. Rotary developing unit SD, cooling unit CP, heating unit HP, bake unit PE in processing space B
B and the peripheral exposure unit EEW have an opening 100 for taking the substrate in and out on the surface opposite to the partition wall 200. Each opening 100 is provided with a shutter (not shown) that can be opened and closed freely.

The transfer chamber SH has openings 100 on the opposite side of the processing space A from the partition wall 200 and on the opposite side of the processing space B from the partition wall 200, respectively. These openings 100 also have
A shutter (not shown) is provided to be openable and closable. As shown in FIG. 4, a delivery unit 31 is provided in the delivery chamber SH so as to be movable in the direction of arrow H.

At the end of the processing space A opposite to the partition wall 200, a substrate storage section IND for storing a substrate is disposed. The substrate storage section IND includes a plurality of cassettes 10 for storing substrates. A transport unit 11 is arranged in front of the substrate storage section IND. The transport unit 11 is configured to be movable in the vertical and horizontal directions and rotatable about a vertical axis.
The substrate is transferred between the transfer unit 31 in the inside and each processing unit in the processing space A.

An intermediate transfer section (interface) IF for transferring a substrate to and from an external device is disposed at an end of the processing space B opposite to the partition wall 200. In this embodiment, an exposure apparatus ST is arranged as an external apparatus so as to be adjacent to the processing space B. The intermediate transfer section IF is for transferring a substrate before exposure and a substrate after exposure to and from the exposure apparatus ST, and includes a transport unit (not shown) for transferring the substrate to and from the exposure apparatus ST. Have. In addition, a transport unit 21 is arranged in front of the intermediate transfer unit IF. The transport unit 21 is configured to be movable in the vertical and horizontal directions and rotatable around a vertical axis, and includes an intermediate transfer section IF and a transfer chamber S.
The substrate is transferred between the transfer unit 31 in H and each processing unit in the processing space B.

An air adjusting unit FF3 composed of a filter and a fan is disposed above the substrate storage section IND, above the transfer chamber SH and above the intermediate transfer section IF in the fifth level S5 of the processing spaces A and B. I have.

In this embodiment, the processing space A corresponds to the first processing space, and the processing space B corresponds to the second processing space.
Further, the rotary coating unit SC, the cooling unit CP, the heating unit HP, and the adhesion enhancing unit AH correspond to a first processing unit, and the rotary developing unit SH, the cooling unit CP, the heating unit HP, the bake unit PEB, and the peripheral exposure unit. The unit EEW corresponds to a second processing unit. Further, the delivery unit 31 corresponds to delivery means,
The transport unit 11 corresponds to a first transport unit, and the transport unit 21 corresponds to a second transport unit.

FIG. 11 is a plan view showing a method for transferring a substrate between the transfer unit 11 and the transfer unit 31.
(A) shows a state before delivery, and (b) shows a state after delivery.

As shown in FIG. 11, the substrate transport unit 1
1 is a holding arm (substrate holding unit) 12 for holding the substrate W
Having. On the other hand, the delivery unit 31 has a delivery table 32. A plurality of substrate holding pins 33 are mounted on the transfer table 32.

From the transport unit 11 to the transfer unit 3
When the substrate W is transferred to the transfer unit 1, the holding arm 12 that holds the substrate W moves forward on the transfer table 32 of the transfer unit 31, places the substrate W between the substrate holding pins 33, and retreats. Conversely, from the delivery unit 31 to the transport unit 11
When a substrate is transferred to the transfer table 32, the holding arm 12 enters a lower portion of the substrate W held between the substrate holding pins 33 on the transfer table 32, holds the substrate W, and retreats.

The transfer of the substrate between the transfer unit 21 in the processing space B and the transfer unit 31 in the transfer chamber SH is performed in the same manner as described above.

In this embodiment, the transfer between the transfer unit 11 and the transfer unit 31 and the transfer between the transfer unit 21 and the transfer unit 31 are performed in the transfer chamber SH. The transfer between the transfer unit 11 and the transfer unit 31 may be performed in the processing space A that has exited the transfer chamber SH, and the transfer between the transport unit 21 and the transfer unit 31 may be performed in the processing space that has exited the transfer chamber SH. B may be performed.

Next, the operation of the substrate processing apparatus of FIG. 1 will be described. FIG. 12 is a diagram illustrating an example of processing in the substrate processing apparatus of FIG.

First, the transport unit 11 in the processing space A is
The substrate is taken out from the cassette 10 and the adhesion strengthening unit A
H sequentially. In these adhesion strengthening units AH, adhesion strengthening treatment is performed on the substrate using HMDS (hexamethylene disilazane) as an adhesion strengthening agent. next,
The transport unit 11 sequentially transports the substrates on which the adhesion enhancement processing has been performed to the cooling unit CP. In the cooling unit CP, a cooling process is performed on the substrate. Thereafter, the transport unit 11 sequentially transports the cooled substrates to the rotary coating unit SC. In the rotary coating unit SC, a photoresist coating process is performed on the substrate.

Next, the transport unit 11 sequentially transports the substrate coated with the photoresist to the heating unit HP. In the heating unit HP, a heat treatment is performed on the substrate. Further, the transport unit 11 sequentially transports the substrates subjected to the heat treatment to the cooling unit CP. In the cooling unit CP, a cooling process is performed on the substrate. Then, the transfer unit 11 transfers the cooled substrate to the transfer chamber S.
Transfer to the transfer unit 31 in H.

The transfer unit 31 includes the transport unit 1
The substrate transferred from 1 is transported from the processing space A side to the processing space B side. The transfer unit 21 in the processing space B receives the substrate from the transfer unit 31 in the transfer chamber SH, and transfers the substrate to the intermediate transfer unit IF. Then, the substrate is transported to the exposure apparatus ST by a transport unit (not shown) of the intermediate transfer unit IF. In the exposure apparatus ST,
An exposure process is performed on the substrate.

After the end of the exposure processing, the transfer device IF
The substrate after the exposure processing is received from the exposure apparatus ST.
Then, the transport unit 21 receives the substrate from the intermediate transfer unit IF, and transfers the substrate to the peripheral exposure unit EEW.
Transport to In the peripheral exposure unit EEW, peripheral exposure is performed on the substrate. Next, the transport unit 21 sequentially transports the substrates subjected to the peripheral exposure to the bake unit PEB. In the bake unit PEB, a post-exposure bake process is performed. Next, the transport unit 21 sequentially transports the substrates subjected to the post-exposure bake processing to the cooling unit CP. In the cooling unit CP, a cooling process is performed on the substrate. Further, the transport unit 21 sequentially transports the cooled substrate to the rotary developing unit SD. In the rotary developing unit SD, a developing process is performed on the substrate.

Thereafter, the transport unit 21 sequentially transports the developed substrate to the heating unit HP. In the heating unit HP, a heat treatment is performed on the substrate. Further, the transport unit 21 sequentially transports the substrates subjected to the heat treatment to the cooling unit CP. In the cooling unit CP, a cooling process is performed on the substrate. Thereafter, the transfer unit 21 transfers the substrate subjected to the cooling process to the transfer unit 31 in the transfer chamber SH.

The transfer unit 31 transports the substrate from the processing space B to the processing space A. The transfer unit 11 in the processing space A receives the substrate from the transfer unit 31 in the transfer chamber SH, and stores the substrate in the cassette 10.

In FIG. 12, where two processing units such as AH, CP, and SC perform the same processing, the same processing is performed in parallel in order to improve the throughput. Then, the transport units 11 and 21 transport the substrates to the processing units that are performing the processing in parallel so that the substrates are transferred alternately in the circulating transport.

As described above, in the substrate processing apparatus of this embodiment, the substrate processing before exposure is performed in the processing space A, the substrate processing after exposure is performed in the processing space B, and the atmosphere of the processing space A and the processing space Since the atmosphere of B is shielded from each other, the substrate after exposure is not affected by the alkali component generated in the processing before exposure. Therefore, it is possible to efficiently perform a series of substrate processing while maintaining high quality.

The processing space A and the processing space B are separated from each other by the partition 2.
00, the processing spaces A and B are sufficiently prevented from being affected by the atmosphere from one another.

Further, the opening 100 of each processing unit in the processing space A and the opening 10 of each processing unit in the processing space B
Since 0 is provided on the surface on the opposite side, when the substrate is carried in and out of each processing unit, the other atmosphere can be sufficiently prevented from entering the processing unit.

Further, since a plurality of processing units are hierarchically arranged for each function, the footprint (installation area)
Is reduced.

In particular, since the air adjusting units FF1 and FF2 are respectively disposed immediately above the rotary coating unit SC and the rotary developing unit SD, the atmosphere of the rotary coating process and the rotary developing process can be efficiently and satisfactorily improved. Can be kept. Further, the chemical units C are provided immediately below the rotary coating unit SC and the rotary developing unit SD, respectively.
Since H1 and CH2 are arranged, the supply of the processing liquid, the discharge of the waste liquid, and the exhaust can be efficiently performed with a simple piping structure.

Further, since the rotary coating unit SC and the rotary developing unit SD are arranged in the intermediate layer, the state of the rotary coating process and the rotary developing process can be easily confirmed visually.

Further, an air adjusting unit FF is provided above the rotary coating unit SC and the rotary developing unit SD.
1, FF2, cooling unit CP, heating unit H
Since the temperature processing unit such as P is disposed, the lower rotary coating unit SC and lower rotary developing unit SD
And the upper temperature processing unit are less susceptible to heat and atmosphere from the other.

Further, since the rotary coating unit SC and the rotary developing unit SD are arranged on the same lower layer in a planar manner, when a liquid leak or the like occurs, the influence on other processing units is small.

In the above-described embodiment, the transfer unit 31 is configured to be movable in the horizontal direction in the transfer chamber SH. However, when the length of the transfer chamber SH is short, the transfer unit 31 is moved to the transfer chamber SH. May be fixed to the central portion 12. In this case, the transport unit 1
The holding arms 12 enter the transfer chamber SH and place the substrate on the transfer unit 31 or receive the substrate held on the transfer unit 31.

FIG. 13 is a longitudinal sectional view of a substrate processing apparatus according to a second embodiment of the present invention, and FIG. 14 is a sectional view taken along line WW in FIG.

The substrate processing apparatus shown in FIG. 13 has two processing spaces A and B separated by a partition wall 200 extending in the vertical direction. The processing spaces A and B are firstly arranged in order from bottom to top.
, A second tier S2, a third tier S3, a fourth tier S4, and a fifth tier S5.

In the first level S1 of the processing spaces A and B, chemical units CH1 and CH2 are arranged, respectively. In the second level S2 of the processing space A, a plurality of rotary cleaning units (spin scrubbers) SW1 that perform cleaning processing on the substrate using the first cleaning liquid are arranged along the partition walls 200, and In the second level S2, a plurality of rotary cleaning units (spin scrubbers) SW2 that perform cleaning processing on the substrate using the second cleaning liquid are arranged along the partition walls 200. The first cleaning liquid is ammonia and aqueous hydrogen peroxide, and the second cleaning liquid is hydrochloric acid and aqueous hydrogen peroxide.

The air conditioning units FF1 and FF2 are arranged on the third level S3 of the processing spaces A and B, respectively. The fourth space S4 of the processing spaces A and B includes a processing space A
And a transfer chamber SH extending between the transfer space SH and the processing space B. As in the first embodiment, the transfer unit 31 is provided in the transfer chamber SH so as to be movable in the horizontal direction.

At the end of the processing space A on the side opposite to the partition wall 200, a substrate storage section IND is arranged as in the first embodiment. The substrate storage IND includes a plurality of cassettes 10.

A transport unit 11 is arranged in front of the substrate storage section IND. The transfer unit 11 is provided movably in the up-down direction and the horizontal direction, and has a transfer chamber SH.
The substrate is transferred between the transfer unit 31 in the inside and each processing unit in the processing space A.

A transfer unit 21 is provided at the end of the processing space B opposite to the partition wall 200. Transport unit 21
Is provided so as to be movable in the up-down direction and the horizontal direction, and transfers a substrate between the transfer unit 31 in the transfer chamber SH and each processing unit in the processing space B.

An air adjusting unit FF3 is arranged in the fifth level S5 of the transport spaces A and B. Also in this substrate processing apparatus, the opening 100 of each processing unit in the processing space A and the opening 100 of each processing unit in the processing space B are provided on opposite surfaces.

FIG. 15 is a view showing an example of processing in the substrate processing apparatus of FIG. In the process of FIG. 15A, first, the transport unit 11 in the processing space A takes out the substrate from the cassette 10 and sequentially transports the substrate to the rotary cleaning unit SW1. In the rotary cleaning unit SW1, a cleaning process is performed on the substrate using the first cleaning liquid. Next, the transfer unit 11 transfers the cleaned substrate to the transfer unit 31 in the transfer chamber SH.

The transfer unit 31 transports the transferred substrate from the processing space A to the processing space B. The transfer unit 21 in the processing space B receives the substrate from the transfer unit 31 in the transfer chamber SH, and sequentially transfers the substrate to the rotary cleaning unit SW2. In the rotary cleaning unit SW2, the substrate is subjected to a cleaning process using a second cleaning liquid. Thereafter, the substrate transfer unit 21 transfers the cleaned substrate to the transfer unit 31 in the transfer chamber SH.

The transport unit 31 transports the transferred substrate from the processing space B to the processing space A. Processing space A
Transfer unit 11 receives the substrate from the transfer unit 31 in the transfer chamber SH and stores it in the cassette 10.

In the process shown in FIG. 15B, first, the transport unit 11 in the processing space A takes out the substrate from the cassette 10, transports the substrate to one rotary cleaning unit SW1, and transfers the cleaned substrate to the other rotary cleaning unit SW1. It is transported to the unit SW1. Thereafter, the transport unit 11 transfers the cleaned substrate to the transfer unit 31 in the transfer chamber SH. The transfer unit 31 transports the transferred substrate from the processing space A to the processing space B.

The transfer unit 21 in the processing space B receives the substrate from the transfer unit 31 in the transfer chamber SH, transfers the substrate to one rotary cleaning unit SW2, and transfers the cleaned substrate to the other rotary cleaning unit SW2. SW2
Transport to Thereafter, the transfer unit 21 transfers the cleaned substrate to the transfer unit 31 in the transfer chamber SH. The transfer unit 31 transports the transferred substrate from the processing space B to the processing space A. The transfer unit 11 in the processing space A receives the substrate from the transfer unit 31 in the transfer chamber SH, and stores the substrate in the cassette 10.

In the substrate processing apparatus of this embodiment, the first
Is performed in the processing space A using the cleaning solution of
Is performed in the processing space B, and the atmosphere in the processing space A and the atmosphere in the processing space B are isolated from each other, so that each cleaning process is not affected by the atmosphere of the other cleaning process. .

FIG. 16 is a view showing a substrate processing apparatus according to a third embodiment of the present invention, wherein (a) and (b) are longitudinal sectional views on the front side and the rear side, respectively.
(C) and (d) are cross-sectional views on the lower side and the upper side, respectively.

The substrate processing apparatus shown in FIG. 16 has two processing spaces A and B separated by a partition wall 200 extending in the horizontal direction. That is, the processing spaces A and B are vertically stacked.

In the processing space A, a plurality of rotary coating units SC, stacked cooling units CP, heating units H
P, the adhesion strengthening units AH are arranged side by side in the horizontal direction. In the processing space B, a plurality of rotary developing units SD,
The stacked cooling unit CP, heating unit HP, and bake unit PEB are arranged side by side in the horizontal direction. Also,
A substrate storage section IND1 is disposed in the processing space A, and a substrate storage section IND2 is disposed in the processing space B. The processing space A includes a transport unit (not shown), as in the first embodiment. The processing space B also includes a transport unit (not shown) as in the first embodiment.

Further, a transfer chamber SH extending between the processing space A and the processing space B is arranged vertically. Also,
An intermediate transfer section IF that transfers a substrate to and from the exposure apparatus ST is disposed at a position opposite to the processing space A with the transfer chamber SH interposed therebetween. A transfer unit (not shown) is provided in the transfer chamber SH so as to be movable in the vertical direction.

The rotary coating unit SC in the processing space A is
An opening 100 for taking in and out the substrate is provided on the substrate storage section IND1 side. Further, the rotary developing unit SD has an opening 100 on the side of the intermediate transfer unit IF for taking out and taking in the substrate.

The transfer chamber SH has openings 100 on the side of the processing space A, on the side of the processing space B, and on the side of the intermediate transfer section IF, respectively, for loading and unloading substrates.

According to the substrate processing apparatus of the present embodiment, the substrate accommodating sections IND1 and IND2 are provided in the processing spaces A and B, respectively, so that the coating processing is performed on the processing space A side and the developing processing is performed on the processing space A. This can be done individually on the B side.

When performing a series of processes from the coating process to the developing process, the substrate follows the following path. First, the transfer unit in the processing space A is used to store the substrate storage unit IND.
The substrates taken out from 1 are sequentially conveyed in the processing space A, subjected to a coating process, and then delivered to the delivery unit in the delivery room SH. The transfer unit conveys the received substrate to the intermediate transfer unit IF. And
The substrate is transferred between the intermediate transfer unit IF and the external exposure apparatus ST, and the exposed substrate is transferred to the transfer chamber S.
H is returned to the delivery unit. The transfer unit that has received the substrate again moves up the transfer chamber SH and transfers the substrate to the transfer unit in the processing space B. Processing space B
The substrates are sequentially transported in the processing space B by the transport unit, subjected to development processing, and delivered to the delivery unit in the delivery chamber SH. After that, the transfer unit descends and transports the substrate to the transport unit in the processing space A. Then, the transport unit in the processing space A stores the substrate in the substrate storage unit IND1.

In the substrate processing apparatus of this embodiment, the coating processing is performed in the processing space A, and the developing processing is performed in the processing space B.
Since the processing space A and the processing space B are isolated from each other, each processing is not affected by the atmosphere of the other processing. Further, since the processing spaces A and B are vertically stacked, the installation area (footprint) is reduced.

[Brief description of the drawings]

FIG. 1 is a perspective view of a substrate processing apparatus according to a first embodiment of the present invention.

FIG. 2 is a side view in the direction of arrow P in FIG.

FIG. 3 is a side view in the direction of arrow Q in FIG. 1;

FIG. 4 is a sectional view taken along line XX in FIGS. 2 and 3;

FIG. 5 is a sectional view taken along line YY in FIGS. 2 and 3;

FIG. 6 is a sectional view taken along line Z1-Z1 in FIGS. 4 and 5;

FIG. 7 is a sectional view taken along line Z2-Z2 in FIGS. 4 and 5;

FIG. 8 is a sectional view taken along line Z3-Z3 in FIGS. 4 and 5;

FIG. 9 is a sectional view taken along the line Z4-Z4 in FIGS. 4 and 5;

FIG. 10 is a sectional view taken along line Z5-Z5 in FIGS. 4 and 5;

FIG. 11 is a plan view showing a holding arm of the transfer unit and a delivery table of the delivery unit.

FIG. 12 is a diagram illustrating an example of a process in the substrate processing apparatus of FIG. 1;

FIG. 13 is a longitudinal sectional view of a substrate processing apparatus according to a second embodiment of the present invention.

FIG. 14 is a sectional view taken along line WW in FIG.

FIG. 15 is a diagram illustrating an example of processing in the substrate processing apparatus of FIG. 13;

FIG. 16 is a front vertical sectional view, a rear vertical sectional view, a lower cross sectional view, and an upper cross sectional view of a substrate processing apparatus according to a third embodiment of the present invention.

FIG. 17 is a plan view illustrating an example of a conventional substrate processing apparatus.

[Explanation of symbols]

 A, B Processing space CH1, CH2 Chemical system unit SC Rotary coating unit SD Rotary developing unit FF1, FF2, FF3 Air conditioning unit CP Cooling unit HP Heating unit AH Adhesion strengthening unit PEB Bake unit EEW Peripheral exposure unit SH Transfer room IND , IND1, IND2 Substrate storage section IF Intermediate transfer section 11, 21 Transport unit 31 Transfer unit 10 Cassette 100 Opening 200 Partition wall

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Yasuo Imanishi 322 Hahazushi Furukawa-cho, Fushimi-ku, Kyoto Dainippon Screen Manufacturing Co., Ltd. Dainichi Screen Manufacturing Co., Ltd. (72) Inside the Rakusai Office (72) Inventor Yuki Iwami 322 Habushishi Furukawa-cho, Fushimi-ku, Kyoto Dainichi Screen Manufacturing Co., Ltd. 322 Habushishi Furukawacho Dainichi Screen Manufacturing Co., Ltd.Rakusai Office

Claims (9)

[Claims] 1. A first and a second processing space, each of which has an atmosphere interrupted from each other, wherein a transfer chamber extending between the first processing space and the second processing space is provided. A first processing space and the second processing space
A delivery unit for delivering a substrate to and from the processing space of the first processing space; one or more first processing units configured to perform a predetermined processing on the substrate in the first processing space; A first transfer unit that transfers a substrate between the unit and the transfer unit; and a second processing space, wherein one or a plurality of second processing units that perform predetermined processing on the substrate, A substrate processing apparatus, further comprising a second transfer unit that transfers a substrate between a second processing unit and the transfer unit. 2. The substrate processing apparatus according to claim 1, wherein the first processing space includes a substrate storage unit that stores the substrates before and after the processing, and the first transfer unit transfers the substrate between the substrate storage unit and the first storage unit. The second processing space is provided with an intermediate transfer unit for transferring a substrate to and from the outside, and the second transfer unit is provided between the second processing space and the intermediate transfer unit. The substrate processing apparatus according to claim 1, wherein the substrate is transferred. 3. The method according to claim 1, wherein the first processing unit performs a process before exposure on the substrate, and the second processing unit performs a process after exposure on the substrate. Substrate processing equipment. 4. The first processing unit performs a first cleaning process using a first cleaning liquid, and the second processing unit performs a second cleaning process using a first cleaning solution.
3. The substrate processing apparatus according to claim 1, wherein a second cleaning process is performed using the cleaning liquid. 5. The first processing space and the second processing space are arranged side by side in a horizontal direction, and the transfer chamber is horizontally disposed over the first processing space and the second processing space. The substrate processing apparatus according to claim 1, wherein: 6. The first processing unit has a substrate entrance for transferring a substrate to and from the first transport unit on a surface opposite to the second processing space, and the second processing unit includes: 6. The substrate processing apparatus according to claim 5, wherein the unit has a substrate entrance for transferring the substrate to and from the second transfer means on a surface opposite to the first processing space. 7. The first and second processing spaces each include a plurality of layers arranged vertically, and the first processing space is arranged in a lower layer of the first processing space.
Is a processing unit that performs processing of the substrate using a predetermined processing liquid, and the first processing unit that is disposed in the upper layer of the first processing space performs temperature processing on the substrate. The second processing space, wherein the second processing space is arranged in a lower layer of the second processing space.
Is a processing unit that performs processing of the substrate using a predetermined processing liquid, and the second processing unit that is disposed in the upper layer of the second processing space performs temperature processing on the substrate. The substrate processing apparatus according to claim 1, wherein the processing section performs a process. 8. The first processing space and the second processing space are vertically stacked, and the transfer chamber is vertically arranged over the first processing space and the second processing space. The substrate processing apparatus according to claim 1, wherein: 9. The apparatus according to claim 1, wherein the transfer chamber is disposed so as to face outside the first processing space and the second processing space. Substrate processing equipment.