JPH10256434A - Semiconductor package and inspection of direction thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide the semiconductor package, which can inspect the direction highly accurately at the low cost, and the method for inspecting the direction for the package. SOLUTION: A photodetector comprising a light projecting means P and a light receiving means D, which are arranged with the suitable interval being provided, is arranged. A through-hole part 12 is formed at a part of a package 11, which is separated from the center of the package 11 for housing a semiconductor device and from the external electrode group taken out to the outside from the package 11 in a semiconductor package 10. This semiconductor package 10 is brought close to the above described photodetector so as to keep the specified positional relationship. Under this state, whether the semiconductor package 10 has the correct direction or not is judged based on whether the emitted light from the light projecting means P is received by the light receiving means D or not.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor package capable of improving the accuracy of automatic discrimination of a direction required for performing automatic inspection, marking, and the like on a packaged semiconductor device. The present invention relates to an inspection method for the orientation.

[0002]

2. Description of the Related Art Conventionally, attempts have been made to automate the determination of the orientation necessary for performing processing such as automatic inspection and marking on a packaged semiconductor device.

Conventionally, in order to automatically determine the direction of a semiconductor package, as shown in a perspective view of FIG.
2, light is emitted from the opposite direction of the depression, and the direction of the direction is determined by recognizing the shadow formed in the depression by a camera, as shown in the perspective view of FIG.

As described in Japanese Patent Application Laid-Open No. H06-104352, an image obtained by photographing a semiconductor device is
There is also known a method of inspecting the direction of a direction discrimination mark based on the binarized image.

[0005]

In the conventional direction determination method shown in FIG. 4, when the position or light amount of the light source changes, or when a flaw or foreign matter is present on the upper surface of the package, a shadow formed inside the depression is formed. However, there is a problem that erroneous determination is likely to occur because the shape and darkness of the image change and the recognition accuracy of the camera cannot follow the change. Along with this erroneous determination, there are problems such as a decrease in the operation rate of a processing device for processing semiconductor device inspection and marking, and an increase in rejected products resulting in an increase in manufacturing costs.

An image obtained by photographing a semiconductor device is
In the method of digitizing and inspecting the direction of the direction discrimination mark based on the binary image, a high-speed computer is required to shorten the processing time for binarization and the like, and the inspection apparatus becomes expensive. There is.

Accordingly, an object of the present invention is to provide a semiconductor package which is inexpensive and can be inspected in a highly accurate direction, and a method for inspecting the direction of the semiconductor package.

[0008]

A semiconductor package according to the present invention, which solves the above-mentioned problems of the prior art, comprises a center of a package for accommodating a semiconductor device and a portion of the package remote from a group of external electrodes led out from the package. , A through portion is formed.

In the above-described inspection method for a direction applied to a semiconductor package according to the present invention, a photodetector comprising a light projecting means and a light receiving means which are disposed opposite to each other at an appropriate interval is provided. The semiconductor package of the present invention is brought close to the photodetector so as to maintain a predetermined positional relationship, and in this approach state, the radiated light from the light projecting means passes through the through portion formed in the package to the light receiving means. It is configured to determine whether or not the semiconductor package of the present invention is in the correct orientation according to whether or not light is received.

[0010]

According to a preferred embodiment of the present invention, the through portion of the semiconductor package has a cutout formed in one of the side surfaces of the semiconductor package from which the external electrode group is not drawn out. It is composed of

[0011]

FIG. 1 is a perspective view showing the structure of a semiconductor package 10 according to one embodiment of the present invention. A semiconductor device is accommodated in a mold resin package 11 by sealing, and a plurality of external electrode groups 13 are drawn out from both side surfaces of the package 11. In FIG.
For convenience of illustration, a structure in which six external electrode groups 13 are formed on both side surfaces of the package 11 is illustrated.
The number of the external electrode groups 13 is much larger, and as many as 120.

The two indices 14 formed on the upper surface of the package 11 are print marks indicating the positions of the front and rear ends of the external electrode group 13 inside the package 11. The half-moon shaped notch 12 is
A penetrating portion is formed at the front end portion (in the drawing, in the front direction). As will be described later, the size of the notch 12 is determined in consideration of the accuracy of the position when the semiconductor package 10 is attached to the orientation inspection device and the diameter of the irradiation light.

The penetrating portion may have an appropriate shape other than the notch 12 as long as it penetrates the package 11 in the vertical direction. The position of the penetrating part may be an appropriate part as long as it is not the center part of the package 11 but the front end direction or the rear end direction. Further, the position of the penetrating portion is a position distant from the external electrode group 13, for example, as shown in FIG.
Is formed as a notch 12 on one of the side surfaces from which no is drawn out.

An example of the method of inspecting the orientation of the semiconductor package 10 according to one embodiment of the present invention will be described with reference to the perspective view of FIG. A photodetector is provided in which the light projector P and the light receiver D are opposed to each other with an appropriate interval larger than at least the thickness of the semiconductor package 10 to be inspected. The semiconductor package 10 of the present embodiment having the structure shown in FIG. 1 is brought close to the photodetector so as to maintain a predetermined positional relationship. In this approach state, the projector P
Depending on whether or not the radiation light from
It is detected whether or not the semiconductor package 10 is oriented correctly.

That is, when the semiconductor package 10 is approached in the correct direction as shown in FIG.
The light emitted from the light source passes through the notch 12 and
And it is determined that the orientation is correct. On the other hand, when the semiconductor package 10 is in a state opposite to the state shown in FIG. 2, the light emitted from the light projector P is reflected on the upper surface of the package 11 where the notch 12 is not formed, and Since it is not detected by D, it is determined that the direction is opposite.

[0016]

As described above in detail, according to the semiconductor package of the present invention and the method of inspecting the orientation of the package, a penetrating portion such as a notch is formed in the package, and irradiation light from the light projecting means is penetrated. This is a configuration that determines whether the direction is normal or not depending on whether or not the light is detected by the light receiving means through the unit. Is improved.

FIG. 3 shows the orientation inspection method according to the prior art shown in FIG. 5 and the orientation inspection method according to the present invention shown in FIG. 2 for a semiconductor package having a flaw or foreign matter attached to the upper surface of the package. And experimental data obtained by comparing the erroneous determination rates by the respective methods. According to the inspection method of the present invention, the erroneous determination rate is 2 to 3%.
It is nearly one digit lower than in the 0% range.

Further, according to the inspection method of the present invention, a camera and a high-speed computer for shortening the processing time for binarization and the like are not required, so that the inspection apparatus is inexpensive. . As a result, the operating rate of a processing device for processing a semiconductor device, such as an inspection device or a marking, at a later stage is increased, and the number of rejected products is reduced so that the manufacturing cost is reduced. Further, since an illumination light source for the camera is not required, adjustment of the position and the light amount is naturally unnecessary, and there is an advantage that maintenance is free.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a configuration of a semiconductor package according to one embodiment of the present invention.

FIG. 2 is a perspective view for explaining a method of inspecting the orientation of the semiconductor package of FIG. 1;

FIG. 3 is experimental data showing a comparison of the erroneous orientation determination rate between the inspection method of the present invention in FIG. 2 and the conventional inspection method in FIG.

FIG. 4 is a perspective view showing a configuration of a conventional typical semiconductor package.

FIG. 5 is a perspective view for explaining the conventional typical semiconductor package orientation inspection method.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Semiconductor package 11 Package in which semiconductor device is accommodated 12 Notch (penetrating part) 13 External electrode 14 Index P Projector D Receiver

Claims (5)

[Claims] 1. A semiconductor package, characterized in that a through portion is formed at a center of a package accommodating a semiconductor device and at a position of the package remote from an external electrode group drawn out of the package. 2. The semiconductor package according to claim 1, wherein the through portion is formed by a cutout formed in one of the side surfaces of the package from which the external electrode group is not drawn out. 3. A semiconductor package having a through portion substantially perpendicular to a direction in which an external electrode group of a package containing a semiconductor device is formed. 4. A photodetector comprising a light projecting means and a light receiving means which are disposed opposite to each other with an appropriate distance therebetween is installed, and a center of a package for accommodating the semiconductor device and the package are drawn out of the package. A semiconductor package having a penetrating portion formed at a position of the package away from the external electrode group to be brought close to the photodetector so as to maintain a predetermined positional relationship with the photodetector; Inspecting the orientation of the semiconductor package, wherein it is determined whether or not the semiconductor package is in a correct orientation, depending on whether or not light is received by the light receiving means through a through portion formed in the package. Method. 5. The semiconductor device according to claim 4, wherein the penetrating portion of the semiconductor package comprises a cutout formed in one of the side surfaces of the package from which the external electrode group is not drawn out. Inspection method for semiconductor package orientation.