JPS61246609A - Inspecting apparatus of shape - Google Patents

Abstract

PURPOSE:To enable the inspection of the deformation of a pattern in all directions, by moving an object to be inspected, such as lead pins of IC, which is irradiated and has the same continuous pattern. CONSTITUTION:IC 11 is conveyed at a prescribed speed in the direction of an arrow. When a laser beam is applied to an end part of a lead pin array 12a, the beam reflected therefrom is given to a photoelectric transducing element 16. In the case when each lead pin is normal, a pulse signal is obtained at a fixed interval and with fixed intensity from the element 16. When the lead pin is bent in the perpendicular direction to the lead array 12a, however, the intensity of an output pulse of the element 16 corresponding to the bent part lowers. When the lead pin is bent in the direction along the lead array 12a, on the other hand, the width of the output pulse of the element 16 is varied. By measuring the number of the interval of the output pulse of the element 16, accordingly, the deformation of the lead pin in all directions can be inspected.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a shape inspection device for inspecting the shape of, for example, lead pins of a completed IC.

[Technical background of the invention and its problems] -1. In a molded IC, it is necessary to inspect the shape of the lead pin. This is because if the lead pin is not in the correct shape, it cannot be inserted into the IC socket.
This is because soldering may not be possible. Examples of the shape defects of the lead pins include bending in the direction along the lead pin row as shown by the broken line in FIG. 10, bending in the direction perpendicular to the lead pin row as shown by the broken line in FIG. 11, etc.

In FIGS. 10 and 11, 11 is a package in which an IC chip is housed, and 12a and 12b are lead pin rows. Conventionally, an ITV camera is used to inspect the shape defects of such IC lead pins. That is, the lead pin row 12 as shown in FIG.
When detecting a bend in the direction along a, the 12th
The inspection is carried out by photographing with an ITV camera from the directions shown by arrows A and B in the figure, and from the directions of arrows C and D in FIG. 12 for bending in the direction shown in FIG. 11, respectively. Therefore, in the case of a dual in-line package, four ITV cameras are required, resulting in high cost.

[Object of the invention] This invention was made in view of the above circumstances,
The purpose is to provide an excellent shape inspection device that is inexpensive and capable of inspecting pattern deformations in all directions in an object to be inspected that has the same continuous pattern.

[Summary of the Invention] That is, in order to achieve the above object, in the present invention, an object to be inspected on which the same pattern is continuously formed is transported by a transport means in a direction along the pattern row, The irradiating means irradiates light in a direction perpendicular to the direction in which the object to be inspected is conveyed by the conveying means, and the light from the pattern of the object to be inspected is received by the light receiving means. Then, based on the output of the light receiving means, the number of patterns and the intervals between patterns on the object to be inspected are inspected by a pattern inspection means.

[Embodiment of the Invention] Hereinafter, an embodiment of the present invention will be described with reference to the drawings. The dual inline package type IC 11 shown in FIG.
2b, and the lead pin rows 12a, 12b are conveyed by a conveyance means (for example, placed on a conveyance belt) not shown.
It is transported at a constant speed in the direction along the arrow (direction of the arrow).

When the IC 11 is transported, the laser beam from the laser oscillator 13 is focused by the lens 14, and is irradiated onto the tip of the IC 11 in a direction perpendicular to the transport direction of the IC 11 and at a predetermined angle with respect to the lead pin row 12a. . The reflected light from the lead pin row 12a is imaged onto the photoelectric conversion element 16 by the lens 15. In order to simplify the explanation, the following explanation will focus on one of the lead pin rows 12a, but a similar device is also provided for the lead pin row 12b.

The output of the photoelectric conversion element 16 is supplied to a binarization circuit 17 and binarized as shown in FIG. The output of this binarization circuit 17 is supplied to a lead pin interval measuring circuit (pattern interval measuring circuit) 18 and a lead pin number counting circuit (pattern number counting circuit) 19. The outputs of the lead pins are respectively supplied to a determination circuit 20 to determine whether the shape of each lead pin is normal or not, and an output signal OUT is obtained.

The lead pin spacing measurement circuit 18. The lead pin number counting circuit 19 and the determination circuit 20 are each connected to the control circuit 2.
1 output.

Next, the operation of the above configuration will be explained with reference to FIGS. 3 to 7. When the ICII is transported at a constant speed and the tip of the lead pin row i2a is irradiated with laser light, the reflected light is incident on the charge conversion element 16 and converted into an electric signal.

Now, assuming that the shape of each lead pin is normal, the third
As shown in the figure, pulse signals having constant intervals and constant intensity are obtained from the photoelectric conversion element 16. However, if the lead pin is bent in the direction perpendicular to the lead pin row 12a as shown by the broken line in FIG.
Alternatively, as shown by the two-dot chain line 23, the reflected light is not accurately incident on the photoelectric conversion element 16, so that the intensity of the output pulse of the photoelectric conversion element 16 corresponding to the bent portion of the lead pin decreases as shown in FIG. . Therefore, if the output signal of the photoelectric conversion element 16 is supplied to the binarization circuit 17 and binarized, and the number of output pulses of the binarization circuit 17 is counted by the dot pin number counting circuit 19, the following result can be obtained. Defects can be detected. On the other hand, if the lead pins are bent in the direction along the lead pin row 12a, as shown by the broken line in FIG.
Correspondingly, as shown in FIG. 7, the widths tt and t2 of the output pulses of the photoelectric conversion element 16.

t3... changes. Therefore, by measuring the interval between each lead pin using the lead pin interval measuring circuit 18, bending of the lead pin in the direction along the lead pin row 12a can be detected. Based on the outputs of the lead pin spacing measuring circuit 1B and the lead pin number counting circuit 19, the determination circuit 20 determines that the lead pin spacing and number are normal when both the lead pin spacing and the number match preset values, and otherwise it is abnormal. I judge that there is.

According to such a configuration, deformation of the lead pin in any direction can be reliably detected without using many expensive cameras.

FIG. 8 shows another embodiment of the invention.

That is, in the above embodiment, the laser beam is transmitted to the lead pin row 12.
Whereas the laser beam was irradiated at one location (the tip part) of a, a half mirror 24 was used to separate the laser beam, irradiated two locations on the lead pin, and the two photoelectric conversion elements 16 and 18 reflected the laser beam. It is designed to receive light. In the figure, the same components as those in FIG. 1 are given the same reference numerals, and detailed explanation thereof will be omitted. According to such a configuration, in the above embodiment, a complicated deformation as shown by the broken line in FIG. Detection is possible by comparing the outputs of

[Effects of the Invention] As described above, according to the present invention, it is possible to obtain an excellent shape inspection device that is inexpensive and capable of inspecting pattern deformation in all directions in an object to be inspected that has the same continuous pattern.

[BRIEF DESCRIPTION OF THE DRAWINGS] FIG. 1 is a block diagram showing a schematic configuration of a shape inspection device according to an embodiment of the present invention, and FIG. 2 is a block diagram showing a schematic configuration of an electric circuit of the shape inspection device shown in FIG. 1 above. Figures 3 through 7 show the shape inspection S! shown in Figures 1 and 2 above, respectively. FIG. 8 is a diagram for explaining another embodiment of the present invention; FIG. 9 is a diagram for explaining the operation of the device shown in FIG. 8; FIG. 10 is a diagram for explaining the operation of the device shown in FIG. or first
FIG. 2 is a diagram for explaining a conventional shape inspection device. 11・I C (tested object), 12a, 12b...Lead! : 'n row (pattern row), 13... laser oscillator (irradiation means), 16... photoelectric conversion element (light receiving means)
, 17... Binarization circuit, 18... Lead pin spacing measuring circuit (pattern spacing measuring circuit), 19... Lead pin number counting circuit (pattern number counting circuit), 20... Judgment circuit, 21...・Control circuit. Applicant's representative Patent attorney Takehiko Suzue Figure 4 Figure 6 Figure 2a Figure 7 2a 12a Figure 11 Figure 12

Claims (6)

[Claims] (1) A transport means for transporting an object to be inspected on which the same pattern is continuously formed in a direction along the pattern row, and irradiation of light in a direction perpendicular to the direction in which the object to be inspected is transported by this transport means. The method includes an irradiation means, a light receiving means for receiving light from the patterns of the object to be inspected, and a pattern inspection means for inspecting the number of patterns and the spacing thereof on the object to be inspected based on the output of the light receiving means. A shape inspection device featuring: (2) The shape inspection apparatus according to claim 1, wherein the object to be inspected is an IC, and the shape of a lead pin of this IC is inspected. (3) The pattern inspection means includes a binarization circuit that binarizes the output of the light receiving unit, a pattern number counting circuit that counts the number of patterns based on the output of the binarization circuit; a pattern interval measuring circuit that measures the interval between the respective patterns based on the output of the value converting circuit; and whether or not the pattern of the object to be inspected is normal based on the outputs of the pattern number counting circuit and the pattern interval measuring circuit. 2. The shape inspection apparatus according to claim 1, comprising: a determination circuit that determines the number of patterns; and a control circuit that controls the pattern number counting circuit, the pattern interval measurement circuit, and the determination circuit, respectively. (4) The shape inspection apparatus according to claim 1, wherein the light of the irradiation means is a laser beam. (5) The shape inspection apparatus according to claim 2, wherein the light from the irradiation means is irradiated onto the tip of a lead pin of an IC. (6) When the IC is a dual in-line package, the shape inspection apparatus according to claim 2, wherein the light from the irradiation means is irradiated from both sides of the IC.