JPH02278380A - Polarity discriminating inspection system for smd by picture processing - Google Patents

Polarity discriminating inspection system for smd by picture processing

Info

Publication number
JPH02278380A
JPH02278380A JP1099262A JP9926289A JPH02278380A JP H02278380 A JPH02278380 A JP H02278380A JP 1099262 A JP1099262 A JP 1099262A JP 9926289 A JP9926289 A JP 9926289A JP H02278380 A JPH02278380 A JP H02278380A
Authority
JP
Japan
Prior art keywords
smd
notch
polarity
package
image processing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1099262A
Other languages
Japanese (ja)
Other versions
JPH0775035B2 (en
Inventor
Toshio Sasano
笹野 敏雄
Mikinori Oida
笈田 幹則
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
PFU Ltd
Original Assignee
PFU Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by PFU Ltd filed Critical PFU Ltd
Priority to JP1099262A priority Critical patent/JPH0775035B2/en
Publication of JPH02278380A publication Critical patent/JPH02278380A/en
Publication of JPH0775035B2 publication Critical patent/JPH0775035B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0266Marks, test patterns or identification means
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/18Printed circuits structurally associated with non-printed electric components
    • H05K1/181Printed circuits structurally associated with non-printed electric components associated with surface mounted components

Abstract

PURPOSE:To improve the precision and the efficiency of polarity discriminating inspection by projecting light upon the package corner part of an SMD on which a notch for polarity discrimination is provided, and detecting the presence of the notch by discriminating a notched surface from picture information obtained by an image pickup means. CONSTITUTION:A picture processing device 11 fetches the picture information in which the image of the prescribed position of the SMD (surface mounted element) 13 is picked up, and discriminates the polarity of the SMD 13 by picture processing. An illuminating means 15 and the image pickup means 17 are arranged at a position which fetches the reflected light of the notched surface when the light is projected upon the package corner part of the SMD 13 on which the notch for polarity discrimination is provided. A notch detecting means 19 discriminates the notched surface from the picture information obtained by this image pickup means 17, and detects the presence of the notch. Thus, influence by burrs or others can be suppressed to be the minimum, and the precision and the efficiency of the polarity discriminating inspection can be improved.

Description

【発明の詳細な説明】 (4既  要〕 プリント基板その他に実装されるSMDの極性を識別す
る極性識別検査方式に関し、 極性識別検査の精度および効率を改善することができる
ことを目的とし、 画像処理装置にSMDの所定位置を過像した画像情報を
取り込み、画像処理によりその極性を識別するSMDの
極性識別検査方式において、極性識別用の切欠きが設け
られるSMDのパッケージ角部に光を当て、切欠き面の
反射光を取り込む位置に照明手段および撮像手段を配置
し、この撮像手段で得られる画像情報から切欠き面を識
別し、切欠きの有無を検出する切欠き検出手段を備え構
成する。
[Detailed Description of the Invention] (4 Already Required) The present invention relates to a polarity identification inspection method for identifying the polarity of an SMD mounted on a printed circuit board or the like, and is intended to improve the accuracy and efficiency of the polarity identification inspection, and to improve the accuracy and efficiency of the polarity identification inspection. In the SMD polarity identification inspection method, in which image information of a predetermined position of the SMD is captured into a device and its polarity is identified through image processing, light is applied to the corner of the SMD package where a notch for polarity identification is provided; An illumination means and an imaging means are arranged at a position to take in reflected light from the notch surface, and a notch detection means is provided for identifying the notch surface from image information obtained by the imaging means and detecting the presence or absence of a notch. .

〔産業上の利用分野〕[Industrial application field]

本発明は、プリント基板その他に実装されるSMD(本
明細書では「表面実装素子」をいう。)の極性を識別す
る極性識別検査方式に関する。
The present invention relates to a polarity identification inspection method for identifying the polarity of an SMD (herein referred to as a "surface mount device") mounted on a printed circuit board or the like.

デバイストレーに所定の向きで収納されているSMDを
プリント基板に装着する際には、ビックアンプしたSM
Dをプリント基板上の配置に従った所定の向きに変える
処理(極性合わせ)が必要になる。本発明の画像処理に
よるSMDの極性識別検査方式は、この極性合わせの処
理に必要なSMDの極性識別に利用される。
When installing the SMD stored in the device tray in the specified orientation on the printed circuit board, it is necessary to
A process (polarity matching) is required to change the direction of D to a predetermined orientation according to the arrangement on the printed circuit board. The SMD polarity identification inspection method using image processing of the present invention is used for SMD polarity identification necessary for this polarity matching process.

[従来の技術] 従来の画像処理によるSMDの極性識別は、SMDのパ
ッケージ角部に捺印された極性識別用マークを認識して
行われていた。
[Prior Art] Conventionally, the polarity of an SMD has been identified by image processing by recognizing a polarity identification mark stamped on the corner of the SMD package.

第7図は、SMDの極性識別検査の従来方式を説明する
図である。
FIG. 7 is a diagram illustrating a conventional method for testing the polarity of an SMD.

第7図(1)は、SMD71、カメラ74、照明75の
位置関係を装置側面から見た状態で示す。第7図(2)
は、SMD71のパッケージ角部に捺印されている極性
識別用マーク72が、カメラ74の視野76内に設けら
れたウィンド77に収められた状態を示す。参照番号7
3はSMD71のリードである。
FIG. 7(1) shows the positional relationship among the SMD 71, camera 74, and illumination 75 when viewed from the side of the device. Figure 7 (2)
shows a state in which the polarity identification mark 72 stamped on the corner of the package of the SMD 71 is housed in a window 77 provided within the field of view 76 of the camera 74. Reference number 7
3 is the lead of SMD71.

画像処理では、ウィンド77内に極性識別用マーク72
があるか否かによりSMD71の極性識別を行っている
。なお、ウィンド77内に極性識別用マークが検出され
ない場合には、所定の操作によりSMD71を回転(9
0°)させ、同様の処理を繰り返して極性合わせを行う
In image processing, a polarity identification mark 72 is placed inside the window 77.
The polarity of the SMD 71 is identified based on whether or not the SMD 71 is present. Note that if the polarity identification mark is not detected within the window 77, rotate the SMD 71 (9) by a predetermined operation.
0°) and repeat the same process to match the polarity.

[発明が解決しようとする課題] ところが、このような方式では、極性識別用マーク72
が捺印ミスにより不鮮明あるいは所定の位置(ウィンド
77)からずれていたり、またその一部が剥がれて不鮮
明になっている場合には、正確な極性識別用マークの撮
像ができないために極性識別が困難になり、時には認識
ミスになることがあった。
[Problems to be Solved by the Invention] However, in such a system, the polarity identification mark 72
If the mark is unclear or deviated from the designated position (window 77) due to a printing error, or if a part of it is peeled off and becomes unclear, it is difficult to identify the polarity because it is impossible to accurately image the polarity identification mark. This sometimes resulted in recognition errors.

また、SMDは多種多様であり、その大きさもいろいろ
あるために、照明75の当て方、視野76の大きさ、検
査領域(ウィンド77)の設定、位置決め精度などに応
じて極性識別検査の精度も左右され、極性識別効率を著
しく低下させることがあった。
Furthermore, since there are a wide variety of SMDs and their sizes, the accuracy of the polarity identification test depends on the way the illumination 75 is applied, the size of the field of view 76, the setting of the inspection area (window 77), the positioning accuracy, etc. polarity discrimination efficiency.

一方、このような問題点を解決するために、SMDのパ
ッケージ角部の一つに設けられた切欠きを利用し、リー
ドの位置からパッケージ角部を含むウィンドを設定し、
切欠きの有無を検出することにより極性を識別する方式
が同一出願人により特許出願(特願昭63−27266
1)された。
On the other hand, in order to solve this problem, a notch provided in one of the corners of the SMD package is used to set a window that includes the package corner from the lead position.
A patent application (Japanese Patent Application No. 63-27266) was filed by the same applicant for a method for identifying polarity by detecting the presence or absence of notches.
1) It was done.

第8図(1)は、ウィンド81内の角の数nが1である
ので切欠きかない、すなわち極性でないと判断する状態
を示す図である。第8図(2)は、ウィンド81内の角
の数nが0であるので切欠きがある、すなわち極性であ
ると判断する状態を示す図である。なお、参照番号83
はSMDであり、参照番号85はそのリードである。
FIG. 8(1) is a diagram showing a state in which it is determined that since the number n of corners in the window 81 is 1, there is no notch, that is, there is no polarity. FIG. 8(2) is a diagram showing a state in which it is determined that since the number n of corners in the window 81 is 0, there is a notch, that is, it is determined to be polar. In addition, reference number 83
is an SMD, and reference number 85 is its lead.

ところで、SMDの上部パッケージと下部パ・ソケージ
の接合部にパリがつくことがある。先願方式による画像
処理では、このようなハリが極性識別用の切欠き部分に
ある場合には、その)<りにより切欠きの有無の識別が
困難になることがあった。
By the way, burrs may form at the joint between the upper package and the lower package of the SMD. In the image processing according to the prior application method, if such a bulge exists in the notch portion for polarity identification, it may become difficult to identify the presence or absence of the notch due to the curvature.

すなわち、切欠きがあるもにかかわらず角として識別す
ることがあり、同様の認識ミスに結びついていた。
That is, even if there is a notch, it may be recognized as a corner, leading to similar recognition errors.

本発明は、パリその他による影響を最小限に抑え、極性
識別検査の精度および効率を改善することができる画像
処理によるSMDの極性識別検査方式を提供することを
目的とする。
SUMMARY OF THE INVENTION An object of the present invention is to provide an SMD polarity identification testing method using image processing that can minimize the influence of Paris and other factors and improve the accuracy and efficiency of polarity identification testing.

(課題を解決するための手段) 第1図は、本発明の原理ブロック図である。(Means for solving problems) FIG. 1 is a block diagram of the principle of the present invention.

図において、画像処理装置11はSMDl 3の所定位
置を撮像した画像情報を取り込み、画像処理によりSM
Dの極性の識別を行なう。
In the figure, an image processing device 11 takes in image information obtained by imaging a predetermined position of the SMD1 3, and performs image processing to
Identify the polarity of D.

照明手段15および撮像手段17は、極性識別用の切欠
きが設けられるSMD 13のパッケージ角部に光を当
て、切欠き面の反射光を取り込む位置に配置される。
The illumination means 15 and the imaging means 17 are arranged at positions to shine light on the corners of the package of the SMD 13 in which a notch for polarity identification is provided, and to take in reflected light from the notch surface.

切欠き検出手段19は、この撮像手段で得られる画像情
報から切欠き面を識別し、切欠きの有無を検出する。
The notch detection means 19 identifies the notch surface from the image information obtained by this imaging means and detects the presence or absence of a notch.

〔作 用〕[For production]

本発明は、SMD l 3の切欠き面を撮像できる位置
に照明手段15および損保手段17を配置し、切欠き検
出手段19がその画像情報から切欠き面を識別して切欠
きの有無を検出することにより、極性の識別を行なうこ
とができる。
In the present invention, the illumination means 15 and the insurance means 17 are arranged at a position where the notch surface of the SMD l 3 can be imaged, and the notch detection means 19 identifies the notch surface from the image information and detects the presence or absence of a notch. By doing so, the polarity can be identified.

すなわち、SMD 13のパッケージ角部の一つに設け
られた切欠きを利用し、その有無を検出することにより
極性を識別するが、本発明方式は、パッケージ角部に光
を当てる照明手段15およびそれを撮像する描像手段(
カメラ)17の位置を工夫し、切欠きの有無の検出精度
を向上させるものである。
That is, the polarity is identified by detecting the presence or absence of a notch provided in one of the package corners of the SMD 13, but the method of the present invention uses the illumination means 15 that shines light on the package corner and Imaging means to image it (
The position of the camera) 17 is improved to improve the accuracy of detecting the presence or absence of a notch.

〔実施例〕〔Example〕

以下、図面に基づいて本発明の実施例について詳細に説
明する。
Hereinafter, embodiments of the present invention will be described in detail based on the drawings.

第2図は、本発明方式を実現する装置の実施例構成を示
すブロック図である。
FIG. 2 is a block diagram showing the configuration of an embodiment of a device that implements the method of the present invention.

図において、ロボットハンド21は制御装置23からの
制御信号に応じてSMD24をピックアップし、また所
定の向きに回転させる。照明25が取り付けられたカメ
ラ26は、SMD24のパッケージ角部を撮像し、その
画像情報を画像処理装置27に送出する。ロボットハン
ド21には、照明25の光をSMD24のパッケージ角
部に当て、その反射光をカメラ26に入射させる所定の
角度を有する鏡22が設置される。なお、ここでは、ロ
ボットハンド21がSMD24をピックアップし、カメ
ラ26の撮像位置(視野内)まで移動させる構成とする
In the figure, a robot hand 21 picks up an SMD 24 in response to a control signal from a control device 23 and rotates it in a predetermined direction. A camera 26 to which a lighting 25 is attached takes an image of the package corner of the SMD 24 and sends the image information to an image processing device 27 . A mirror 22 having a predetermined angle is installed on the robot hand 21 so that the light from the illumination 25 is directed to the corner of the package of the SMD 24 and the reflected light is incident on the camera 26 . Note that here, the robot hand 21 picks up the SMD 24 and moves it to the imaging position (within the field of view) of the camera 26.

第3図は、本実施例における鏡22、SMD24、照明
25およびカメラ26の位置関係を説明する図である。
FIG. 3 is a diagram illustrating the positional relationship among the mirror 22, SMD 24, illumination 25, and camera 26 in this embodiment.

図において、カメラ26にリングライトとして取り付け
られる照明25から発せられた光は、鏡22によりその
光路が曲げられてSMD24のパッケージ角部に当てら
れる。その反射光は、鏡22により再びその光路が曲げ
られてカメラ26に入射される。
In the figure, the light emitted from a light 25 attached to a camera 26 as a ring light has its optical path bent by a mirror 22 and is applied to a corner of the SMD 24 package. The optical path of the reflected light is bent again by the mirror 22 and enters the camera 26.

なお、ここでは、切欠き面に対してほぼ垂直に光が当て
られるように配置されるものとする。また、ここでは、
照明25およびカメラ26が鏡22を介してSMD24
のパッケージ角部に対応する位置に設置されているが、
照明25の光をSMD24のパッケージ角部に直接溝て
、その反射光を鏡22を介してカメラ26に入射させる
配置でもよい。
Here, it is assumed that the notch is arranged so that the light is applied almost perpendicularly to the notch surface. Also, here:
A light 25 and a camera 26 are connected to the SMD 24 via a mirror 22.
It is installed in a position corresponding to the corner of the package,
An arrangement may also be used in which the light from the illumination 25 is directed directly into the corner of the package of the SMD 24 and the reflected light is made to enter the camera 26 via the mirror 22.

第4図は、SMDの撮像からその極性識別までの画像処
理の一例を説明するフローチャートである。
FIG. 4 is a flowchart illustrating an example of image processing from SMD imaging to polarity identification.

第5図は、画像処理画面の一例を示す図である。FIG. 5 is a diagram showing an example of an image processing screen.

第5図において、視野31内には、画像処理用のウィン
ド33が設けられる。ここでは、SMD24のパッケー
ジ角部の一つに設けられる極性識別用の切欠き面35が
ウィンド33内に入った状態を示す。参照番号37はS
MD24のリードである。
In FIG. 5, a window 33 for image processing is provided within the field of view 31. As shown in FIG. Here, a state is shown in which a notch surface 35 for polarity identification provided at one corner of the package of the SMD 24 is inside the window 33. Reference number 37 is S
This is the lead of MD24.

以下、第2図〜第5図を参照して本発明実施例の動作に
ついて説明する。
The operation of the embodiment of the present invention will be described below with reference to FIGS. 2 to 5.

SMD24は、ロボットハンド21によりカメラ26の
視野31内に運ばれ、ウィンド33の位置にそのパッケ
ージ角部が入るように合わせられ、撮像が行われる。
The SMD 24 is carried into the field of view 31 of the camera 26 by the robot hand 21, aligned so that the corner of the package is in the position of the window 33, and an image is taken.

この位置では、照明25の光が鏡22によりSMD24
のパッケージ角部に当てられ、その反射光が鏡22によ
りカメラ26に入射され、第5図に示す画像処理画面が
得られる。
In this position, the light from the illumination 25 is transmitted to the SMD 24 by the mirror 22.
The reflected light is incident on the camera 26 by the mirror 22, and the image processing screen shown in FIG. 5 is obtained.

画像処理装置27では、ウィンド33内に切欠き面35
があるか否かについて、ウィンド33内で所定光度以上
になっている像の面積を抽出し、その面積に応じて切欠
きの有無を検出し、極性がどうかを識別する。
In the image processing device 27, a notch surface 35 is formed in the window 33.
As for whether or not there is a notch, the area of the image whose luminous intensity is above a predetermined level within the window 33 is extracted, the presence or absence of a notch is detected according to the area, and the polarity is identified.

すなわち、SMD24のパッケージ角部に切欠きがあれ
ば、ウィンド33内には第6図(1)に示すように所定
の面積をもつ像(切欠き面)61が検出され、極性であ
ると識別することができる。また、SMD24のパッケ
ージ角部に切欠きがなければ、ウィンド33内には第6
図(2)に示すようにその頂部が線として表される像6
3が検出され、極性でないと識別することができる。
That is, if there is a notch in the corner of the package of the SMD 24, an image (notch surface) 61 with a predetermined area is detected in the window 33 as shown in FIG. 6(1), and it is identified as polarity. can do. Also, if there is no notch in the corner of the package of the SMD 24, the sixth
Image 6 whose top is represented as a line as shown in Figure (2)
3 is detected and can be identified as non-polar.

ここで、切欠きがなG・(極性でない)と識別された場
合には、ロボントハンド21を操作して次のパッケージ
角部の識別を行ない、切欠きを検出するまで同様の処理
が繰り返され極性合わせが行なわれる。
Here, if the notch is identified as G (not polar), the robot hand 21 is operated to identify the next corner of the package, and the same process is repeated until the notch is detected. A match is made.

なお、本実施例では、罹性識別用の画像情報を得るカメ
ラ26として、リードの曲がりを検査する外観検査機な
どのチエツク用カメラを共用する構成を示したので鏡2
2を必要としたが、独立したカメラを使用する場合には
、直接切欠き面に垂直に光を当て、その反射光を取り込
む位置にカメラおよび照明を配置してもよい。
In this embodiment, the mirror 2 is used as the camera 26 for obtaining image information for susceptibility identification.
However, if an independent camera is used, the camera and lighting may be placed at a position where light is directly applied perpendicularly to the cutout surface and the reflected light is captured.

〔発明の効果〕〔Effect of the invention〕

上述したように、本発明によれば、SMDの種類および
大きさ、さらにパッケージのパリに影古されずに、確実
にそのパンケージ角部のモールド形状(切欠き)を識別
することが可能である。
As described above, according to the present invention, it is possible to reliably identify the mold shape (notch) of the corner of the pan cage without being influenced by the type and size of the SMD or the edges of the package. .

また、SMDの外観(切欠き)の認識により極性を識別
するために、極性識別用マークの捺印不良その他による
識別誤りがなくなり、識別精度および効率の改善を図る
ことができる。
Furthermore, since the polarity is identified by recognizing the external appearance (notch) of the SMD, identification errors due to poor marking of the polarity identification mark or the like are eliminated, and identification accuracy and efficiency can be improved.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本発明の原理ブロック図、 第2図は本発明方式を実現する装置構成の一例を示すプ
ロ・ツク図、 第3図は実施例における位置関係を説明する図、第4図
は本発明方式による画像処理の一例を説明するフローチ
ャート、 第5図は画像処理画面の一例を示す図、第6図は本発明
方式による極性識別例を示す図、第7図はSMDの極性
識別検査の従来方式を説明する図、 第8図は先願方式による極性識別例を示す図である。 図において、 11は画像処理装置、 3はSM、D。 5は照明手段、 7は撮像手段、 9は切欠き検出手段、 ■はロボットハンF゛、 2は鏡、 3は制御装置、 4はSMD。 5は照明、 6はカメラ、 7は画像処理装置、 1は視野、 3はウィンド、 5は切欠き面、 7はリード、 鳳 63は像である。 本発明原理ブロック図 第1図 本発明方式を実現する装置構成の一例を示すブロック図
第 図 実施例における位置関係を説明する図 本発明方式による極性識別例を示す図 第 図 本発明方式による画像処理の一例を説明するフローチャ
ート第4図 面像処理画面の一例を示す図 SMDの極性識別検査の従来方式を説明する図第7図
Fig. 1 is a block diagram of the principle of the present invention, Fig. 2 is a block diagram showing an example of a device configuration for realizing the method of the present invention, Fig. 3 is a diagram explaining the positional relationship in the embodiment, and Fig. 4 is a block diagram of the principle of the present invention. A flowchart illustrating an example of image processing according to the method of the present invention, FIG. 5 is a diagram showing an example of an image processing screen, FIG. 6 is a diagram showing an example of polarity identification according to the method of the present invention, and FIG. 7 is a polarity identification test for SMD. FIG. 8 is a diagram illustrating an example of polarity identification using the prior application method. In the figure, 11 is an image processing device, 3 is an SM, and D is. 5 is an illumination means, 7 is an imaging means, 9 is a notch detection means, (2) is a robot hand F, 2 is a mirror, 3 is a control device, and 4 is an SMD. 5 is a light, 6 is a camera, 7 is an image processing device, 1 is a field of view, 3 is a window, 5 is a notch surface, 7 is a lead, and 63 is an image. Fig. 1 is a block diagram of the principles of the present invention. Fig. 1 is a block diagram showing an example of a device configuration for realizing the method of the present invention. Fig. is a diagram explaining the positional relationship in an embodiment. Fig. is a diagram showing an example of polarity identification according to the method of the present invention. Flowchart illustrating an example of processing. 4th figure. 4th figure illustrating an example of an image processing screen. 7th figure illustrating the conventional method of SMD polarity identification inspection.

Claims (1)

【特許請求の範囲】[Claims] (1)画像処理装置(11)にSMD(13)の所定位
置を撮像した画像情報を取り込み、画像処理によりその
極性を識別するSMDの極性識別検査方式において、 極性識別用の切欠きが設けられるSMD(13)のパッ
ケージ角部に光を当て、切欠き面の反射光を取り込む位
置に照明手段(15)および撮像手段(17)を配置し
、 この撮像手段(17)で得られる画像情報から切欠き面
を識別し、切欠きの有無を検出する切欠き検出手段(1
9)を備えた ことを特徴とする画像処理によるSMDの極性識別検査
方式。
(1) In the SMD polarity identification inspection method, which captures image information of a predetermined position of the SMD (13) into the image processing device (11) and identifies its polarity through image processing, a notch for polarity identification is provided. An illumination means (15) and an imaging means (17) are arranged at a position where light is applied to the corner of the package of the SMD (13) and reflected light from the notch surface is captured, and from the image information obtained by this imaging means (17), Notch detection means (1) that identifies the notch surface and detects the presence or absence of a notch.
9) An SMD polarity identification inspection method using image processing.
JP1099262A 1989-04-19 1989-04-19 SMD polarity discrimination inspection device by image processing Expired - Lifetime JPH0775035B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1099262A JPH0775035B2 (en) 1989-04-19 1989-04-19 SMD polarity discrimination inspection device by image processing

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1099262A JPH0775035B2 (en) 1989-04-19 1989-04-19 SMD polarity discrimination inspection device by image processing

Publications (2)

Publication Number Publication Date
JPH02278380A true JPH02278380A (en) 1990-11-14
JPH0775035B2 JPH0775035B2 (en) 1995-08-09

Family

ID=14242793

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Application Number Title Priority Date Filing Date
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Country Status (1)

Country Link
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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002374098A (en) * 2001-04-13 2002-12-26 Yamaha Corp Semiconductor package and its mounting method
CN108064127A (en) * 2016-11-07 2018-05-22 Juki株式会社 Polarity discriminating device, erecting device, polarity discriminating method
EP3501378A1 (en) * 2017-12-22 2019-06-26 Koninklijke Philips N.V. Mounting device, mounting device template, detection system amd method of use thereof
CN112378908A (en) * 2020-11-09 2021-02-19 日立楼宇技术(广州)有限公司 Capacitor polarity installation detection device and detection method

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002374098A (en) * 2001-04-13 2002-12-26 Yamaha Corp Semiconductor package and its mounting method
US7541294B2 (en) 2001-04-13 2009-06-02 Yamaha Corporation Semiconductor package and semiconductor package mounting method
CN108064127A (en) * 2016-11-07 2018-05-22 Juki株式会社 Polarity discriminating device, erecting device, polarity discriminating method
CN108064127B (en) * 2016-11-07 2021-02-26 Juki株式会社 Polarity determination device, mounting device, and polarity determination method
EP3501378A1 (en) * 2017-12-22 2019-06-26 Koninklijke Philips N.V. Mounting device, mounting device template, detection system amd method of use thereof
CN112378908A (en) * 2020-11-09 2021-02-19 日立楼宇技术(广州)有限公司 Capacitor polarity installation detection device and detection method

Also Published As

Publication number Publication date
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