JPH10244765A - Polyimide thermal recording transfer body - Google Patents

Abstract

PROBLEM TO BE SOLVED: To have a sufficient elastic modulus, and retain a long period heat resistance and chemical stability by employing a polyimide film consisting of specific two layers. SOLUTION: The polyimide thermal recording transfer body is a two layer laminate of layers A/B; herein, used is a polyimide film having the same molecular structure. The polyimide film has an elastic modules of 200kg/mm<2> or more at 180 deg.C. This is that when the film is pressed by a high temperatured head, distortion is generated in the thickness direction of the film, thereby causing images to be lowered in its quality. Besides, the polyimide film is made 0.1μm or lower in the surface roughness at the side of the thermal transfer layer (layer A) and 70% or more in luster at the surface. When the surface roughness is made 0.1μm or more and luster is 70% or less, the transfer layer is roughened to be lowered in its image quality. Also, the surface roughness at the head side (layer B) is made 0.12-1.0μm. When the surface roughness is 0.12 or less, friction becomes large to thereby cause a deterioration of the film, and when it is 1.0μm or more, the contact area becomes small, thereby getting thermal conductivity worse.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a transfer member for thermal recording of a polyimide system comprising a two-layered aromatic polyimide laminate, and more particularly to a thermal printer for performing recording by thermal fusion transfer or sublimation transfer. The present invention relates to a polyimide-based transfer member for thermosensitive recording used for a thermosensitive recording medium.

[0002]

2. Description of the Related Art As a method of transferring a color material, there are a method of applying heat and a method of applying pressure. In the method of transferring by applying heat, a transfer body for heat-sensitive recording is used, and this transfer body is generally composed of a film as a base material and a heat-sensitive transfer layer. The conventional base film used to be a polyester-based film.However, to increase the recording speed, improve print quality, and diversify the choice of color materials, the temperature of thermal heads has increased, and conventional polyester-based films have been used. At present, it is not enough for heat resistance. For this reason, a polyamide-based film or the like has been found as a substrate in place of the polyester-based film (Patent Publication No. 25).
25399), and the polyamide type has an elastic modulus at 180 ° C. of about 100 kg / mm ² .
It cannot be said that the elastic modulus is sufficient. Further, polyamides generally have high water absorption, and are unsuitable for printing equipment with advanced functions due to deterioration in image quality and durability. On the other hand, in the above-mentioned prior art, the water absorption is improved by introducing an alkyl group / alkyl chain or a halogen atom. Absent. Further, halogen atoms, particularly chlorine atoms, are unsuitable for use as a transfer body for thermal recording because there is a concern about circuit contamination.

[0003]

SUMMARY OF THE INVENTION The present invention uses a two-layer aromatic polyimide laminate to have a sufficient elasticity even at a high temperature and to maintain long-term heat resistance and chemical stability. To provide a transfer body for heat-sensitive recording of polyimide.

[0004]

Means for Solving the Problems The present inventors have conducted intensive studies to solve the above problems, and as a result, by using an aromatic polyimide laminate having two specific layers,
The present inventors have found a polyimide-based transfer member for thermosensitive recording which has a sufficient elastic modulus even at a high temperature and maintains long-term heat resistance and chemical stability, and has completed the present invention.

That is, the present invention relates to a polyimide-based thermal recording transfer member comprising a two-layer type laminated polyimide characterized by having an elastic modulus at 180 ° C. of 200 kg / mm ² or more. 0.1 μm
Hereinafter, an aromatic polyimide layer (A) having a gloss of 70% or more
And a laminate of an aromatic polyimide layer (B) having a surface roughness of 0.12 to 1.0 μm, and a thermal transfer layer is provided on the surface of the aromatic polyimide layer (A) side. More specifically, the aromatic polyimide layers (A) and (B) forming the laminate have the general formula (1)

Embedded image (Wherein, Ar has 4 to 27 carbon atoms, and is an aliphatic group, a monocyclic aliphatic group, a condensed polycyclic aliphatic group, a monocyclic aromatic group, a condensed polycyclic aromatic group, Wherein the aromatic group is a tetravalent group selected from the group consisting of non-condensed polycyclic aromatic groups connected directly or by a cross-linking member.) The present invention relates to a transfer body for use.

[0006]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The polyimide film used in the present invention has an elastic modulus at room temperature of 300 kg / mm ² or more, and preferably has an elastic modulus at 180 ° C. of 200 k / mm ^2.
g / mm ² or more. This is because, when the film is pressed by a high-temperature head, distortion occurs in the thickness direction of the film, which causes image deterioration.

The thickness of the film is desirably 1 to 20 μm, preferably 1 to 15 μm, and more preferably 2 to 10 μm.
μm. If the thickness is less than 1 μm, the strength is not sufficient.
Above μm, heat conduction is not sufficient, which causes deterioration in image quality.

When a transfer member for thermal recording is formed using this polyimide film, the transfer member is composed of a two-layer laminate, and the two layers (A layer / B layer) are polyimide films having the same molecular structure. Is desirable, but may be different.

The polyimide film of the present invention preferably has a surface roughness on the heat-sensitive transfer layer side (layer A) of 0.1 μm or less, and a surface glossiness of 70% or more. Preferably, the glossiness is 80% or more. Surface roughness 0.1μ
When the glossiness is not less than m and the glossiness is less than 70%, the surface of the transfer layer is roughened and the image quality is reduced.

The surface roughness of the head layer (layer B) is 0.12 to 1.00 μm, preferably 0.15 to 1.00 μm.
0.5 μm. If the surface roughness is less than 0.12 μm, friction with the head increases, causing deterioration of the film, and fine particles of the film that have been cut off have an adverse effect on the head, and further cause image deterioration. Also,
If it is larger than 1.00 μm, the contact area with the head is small, the heat conduction becomes poor, and the printing speed is hindered. Further, deformation in the thickness direction of the film becomes a problem, which causes deterioration in image quality.

The moisture absorption of the polyimide film used in the present invention is preferably 2% or less, more preferably 1% or less. If the moisture absorption of the film is high, foaming occurs on the film, and the ink transfer becomes non-uniform, which causes deterioration in image quality.

The present invention provides a compound represented by the general formula (1):

Embedded image (In the formula, Ar is the same as above.) A polyimide film having a basic skeleton represented by the following formula is used. This polyimide has the formula (2)

Embedded image 1,3-bis (3-aminophenoxy) benzene represented by the general formula (3)

Embedded image (Wherein, Ar has 4 to 27 carbon atoms, and is an aliphatic group, a monocyclic aliphatic group, a condensed polycyclic aliphatic group, a monocyclic aromatic group, a condensed polycyclic aromatic group, A tetravalent dianhydride represented by a non-condensed polycyclic aromatic group in which the aromatic groups are connected to each other directly or by a bridging member.) By thermally or chemically imidizing the resulting polyamic acid.

The 1,3-bis (3-aminophenoxy) benzene of the formula (2) used herein is an essential monomer of the polyimide used in the present invention, but other monomers may be used as long as the good physical properties of the polyimide are not impaired. Can be used in combination. The amount that can be mixed and used is less than 30 equivalent parts, preferably less than 10 equivalent parts, more preferably less than 5 equivalent parts, based on the total diamine.

Examples of the aromatic diamines which can be used in combination are, for example, m-phenylenediamine, o-phenylenediamine, p-phenylenediamine, m-aminobenzylamine, p-aminobenzylamine, 4,4'-diaminodiphenyl ether 3,3′-diaminodiphenyl ether, 3,4′-diaminodiphenyl ether,
Bis (3-aminophenyl) sulfide, bis (4-aminophenyl) sulfide, (3-aminophenyl)
(4-aminophenyl) sulfide, bis (3-aminophenyl) sulfoxide, bis (4-aminophenyl)
Sulfoxide, (3-aminophenyl) (4-aminophenyl) sulfoxide, bis (3-aminophenyl) sulfone, bis (4-aminophenyl) sulfone, (3-
Aminophenyl) (4-aminophenyl) sulfone,
3,3'-diaminobenzophenone, 4,4'-diaminobenzophenone, 3,4'-diaminobenzophenone, 3,3'-diaminodiphenylmethane, 4,4'-
Diaminodiphenylmethane, 3,4'-diaminodiphenylmethane, bis [4- (3-aminophenoxy) phenyl] methane, bis [4- (4-aminophenoxy) phenyl] methane, 1,1-bis [4- (3- Aminophenoxy) phenyl] ethane, 1,2-bis [4- (3-
Aminophenoxy) phenyl] ethane, 1,1-bis [4- (4-aminophenoxy) phenyl] ethane,
1,2-bis [4- (4-aminophenoxy) phenyl] ethane, 2,2-bis [4- (3-aminophenoxy) phenyl] propane, 2,2-bis [4- (4-aminophenoxy) Phenyl] propane, 2,2-bis [4- (3-aminophenoxy) phenyl] butane,
2,2-bis [3- (3-aminophenoxy) phenyl] -1,1,1,3,3,3-hexafluoropropane, 2,2-bis [4- (4-aminophenoxy) phenyl]- 1,1,1,3,3,3-hexafluoropropane, 1,3-bis (4-aminophenoxy) benzene, 1,4-bis (3-aminophenoxy) benzene,
1,4-bis (4-aminophenoxy) benzene, 4,
4'-bis (4-aminophenoxy) biphenyl, bis [4- (3-aminophenoxy) phenyl] ketone, bis [4- (4-aminophenoxy) phenyl] ketone,
Bis [4- (3-aminophenoxy) phenyl] sulfide, bis [4- (4-aminophenoxy) phenyl]
Sulfide, bis [4- (3-aminophenoxy) phenyl] sulfoxide, bis [4- (4-aminophenoxy) phenyl] sulfoxide, bis [4- (3-aminophenoxy) phenyl] sulfone, bis [4- (4 -Aminophenoxy) phenyl] sulfone, bis [4- (3
-Aminophenoxy) phenyl] ether, bis [4-
(4-aminophenoxy) phenyl] ether, 1,4
-Bis [4- (3-aminophenoxy) benzoyl] benzene, 1,3-bis [4- (3-aminophenoxy)
Benzoyl] benzene, 4,4′-bis [3- (4-aminophenoxy) benzoyl] diphenyl ether,
4,4'-bis [3- (3-aminophenoxy) benzoyl] diphenyl ether, 4,4'-bis [4- (4
-Amino-α, α-dimethylbenzyl) phenoxy] benzophenone, 4,4′-bis [4- (4-amino-
α, α-dimethylbenzyl) phenoxy] diphenylsulfone, bis [4- {4- (4-aminophenoxy) phenoxy} phenyl] sulfone, 1,4-bis [4-
(4-aminophenoxy) phenoxy-α, α-dimethylbenzyl] benzene, 1,3-bis [4- (4-aminophenoxy) phenoxy-α, α-dimethylbenzyl] benzene, 1,3-bis [4- (4-amino-6-
Trifluoromethylphenoxy) -α, α-dimethylbenzyl] benzene, 1,3-bis [4- (4-amino-
6-fluorophenoxy) -α, α-dimethylbenzyl] benzene, 1,3-bis [4- (4-amino-6-
Methylphenoxy) -α, α-dimethylbenzyl] benzene, 1,3-bis [4- (4-amino-6-cyanophenoxy) -α, α-dimethylbenzyl] benzene,
3,3'-diamino-4,4'-diphenoxybenzophenone, 4,4'-diamino-5,5'-diphenoxybenzophenone, 3,4'-diamino-4,5'-diphenoxybenzophenone, 3, 3'-diamino-4-phenoxybenzophenone, 4,4'-diamino-5-phenoxybenzophenone, 3,4'-diamino-4-phenoxybenzophenone, 3,4'-diamino-5'-
Phenoxybenzophenone, 3,3'-diamino-4,
4′-dibiphenoxybenzophenone, 4,4′-diamino-5,5′-dibiphenoxybenzophenone, 3,
4'-diamino-4,5'-dibiphenoxybenzophenone, 3,3'-diamino-4-biphenoxybenzophenone, 4,4'-diamino-5-biphenoxybenzophenone, 3,4'-diamino-4-bi Phenoxybenzophenone, 3,4'-diamino-5'-biphenoxybenzophenone, 1,3-bis (3-amino-4-phenoxybenzoyl) benzene, 1,4-bis (3-amino-4-phenoxybenzoyl) benzene 1,3-bis (4-amino-5-phenoxybenzoyl) benzene, 1,4-bis (4-amino-5-phenoxybenzoyl) benzene, 1,3-bis (3-amino-4-biphenoxybenzoyl) ) Benzene, 1,4-bis (3-amino-4-biphenoxybenzoyl) benzene, 1,3
-Bis (4-amino-5-biphenoxybenzoyl) benzene, 1,4-bis (4-amino-5-biphenoxybenzoyl) benzene, 2,6-bis [4- (4-amino-α, α- Dimethylbenzyl) phenoxy] benzonitrile, 6,6'-bis (2-aminophenoxy)-
3,3,3 ', 3'-tetramethyl-1,1'-spirobiindane, 6,6'-bis (3-aminophenoxy)
-3,3,3 ', 3'-tetramethyl-1,1'-spirobiindane, 6,6'-bis (4-aminophenoxy) -3,3,3', 3'-tetramethyl-1,1 ´-
And spirobiindane. These may be used alone or in combination of two or more.

The tetracarboxylic dianhydride of the general formula (3) used herein is 3,3 ', 4,4'
-Benzophenone tetracarboxylic dianhydride is preferred, but other aromatic tetracarboxylic dianhydrides can be mixed and used as long as the good physical properties of the polyimide are not impaired. The amount that can be mixed and used is 50 equivalents or less, preferably less than 30 equivalents, more preferably less than 10 equivalents, based on the total aromatic tetracarboxylic dianhydride.

Specifically, for example, pyromellitic dianhydride, 2,2 ', 3,3'-benzophenonetetracarboxylic dianhydride, 3,3', 4,4'-biphenyltetracarboxylic dianhydride Anhydride, 2,2 ', 3,3'-biphenyltetracarboxylic dianhydride, 2,2-bis (2,3-
Dicarboxyphenyl) propane dianhydride, bis (3
4-dicarboxyphenyl) ether dianhydride, bis (3,4-dicarboxyphenyl) sulfone dianhydride,
1,1-bis (2,3-dicarboxyphenyl) ethane dianhydride, bis (2,3-dicarboxyphenyl) methane dianhydride, bis (3,4-dicarboxyphenyl) methane dianhydride, , 2'-bis (3,4-dicarboxyphenyl) -1,1,1,3,3,3-hexafluoropropane dianhydride, 1,4-difluoropyromellitic acid, 1,4-bis (tri Fluoromethyl) pyromellitic acid, 1,4-bis (3,4-dicarboxytrifluorophenoxy) tetrafluorobenzene dianhydride, 2,2
'-Bis [4- (3,4-dicarboxyphenoxy) benzene] -1,1,1,3,3,3-hexafluoropropane dianhydride, 2,3,6,7-naphthalenetetracarboxylic dianhydride Anhydride, 1,4,5,8-naphthalenetetracarboxylic dianhydride, 1,2,5,6-naphthalenetetracarboxylic dianhydride, 1,2,3,4-benzenetetracarboxylic dianhydride 3,4,9,10-perylenetetracarboxylic dianhydride, 2,3,6,7, -anthracenetetracarboxylic dianhydride, 1,2,7,8-phenanthrenetetracarboxylic dianhydride, 1,2,3,
4-butanetetracarboxylic dianhydride, 1,2,3,4
-Cyclobutanetetracarboxylic dianhydride and the like. These may be used alone or in combination of two or more.

In the production of polyimide, it is customary to adjust the ratio of tetracarboxylic dianhydride to diamine in order to adjust the molecular weight of the resulting polyimide. In the method of the present invention, an appropriate molar ratio of diamine to tetracarboxylic dianhydride must be in the range of 0.9 to 1.1 in order to obtain a polyimide having good melt fluidity.

In addition, amino groups or dicarboxylic anhydride groups remain at the molecular terminals of the polyimide, but these groups are active, so these molecular terminals are sealed with non-reactive groups. That is usually done. When the amino group remains at the terminal, the dicarboxylic acid anhydride is usually used, and when the dicarboxylic anhydride group remains, the amino group is usually used. Here, the amounts of dicarboxylic anhydrides or monoamines used for sealing are as follows. 0.9 to 0.9 mol of tetracarboxylic dianhydride per mole of diamine
If the amount is less than 1.0 mol, the amino group remains at the terminal, so 0.001 to 1.0 mol of dicarboxylic anhydride is used. Conversely, if the diamine is 0.9 to less than 1.0 mole per 1.0 mole of tetracarboxylic dianhydride, the diamine anhydride group remains at the terminal, so that the monoamine is 0.001 to 1.0 mole. use. Preferred dicarboxylic anhydrides and monoamines used in the present invention are phthalic anhydride and aniline, respectively.

The method for producing the polyimide of the present invention includes:
Although all known methods capable of producing polyimide can be applied, it is particularly preferable to carry out the reaction in an organic solvent. The reaction temperature is usually 250 ° C or lower, preferably 50 ° C or lower. The reaction pressure is not particularly limited, and the reaction can be sufficiently performed at normal pressure. The reaction time depends on the type of tetracarboxylic dianhydride, the type of solvent and the reaction temperature,
Usually 4 to 24 hours are sufficient. Further, by heating the obtained polyamic acid to 100 to 400 ° C. to imidize or chemically imidizing using an imidizing agent such as acetic anhydride, a polyimide having a repeating structural unit corresponding to the polyamic acid is obtained. can get. Further, a diamine of the formula (2) and a tetracarboxylic dianhydride of the general formula (3) and, if necessary, a dicarboxylic anhydride or a monoamine for sealing the terminal of the polyimide are combined with an organic solvent. By heating after suspending or dissolving in polyimide and imidizing simultaneously with the generation of the polyamic acid which is a precursor of the polyimide, it is also possible to obtain the target polyimide represented by the general formula (1). .

When the polyimide of the present invention is formed, three methods are conceivable. One is a method in which a varnish of polyamic acid, which is a precursor of polyimide, is cast and then thermally imidized to form a film. The other is a method of casting a polyimide varnish and then removing the solvent to form a film. Furthermore, since the polyimide of the present invention is thermoplastic, it can be formed into a film by melt extrusion. The obtained film is subjected to stretching and heat treatment, and the stretching ratio is 1 in area ratio.
It is about 10 to 10 times. The heat treatment is appropriately performed at about 250 to 420 ° C.

In the present invention, the ratio of the thickness of the layer A to the layer B is
A layer / B layer = 0.1 to 10, preferably 0.5 to 2.

Fine particles can be added to control the surface roughness of the layer B of the film. Although the fine particles used here are not particularly limited, SiO ₂ , Ti
O ₂ , ZnO, Al ₂ O ₃ , CaSO ₄ , BaSO ₄ , Ca
Desirable are CO ₃ , carbon black, zeolite, silicone particles, Teflon particles and the like. The preferred particle size here is 20 μm to 0.01 μm, more preferably 0.1 μm to 0.1 μm.
At 5 μm, the amount added is preferably 0.1-80 wt%, more preferably 1-40 wt% per polymer.

In order to make the surface of the layer A smoother than the layer B, no particles may be added, or a small amount of particles smaller than the particles on the layer B may be added. The preferred particle size is from 20 to 0.01 μm, and the amount added is less than 5 wt%, more preferably less than 1 wt%.

The heat-sensitive transfer layer is formed on the layer A of the substrate film of the present invention, but may be subjected to a pretreatment such as a corona treatment, a plasma treatment and a glow treatment, if necessary.

[0025]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below in detail with reference to embodiments. However, the present invention is not limited to these examples. In addition, each physical property in an Example was evaluated by the following method. Elastic modulus: Using a Shimadzu Autograph AG-5000C, a test film piece having a test piece width of 5 mm, a distance between chucks of 35 mm, and a thickness of 50 μm is pulled at a pulling speed of 50 mm / min to measure. Measurement temperature is room temperature and 180 ° C. Surface roughness: measured according to JIS-K7104. Gloss: Measured according to JIS-K7105 (60-degree specular gloss). Glass transition temperature (Tg): Measured by DSC (DSC3100 manufactured by Mac Science). 5% weight loss temperature (Td): measured by DTG (TG-DTA2000 manufactured by Mac Science) in the air. Logarithmic viscosity (ηinh): Measured at 35 ° C. by dissolving in a mixed solvent of p-chlorophenol / phenol = 9/1 (wt) at a concentration of 0.5 g / dl.

A production example of the polyimide film used in the present invention is shown below. Production Example 1 1,3-bis (3-aminophenoxy) benzene was placed in a vessel equipped with a stirrer, a reflux condenser, and a nitrogen inlet tube.
62 g (0.05 mol) and N, N-dimethylacetamide (150.1 g) were charged, and the solution temperature was not increased at room temperature under a nitrogen atmosphere.
4'-benzophenonetetracarboxylic dianhydride
11 g (0.05 mol) were charged. Add this solution to 17
The mixture was stirred for about 10 hours under a nitrogen atmosphere at 0 ° C. to obtain a polyimide varnish. The logarithmic viscosity of the obtained polyimide is 1.21.
dl / g. This polyimide varnish is divided into three parts,
In one varnish, 0.2 wt% of silica having a particle size of 2 μm per polymer (A varnish), in one varnish, 6 wt% of similar silica (B varnish) was added, and in the other varnish, nothing was added. (C varnish). Each of the obtained polyimide varnishes was applied to a glass plate,
Each polyimide film was obtained by firing at 200 ° C. for 1 hour, 250 ° C. for 1 hour, and 250 ° C. for 2 hours. The polyimide films obtained from the A varnish and the B varnish were subjected to a stretching treatment so as to have a thickness of 3 μm each, which was used as an A layer and a B layer, respectively. The polyimide film obtained from the C varnish to which nothing was added had a thickness of about 50 μm, a glass transition temperature (Tg) of 235 ° C., and a 5% weight loss temperature (Td5) of 547 ° C. The tensile modulus of the polyimide film to which silica was not added was 307 kg / mm ² at room temperature,
It was 245 kg / mm ² at 180 ° C.

Production Examples 2 to 4 A polyimide film was produced in the same manner as in Production Example 1 except that the diamine compound and the acid anhydride compound in Production Example 1 were appropriately changed as shown in Appendix 1. Table 1 shows the physical properties of the obtained polyimide film together with Production Example 1.

Example 1 Layers A and B of the polyimide film obtained in Production Example 1 were laminated to form a laminated film by thermocompression bonding (400 ° C./5 minutes). The surface roughness of the layer A side of the obtained laminated film is 0.048 μm, and the surface roughness of the layer B side is 0.22 μm.
m, and the glossiness of the layer A surface was 82%. Also,
Elastic modulus at room temperature and 180 ° C. The laminated film, respectively ^{332kg / mm 2, 260kg / mm} 2
Met. On the surface of layer A of the laminated film obtained here,
Three kinds of sublimable dyes of yellow, cyan, and magenta are dissolved and coated in a binder and a solvent having the following composition: 5 parts by weight; a cellulose resin; 5 parts by weight; 40 parts by weight of toluene; A three-color transfer film was obtained. The coated film was dried under reduced pressure at 60 ° C. to obtain a transfer film having a thickness of 8 μm. This transfer film was brought into close contact with the image receiving paper, and heated by a thermal head having a surface temperature of 350 ° C. to perform printing. The resulting image was full color and very good. In addition, the running property at the time of printing is also good,
The transfer film after printing did not show any abrasion, scratches or distortion.

Examples 2 to 5 Using the polyimide films obtained in Production Examples 2 to 5, transfer films of three colors were obtained in exactly the same manner as in Example 1. Table 2 shows the surface roughness of the A layer and the B layer, the gloss of the surface of the A layer,
The elastic modulus at room temperature and 180 ° C. of the laminated film, the state of the printed image, and the state of the transfer film after printing are shown together with the results of Example 1.

[0030]

[Table 1]

[0031]

[Table 2]

[0032]

The transfer material for heat-sensitive recording of the polyimide according to the present invention has good surface roughness and glossiness and a good elastic modulus at high temperature. Are suitable. Also, the resulting image is clear, further wear,
No scratches, distortions, etc. are observed, and it is excellent in durability and stability in long-term use.

Claims (3)

[Claims] 1. An elastic modulus at 180 ° C. of 200 kg /
mm ² or more, a polyimide-based transfer member for thermosensitive recording comprising a two-layer type laminated polyimide. 2. Surface roughness 0.1 μm or less, gloss 70%
The above aromatic polyimide layer (A) and a surface roughness of 0.1
2. A heat-sensitive transfer layer comprising a laminate of an aromatic polyimide layer (B) having a thickness of 2 to 1.0 [mu] m, and a heat-sensitive transfer layer provided on a surface of the aromatic polyimide layer (A). Transfer material for polyimide-based thermal recording. 3. The aromatic polyimide layers (A) and (B) forming the laminate are represented by the general formula (1). (Wherein, Ar has 4 to 27 carbon atoms, and is an aliphatic group, a monocyclic aliphatic group, a condensed polycyclic aliphatic group, a monocyclic aromatic group, a condensed polycyclic aromatic group, The aromatic group is a tetravalent group selected from the group consisting of non-condensed polycyclic aromatic groups connected to each other directly or by a bridging member.) Transfer member for thermal recording of polyimide.