JPH10242101A - Substrate treating device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a substrate treating device which can suppress the cost by collecting discharged pure water by providing a fixed type treating solution supplying means having a slow leaking function. SOLUTION: During the course of substrate treatment which is performed while a cup 20 is maintained at an elevated position, a splash guard 220 blocks between a pure water collecting tray 50 and a pure water collecting pot 60 and a nozzle 10 supplies a large quantity of pure water DIW to the upper surface of a substrate W by injecting the water DIW. When the substrate treatment is not performed and the cup 20 is maintained at a lowered position, the splash guard 220 does not obstruct the flow of the discharged pure water DIW to the pot 60 from the tray 50, because the guard 220 is retreated from the blocking position, and the nozzle 10 discharges a little quantity of pure water DIW. The discharged pure water DIW is purified by means of a purifying device after the pure water DIW is collected to a recovery tank from the pot 60 through a pure water collecting tube 70 and stored in the tank and again returned to a pure water supplying mechanism for reuse.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of supplying a processing liquid to a substrate (hereinafter, referred to as a "substrate") such as a held semiconductor wafer, a glass substrate for a photomask, a glass substrate for a liquid crystal display, and a substrate for an optical disk. The present invention relates to a substrate processing apparatus that performs processing, and particularly to a substrate processing apparatus that constantly discharges a processing liquid even when a processing liquid is not supplied to a substrate.

[0002]

2. Description of the Related Art Conventionally, in a substrate processing apparatus for supplying pure water to a substrate and processing the substrate, if the supply of pure water from a nozzle is stopped during a standby time when the substrate is not processed, pure water remaining in a pure water line is stopped. Since bacteria are generated in the water and supplied to the surface of the substrate to be processed after being turned into particles, the substrate is adversely affected. This is referred to as “slow leak”, which prevents pure water from accumulating in the pure water line and prevents bacteria from being generated in the pure water (hereinafter, this function is referred to as “slow leak function”).
That. ).

However, since the amount of pure water used thereby increases, as a countermeasure, during standby, the nozzle is horizontally rotated so as to be located immediately above the collection pot located outside the cup holding the substrate. 2. Description of the Related Art Pure water is collected in a collecting pot, and the purified water is purified and used again for processing a substrate.

[0004]

However, with the subsequent increase in the size of the substrates, recent substrate processing apparatuses have to supply a large amount of pure water to the processing of the substrates, and therefore a plurality of nozzles are provided. There are many.

However, since the horizontally rotating nozzles interfere with each other and the horizontal rotation of the nozzle is practically impossible, it is almost essential to use a fixed type nozzle. It had a function and it was difficult to recover pure water.

The present invention is intended to overcome the above-mentioned problems in the prior art, and includes a fixed processing liquid supply means having a slow leak function, whereby the discharged pure water can be recovered to reduce the cost. It is an object to provide a substrate processing apparatus.

[0007]

According to a first aspect of the present invention, there is provided a substrate processing apparatus for performing a predetermined substrate processing by supplying a processing liquid to a substrate held substantially horizontally. Processing liquid supply means for discharging a processing liquid obliquely downward from a processing liquid discharge port disposed at a position higher than the substrate and supplying the processing liquid onto the substrate, thereby performing predetermined substrate processing; The processing liquid is disposed below the outlet, and when a processing liquid having a smaller amount than the discharging amount during the predetermined substrate processing is being discharged downward from the processing liquid discharging port, the processing liquid is discharged from the processing liquid discharging port. And a processing liquid receiving member that receives the processing liquid at a lower position and discharges the processing liquid toward a predetermined processing liquid recovery path.

According to a second aspect of the present invention, in the substrate processing apparatus of the first aspect, a small amount of the processing liquid flows out of the processing liquid receiving member into the air obliquely downward, and thereafter, the processing liquid receiving member. The liquid flows into an opening of a processing liquid recovery guide provided diagonally below and separated by a gap, and is guided to a processing liquid recovery path.

According to a third aspect of the present invention, in the substrate processing apparatus of the second aspect, there is provided a cup having a cylindrical splash prevention wall capable of ascending and descending through a gap, and driving means for driving the cup up and down. And further comprising:

According to a fourth aspect of the present invention, there is provided the substrate processing apparatus according to any one of the first to third aspects, further comprising a plurality of processing liquid supply means. And

Further, the apparatus according to a fifth aspect of the present invention is the substrate processing apparatus according to the fourth aspect, wherein the processing liquid receiving member is provided immediately below each of the plurality of processing liquid supply means. And

[0012]

BEST MODE FOR CARRYING OUT THE INVENTION

[0013]

[1. FIG. 1 shows a mechanical configuration and an arrangement of the apparatus according to the embodiment.
1 is a sectional view of a substrate processing apparatus 1 according to a first embodiment.
In this figure and the following figures, a three-dimensional coordinate system XYZ with a horizontal plane as an XY plane and a vertical direction as a Z-axis direction
Is defined. Hereinafter, the substrate processing apparatus 1 will be described with reference to FIG.

As shown in the drawing, the apparatus includes a nozzle 10, a cup 20, a lower cup 30, a rotary drive unit 40, a pure water recovery tray 50, a pure water recovery pot 60, a pure water recovery tube 70,
The apparatus includes a lifting cylinder 80 and a control device (not shown), and injects pure water onto the upper surface of the substrate W while rotating while holding the substrate W horizontally.

The nozzle 10 corresponds to a processing liquid supply means, and injects pure water DIW supplied by a pure water supply mechanism (not shown) onto the upper surface of the substrate W obliquely below.
As described later, the slow leak is performed even when the processing of the substrate W is not performed.

The cup 20 is composed of an upper cup 210 and a splash guard 220. The upper cup 210 guards most of the pure water DIW supplied to the upper surface of the substrate W in the processing.
It is a cylindrical version provided on the upper side of the side, concentric with 0,
The splash of the pure water DIW recoiled on the upper surface of the substrate W is prevented from reaching the outside. In addition, the upper cup 210 and the splash guard 220 are integrated, and when the substrate is carried in and out, it descends,
It rises during substrate processing.

The lower cup 30 is provided below the upper cup 210, and guides the processing liquid that has descended along the inner wall of the upper cup 210 to the drain 30a.

The rotation drive unit 40 horizontally holds the substrate W by chucking the chuck 410 and rotates the substrate W about the shaft 420 in a horizontal plane by a motor (not shown) in the shaft 420 and the base 430.

The pure water collecting tray 50 corresponds to a processing liquid receiving member, and the pure water DI
Receiving W, it leads to a pure water recovery pot 60 described later.

The pure water collecting pot 60 is connected to the pure water collecting tray 50.
And the pure water DIW guided by the pure water recovery tube 70 described below.

The pure water collecting tube 70 is connected to the pure water collecting pot 6.
The pure water DIW from 0 is guided to a recovery tank (not shown) outside the apparatus. The pure water recovery pot 60 and the pure water recovery tube 70
The combination of the above corresponds to a processing liquid recovery path, and the pure water recovery pot 60 corresponds to a processing liquid recovery guide.

The lift cylinder 80 drives the upper cup 210 and the splash guard 220 to move up and down as one unit.

Further, the apparatus performs processing of the substrate W by a control mechanism (not shown) according to a procedure described later.

Next, the main part will be described in more detail.

FIG. 2 is a plan view of the substrate processing apparatus 1 according to this embodiment. As shown in FIG. 2, two nozzles 10 are fixed to a support member (see FIG. 1) in parallel, each has an inverted U-shaped pipe 10a, and its injection port 10b is It is directed in the direction of the substrate W. Then, at the time of substrate processing, a large amount of pure water DIW is supplied by injecting the pure water DIW toward the upper surface of the substrate W, and a small amount of pure water DIW is supplied at a time other than the substrate processing.
Is always discharged.

As shown in FIG. 1, a pure water recovery tray 50 is located immediately below the injection port 10b corresponding to the processing liquid discharge port of the nozzle 10. The bottom surface of the pure water recovery tray 50 is inclined so as to be lower toward the outflow end 50a facing the pure water recovery pot 60, and the outflow end 50a of the pure water recovery tray 50 is provided with a vertical partition. No (see FIG. 2). The upper surface of the pure water recovery pot 60 is an opening 60a.
a, the pure water DIW dripping from the nozzle 10 into the pure water collecting tray 50 flows out of the outflow end 50a into the air due to the slow leak from the nozzle 10, and is then transferred to the pure water collecting pot 60. Reach. FIG. 3 shows that the discharged pure water DIW is supplied from the pure water collecting tray 50 to the pure water collecting pot 6.
0 is shown.

The pure water DIW collected in the pure water recovery pot 60 is stored in a recovery tank (not shown) outside the apparatus via a pure water recovery tube 70, purified by a purification device, and again supplied with a pure water supply mechanism. It is returned to and reused.

Further, the cup 20 is raised and lowered at a predetermined timing by the lifting cylinder 80 under the control of the control unit. At that time, the splash guard 220 moves up and down the gap between the pure water collecting tray 50 and the pure water collecting pot 60, and the cup 20 is raised as shown in FIG. 1 (hereinafter referred to as “cup rising state”). )), The connection between the pure water recovery tray 50 and the pure water recovery pot 60 is shut off, and conversely, in a state where the cup is lowered as shown in FIG. The pure water DIW discharged in a state of being retracted from between the collection tray 50 and the pure water collection pot 60 is discharged from the pure water collection tray 5.
It does not hinder reaching from 0 to the pure water recovery pot 60. Note that the upper end of the splash guard 220 holds the inverted U-shaped pipe 10 of the nozzle 10 even when the cup 20 is raised.
Stop at a height that does not interfere with a (see FIG. 1).

With the above configuration, the substrate processing apparatus 1 performs processing of the substrate W in the following procedure.

As an initial state, the cup 20 is in the cup lowering state, and the nozzle 10 is performing a slow leak.

First, the substrate W is carried into the substrate processing apparatus 1 by a substrate transfer device (not shown) outside the apparatus.

Next, the cup 20 is raised, and the cup 20 is in a raised state.

Next, the substrate W is rotated, and pure water DIW is injected from the nozzle 10 to process the substrate W.

When the processing of the substrate W is completed, pure water DI
At the same time as the injection of W from the nozzle 10 is stopped, a slow leak is started.

Next, the cup 20 descends again to reach the cup descending state, and the substrate W is transported by the substrate transport device outside the apparatus.
Is carried out, and the processing of one substrate W is completed.

Then, different substrates W are sequentially carried in, and the above-described series of processing is performed.

With the above configuration, the substrate processing apparatus 1 of this embodiment includes the pure water recovery tray 50 immediately below the nozzle 10 so that a large amount of pure water can be provided by the fixed type nozzle 10 having a slow leak function. Can be supplied onto the substrate W, and at the time of slow leak, the discharged pure water can be collected to reduce the cost. In addition, it is possible to suppress the generation of bacteria in the DIW DIW due to the slow leak, thereby suppressing the generation of particles.

The pure water recovery pot 6 is provided outside the cup 20.
Since 0 is located, droplets including particles and the like generated during substrate processing do not enter the pure water recovery pot 60, so that pure water DIW discharged in a cleaner state than pure water DIW used for substrate processing is used. Can be recovered.

[0039]

[2. Modification Example In the substrate processing apparatus 1 of this embodiment, the slow leak is performed in the state where the cup is lowered. However, the present invention is not limited to this, and the pure water recovery tray 50 and the pure water recovery pot 60 of the splash guard 220 may be used. Between pure water D
An opening through which the IW passes may be provided to perform a slow leak with the cup raised.

In the substrate processing apparatus 1 of this embodiment, the pure water recovery tray 50 and the pure water recovery pot 60 are separately provided, and the splash guard 220 is moved up and down in a gap between the two. Not limited to this,
It is good also as a structure which connects a pure water collection tray and a pure water collection pot directly, without providing a splash guard.

Further, in the substrate processing apparatus 1 of this embodiment, two nozzles 10 are provided, but the present invention is not limited to this, and three or more nozzles may be provided or only one nozzle may be provided. .

Although the substrate processing apparatus 1 of this embodiment performs the substrate processing using pure water, the present invention is not limited to this. The substrate processing apparatus supplies a processing liquid such as a resist coating to the substrate. It may be used for processing.

In the substrate processing apparatus 1 of this embodiment, the processing is performed while rotating the substrate W. However, the present invention is not limited to this, and a large number of nozzles are provided in a row to relatively translate the substrate. It may be configured to move and process.

Further, in the substrate processing apparatus 1 of this embodiment, the substrate W is processed by being held horizontally by the chuck. However, the present invention is not limited to this. Configuration may be used.

Further, the substrate processing apparatus 1 of this embodiment
In the embodiment, the processing of the substrate W is performed by jetting pure water DIW. However, the present invention is not limited to this, and the processing may be performed by a dedicated cleaning liquid used in a high-pressure jet cleaning apparatus or an ultrasonic cleaning apparatus.

[0046]

As described above, according to the first to fifth aspects of the present invention, the processing liquid supply means discharges the processing liquid obliquely downward from the processing liquid discharge port and supplies the processing liquid to the substrate. The processing liquid is disposed below the discharge port when the processing liquid having a smaller amount than the discharge amount during the predetermined substrate processing is being discharged from the processing liquid discharge port. And a processing liquid receiving member for receiving the discharged processing liquid toward a predetermined processing liquid recovery path, so that even if the processing liquid supply means having a slow leak function is used as a fixed type, the discharged processing liquid is collected. Cost can be reduced.
In addition, the generation of particles due to bacteria due to slow leak can be suppressed.

According to the second and third aspects of the present invention, the processing liquid discharged from the processing liquid discharge port in a smaller amount than the discharge amount during the predetermined substrate processing period is obliquely downward from the processing liquid receiving member. Flows into the opening of a processing liquid recovery guide section provided with a gap diagonally below the processing liquid receiving member and is guided to the processing liquid recovery path. By positioning the part and collecting the processing liquid, it is possible to prevent droplets including particles and the like generated during substrate processing from entering the processing liquid recovery path, thereby making it possible to reduce the amount of processing liquid used in the substrate processing. A small amount of processing liquid discharged in a clean state can be recovered.

Furthermore, in the present invention, since a plurality of processing liquid supply means are provided, a large amount of processing liquid is applied to the substrate during predetermined substrate processing while collecting the processing liquid which has been leaked slowly. Can be supplied.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view of a substrate processing apparatus according to an embodiment.

FIG. 2 is a plan view of the substrate processing apparatus according to the embodiment;

FIG. 3 is a sectional view of the substrate processing apparatus according to the embodiment;

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Substrate processing apparatus 10 Nozzle 20 Cup 50 Pure water recovery tray 50a Outflow end 60 Pure water recovery pot 70 Pure water recovery tube 80 Elevating cylinder 210 Upper cup 220 Splash guard DIW Pure water W Substrate

Claims (5)

[Claims] 1. A substrate processing apparatus for performing a predetermined substrate processing by supplying a processing liquid to a substrate held substantially horizontally, wherein the processing liquid is disposed obliquely downward from a processing liquid discharge port disposed at a position higher than the substrate. A processing liquid supply unit that discharges and supplies the processing liquid onto the substrate, thereby performing the predetermined substrate processing; and a processing liquid supply unit that is disposed below the processing liquid discharge port. When a processing liquid having a smaller amount than the discharge amount is being discharged downward from the processing liquid discharge port, the processing liquid is received below the processing liquid discharge port and discharged toward a predetermined processing liquid recovery path. A substrate processing apparatus, comprising: a processing liquid receiving member. 2. The substrate processing apparatus according to claim 1, wherein the small amount of the processing liquid flows out of the processing liquid receiving member into the air obliquely downward, and thereafter, a gap is formed diagonally below the processing liquid receiving member. A substrate processing apparatus, wherein the substrate processing apparatus flows into an opening of a processing liquid recovery guide provided and guided to the processing liquid recovery path. 3. The substrate processing apparatus according to claim 2, further comprising: a cup having a cylindrical splash prevention wall that can move up and down through the gap; and a driving unit that drives the cup up and down. Substrate processing apparatus. 4. The substrate processing apparatus according to claim 1, further comprising a plurality of processing liquid supply units. 5. The substrate processing apparatus according to claim 4, wherein the processing liquid receiving member is provided immediately below each of the plurality of processing liquid supply units.