JPH10232910A - Ic card - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent the surface of a glass component and the back surface of a film from being tightly adhered and producing Newton rings by releasing the pressure generated inside an IC card by a notch provided on an adhesive sheet or the notch and a discharge hole provided on a resin frame. SOLUTION: On the adhesive sheet 12, the notch 16 for discharging the pressure inside the IC card, that is a negative pressure, is provided from an inner side to the position of the intermediate step 14 of the resin frame 8 toward the outer shape of the film 10. Also, the resin frame 8 is provided with the discharge hole 17 for discharging the negative pressure near the notch 16. When constitution is performed in such a manner, the film 10 and a solar battery 6 are heating-processed and adhered by the adhesive sheet 12 using a thermosetting and thermoplastic adhesive material and the negative pressure is not generated in a clearance 18 between the film 10 and the solar battery 6 even when cooling is performed to a normal temperature. That is, the negative pressure is discharged through the notch 16, the clearance constituted of the side wall of the solar battery 6 and the intermediate step 14 of the frame 8 and the discharge hole 17.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC including a liquid crystal display panel (hereinafter abbreviated as LCD), a solar cell for power supply, a high performance card such as a financial card and a calculator card provided with a key switch and the like. It's about cards.

[0002]

2. Description of the Related Art Generally, an IC card is, as shown in FIG.
An LSI 2 having the function of a memory for recording data for personal authentication and toll collection information and the like and a microcomputer for operation, and electronic components such as surface mounting components 3 are mounted on a substrate 1, and a key electrode 4 on the substrate 1 side is mounted. Are located.

[0005] The LCD 5 and the solar cell 6 are electrically and mechanically connected to the substrate 1 by a heat seal 7.

A substrate 1 on which these components are mounted is mounted on a resin frame 8 and a film 1 on which a keypad 9 is formed.
0 is completed.

LCDs used in such IC cards
As for the solar cell 5 and the solar cell 6, an LCD using a transparent film and a solar cell using a plastic film are manufactured in consideration of the bending resistance of the card. Often employ batteries.

When a glass LCD or a solar cell is employed, the film 10 is bonded to the LCD 5 or the solar cell 6 with an adhesive sheet using a thermosetting and thermoplastic adhesive in order to increase the card strength. doing.

FIG. 7 shows a conventional example using a thermosetting and thermoplastic adhesive for lamination (stacked structure) involving heat treatment.

FIG. 7 is a partial sectional view of a lamination in which the solar cell 6 and the film 10 are bonded.
Are connected by a heat seal 7 and set on a resin frame 8, and then a film 1 having a printing ink 11 on the front surface and an adhesive sheet 12 using a thermosetting and thermoplastic adhesive on the back surface is attached.
0 is heated and bonded to the solar cell 6.

At this point, the solar cell 6 and the film 10
A gap is formed between the back surfaces. The fact that such a gap prevents Newton's ring is disclosed in Jpn.
No. 188 is also described.

[0010]

However, at the end of the lamination in the IC card manufacturing process, the heat-treated one undergoes cooling shrinkage when cooled to room temperature, and the generated pressure (negative pressure) causes As shown, the film 10 is curved, and the glass surface of the solar cell 6 and the back surface of the film 10 are in close contact with each other at the contact portion 13.

If the IC card is in close contact with the IC card, a rainbow-colored Newton's ring is generated when viewed from the surface of the IC card, causing a problem that the commercial value of the card is reduced.

[0012]

In order to solve the above-mentioned problems, the present invention is provided with a means for releasing the pressure generated inside the IC card.

As means for releasing the pressure, a notch is provided in an adhesive sheet for bonding the back surface of the film on the surface of the IC card to the glass component, or a notch is provided and a hole is provided in the resin frame.

[0014]

FIG. 1 is a simplified explanatory view showing a state before assembling an IC card according to a first embodiment of the present invention, and FIG.
Is a simplified explanatory view showing a state after assembly, and wiring patterns, key electrodes, key pads, and the like are omitted for clarity of the structure.

The substrate 1 is made of a resin substrate such as glass epoxy, particularly a plastic film substrate when thinning is desired, and the LSI 2 and the surface mount components 3 are mounted thereon.

The electrodes of the glass part LCD 5 and the electrodes of the substrate 1 are electrically and mechanically connected by a heat seal 7, and the electrodes of the glass parts solar cell 6 and the electrodes of the substrate 1 are also electrically and mechanically connected by the heat seal 7. Connected.

The substrate 1 assembled as described above is placed in a resin frame 8 having an intermediate step 14, and a film 10 provided on the back surface with an adhesive sheet 12 using a thermosetting, thermoplastic adhesive with heat treatment. And cover it to complete.

On the surface of the film 10 at this time, the color design is naturally performed by the printing ink 11 and the LCD 10 is used.
Except for the transparent window 5 of the solar cell 5 and the solar cell 6, a matte treatment is performed to give a sense of quality. This matting treatment generally applies a matte ink as a special matting ink on the film surface, and this is called a matte treatment.

FIG. 3 is an enlarged cross-sectional view of a portion surrounded by a circle in FIG. 2, and FIG. 4 is a partial plan view partially omitted.

3 and 4, a solar cell 6 is provided on a substrate 1.
Are connected by the heat seal 7 and set on the resin frame 8 having the intermediate step 14, and then the printing ink 11
10 on the front side and the adhesive sheet 12 on the back side
And the solar cell 6 are bonded by heating. In FIG. 4, the printing ink 11 is omitted.

The adhesive sheet 12 is provided with a notch 16 for releasing the pressure inside the IC card, that is, a negative pressure, from the inside toward the outer shape of the film 10 to the position of the intermediate step 14 of the resin frame 8 as shown in FIG. ing.

Further, the resin frame 8 is provided with a cutout hole 17 near the notch 16 for releasing negative pressure. The effect is high when the hole 17 is arranged in the immediate vicinity of the notch 16, particularly, immediately below.

With this structure, the film 10 and the solar cell 6 are bonded by heat treatment with the adhesive sheet 12 using a thermosetting and thermoplastic adhesive, and even when cooled to room temperature,
No negative pressure is generated in the gap 18 between the film 10 and the solar cell 6.

That is, the negative pressure is applied to the notch 16 and the solar cell 6.
Through the gap formed by the side wall of the intermediate step 14 and the side wall of the intermediate step 14 of the resin frame 8,
This is because they escape to the outside of the C card.

Therefore, the glass surface of the solar cell 6 and the back surface of the film 10 come into close contact with each other due to the negative pressure generated at the time of cooling at the end of lamination in the IC card manufacturing process.
The generation of a rainbow-colored Newton ring can be prevented.

According to actual production data, when the adhesive sheet 12 having a thickness of 100 μm is used, the width of the notch 16 of the adhesive sheet 12 is about 1 mm, and the diameter of the hole 17 is 0.3 m.
About m (a pinhole is sufficient), a sufficient effect was obtained.

FIG. 5 is a partially omitted plan view of a solar cell part according to a second embodiment of the present invention.

In this embodiment, the notch 19 for releasing the negative pressure is provided from the inside of the adhesive sheet 12 to the outer shape of the resin frame 8 to the outer shape line 20 of the film 10. No holes are provided.

The passage for the negative pressure is the notch 19 of the adhesive sheet 12 itself, which continues from the gap between the outline 20 of the film 10 and the resin frame 8 to the outside of the IC card, so that the negative pressure easily escapes.

As described above, according to the second embodiment, the notch 19 for releasing the negative pressure is provided up to the outer shape line 20 of the film 10 in the adhesive sheet, so that the resin frame is not provided with a punched hole. The same effect as that of the first embodiment can be obtained. From actual production data, 100μ
When the adhesive sheet 12 having a thickness of m was used, the width of the notch 18 of the adhesive sheet 12 was about 1 mm, and a sufficient effect was obtained.

In the above description, a notch or a hole is provided in a bonding part between a solar cell and a film of a glass part. However, if necessary, a notch or a hole is similarly formed in an LCD part which is another glass part. Needless to say, it may be provided.

Although the pressure generated inside the IC card has been described in the case of the manufacturing process, it is needless to say that the internal pressure generated from the use environment conditions where temperature conditions are severe can be similarly adjusted.

[0033]

As described above, according to the present invention, the pressure generated inside the IC card is controlled by the notch provided in the adhesive sheet.
Alternatively, since the cutout is formed by the cutout and the cutout hole provided in the resin frame, it is possible to prevent the front surface of the glass component from coming into close contact with the back surface of the film to generate a Newton ring.

[Brief description of the drawings]

FIG. 1 is a simplified explanatory diagram showing a state before assembling an IC card according to a first embodiment of the present invention;

FIG. 2 is a simplified explanatory diagram showing a state after assembly.

FIG. 3 is a partial cross-sectional view of the first embodiment of the present invention.

FIG. 4 is a partial plan view of the first embodiment of the present invention.

FIG. 5 is a partial plan view of a second embodiment of the present invention.

FIG. 6 is a perspective view illustrating assembly of a conventional IC card.

FIG. 7 is a partial cross-sectional view of a conventional IC card.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Substrate 2 LSI 3 Surface mount component 5 LCD 6 Solar cell 8 Resin frame 10 Film 12 Adhesive sheet 14 Intermediate step 16, 19 Notch 17 Cutout hole 20 Film outline

──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. ⁶ Identification code FI H01L 31/04 H01L 31/04 Q

Claims (5)

[Claims] An IC card in which a substrate on which electronic components are mounted and a glass component such as a solar cell connected to the substrate are mounted on a resin frame and a film is stretched, wherein the glass component and the film are provided. A notch is provided from the inside to the intermediate step position of the resin frame, and a hole is provided in the resin frame, and the pressure generated inside the IC card is passed through the notch and the hole. An IC card characterized by being pulled out. 2. The IC card according to claim 1, wherein the hole is provided near the notch. 3. The IC card according to claim 1, wherein the hole is provided immediately below the notch. 4. An IC card in which a substrate on which electronic components are mounted and a glass component such as a solar cell connected to the substrate are mounted on a resin frame and a film is stretched, wherein the glass component and the film are provided. An IC card, characterized in that a cutout is provided from the inside to the outer line of the film on an adhesive sheet for bonding the back surface of the IC card, and pressure generated inside the IC card is removed through the cutout. 5. The IC card according to claim 1, wherein the pressure generated inside the IC card is a negative pressure.