JPH10229277A - Bond applicator - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent bond from varying in amount of coating with a replacement of a bond applicator by a method wherein a replacement bond applicator is taken out of a refrigerator and mounted after it is detected that bond contained in a current bond applicator runs out and is reduced to a prescribed level of amount. SOLUTION: A frame 10 is provided around a movable table 1, and a mount 9 for a bond applicator 8 is provided in the side of the frame 10. A first information device 11 and a second information device 12 are provided in the frame 10, wherein the first information device 11 informs that bond contained in the bond applicator 8 is running out. A CPU 16 operates the second information device 12 when it receives detection signals outputted from the device 11. The second information device 12 informs that a bond residue contained in the bond applicator 8 becomes smaller than a prescribed level and will run out in a prescribed time. When an operator receives the information, he takes a replacement bond applicator out of a refrigerator and mounts it on the mount 9.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a bond applying apparatus for applying a bond to a substrate or the like.

[0002]

2. Description of the Related Art As a method for fixing an electronic component to a substrate such as a printed circuit board or a lead frame, a method of bonding using a bond is known. In this method, a bond is applied on a substrate before mounting an electronic component. In general, a compound such as an epoxy resin is used for this bond, and its management such as a storage method requires predetermined management.

[0003] The bond used in the bond applicator is:
It is sealed in the bond applicator, and when the bond is out of stock, it is replaced with a new bond applicator. The exchange bond applicator is stored in a refrigerator to prevent quality deterioration. For this reason, the temperature of the bond immediately after taking out the new bond applicator from the refrigerator at the time of replacement is the refrigeration temperature (generally about 4 ° C.), and it takes about 1 hour from this temperature to normal temperature. During this time, the viscosity of the bond is not constant, because the viscosity of the bond is highly dependent on temperature.
That is, the viscosity of the bond is high immediately after being taken out of the refrigerator, and decreases as the temperature approaches room temperature.

[0004]

The amount of the bond applied depends on the viscosity of the bond used. Since the viscosity of a bond for which a predetermined time has not elapsed after being taken out of the refrigerator is not constant, if the bond is applied as it is, the applied amount fluctuates. That is, when the viscosity of the bond is initially high, the amount of application is too small, and stable quantitative application cannot be performed. As described above, when the bond applicator is replaced, if the bond applicator has not been used for a predetermined time after being taken out of the refrigerator, the amount of the applied bond is not stable, and thus the electronic component is attached to the substrate. There was a problem that adhesion failure was likely to occur.

SUMMARY OF THE INVENTION It is therefore an object of the present invention to provide a bond coating apparatus which can eliminate the fluctuation of the coating amount due to the exchange of the bond coating device and can perform stable coating.

[0006]

According to the present invention, there is provided an apparatus for applying a bond, comprising: a positioning portion for a substrate; a holder for holding a bond applicator; and a movement for horizontally moving the bond applicator relative to the substrate. A bond detecting device for detecting that the bond accommodated in the bond applicator has run out of stock, the device being driven by a signal from the first detecting device. A first notification element for notifying the operator to that effect, a second detection means for detecting that the amount of the bond stored in the bond applicator has decreased to a predetermined amount, and a signal from the second detection means. A second notification element to be driven, a mounting section for mounting a replacement bond applicator taken out of the refrigerator in response to the notification by the driving of the second notification element, and a bond applicator to the mounting section Wherein detects that the mounted second
And a mounting detecting means for stopping the driving of the notification element.

[0007]

According to the present invention having the above-described structure, a notification is given a predetermined time before the out-of-stock of the bond in the bond applicator. Then, the operator receives this notification, removes the exchange bond applicator from the refrigerator, attaches it to the mounting portion, and waits for the exchange apparatus to be exchanged. Next, when there is a notification that the bond is out of stock, the operator removes the bond applicator from the mounting section and mounts it on the holder. In this case, the bond applicator for replacement was previously mounted on the mounting portion and was on standby until there was a notification of out-of-stock, so that the bond in the bond applicator was at room temperature during that time and had a predetermined viscosity. . Therefore, if this bond applicator is mounted on the holder, normal application with a stable application amount can be immediately performed.

Next, an embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a perspective view of a bond applicator according to an embodiment of the present invention, FIG. 2 is a side sectional view of a bond applicator holder of the bond applicator, and FIG. FIG. 4 is a block diagram of a control system of the bond applicator, and FIG. 5 is a sectional view of a refrigerator of the bond applicator.

First, the overall structure of a bond applying apparatus will be described with reference to FIG. In FIG. 1, reference numeral 1 denotes a movable table. The substrate 2 is placed on the movable table 1. By driving the movable table 1, the substrate 2 moves in the horizontal direction and is adjusted to an arbitrary position. A movable table 3 is provided above the movable table 1. The moving table 3 includes an X table 4, a Y table 5, and a Z table 6. A holder 7 is mounted on the Z table 6. A bond applicator 8 is exchangeably mounted on the holder 7. By driving the moving table 3, the bond applicator 8 can be positioned at an arbitrary position on the upper surface of the substrate 2.

A frame 10 is provided around the movable table 1. A mounting portion 9 of the bond applicator 8 is provided on a side surface of the frame 10. The mounting unit 9 is mounted with a replacement bond applicator 8 which is taken out of the refrigerator and used next. The frame 10 is provided with a first notification element 11 and a second notification element 12.
The first notification element 11 notifies that the bond in the bond applicator 8 is out of stock. The second notification element 12 notifies that the remaining amount of the bond in the bond applicator 8 becomes equal to or less than a predetermined amount, and that the product runs out in a predetermined time (for example, one hour).

Next, the structure of the holder 7 will be described with reference to FIG. The holder 7 has a mounting hole 7 into which the bond applicator 8 is fitted.
a is provided. The bond applicator 8 is inserted into the mounting hole 7a. The holder 7 has two pairs of photosensors 13.
a, 13b, 14a, and 14b are provided. The photosensors 13a and 13b are provided below the mounting hole 7a, and the first sensor for detecting that the level of the bond in the bond applicator 8 has reached the lower limit position, that is, the out of bond.
Is the detection means. Photo sensors 14a, 14b
Is provided on the upper surface of the holder 7 and serves as second detection means for detecting that the remaining amount of the bond in the bond applicator 8 has become equal to or less than a predetermined amount.

Next, the structure of the mounting section 9 will be described with reference to FIG. The mounting portion 9 is provided with a mounting hole 9a. On the inner surface of the mounting hole 9a, a micro switch 15 as a mounting detecting means is mounted. When the exchange bond applicator 8 is inserted into the mounting hole 9a, the microswitch 15 is turned on, and the attachment of the exchange bond applicator 8 is detected.

Next, a control system of the bond applying apparatus will be described with reference to FIG. In FIG. 4, reference numeral 16 denotes a CPU. The CPU 16 receives signals from the photo sensor 13b as the first detection unit, the photo sensor 14b as the second detection unit, and the micro switch 15 as the attachment detection unit, and receives the first notification element 11 and the second notification. Element 1
2 is controlled.

Next, a method of storing bonds will be described with reference to FIG. In FIG. 5, reference numeral 8 denotes a bond applicator in which a bond is sealed. In order to prevent the bond quality from deteriorating, the bond applicator 8 is refrigerated and stored in the refrigerator 20 in a vertical position, and the bond in the bond applicator 8 is maintained at about 4 ° C.
Is cooled.

This bond coating apparatus has the above-described configuration, and its operation will be described below. In FIG. 1, a substrate 2 is placed and positioned on a first movable table 1. By driving the moving table 3, the bond applicator 8 is positioned with respect to the substrate 2, and a predetermined bond application is performed. By repeating the application operation, the bond in the bond applicator 8 is consumed, and the liquid level of the bond gradually decreases. When the liquid level falls to a predetermined level, that is, when the remaining amount of the bond in the bond applicator 8 becomes a predetermined amount, the photo sensor 14b as the second detection means detects this state. This predetermined amount is set so as to be the amount of bond consumption equivalent to one hour of working time in normal times. In other words, it corresponds to the amount of time required for the bond taken out of the refrigerator 20 to return to room temperature. This setting is performed by adjusting the positions of the photo sensors 14a and 14b.

In FIG. 4, when the CPU 16 receives this detection signal, it activates the second notification element 12. Upon receiving this notification, the operator takes out a new bond applicator 8 for replacement from the refrigerator 20 and mounts it on the mounting unit 9. In FIG. 3, when the exchange bond applicator 8a is attached, the attachment is detected by the microswitch 15, and this signal is transmitted to the CPU 16 (FIG. 4). By detecting this signal, the driving of the second notification element 12 is stopped.

Thereafter, when the coating operation is repeated and the bond is consumed, the liquid level in the bond applicator 8 is further lowered. When the liquid level falls to the lower limit level, the photo sensor 1
3b detects. Upon receiving this detection signal, the CPU 16 activates the first notification element 11. Upon receiving this notification, the operator removes the empty bond applicator 8 from the holder 7 and replaces it with a replacement bond applicator 8 previously mounted on the mounting section 9. Since the exchange bond applicator 8 for replacement has already been kept at room temperature for about one hour, the temperature of the internal bond has risen to room temperature and has a viscosity corresponding to the application conditions.

As described above, the operator is automatically instructed to take out a new bond applicator 8 from the refrigerator 20. If the new bond applicator 8 is removed from the refrigerator 20 according to this instruction, the bond newly attached to the holder at the time of replacement has a predetermined viscosity at room temperature, and a stable application amount can be obtained. Further, since the bond is used about one hour after being taken out of the refrigerator 20, it is not exposed to the room temperature for an unnecessarily long time, so that the quality of the bond does not deteriorate.

The present invention is not limited to the above-described embodiment. For example, in the above-described embodiment, the photo sensor 13b is used as the first detecting means for detecting the out-of-stock bond and the bond in the bond applicator 8 is used. The actual operation time of the coating apparatus is measured by a timer after the photo sensor 14b, which is the second detection means, detects that the bond has been reduced to a predetermined amount, or the number of times of application is counted. In this case, a method of estimating the consumption of the bond during this period and estimating the out-of-stock of the bond based on the estimated consumption may be employed. In this case, the CPU 16 serves as the second detection means.

Further, in the above-described embodiment, as the notification elements for notifying the operator, the first notification element 11 and the second notification element 12 are used separately, but the same notification is used. The element may be used for notification by a signal from the first detection unit and a signal from the second detection unit. In this case, the form of notification, for example, the number of buzzers, the interval, and the like, are changed between the case where notification is performed using a signal from the first detection unit and the case where notification is performed using a signal from the second detection unit. It is desirable.

[0021]

According to the present invention, a notice is given to the operator a predetermined time before the bond is out of stock, and in response to this notice, a replacement bond applicator is taken out of the refrigerator and mounted on the mounting portion, and the bond is out of stock. In response to the notification, the bond applicator that is waiting at the mounting unit is mounted on the holder, so that the bond in the bond applicator is mounted on the mounting unit and has a predetermined viscosity at room temperature during standby. Therefore, if the bond applicator is mounted on the holder, normal application with a stable application amount can be performed immediately.

[Brief description of the drawings]

FIG. 1 is a perspective view of a bond application device according to an embodiment of the present invention.

FIG. 2 is a side sectional view of a bond applicator holder of the bond applicator according to one embodiment of the present invention;

FIG. 3 is a side sectional view of a mounting portion of the bond applying apparatus according to the embodiment of the present invention.

FIG. 4 is a block diagram of a control system of the bond applying apparatus according to the embodiment of the present invention;

FIG. 5 is a sectional view of a refrigerator of the bond applicator.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Movable table 2 Substrate 3 Moving table 7 Bond applicator holder 8 Bond applicator 9 Mounting part 11 1st alerting element 12 2nd alerting element 13b Photo sensor (first detection means) 14b Photo sensor (second detection) Means) 15 mounting detection means 16 CPU

Claims (1)

[Claims] An apparatus for applying a bond, comprising: a positioning unit for a substrate; a holder for holding a bond applicator; and a moving table for horizontally moving the bond applicator relative to the substrate. First detection means for detecting that the bond accommodated in the bond applicator has run out of stock;
A first notification element which is driven by a signal from the first detection means to notify the operator of the fact, and a second detection means which detects that the number of bonds contained in the bond applicator has decreased to a predetermined amount. A second notification element driven by a signal from the second detection means, and a replacement bond applicator taken out of the refrigerator in response to the notification by the driving of the second notification element. An apparatus for applying a bond, comprising: a mounting section; and a mounting detection section configured to detect that a bond applicator has been mounted on the mounting section and stop driving the second notification element.