JPH0886732A - Device and method for measuring stringiness of adhesive - Google Patents

Abstract

PURPOSE: To provide a device and a method for measuring the stringiness of a conductive resin or the like when a semiconductor chip component is secured to a printed board or the like with electrical continuity made between them. CONSTITUTION: This device for measuring adhesive stringiness includes a board 20, an adhesive 2, a carrier 4 holding the adhesive, an arm 7 gripping the carrier, a mechanism for moving the arm, a load sensor 9 provided between the arm and the carrier, and a computer mechanism 8 for controlling these mechanisms and members and for processing data. The carrier 4 is brought close to the upper surface of the board 20 to apply the adhesive 2 to the surface, and while the carrier 4 is raised its load is measured to detect a cut in the adhesive.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus and method for measuring the amount of stringing of a conductive resin or the like that occurs when a semiconductor chip component is fixed to a printed board or the like with electrical continuity.

[0002]

2. Description of the Related Art When a semiconductor chip component such as a chip capacitor or a chip resistor is fixed to a printed circuit board or the like with electrical continuity, conductive resin or cream solder (hereinafter abbreviated as adhesive) is transferred or dispensed. A general method is to mount and cure a chip component on it. In the case of transfer, as shown in FIG. 9, a transfer pin 22 having a bottom surface having substantially the same shape as the electrode pattern is immersed in a dish 1 on which a conductive adhesive 2 has been leveled (a), and the transfer pin 22 is then transferred. The adhesive 2 adhered to is adhered by pressing it onto the electrode plate 21 (b). Then, when the transfer pin 22 is moved to the dish 1 to transfer the adhesive to another electrode plate, a stringing phenomenon (hereinafter referred to as stringing) occurs due to the viscosity of the adhesive (c), and the electrode plate 21 is The adhesive 2 sometimes caused a short circuit (d).

Further, as shown in FIG. 10, in the dispensing system process, an adhesive 2 is filled in a syringe-shaped container called a syringe 10, and a pressure is applied to the adhesive 2, so that a syringe needle attached to the tip of the syringe is attached. Needle 11
The adhesive 2 is discharged from (a). Then release the pressure,
When the syringe was moved to another electrode plate, the adhesive at the tip of the needle caused the string 24 (b), and the electrode 2 was sometimes short-circuited by the adhesive 2 (c).

[0004]

When such a conventional method is used, "viscosity" is used as a characteristic value indicating the easiness of stringing, but the susceptibility to stringing is not always dependent on the viscosity. In some cases, it is not possible to manage the thread, and there has been awaited a means for more accurately measuring the easiness or the degree of stringiness. Therefore, an object of the present invention is to provide an adhesive threading amount measuring apparatus and a threading amount measuring method that solve the above problems.

[0005]

An adhesive threading amount measuring apparatus according to the present invention comprises a substrate, an adhesive, a carrier for holding the adhesive, an arm for holding the carrier, and a mechanism for moving the arm. And a load sensor provided between the arm and the carrier or a weight measuring mechanism on which the substrate is mounted, or both the load sensor and the weight measuring mechanism, and each of these mechanisms and members are controlled and data processing is performed. And a computer mechanism.

[0006] A method for measuring the amount of stringing that occurs when an adhesive is applied to a substrate using the above-mentioned device, wherein a carrier is brought close to the substrate, the adhesive is applied to the surface of the carrier, and then the carrier is attached. The load between the arm and the carrier or the weight of the substrate is measured while pulling up.

Further, another adhesive threading amount measuring apparatus according to the present invention moves a dish containing the adhesive, a contactor holding the adhesive, an arm for holding the contactor, and an arm. A mechanism, a load sensor provided between the arm and the contact, and a computer mechanism for controlling each of these mechanisms and members and processing data.

A method for measuring the amount of stringing that occurs when an adhesive is conveyed to a substrate using the above apparatus, in which the contactor is dipped in the adhesive contained in a dish and then the contactor is pulled up. Meanwhile, the load between the arm and the contactor or the weight of the substrate is measured.

[0009]

With the above configuration, the easiness or extent of stringing can be directly obtained by measuring the change in the load applied to the contactor, the change in the mass of the adhesive on the substrate, or both. be able to. Therefore,
By measuring the mass of this, troubles such as short circuit between the electrodes due to stringing can be prevented in advance.

[0010]

Embodiments of the present invention will be described below with reference to the accompanying drawings. In the description of the drawings, the same elements will be denoted by the same reference symbols, without redundant description. FIG. 1 is a schematic view of an apparatus for depositing an adhesive on a substrate. A substrate 20 having a conductive film on its surface, a carrier 4 that conveys and attaches the adhesive 2 to the substrate 20, and an arm 7 that holds the carrier 4.
And a mechanism for vertically moving and rotating the arm 7 attached to the ball screw 6. A load sensor 9 is provided between the carrier 4 and the arm 7. The output of the load sensor 9 is sent to a computer mechanism: CPU 8 via an amplifier 13 as necessary, and is combined with a control signal of a pulse motor 5 to detect the threading state between the carrier 4 and the substrate 20.

The carrier 4 has a bottom surface having substantially the same shape as that of the electrode pattern, and is used in the case of a contactor formed of a conductive material and a syringe-like syringe which is filled with an adhesive and discharged from the tip. There are cases.

Next, the operation when the contactor 40 is used as the carrier 4 in FIG. 1 will be described with reference to FIG.
The left figure shows the contactor 40 with the adhesive 2 attached to the bottom surface of the substrate 2.
After being brought into contact with the surface of No. 0, the ball screw 6 is rotated and pulled up in the Z direction. The right diagram shows the relationship between the position of the contact 40 and the load m at that time.

First, the position where the contactor 40 is in contact with the adhesive 2 is Z0, the load at that time is m0 ((a) in the figure), and when the contactor 40 is pulled up by the pulse motor 5, the adhesive is applied. It is lifted by the viscosity and surface tension of 2 and the load m increases. When the contact 40 reaches the height ZP ((b) in the figure), the adhesive 2 moves from the contact 40 to the substrate 2 due to gravity.
It begins to flow toward 0 and m decreases (c). Further contactor 40
When is pulled up, the flow stops and a certain amount of adhesive is attached to the contact due to the surface tension of the adhesive 2, and m = m
It becomes constant at 1 (d). If the rising speed of the contactor 40 is kept constant, there is no change in m at the moment when the thread is cut, that is, the height when the thread is cut becomes Z1 and Z1 −
The degree of stringing can be obtained from Z0. Z1-Z
When 0≈0, there is almost no stringing state, and as Z1 -Z0 increases, the string is drawn longer and the probability of short-circuiting between the electrodes increases.

FIG. 2 is a schematic diagram showing another structure of this embodiment. In this case, the substrate 20 is placed on the electronic balance 3,
A change in the mass of the adhesive on the substrate can be detected when the contactor 4 moves up and down. Other configurations are shown in FIG.
Is the same as FIG. 7 shows the position where the contactor 4 is moved in the Z direction and the corresponding indication value of the electronic balance. Since the contactor 4 is brought into contact with the substrate 20 and then pulled up, the mass is reduced due to the viscosity and surface tension of the adhesive 2. However, the degree of stringing can be obtained as in the case of FIG.

FIG. 3 is a schematic view showing another structure of this embodiment. This is a combination of the configurations of FIG. 1 and FIG. 2, and has the effect of improving the accuracy as compared with the case where each is independent.

FIG. 4 is a schematic diagram showing the structure of the dispense system. A syringe 10 filled with an adhesive 2 is attached to the tip of the arm 7 instead of the contactor 4 of FIG. 1, and a dispensing unit for controlling the air pressure for discharging the adhesive 2 from the needle 11 is attached to the syringe 10. 12 and the flexible tube 14 are connected. The substrate 20 is placed on the electronic balance 3, and the adhesive 2 is discharged onto the surface of the substrate 20 through the needle 11. Other configurations are the same as those in FIG.

FIG. 8 shows the position where the syringe 10 is moved and the corresponding indication value of the electronic balance 3 in this case. First, the syringe 10 is brought close to the substrate 20, and the needle 11
At the position Z0 where the adhesive 2 was discharged from, the mass at that time was m0
Until the syringe 10 is pulled up and the adhesive is pushed out by a certain amount. Here, the smaller the stringiness of the adhesive, the more quickly the mass converges.

FIG. 5 is a schematic view of an apparatus for conveying the adhesive contained in the dish to the substrate. A contactor 40 is attached to the tip of the arm 7 as the carrier 4 of FIG. 1, and the plate 1 containing the adhesive 2 is arranged in place of the substrate 20. Other configurations are the same as those in FIG.

Next, the threading state of this device will be described. After the contactor 40 is brought into contact with the adhesive 2, the ball screw 6 is rotated and pulled up in the Z direction. Then contactor 4
When 0 is pulled up, the stringing is cut off, so the mass change in that process shows the same tendency as in the case of FIG. Therefore, by measuring the mass m, it is possible to reliably detect the state of stringing.

Further, the bottom surface of the contact 40 is introduced into the adhesive 2 in the dish 1 by a device combining FIG. 3 and FIG. 5, and this is pulled up and rotated to move the adhesive 2 to the substrate 20.
Can be attached to. Here, from the plate 1 to the contact 40
When pulling up, and when pulling up the contactor 40 from the surface of the substrate 20, stringing occurs. However, in any case, the state of stringing can be reliably detected by the method described above.

[0021]

As described above, the measuring method according to the present invention measures the change in the load applied to the contactor, the change in the mass of the adhesive on the substrate, or both to determine the likelihood of stringing or The degree can be directly calculated. Therefore, there is an effect that the trouble such as the short circuit between the electrodes due to the stringing can be prevented by measuring the mass of this.

[Brief description of drawings]

FIG. 1 is a schematic diagram of an apparatus for depositing an adhesive on a substrate.

FIG. 2 is a schematic view of another device for depositing an adhesive on a substrate.

FIG. 3 is a schematic diagram of another apparatus for depositing an adhesive on a substrate.

FIG. 4 is a schematic view of an apparatus for depositing an adhesive on a substrate by a syringe.

FIG. 5 is a schematic view of an apparatus that conveys an adhesive agent contained in a dish to a substrate.

FIG. 6 is an explanatory diagram of a case where an adhesive is attached on a substrate by the device of FIG.

FIG. 7 is an explanatory diagram when an adhesive is attached on a substrate by the apparatus of FIG.

8 is an explanatory diagram of a case where an adhesive is attached on a substrate by the device of FIG.

FIG. 9 is a process diagram for explaining a conventional example.

FIG. 10 is a process drawing for explaining another conventional example.

[Explanation of symbols]

 1: Plate 2: Adhesive 3: Weight Measuring Mechanism 4: Carrier 5: Pulse Motor 6: Ball Screw 7: Arm 8: CPU 9: Load Sensor 10: Syringe 11: Needle 12: Dispense Unit 13: Amplifier 14: Flexible Tube 20: Substrate 21: Electrode 22: Transfer Pin 23: Semiconductor Chip 24: Threading 40: Contact

Claims (8)

[Claims] 1. A substrate, an adhesive, a carrier for holding the adhesive, an arm for holding the carrier, a mechanism for moving the arm, a load sensor provided between the arm and the carrier, and these. And a computer mechanism for controlling data and processing each mechanism and member, and a threading amount measuring device for an adhesive. 2. A substrate, an adhesive, a carrier for holding the adhesive, an arm for holding the carrier, a mechanism for moving the arm, a weight measuring mechanism on which the substrate is placed, each of these mechanisms, and An adhesive threading amount measuring device comprising: a computer mechanism for controlling a member and performing data processing. 3. A substrate, an adhesive, a carrier for holding the adhesive, an arm for holding the carrier, a mechanism for moving the arm, a load sensor provided between the arm and the carrier, A weight measuring mechanism on which a substrate is placed,
An adhesive threading amount measuring device comprising a computer mechanism for controlling each of these mechanisms and members and for processing data. 4. The adhesive threading amount measuring device according to claim 1, wherein the carrier is a contactor. 5. The thread pulling amount measuring device for an adhesive according to claim 2, wherein the carrier is a syringe. 6. A tray containing an adhesive, a contactor holding the adhesive, an arm for holding the contactor, a mechanism for moving the arm, and a load provided between the arm and the contactor. An adhesive threading amount measuring device comprising a sensor and a computer mechanism for controlling each of these mechanisms and members and processing data. 7. A method for measuring the amount of stringing that occurs when an adhesive is attached on a substrate, which comprises moving the substrate, the adhesive, a carrier holding the adhesive, an arm holding the carrier, and an arm. A load sensor provided between the arm and the carrier or a weight measuring mechanism on which the substrate is placed, and a computer mechanism that controls each of these mechanisms and members and performs data processing. An amount of threading of the adhesive characterized in that the carrier is brought close to the top and an adhesive is attached to the surface thereof, and then the load between the arm and the carrier or the weight of the substrate is measured while pulling up the carrier. Measuring method. 8. A method for measuring the amount of stringing that occurs when an adhesive is conveyed to a substrate, which comprises a plate containing the adhesive, a contactor holding the adhesive, an arm for gripping the contact, and an arm. A moving mechanism, a load sensor provided between the arm and the contactor or a weight measuring mechanism on which the substrate is placed, and a computer mechanism that controls each of these mechanisms and members and performs data processing. And soaking the contacts in the adhesive contained in the dish, and then
A method for measuring the amount of stringing of an adhesive, characterized in that a load between the arm and the contactor or a weight of the substrate is measured while pulling up the contactor.