WO2014174933A1

WO2014174933A1 - Fluid weight measurement device and fluid weight measurement method

Info

Publication number: WO2014174933A1
Application number: PCT/JP2014/056924
Authority: WO
Inventors: 耕平瀬山
Original assignee: 株式会社新川
Priority date: 2013-04-26
Filing date: 2014-03-14
Publication date: 2014-10-30
Also published as: TWI511800B; TW201440895A; JP2016136546A

Abstract

A fluid weight measurement device is provided with a precision balance (201), a measuring cup (202) placed on the precision balance (201), and a receiving needle (203) that is attached to the inner surface of the measuring cup (202) and on the surface of which fluid discharged from a needle (105) of a dispenser (100) falls onto and flows down in the direction of the measuring cup (202). As a result, the accuracy of the measurement of the weight of the fluid discharged from the dispenser is improved.

Description

Fluid weight measuring device and fluid weight measuring method

The present invention relates to an apparatus and method for measuring the weight of fluid discharged from a dispenser.

As a method of mounting a semiconductor chip, which is an electronic component, on a circuit board, a flip chip mounting apparatus in which bump electrodes called bumps are formed on the semiconductor chip and the semiconductor chip is directly connected to the circuit board has been widely adopted. . In a flip chip mounting apparatus, a thermosetting non-conductive paste (NCP) is applied in advance to a circuit board by a dispenser and heated in order to ensure the connection reliability of the joint between the semiconductor chip and the circuit board. The bumps of the semiconductor chip are pressed against the electrodes of the circuit board by a mounting tool, and the bumps are heated and melted to electrically connect the semiconductor chip and the circuit board, and at the same time, the non-conductive paste (NCP) is heated and cured to make the semiconductor chip. A method of resin sealing between the circuit board and the circuit board is used (for example, see Patent Document 1).

Also, when an electronic component such as a semiconductor chip is mounted on a substrate such as a lead frame, a paste-like adhesive is applied to the position where the electronic component on the substrate is attached by a dispenser, and the electronic component is placed thereon. Many die bonders are also used to mount an electronic component on a substrate by pressing (see, for example, Patent Document 2).

JP 2005-150446 A JP 2002-110709 A

By the way, if the amount of non-conductive paste (NCP) used in the flip chip mounting apparatus or paste adhesive used in the die bonder is too large on the substrate, it will protrude from the periphery of the semiconductor chip during mounting. While there are too many non-conductive pastes (NCPs) and adhesives, the non-conductive pastes (NCPs) and adhesives may adhere to the surface of the collet that is a mounting tool, etc. Conversely, if the amount of non-conductive paste (NCP) or adhesive applied is too small, there is a problem that the connection reliability between the semiconductor chip and the substrate cannot be ensured.

In addition, since non-conductive paste (NCP), adhesive, and the like change in properties such as viscosity with time, the amount of non-conductive paste (NCP) and adhesive discharged from the dispenser changes and is appropriate. The amount of non-conductive paste (NCP) or adhesive may not be applied. Therefore, in a flip chip mounting apparatus or a die bonder, a non-conductive paste (NCP) discharged from a dispenser during a predetermined application operation so that an appropriate amount of non-conductive paste (NCP) or adhesive can be applied. In many cases, a method is used in which the weight of the adhesive is measured and the coating operation is corrected based on the measurement result.

The weight of the non-conductive paste (NCP) or adhesive discharged from the dispenser is such that the same amount of non-conductive paste (NCP) or adhesive as the predetermined application operation is discharged from the dispenser into the measuring cup. In many cases, the measurement is performed by measuring the weight. However, when the viscosity of the non-conductive paste (NCP) or the adhesive is high, the non-conductive paste (NCP) or the adhesive can be removed even if a predetermined application operation is performed. In some cases, the droplet does not completely fall into the measuring cup from the discharge port of the dispenser, and the measured weight may vary. For this reason, the amount of application of the non-conductive paste (NCP) or the adhesive varies, and the mounting quality may deteriorate.

An object of the present invention is to improve the weight measurement accuracy of fluid discharged from a dispenser.

The fluid weight measuring device of the present invention includes a weighing table, a measuring cup placed on the weighing table and storing fluid, and attached to the inner surface of the measuring cup, and the fluid discharged from the dispenser is measured along the surface. A fluid weight measuring apparatus for measuring the weight of fluid discharged from a dispenser, comprising a receiving needle that falls down to the inner surface of a cup.

In the fluid weight measuring device of the present invention, it is also preferable to include a cover attached to the measuring cup and surrounding the needle.

The fluid weight measuring method of the present invention includes a weighing table, a measuring cup placed on the weighing table and storing the fluid, and attached to the inner surface of the measuring cup, and the fluid discharged from the dispenser is measured along the surface. A step of preparing a fluid weight measuring device comprising a receiving needle falling down to the inner surface of the cup, a step of bringing the discharge port of the dispenser close to the tip of the needle, and a predetermined amount from the discharge port of the dispenser toward the tip of the needle And a step of measuring the increase in weight due to the fluid accumulated in the measuring cup and the fluid adhering to the surface of the needle by a weighing table. Is a fluid weight measuring method for measuring the weight of the fluid to be measured.

In the fluid weight measuring method of the present invention, the approaching step includes the step of disposing the discharge port from the discharge port more than the size of the liquid droplets remaining in the discharge port while being suspended from the discharge port when stopping the discharge of the fluid from the discharge port of the dispenser. It is also preferable to make the discharge port close to the tip of the needle so that the distance from the tip of the needle becomes small.

The present invention has an effect of improving the accuracy of measuring the weight of the fluid discharged from the dispenser.

It is a top view which shows the dispenser which has the fluid weight measuring apparatus in embodiment of this invention. It is an elevation view which shows the dispenser which has the fluid weight measuring apparatus in embodiment of this invention. It is explanatory drawing which shows the process of measuring the weight of nonelectroconductive paste (NCP) using the fluid weight measuring apparatus in embodiment of this invention.

As shown in FIGS. 1A and 1B, the fluid weight measuring device 200 of the present embodiment is disposed beside the dispenser 100. First, the configuration of the dispenser 100 will be described. The dispenser 100 is attached to a base 110, a dispenser stage 112 that is mounted on a support base 111 fixed to the base 110 and sucks and fixes the substrate 300 on the surface, a transport rail 113 that transports the substrate 300, and the base 110. The X direction guide 101 extending in the X direction, which is the transport direction of the substrate 300, the Y direction guide 102 guided in the Y direction perpendicular to the X direction guided by the X direction guide, and the Y direction guide 102 guided in the Y direction A dispenser head 103 that moves in the direction, a syringe 104 that is attached to the dispenser head 103 and moves in the Z direction, which is the vertical direction, and a needle 105 that is attached to the tip of the syringe 104 are provided.

Since the dispenser head 103 can be freely moved in the XY direction by the X direction guide 101 and the Y direction guide 102, the syringe 104 and the needle 105 attached to the dispenser head 103 so as to be movable in the Z direction are arranged in the XYZ direction. It is configured to be able to move freely. The syringe 104 stores a non-conductive paste (NCP) or a paste-like adhesive inside, and a non-conductive paste (NCP) which is a fluid stored by the screw pump 106 shown in FIG. ) Or a paste-like adhesive is discharged from the discharge port at the tip of the needle 105 at the tip.

As shown in FIG. 1B, the fluid weight measuring device 200 includes a precision scale 201 that is a weighing table disposed beside the dispenser stage 112, a measuring cup 202 placed on the precision scale 201, and a measuring cup 202. A receiving needle 203 that extends vertically upward from the bottom surface inside the cover, and a cover 204 that is attached to the upper surface of the measuring cup 202 and covers the periphery of the receiving needle 203.

As shown in FIG. 1B, the precision scale 201 is arranged on the side of a support base 111 that supports the dispenser stage 112, and a part thereof is below the dispenser stage 112. As shown in FIG. A portion on which 202 is placed is disposed outside the dispenser stage 112 and the transport rail 113.

As shown in FIG. 2, the receiving needle 203 attached so as to extend vertically upward from the center of the bottom surface 205 inside the measuring cup 202 is thick at the base side fixed to the bottom surface 205 and narrows toward the tip. The tip is very thin and the diameter is smaller than the inner diameter of the needle 105. As shown in FIG. 2, the cover 204 is attached to the lid portion 204 b that covers the upper surface of the measuring cup 202 and the lid portion 204 b, and extends from the lid portion 204 b around the receiving needle 203 toward the vertically upward direction. It is comprised by the main body 204a. The cover main body 204a extends to the vicinity of the tip of the receiving needle 203. In this embodiment, the upper end of the cover main body 204a extends to a position slightly lower than the tip of the receiving needle 203, and the front end of the receiving needle 203 slightly protrudes from the upper end of the cover main body 204a. It may be configured to extend to a position slightly higher than the tip of the needle 203.

Next, a process for measuring the discharge weight of the non-conductive paste (NCP) or paste adhesive discharged from the dispenser 100 described with reference to FIGS. 1A, 1B, and 2 will be described.

1A and 1B, the Y-direction guide 102 is moved along the X-direction guide 101 in the X-direction, and the dispenser head 103 is moved along the Y-direction guide 102 in the Y-direction. The center of the needle 104 and the center of the needle 105 is the position in the XY direction of the tip of the receiving needle 203 of the measuring cup 202. When the position of the needle 105 in the XY direction becomes the position of the receiving needle 203 in the XY direction, the syringe 104 is lowered by a Z-direction motor (not shown) built in the dispenser head 103, and the discharge port at the tip of the needle 105 is opened. The receiving needle 203 is brought close to the tip. Then, as shown in FIG. 2, the distance d between the tip of the needle 105 and the tip of the receiving needle 203 is brought close to, for example, about 0.2 to 0.3 mm.

Next, the screw pump 106 shown in FIG. 2 built in the syringe 104 is operated to discharge the non-conductive paste (NCP) from the discharge port at the tip of the needle 105. The discharge of the non-conductive paste (NCP) is performed in the same manner as the discharge operation when the non-conductive paste (NCP) is applied onto the substrate 300. Normally, the non-conductive paste (NCP) is applied on the substrate 300 four times, for example, as indicated by a letter “X” from the four corners of the region of the substrate 300 where the semiconductor chip is mounted toward the center of the region. It is applied by dividing into four times, or it is applied by dividing into eight times like a “rice” from the center of the four corners and sides to the center of the region. That is, when the non-conductive paste (NCP) is applied to one region, the discharge operation of repeating the start and stop of the non-conductive paste (NCP) from the tip of the needle 105 several times is performed. . Therefore, in the measurement of the discharge weight of the non-conductive paste (NCP), the discharge and stop of the non-conductive paste (NCP) are performed in the same pattern as the discharge operation when the non-conductive paste (NCP) is applied to the substrate 300. Repeat several times.

First, when the screw pump 106 shown in FIG. 2 is started, the non-conductive paste (NCP) 51 starts to be discharged from the discharge port at the tip of the needle 105. As shown in FIG. 2, the discharged non-conductive paste (NCP) 51 having a high viscosity is downward along the outer surface of the receiving needle 203 while covering the tip of the receiving needle 203 that is close at a distance d. Slowly transmitted to and falling. When the screw pump 106 stops, the discharge of the non-conductive paste (NCP) from the discharge port of the needle 105 stops. At this time, a non-conductive paste (NCP) having a high viscosity exists between the discharge port of the needle 105 and the tip of the receiving needle 203. The non-conductive paste (NCP) existing between the discharge port of the needle 105 and the tip of the receiving needle 203 is transmitted along the outer surface of the receiving needle 203 downward and falls off ( NCP) and a continuous liquid mass 52 are formed, and the liquid mass 52 is drawn by the liquid mass 52 to move downward, and is eventually separated from the discharge port at the tip of the needle 105.

As shown in FIG. 2, the non-conductive paste (NCP) discharged from the start to the stop of the screw pump 106 becomes

liquid masses

52, 53, and 54 that flow down the outer surface of the receiving needle 203. Reaches the bottom surface 205 of the measuring cup 202 and is stored as a reservoir 55 on the bottom surface 205.

As described above, when the discharge and stop of the non-conductive paste (NCP) are repeated in the same pattern as the discharge operation when the non-conductive paste (NCP) 51 is applied to the substrate 300, the non-conductive paste (NCP) is repeated each time. ) 51 is transferred to the outer surface of the receiving needle 203 as liquid masses 52 to 54, and is stored as a reservoir 55 in the measuring cup 202.

When the above discharge operation is completed, the difference between the weight of the measuring cup 202 before the start of the discharge operation and the weight of the measurement cup 202 after the end of the discharge operation is measured by the precision scale 201, and the non-conductivity that discharges the weight difference. The weight of the paste (NCP). Since the receiving needle 203 is fixed to the bottom surface 205 of the measuring cup 202, even if the discharged non-conductive paste (NCP) having a high viscosity remains attached to the surface of the receiving needle 203, it is measured as the weight discharged from the needle 105. Therefore, the weight of the discharged non-conductive paste (NCP) can be accurately measured.

As described above, according to the fluid weight measuring apparatus 200 of the present embodiment, the distance d between the tip of the needle 105 and the tip of the receiving needle 203 is brought close to, for example, about 0.2 to 0.3 mm. Thus, the non-conductive paste (NCP) 51 remaining at the tip of the needle 105 after the screw pump 106 is stopped can be almost eliminated. Therefore, the nonconductive paste (NCP) 51 discharged from the start to the stop of the screw pump 106 can be accurately delivered to the receiving needle 203, and the viscosity of the nonconductive paste (NCP) 51 is increased. Even when the value is high, the discharge weight can be accurately measured.

In the present embodiment, since the periphery of the receiving needle 203 is surrounded by the cover 204, the non-conductive paste (NCP) 51 discharged from the tip of the needle 105 is smoothly affected by the flow of outside air. Since it is delivered to the receiving needle 203, a part of the non-conductive paste (NCP) 51 discharged by the flow of outside air is not blown away, and the non-conductive discharged from the discharge port at the tip of the needle 105. The amount of paste (NCP) 51 can be accurately measured.

In the present embodiment, the distance d between the distal end of the needle 105 and the distal end of the receiving needle 203 has been described as being close to, for example, about 0.2 to 0.3 mm. It is sufficient that the distance is smaller than the size of the droplet when the non-conductive paste (NCP) 51 is dropped from the discharge port, and is not limited to 0.2 to 0.3 mm. For example, when the inner diameter of the discharge port of the needle 105 is large, the liquid droplets to be discharged are also large, so the distance d may be increased. Conversely, when the inner diameter of the needle 105 is small, the liquid is discharged. Since the size of the droplet is small, the distance d may be a smaller distance.

In this embodiment, the case of measuring the weight of the non-conductive paste (NCP) discharged from the dispenser 100 has been described as an example. However, the present invention is not limited to the non-conductive paste (NCP) discharged from the dispenser 100. The present invention can be applied not only to the case of measuring the weight of the liquid, but also to the case of measuring the weight of the fluid having high viscosity discharged from the needle 105 as well as the paste-like adhesive.

The present invention is not limited to the embodiments described above, but includes all changes and modifications that do not depart from the technical scope or essence of the present invention defined by the claims.

51 Non-conductive paste (NCP), 52, 53, 54 Liquid mass, 55 pool, 100 dispenser, 101 X direction guide, 102 Y direction guide, 103 dispenser head, 104 syringe, 105 needle, 106 screw pump, 110 base, DESCRIPTION OF SYMBOLS 111 Support stand, 112 Dispenser stage, 113 Conveying rail, 200 Fluid weight measuring apparatus, 201 Precision scale, 202 Measuring cup, 203 Receiving needle, 204 Cover, 204a Cover main body, 204b Cover part, 205 Bottom surface, 300 Substrate.

Claims

A fluid weight measuring device comprising:
A weighing platform;
A measuring cup that is placed on the weighing platform and stores the fluid;
A receiving needle attached to the inner surface of the measuring cup, and the fluid discharged from the dispenser is transferred along the surface to the inner surface of the measuring cup;
A fluid weight measuring device for measuring the weight of fluid discharged from a dispenser.
The fluid weight measuring apparatus according to claim 1, further comprising a cover attached to the measuring cup and surrounding the needle.
A fluid weight measuring method comprising:
A weighing table, a measuring cup placed on the weighing table and storing the fluid, and attached to the inner surface of the measuring cup, and the fluid discharged from a dispenser along the surface of the measuring cup on the inner surface of the measuring cup Providing a fluid weight measuring device comprising:
Bringing the discharge port of the dispenser close to the tip of the needle;
Discharging a predetermined amount of the fluid from the discharge port of the dispenser toward the tip of the needle and storing the fluid in the measuring cup;
Measuring an increase in weight due to the fluid accumulated in the measuring cup and the fluid adhering to the surface of the needle with the weighing platform;
A fluid weight measuring method for measuring the weight of fluid discharged from a dispenser.
The fluid weight measuring method according to claim 3,
In the approaching step, when stopping the discharge of the fluid from the discharge port of the dispenser, the discharge port and the size of the liquid droplet remaining in the discharge port in a state of being suspended from the discharge port A fluid weight measuring method in which the discharge port is brought close to the tip of the needle so that the distance from the tip of the needle becomes small.