JPH10229088A - Method and apparatus for testing semiconductor members, semiconductor manufacturing apparatus and semiconductor members - Google Patents

Abstract

PROBLEM TO BE SOLVED: To raise the yield by judging semiconductor members of critical levels to be good in a method and apparatus for testing semiconductor members, semiconductor manufacturing apparatus and semiconductor members. SOLUTION: The method comprises means for testing bumps of semiconductor members, usual judging means 32 which judges those semiconductor member having defective bumps, if judging according to a first judging criterion, to be defective products, and strictly judging means 34 which judges whether any of the defective bumps judged according to the first criterion meets a second criterion different from the first one and, if meeting, judges the associated semiconductor member to be a good product.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and apparatus for inspecting a semiconductor member, a semiconductor manufacturing apparatus, and a semiconductor member.

[0002]

2. Description of the Related Art It is known that bumps such as solder bumps are formed on a semiconductor chip (semiconductor member) and the semiconductor chip is joined to a circuit board or the like using the solder bumps. Before joining a semiconductor chip to a circuit board or the like, a solder bump formed on the semiconductor chip is inspected. The inspection of the solder bump is performed by, for example, irradiating a laser beam and inspecting the reflected light to measure the height of the solder bump.

[0003]

In the inspection of solder bumps, if at least one of the solder bumps has a height less than an allowable value, the semiconductor chip is determined to be defective. A semiconductor chip determined to be defective must be discarded, and there is a problem that the yield is reduced.
In addition, when one semiconductor chip includes a small amount (for example, one) of defective solder bumps and a large number of such semiconductor chips are generated, many semiconductor chips are discarded despite minor defects. Must.

An object of the present invention is to provide a method and apparatus for inspecting a semiconductor member and a semiconductor manufacturing apparatus capable of extracting a semiconductor member at a cautious product level (a critical quality level) as a non-defective product and improving the yield, and a semiconductor manufacturing apparatus as described above. It is to provide a manufactured semiconductor member.

[0005]

According to the present invention, there is provided a method for inspecting a semiconductor member, comprising the steps of: inspecting a bump of the semiconductor member;
It is determined whether or not there is a bump that is determined to be defective according to the first criterion, which satisfies a second criterion different from the first criterion, and a bump that satisfies the second criterion is determined. If there is, the semiconductor member is determined to be non-defective.

In addition, the method for inspecting a semiconductor member according to the present invention inspects the bumps of the semiconductor member, and if there is a bump determined to be defective according to the first determination criterion, the semiconductor member is normally determined to be defective. And inspecting the bumps of the semiconductor member and determining whether any of the bumps determined to be defective according to the first criterion satisfies a second criterion different from the first criterion. And if there is a bump that satisfies the second criterion, a severe determination for determining that the semiconductor member is non-defective is selectively performed.

Further, the semiconductor member inspection apparatus according to the present invention includes a means for inspecting a bump of a semiconductor member, and a bump which is determined to be defective according to the first determination criterion. Means for determining whether or not there is a bump that satisfies the second criterion, and means for determining that the semiconductor member is non-defective if there is a bump that satisfies the second criterion. Is what you do.

In addition, a semiconductor member inspection apparatus according to the present invention includes means for inspecting a bump of a semiconductor member, and if there is a bump determined to be defective according to a first determination criterion, the semiconductor member is determined to be defective. A normal judging means for judging whether there is a bump satisfying a second judging criterion different from the first judging criterion among bumps judged to be defective by the first judging criterion, If there is a bump that satisfies the second criterion, the semiconductor device is provided with severe determination means for determining the semiconductor member as a non-defective product.

The semiconductor member can be a solder chip or other semiconductor member such as a semiconductor package having bumps. The bump can be a solder bump. In each of the above-described configurations, for example, even if the height of one solder bump is less than the allowable value, the semiconductor chip is not immediately determined to be defective, and the semiconductor chip further satisfies the second determination criterion. Determine whether Therefore, even if there is a bump determined to be defective according to the first determination criterion, if the bump satisfies the second determination criterion, the semiconductor member is used as a non-defective product. Therefore, the yield of semiconductor members is improved.

Preferably, the means for judging whether or not there is a bump that satisfies the second criterion determines whether there is a bump that satisfies the second criterion from the type and position of the bump. I do. In this case, preferably, the means for determining whether or not there is one satisfying the second determination criterion is determined to be defective within a predetermined range including a bump determined to be defective by the first determination criterion. It is determined whether or not there is a good bump of the same type as the bump.

Preferably, the type of the bump is a bump other than the signal bump. Further, it can include means for generating a command for switching between the normal judgment means and the severe judgment means. In addition, it is possible to provide a repairing device for repairing a bump determined to be defective, and a device for sending information on a semiconductor member determined to be defective by the severe determination means to the repairing device.

Further, the present invention provides a semiconductor manufacturing apparatus including the above-described semiconductor member inspection apparatus. Further, the present invention provides a semiconductor member including a bump which is determined to be defective by the first criterion and satisfies a second criterion different from the first criterion.

[0013]

FIG. 3 is a diagram showing a semiconductor manufacturing apparatus 100 which is arranged online. Semiconductor manufacturing equipment 10
0 is the semiconductor member inspection device 10 and the first manufacturing device 12
, A second manufacturing device 14, a correction device 16, and the like. These devices are interconnected by a host computer 18. In addition, in the inspection device 10, the semiconductor member inspection method of the present invention is performed.

As shown in FIG. 2, the inspection apparatus 10 comprises:
It includes a light emitting device 20, a light receiving device 22, and a determination unit 24. The semiconductor chip 26 as a semiconductor member has a large number of solder bumps 28. The light emitting device 20 is, for example, a laser device that generates a laser beam, irradiates the laser beam obliquely to the solder bump 28, and the light receiving device 22 receives the laser beam reflected by the solder bump 28. Judgment means 24
Is composed of, for example, a computer, calculates the height of the solder bump 28 from the signal of the light receiving device 22, and makes a determination described below.

FIG. 1 is a diagram schematically showing the functions of a semiconductor member inspection apparatus 10 according to an embodiment of the present invention. The inspection device 10 is configured to execute the normal determination unit 3 based on the determination switching command 30.
2 and severe determination means 34. Judgment switching command 3
0 is supplied from the host computer 18. The host computer 18 switches between the normal judging means 32 and the severe judging means 34 according to the status of the manufacturing process before and after, the type of the semiconductor chip 26, the status of the lot, and the like. Coordinate production plans for

FIG. 4 is a view showing a semiconductor chip 26 having a large number of solder bumps 28. Solder bump 28
Include a signal solder bump, a VDD (power supply) solder bump, and a ground solder bump. Although the number of signal solder bumps is large, the number of VDD solder bumps and ground solder bumps is also considerable. Further, a monitor solder bump and a dummy solder bump may be included.

In FIG. 4, the height of each solder bump 28 is measured, it is determined whether or not the height is within an allowable value, and the quality of the bump is determined. The hatched solder bumps 28a are VDD solder bumps determined to be defective. Solder bump 28 indicated by single circle
b denotes a VDD solder bump determined to be non-defective. Solder bumps 28 indicated by double circles are other solder bumps determined to be non-defective. This includes signal solder bumps, VDD solder bumps, and ground solder bumps. Further, a predetermined range 36 is shown. In this embodiment, the predetermined range 36 is defined as a range of 5 × 5 solder bumps.

FIG. 5 shows a flowchart performed by the normal determining means 32. In step 40, CAD loading is performed, and the address, type, and the like of the solder bump 28 are read. In step 41, a bump rank is assigned. The measurement result regarding the height of the solder bump 28 is known by the inspection described with reference to FIG. 2, and the bump rank is a ranking of the height of each solder bump 28. Then, the solder bump whose height does not fall within the allowable range is determined to be defective and is recorded like the solder bump 28a shown by hatching in FIG. For example, if the standard height of the solder bumps 28 is 100 μm, it is determined whether the average value of the heights of all the solder bumps 28 of the chip is within an allowable range (83 to 123 μm), and The average height of each solder bump is ±
Judgment is made within 25 μm, ± 20 μm, ± 13 μm, and ranking is performed.

In step 42, the semiconductor chip 2
It is checked whether 6 is within the specification range. Here, if there is a defective solder bump 28a whose height exceeds the average value ± 25 μm, the semiconductor chip 26 is determined to be defective. Further, in step 43, a variation standard check of the solder bumps 28 is performed. That is,
If the height of the solder bumps 28 of one semiconductor chip 26 is uneven, it is inconvenient to join it to a circuit board or the like.

If it is determined in steps 41, 42, and 43 that the height of the solder bumps 28 has no problem, in step 44, the semiconductor chip 26 is determined to be non-defective. In step 45, the determination result is output to the host computer 18. FIG. 6 shows a flowchart performed by the severe determination means 34. Steps 40 to 48 in FIG. 6 are the same as steps 40 to 48 in FIG. FIG. 6 differs from FIG. 5 in that steps 46 and 47 are added.

In step 40, CAD loading is performed, and the address, type, etc. of the solder bump 28 are read.
In step 41, a bump rank is assigned,
Solder bumps that do not fall within the allowable range are determined to be defective and are recorded as solder bumps 28a indicated by hatching in FIG. In step 46, the number of solder bumps 28 determined to be defective is checked. In the severe determination, even if there is a defective solder bump 28a, the semiconductor chip 26 is not immediately determined to be defective. However, 10 or more defective solder bumps 2
If there is 8a, the semiconductor chip 26 is determined to be defective.

In step 42, the semiconductor chip 2
It is checked whether 6 is within the specification range. Here, the semiconductor chip 26 is determined to be defective if the signal solder bump 28 is defective, but the semiconductor chip 26 is not immediately determined to be defective even if the other solder bumps 28 are defective. In step 43, a variation standard check of the solder bumps 28 is performed.

In step 47, a bump periphery check is performed. The bump periphery check checks whether there is a solder bump satisfying a predetermined criterion based on the type and position of the solder bump 28. Here, referring again to FIG. 4, the VD of the defective product indicated by hatching is shown.
Assume that there is a D solder bump 28a. Therefore, a predetermined range (range of 5 × 5 solder bumps) 36 is set around the defective VDD solder bump 28a. Then, it is determined whether or not there is a non-defective VDD solder bump 28b of the same type as the defective VDD solder bump 28a within the predetermined range 36.

In step 44, the VDD of the defective product
If the non-defective VDD solder bump 28b is within the predetermined range 36 including the solder bump 28a, the semiconductor chip 26 is determined to be non-defective. However, in the embodiment, if there is still another defective solder bump 28a for VDD within the predetermined range 36, the semiconductor chip 26 is determined to be defective.

Similarly, when the defective solder bump 28 is a ground solder bump, a non-defective ground solder bump 28 of the same kind within a predetermined range 36 including the defective solder bump 28. If there is, the semiconductor chip 26 is determined to be non-defective. As described above, if the defective solder bump 28 and the non-defective ground solder bump 28 are within a predetermined range, the function of the defective solder bump 28 for a defective product is the same as the function of the good solder bump 28 for a ground. Shared by However, in the case of the signal solder bump 28, the function cannot be shared by other bumps, so that the bump periphery check is not applied to the signal solder bump 28. Finally, in step 45, the judgment result is output to the host computer 18.

Therefore, in the severe determination, there is a pure non-defective semiconductor chip 26 having no defective solder bumps 28 and a defective solder bump 28, but the same type near the defective solder bump 28. And the second good semiconductor chip 26 having the good solder bump 28. In that sense, step 44 in FIG. 6 is slightly different from step 44 in FIG. The secondary non-defective semiconductor chip 26 is a bump that is determined to be defective by the first determination criterion and satisfies a second determination criterion different from the first determination criterion.

FIG. 7 is a diagram showing the relationship between the inspection device 10 and the correction device 16. The host computer 18 exchanges signals with the inspection device 10 and the correction device 16. The inspection result of the inspection device 10 is stored in the host computer 18.
Is input to the correction device 16 via the. The correction device 16
The solder bump 28 determined to be defective based on the inspection result of the inspection device 10 is corrected (removed). In particular, the semiconductor chip 26 determined to be defective by the severe determination means 34
By sending the information about the solder bumps 28 to the correction device 16, only the solder bumps 28 that need to be corrected at a minimum need be corrected, and not all the defective solder bumps 28 need be corrected. Therefore, the number of steps is reduced.

[0028]

As described above, according to the present invention,
It is possible to improve the yield by extracting a semiconductor member of a cautionary product level (critical quality level) as a non-defective product.

[Brief description of the drawings]

FIG. 1 is a diagram showing an outline of functions of a semiconductor member inspection apparatus according to an embodiment of the present invention.

FIG. 2 is a view showing an inspection means of an inspection device for a semiconductor member.

FIG. 3 is a diagram illustrating a semiconductor manufacturing apparatus including an inspection unit.

FIG. 4 is a diagram showing a semiconductor chip having solder bumps.

FIG. 5 is a flowchart of a normal determination unit.

FIG. 6 is a flowchart of a severe determination unit.

FIG. 7 is a diagram showing a relationship between an inspection device and a correction device.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 ... Inspection apparatus 16 ... Correction apparatus 18 ... Upper host computer 26 ... Semiconductor chip 28 ... Solder bump 32 ... Normal determination means 34 ... Severe determination means 36 ... Predetermined range 100 ... Semiconductor manufacturing equipment

Claims (9)

[Claims] An inspection of bumps of a semiconductor member is performed,
It is determined whether or not there is a bump that is determined to be defective according to the first criterion, which satisfies a second criterion different from the first criterion, and a bump that satisfies the second criterion is determined. A method for inspecting a semiconductor member, wherein the semiconductor member is determined to be non-defective if there is any. 2. A bump inspection of a semiconductor member is performed, and a first
If there is a bump that is determined to be defective according to the determination criterion, a normal determination that the semiconductor member is determined to be defective and an inspection of the bump of the semiconductor member are performed, and among the bumps determined to be defective according to the first determination criterion, Determining whether there is a bump that satisfies a second criterion different from the first criterion, and if there is a bump that satisfies the second criterion, determines that the semiconductor member is non-defective. And a method for inspecting a semiconductor member. 3. A method for inspecting a bump of a semiconductor member, wherein the bump is determined to be defective according to a first determination criterion.
Means for determining whether or not there is one that satisfies a second criterion different from the first criterion, and if there is a bump that satisfies the second criterion, the semiconductor member is determined to be good. And a means for inspecting a semiconductor member. 4. A means for inspecting bumps of a semiconductor member, a normal judgment means for judging a semiconductor member as defective if there is a bump judged to be defective according to a first judgment criterion, and the first judgment It is determined whether or not there is any bump that is determined to be defective according to the standard and satisfies a second determination criterion different from the first determination criterion. For example, a semiconductor member inspection apparatus comprising severe determination means for determining that the semiconductor member is non-defective. 5. A means for determining whether or not there is a bump that satisfies the second criterion determines whether or not there is a bump that satisfies the second criterion based on the type and position of the bump. The inspection device for a semiconductor member according to claim 3 or 4, wherein: 6. The means for judging whether or not there is any that satisfies the second criterion is determined to be defective within a predetermined range including a bump determined to be defective by the first criterion. 6. The semiconductor member inspection apparatus according to claim 5, wherein it is determined whether there is a good bump of the same type as the bump. 7. The semiconductor member inspection apparatus according to claim 6, wherein the type of the bump is a bump other than the signal bump. 8. The semiconductor member inspection apparatus according to claim 3, further comprising means for issuing a command for switching between the normal determination means and the severe determination means. 9. A repair apparatus for repairing a bump determined to be defective, and a means for sending information on a semiconductor member determined to be defective by the severe determination means to the repair apparatus. The inspection device for a semiconductor member according to claim 3 or 4, wherein: