JPH10228054A - Mounting structure for printed board and its manufacture - Google Patents

Abstract

PROBLEM TO BE SOLVED: To increase the mount density in the housing of a device, to increase the degree of freedom of the outward appearance design of the device, and to reduce cost by using a hard printed board consisting of polyester resin as its base material as the printed board, and folding the printed board into three-dimensional structure so that it can be mounted in the device. SOLUTION: A liquid crystal display element 10b is arranged and soldered to the top-surface left plane equivalent part of the polyester hard printed board, a release switch is arranged and soldered to a relay position for the left front position, and a DC-DC converter circuit component 10d is arranged and soldered to the left front position. Further, a CPU 10e is soldered to the oblique side position of the pentagonal prism of a top-surface camera and a communication coil spring 10f is soldered to the fitting seat position of the center rear part. Further, a connector connection with another circuit on the bottom surface of a camera body is made from the top surface right plane position through the right front position. Then the polyester printed board where components are mounted is folded by using a punch and a die which are heated with a specific temperature range at a folding position to obtain a three-dimensional hard printed board.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed circuit board mounting structure of an apparatus which requires a process for avoiding another internal mechanism when performing a printed circuit board mounting process inside a housing.

[0002]

2. Description of the Related Art Conventionally, a printed circuit board has been mounted on an electric circuit using a hard printed circuit board (hereinafter referred to as HPC) containing phenol resin or the like or a flexible printed circuit board (hereinafter referred to as FPC) such as polyimide. For the purpose of diversifying the functions of the apparatus, improving the reliability, and reducing the cost, the combined use of the HPC and the FPC has been studied as proposed in Japanese Patent Application Laid-Open No. 6-258701.

[0003]

In the conventional three-dimensional mounting, the FPC is very effective on the storage surface due to its film shape and flexibility. However, the shape position cannot be specified by bending to have a curvature, and the device is not used. Since the whole is required to be compact, the position of the FPC cannot be fixed in the space inside the housing, so that the mounted parts are strongly pushed by other fixing members and the soldering is peeled off, resulting in functional failure of the entire device, In some cases, the function of the mounted parts was affected. As a countermeasure, it is necessary to allow a considerable margin in the space around the FPC mounted product in the housing, and for that purpose, increase the size of the housing or separately provide FPC fixing parts for positioning the FPC, and Measures such as fixing the FPC to the parts with adhesive tape are taken.

[0004] Also, the composite of the printed circuit board disclosed in Japanese Patent Application Laid-Open No. 6-258701 uses the high-cost FPC,
In addition, the use of connectors has also been working negatively in terms of cost.

SUMMARY OF THE INVENTION An object of the present invention is to provide a three-dimensional printed circuit board by heating and bending a flat rigid printed circuit board mainly made of a low-cost thermoplastic polyester resin as a main base material at a necessary portion. And / or a printed circuit board mounting structure in which electronic components are mounted by soldering or the like to form a three-dimensional board mounted body.

[0006]

According to the present invention, there is provided a printed circuit board mechanically or electrically coupled to constituent elements of a device having an electronic circuit, and a printed circuit board disposed on the printed circuit board. A printed circuit board comprising an electrical component and an electronic component, wherein the printed board is a hard printed board mainly made of polyester resin, and the printed board is bent to have a three-dimensional structure so as to be mountable in an apparatus. Provide a mounting structure of a substrate.

[0007] In addition, electric parts and electronic parts are disposed around the bent portion on the printed circuit board so as to avoid electric parts and electronic components, and the bent portion is bent using a tool heated to a predetermined temperature range to form a three-dimensional structure. A method for manufacturing a printed circuit board mounting structure, characterized in that the printed circuit board mounting structure according to claim 1 is obtained.

Further, there is provided a mounting structure for a printed circuit board for a camera, wherein the rigid printed circuit board having the three-dimensional structure according to claim 1 is arranged on the mirror box or the left and right fronts of the taking lens from the upper surface inside the camera. .

According to the above configuration, most of the electronic circuits can be configured as one three-dimensional rigid printed circuit board, and at the same time, the position dimensions of the printed circuit board can be fixed to the internal movable mechanism of the apparatus. Contact and interference with the mechanism can be avoided, and processing can be performed with high reliability and high packaging density.

[0010]

Embodiments of the present invention will be described below in detail with reference to the drawings. FIG. 1 is a perspective view of a main part of a back-drive AF single-lens reflex camera according to an embodiment of the present invention, in which outer parts including a case and the like are removed, FIG.
3 is a perspective view of a three-dimensional rigid printed circuit board mounted with electric components and the like provided on a fixed side body of the camera shown in FIG. 1, and FIGS. The figure shows the focusing operation of the movable body.

Regarding the description of the back-drive AF single-lens reflex camera, the present applicant has disclosed in Japanese Patent Application Nos.
This is omitted since it is proposed in US Pat. No. 143,477 or Japanese Patent Application No. 7-317354. In this case, the three-dimensional rigid printed circuit board of the present invention is mounted on a movable body such as a back-drive AF single-lens reflex camera. Will be described.

FIG. 1 shows the camera body 1 with the operation dial group 2a, upper cover 2, side inner covers 3, side covers 4 and 5, front cover 6 and lower cover 7 removed from the back-drive single-lens reflex camera. ing. This camera body 1
Is composed of a fixed body 1b that supports a movable body 1a with halftone dots movably in the optical axis direction as shown in FIG. The rigid printed circuit board 10 of the present invention formed integrally from the upper surface of the camera body to the front left and right is screwed.

FIG. 2 shows a rigid printed circuit board 10a mainly made of a polyester resin having holes for supporting the operation dial shown in FIG. 1, and a pattern suitable for the operation dial function or the like is formed around the hole. It is needless to say that the connection pattern is formed corresponding to the mounted components of the portion.

The main components mounted in FIG. 2 will be described. First, in the plane state of the polyester rigid printed circuit board, the liquid crystal display element 10b is provided in a portion corresponding to the upper left surface of the printed circuit board in FIG. 2, a release switch is provided in a relay portion to the left front portion, and a DC-switch is provided in the left front portion. D
The C converter circuit component 10d is arranged / soldered. Further, a CPU 10e is soldered to a slope portion of the pentaprism of the top camera, and a communication coil spring 10f is soldered to a mounting seat portion at the center rear. Further, the camera body 1 is connected to another circuit on the bottom surface of the camera body 1 via a right front portion through a right front portion.

Next, as described above, the components are bent using a punch and a die heated to a predetermined temperature range at a bent portion of the polyester printed circuit board on which the components are soldered and mounted. The printed board taken out becomes a three-dimensional hard printed board having the shape shown in FIG. The present invention will be described with reference to a back-drive AF single-lens reflex camera incorporating the printed circuit board in FIG. The halftone-dotted part is the movable body 1a that performs the focusing operation, and the other part shown in FIG. 3 is fixed. The difference between the movable part and the fixed part can be easily understood by comparing FIGS. In the upper part of the figure, the printed circuit board 10 is stored in the gap between the upper cover 2 and the upper part of the pentaprism / eyepiece of the movable body 1a.

The gap is so large that it cannot be realized unless a hard material such as a metal is used. If only a conventional FPC is used, the flexibility characteristic of the FPC is disadvantageous and more space is required. In addition, the present applicant has adopted a configuration in which a FPC is used and a pentaprism portion is a portion corresponding to the printed circuit board 10 shown in FIG. I have.

Although the three-dimensional rigid printed circuit board of the present invention has been described above as being applied to a back-drive AF single-lens reflex camera, the present invention is not limited to the single-lens reflex camera, but the present invention operates in a housing on which the printed circuit board is mounted. In some cases or in place of FPC, it can be used for all three-dimensional wiring.

[0018]

As described above, according to the structure of the present invention, most of the electronic circuit can be constituted by one rigid printed circuit board, and at the same time, the cost can be reduced and the position and the size of the internal movable mechanism of the device can be reduced. Can be fixed, contact and interference with the movable mechanism can be avoided, and not only high reliability but also high processing density and compact processing can be achieved.

Further, by using a hard substrate such as a terminal of a mobile phone instead of a hard substrate, the degree of freedom in the outer shape, particularly in the design is increased.

[Brief description of the drawings]

FIG. 1 is a perspective view of a main part of a back-drive AF single-lens reflex camera according to an embodiment of the present invention, in which outer parts including a case and the like are removed.

FIG. 2 is a perspective view of a three-dimensional rigid printed circuit board on which electric components and the like provided on a fixed body of the camera shown in FIG. 1 are mounted;

FIG. 3 is a state diagram of the back-drive AF single-lens reflex camera of FIG.

FIG. 4 is a state diagram when the movable body in FIG. 3 is at a closest position.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Camera body 1a Movable body 1b Fixed body 2 Upper cover 6 Front cover 7 Lower cover 10 Three-dimensional rigid printed circuit board

Claims (3)

[Claims] 1. A printed circuit board comprising: a printed circuit board mechanically or electrically coupled to constituent elements of an apparatus having an electronic circuit; and electric components and electronic components arranged on the printed circuit board, wherein the printed circuit board is made of polyester resin. And a three-dimensional structure by bending the printed board so that it can be mounted in an apparatus. 2. A three-dimensional structure in which a bent portion on a printed circuit board is disposed around a bent portion by using a tool heated to a predetermined temperature range while avoiding an electric component or an electronic component. A method for manufacturing a printed circuit board mounting structure, wherein the printed circuit board mounting structure according to claim 1 is obtained. 3. A mounting structure for a printed circuit board for a camera, wherein the rigid printed circuit board having the three-dimensional structure according to claim 1 is disposed on the mirror box or on the left and right front of the taking lens from the upper surface inside the camera.