JPH1022199A - Rotary type development processing device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To solve yield deterioration due to development pattern failure by preventing an out-of-cup mist, which is generated in a rotary type development device, from sticking on a wafer. SOLUTION: In a rotary type development processing device which is provided with a spinner part 31 which has a wafer chuck and can suck/rotate, a cup 32 which has a cup exhaust port 44 and a cup liquid-discharge port 46, a top-of-cup cover 33 which internally contacts with the cup and covers the top thereof, an outer peripheral cover part 35 which houses the top-of-cup cover and the entire cup and which has a wafer taking-in/out port 40, a developing nozzle 41 which discharges developing solution, and a rear-face rinse nozzle 42 and a rinse nozzle 43 which discharge rinse solution, a top surface cover peripheral opening part 1 of the outer peripheral cover part is provided at least on a part right above between a side surface cover 38 of the outer peripheral cover part and a side surface part of the cup 32. Thereby an air flow is adjusted and sticking of a mist can be prevented.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a rotary developing apparatus for semiconductor substrates in semiconductor manufacturing.

[0002]

2. Description of the Related Art In a conventional rotary developing apparatus, various constitutional devices are devised in order to prevent mist generated inside a cup from adhering. Hereinafter, an example of a conventional rotary developing apparatus will be described with reference to the drawings.
FIG. 22 is a plan view and a sectional view of a configuration of a first example of a conventional rotary developing apparatus. In FIG. 22, reference numeral 31 denotes a spinner unit including a wafer chuck, a motor, and a rotating shaft.
The wafer can be rotated by suction. A cup 32 has a cylindrical shape and includes a cup exhaust port 44, a cup exhaust pipe 45, a cup waste liquid port 46, and a cup waste liquid pipe 47. Reference numeral 33 denotes a cup upper cover which moves up and down in the cup. 41 is a developing nozzle, 42 is a back surface rinsing nozzle, and 43 is a rinsing nozzle. Numeral 34 denotes a cup inner cover for discharging waste liquid into a cup waste liquid port 46.
The mist is guided to the cup exhaust port 44. Reference numeral 35 denotes an outer peripheral cover portion, which includes an upper surface cover 36 that houses the whole of the above components and has an opening 37, a side cover 38 that has a wafer loading / unloading port 40, and a bottom plate 39. In the conventional rotary type developing apparatus, there are a case where the opening 37 of the top cover is not provided as shown in FIG. 23 and a case where the top cover is not present.

[0003] The operation of the rotary developing apparatus configured as described above will be described below.

[0004] First, a wafer 48 is vacuum-sucked to the spinner section 31, a developing solution is discharged from the developing nozzle 41 onto the wafer 48 which rotates at a low speed, and the developing solution is deposited on the wafer surface. I do. Next, the rinsing nozzle 43 and the backside rinsing nozzle 4 are rotated while rotating the wafer 48.
Rinse liquid is discharged from 2 and rinsed. Then, the wafer 4
8 rotates at high speed to dehydrate and dry the wafer surface. At this time, a large amount of mist is generated. However, since the mist is guided by the cup inner cover 34 and is forcibly exhausted from the exhaust port 44, most of the mist in the cup does not adhere to the wafer 48 and normal development processing is performed. Done. Thereafter, the rotation of the spinner 31 is stopped, the cup upper cover 33 and the cup 34 are lowered, the wafer is replaced, and the wafer 48 exits through the wafer loading / unloading port 40.

[0005]

However, in the above-described conventional rotary developing apparatus, as shown in FIG. 7A, the gap 5 between the cup 32 and the cup upper cover 33 is required.
The mist 49 leaks from the cup 2 to the outside of the cup, and the mist leaking to the outside of the cup goes around to the upper portion of the cup as shown in FIG. 7B and adheres again to the wafer inside the cup, or as shown in FIG. Mist remains and adheres to the wafer when the wafer is replaced, as shown in FIG. 7D, the mist adheres to the wafer 50 waiting before development from the wafer loading / unloading port 40, or the upper surface of the outer peripheral cover portion. There is a problem that the dust 51 adhered to the cover drops to the wafer 48 due to the vibration during the spin-drying. The sealed type having no opening in the upper cover as shown in FIG.
The open type without the upper cover has a large amount of mist adhesion in FIG. 7B and has a problem in terms of the safety of the worker who intends to cover the mist in FIG. 7D. Therefore, in the conventional example, it is best that the upper cover is partially open as shown in FIG. However,
There is a problem that the mist outside the cup adheres to the wafer as in the case of FIG. 7C.

SUMMARY OF THE INVENTION The present invention is to solve the above-mentioned conventional problems, and in particular, to provide a rotary type developing apparatus for preventing mist outside the cup from adhering to a wafer.

[0007]

According to a first aspect of the present invention, there is provided a spinner having a wafer chuck capable of adsorbing and rotating a wafer, a cup having an exhaust port and a waste liquid port, and A cup upper cover that inscribes and covers the upper part, an outer peripheral cover part that houses the cup upper cover and the entire cup and has a wafer loading / unloading port, a developing nozzle that discharges a developing solution, and a rinsing nozzle that discharges a rinsing liquid. In this rotary developing apparatus, the peripheral opening of the upper surface cover of the outer peripheral cover is provided at least directly above the side cover of the outer peripheral cover and the side surface of the cup.

The second means is provided with a drive-type closing plate above or below the opening of the upper cover of the outer peripheral cover.

The third means is that the aperture ratio is 10% or more and 40% or more.
It is provided with an upper surface cover of an outer peripheral cover portion as described below.

The fourth means is provided with a large opening at the center of the upper surface cover of the outer peripheral portion which is entirely opened right above the wafer developing section.

The fifth means is provided with an exhaust port at or near the bottom of the outer peripheral cover in the outer region of the cup.

The sixth means has an exhaust port characterized in that the exhaust port of the outer peripheral cover portion of the fifth means comprises a large number of holes in the pipe.

The seventh means has the upper surface cover opening of the first means provided with the exhaust port of the outer peripheral cover part of the fifth means.

Eighth means is that the upper surface of the cup upper cover is located outwardly of the upper surface of the cup and is adjacent to the outer peripheral cover portion, and the upper surface of the cup is connected to the upper surface of the upper cover and extends downward near the outer peripheral side cover. It has a cup upper outer surface cover that opens and closes the outlet.

The ninth means is provided with a blower on the upper surface of the outer peripheral cover. A tenth means is provided with a blower above the outer peripheral cover of the ninth means and an exhaust port at or near the bottom of the outer peripheral cover in an outer region of the cup.

According to an eleventh means, the cup upper cover is provided with a bellows-shaped folded cylindrical cup upper bellows side cover.

[0017]

An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a configuration diagram of a rotary developing apparatus according to a first embodiment, which corresponds to claim 1.
FIGS. 1A and 1B are a plan view and a cross-sectional view of a top cover of a rotary developing apparatus, respectively. The plan view of FIG. 1A shows a portion indicated by y1 in the cross-sectional view of FIG. 1B.

Next, the components of the apparatus will be described. Reference numeral 31 denotes a spinner unit, which includes a motor, a rotating shaft, and a wafer chuck. 32 is a cup having a cylindrical shape and a cup exhaust port 44.
And a cup exhaust pipe 45, a cup waste liquid port 46, and a cup waste liquid pipe 47. A cup upper cover 33 is inscribed in the cup and moves up and down. 41 is a developing nozzle, 42 is a back surface rinsing nozzle, and 43 is a rinsing nozzle. Reference numeral 34 denotes a cup inner cover for guiding waste liquid to the cup waste liquid port 46 and mist to the cup exhaust port 44. Reference numeral 35 denotes an outer peripheral cover part which houses the whole of the above parts, and includes an upper cover 36 having an upper cover opening 37 and an upper cover peripheral opening 1, a side cover 38 having a wafer loading / unloading port 40, and a bottom plate 39.

Next, the operation of the above configuration will be described.
The developing solution is discharged from the developing nozzle 41 to the wafer 48 that has been vacuum-sucked on the wafer chuck of the spinner unit 31. Then, the developer is applied on the surface of the wafer rotating at a low speed,
Develop for about 1 minute while still. Next, the rinsing nozzle 43
Then, the rinsing liquid is discharged from the backside rinsing nozzle 42.
At this time, the rotation speed of the spinner unit 31 is 1000 [rpm /
min], the rinsing liquid is ultrapure water. Then 4000
High-speed spin-drying is performed at ~ 6000 [rpm / min]. The developer and the rinsing liquid flow to the cup waste liquid port 46, and mist in the cup generated during high-speed rotation is absorbed through the cup exhaust port 44. Thereafter, the spinner unit 31 stops, the lower part of the cup and the upper part of the cup are respectively lowered, and the wafer exchange is performed. Figure 2 shows the state of the cup when the wafer is replaced
(B). In the above operation, as shown in FIG. 2A, the cup 32 and the cup upper cover 3
The mist generated outside the cup through the gap 52 of No. 3 moves downward by the airflow entering from the peripheral opening 1 of the top cover. Normally, since the developing machine is installed in a clean room, it always receives a downward air flow of 0.3 to 0.8 [m / sec]. can get. At the same time, the bottom plate of the outer peripheral cover portion has a gap through which the cup exhaust pipe and the spinner portion pass, and the mist is slowly drawn down from the gap below the apparatus. FIG. 3 is a schematic sectional view of a developing device installed in a clean room. 55 is a ceiling, 56 is a ventilation floor, 57 is a developing device, 58 is a developing device outer peripheral cover portion, 5
9 is a wall of the maintenance room, and 60 is a floor without ventilation. Examples of the two types of clean rooms (a) and (b) are shown. In each case, a downward airflow exists in the outer peripheral cover of the developing device, and the mist flows slowly along the airflow. Therefore, as shown in FIG. 2B, when the wafer is replaced, the mist in the outer peripheral cover portion is moved below the wafer under the influence of the air flow, so that the mist does not adhere to the wafer and the development pattern Defects can be prevented.

FIG. 4 is a block diagram of a rotary developing apparatus according to a second embodiment, which corresponds to claims 2 and 3. FIG. 4 is a plan view and a sectional view of an upper cover of the rotary developing apparatus. The plan view shows a portion y1 of the sectional view designation. The numbers in the figure are the same as in the first embodiment, except that 13 is a shielding plate and 1
The motor is controlled by a step motor 15 via the fourth drive shaft.

The operation of the above configuration will be described with reference to FIG. The thirteen shielding plates can be moved in the left-right direction of the drawing by the fifteen step motors via the fourteen drive shafts, and a top cover having a desired aperture ratio can be formed.
In addition, by performing the sequence control, the aperture ratio of the top cover can be changed during the developing process. FIG. 6 shows the relationship between the upper surface cover opening ratio and the pattern defect ratio after the development processing. A is a strong condition of the exhaust air amount, the upper air blowing amount, and the exhaust amount outside the cup, and B is a weak condition on the contrary. Since the aperture ratio optimum value varies depending on the exhaust amount in the cup, the amount of air blown from the top of the cover, and the exhaust amount outside the cup, the aperture ratio can be controlled to prevent a development pattern defect. Conversely, in the case of paddle development in which a developer is poured on the wafer surface, the exhaust amount in the cup is restricted by the conditions used from the viewpoint of uniformity of development (dimension), and is, for example, 10 to 20 [mm].
H ₂ O]. The amount of air blown from the ceiling cannot be easily changed because it is the condition for installing the clean room. Therefore, as a method for finely controlling the mist, the opening ratio of the outer peripheral portion upper surface cover is effective. It can be seen from the data in FIG. 6 that the pattern defect rate is small to some extent if the aperture ratio is 10 to 40% regardless of the conditions. When the aperture ratio is small, the mist due to the wraparound adheres to the wafer as shown in FIG. 7B, and when the aperture ratio is large, FIG.
This is because the mist leaks out of the outer peripheral cover as shown in FIG. The top cover of a commercially available device is
Although there are some openings only directly above the development processing section, the opening ratio is 5 to 8%. The aperture ratio is defined by the area ratio of the opening of the top cover to the area of the maximum area of the outer peripheral cover. Further, by performing sequence control using a stepping motor or the like, scattering of the undiluted mist of the developing solution that occurs when the developing nozzle is of a spray type can be prevented by closing the upper cover only when discharging the developing solution.

FIG. 8 is a block diagram of a rotary developing apparatus according to a third embodiment, which corresponds to claim 4. FIG. 8 is a plan view and a sectional view of a top cover of the rotary developing apparatus. The plan view shows a portion y1 of the sectional view designation. The numbers in the figure are number 1
This is the same as the embodiment. Reference numeral 2 denotes a large opening at the center of the top cover, and the diameter d1 is at least larger than the wafer diameter d2.
As shown in FIG. 9, a minimum stitch cover 29 may be provided for safety.

The operation of the above configuration will be described. If the upper cover is present, the dust 51 adheres to the inside of the upper cover, and may fall and adhere to the wafer due to vibration or the like. However, since the cover does not exist on the wafer as in this embodiment, the dust is Pattern defects can be prevented without adhering to the wafer.

FIG. 10 is a block diagram of a rotary developing apparatus according to a fourth embodiment, which corresponds to claim 5. 10A is a cross-sectional view and a plan view of the top cover indicated by y1, and FIG. 10B is a cross-sectional view and a plan view of the bottom of the outer peripheral cover portion indicated by y2. The numbers in the figure are the same as in the first embodiment. Reference numeral 3 denotes an outer cover exhaust port, and reference numeral 4 denotes an outer cover exhaust pipe. The operation of the above configuration will be described with reference to FIG. As shown in FIG. 11A, the mist generated during the high-speed rotation dehydration and coming out of the cup is quickly drawn into the exhaust pipe 4 from the exhaust port 3, and as shown in FIG. Since most of the mist does not exist outside the cup, the mist does not adhere to the wafer.

FIG. 12 is a block diagram of a rotary developing apparatus according to a fifth embodiment, which corresponds to claim 6. 12A is a cross-sectional view and a plan view of the top cover indicated by y1, and FIG. 12B is a cross-sectional view and a plan view of the bottom of the outer peripheral cover portion indicated by y2. The configuration of the present embodiment includes, in addition to the configuration of the fourth embodiment, a perforated outer peripheral cover portion exhaust pipe 5 having a plurality of exhaust ports 6. The perforated exhaust pipe 5 having a hole at the outer peripheral cover is as shown in FIG.
The exhaust pipe 4 is connected with a three-way pipe 7 shown in FIG.
By providing the perforated outer peripheral cover portion exhaust pipe 5, the mist of the entire outer peripheral cover portion can be more uniformly sucked than in the fourth embodiment, so that the mist can be more reliably prevented from adhering to the wafer. 13 (c) and 13 (d) are plan views showing the connection state, where 8 is an obstacle and 39 is a bottom plate.

FIG. 14 is a block diagram of a rotary developing apparatus according to a sixth embodiment, which corresponds to claim 7. FIG. 14A is a plan view and a cross-sectional view of an upper cover of the rotary developing apparatus. The plan view shows a portion y1 of the sectional view designation.
FIG. 14B is a plan view and a cross-sectional view of the device bottom. The plan view shows a portion y2 of the sectional view instruction. The components of the apparatus will be described. Reference numeral 31 denotes a spinner unit, which includes a motor, a rotating shaft, and a wafer chuck. A cup 32 has a cylindrical shape and includes a cup exhaust port 44 and a cup exhaust pipe 45, a cup waste liquid port 46, and a cup waste liquid pipe 47. A cup upper cover 33 is inscribed in the cup and moves up and down. 41
Denotes a developing nozzle, 42 denotes a back surface rinsing nozzle, and 43 denotes a rinsing nozzle. Reference numeral 34 denotes a cup inner cover for guiding waste liquid to the cup waste liquid port 46 and mist to the cup exhaust port 44. Reference numeral 35 denotes an outer peripheral cover portion which accommodates the whole of the above-described portions, and has a central opening 3.
7, a top cover 36 having a peripheral opening 1, a side cover 38 having a wafer loading / unloading port 40, and a bottom plate 3.
9 is provided. Reference numeral 1 denotes a peripheral opening of the upper cover, and reference numeral 4 denotes an exhaust pipe for the outer peripheral cover, which is connected to a perforated exhaust pipe 5 for the outer peripheral cover. The exhaust pipe with a perforated outer cover 5 has a number of exhaust ports 6.

The operation of the above configuration will be described. The wafer 4 vacuum-adsorbed on the wafer chuck of the spinner unit 31
The developing solution is discharged from the developing nozzle 41 to 8. The developing solution is applied on the surface of the wafer rotating at a low speed and is developed in a stationary state for about one minute. Next, the rinse liquid is discharged from the rinse nozzle 43 and the back rinse nozzle 42. At this time, the rotation speed of the spinner 31 is 1000 [rpm / min], and the rinsing liquid is ultrapure water. Thereafter, 4000 to 6000 [rp]
m / min] at high speed. The developing solution and the rinsing liquid flow to the cup waste liquid port 46, and mist in the cup generated during high-speed rotation is absorbed through the cup exhaust port 44.
Thereafter, the spinner unit 31 stops, the lower part of the cup and the upper part of the cup are respectively lowered, and the wafer exchange is performed. FIG. 15A shows the state of the cup when the wafer is replaced.
(B). In the above operation, as shown in FIG. 15A, at the time of high-speed rotation dehydration, the mist generated outside the cup through the gap 52 between the cup 32 and the cup upper cover 33 enters through the peripheral opening of the upper cover and the outer cover outlet 3 The air moves quickly downward due to the airflow absorbed into the air. Since the air blow from the opening of the top cover and the exhaust from the bottom plate are both aligned, the mist removal effect outside the cup is further increased. Therefore, there is no mist in the outer peripheral cover at the time of wafer replacement, and mist does not adhere to the wafer, so that a defective development pattern can be prevented.

FIG. 16 shows a rotary developing apparatus according to a seventh embodiment. A cup upper surface outer cover 9 close to the outer peripheral cover portion and connected to the cover 9 on the upper surface outer periphery of the upper portion of the cup, and extends downward near the outer peripheral cover portion side cover 38 to open and close the wafer loading / unloading port 40. This is a configuration having a side cover 19. The operation is shown in FIG.
Will be described. As shown in FIG. 17 (a), the mist 49 that has come out from between the cup 32 and the cup upper cover 33 is surrounded by the cup upper upper outer cover 9 and the cup upper outer cover 19, and And does not go outside through the wafer loading / unloading port 40. After completion of the development process, as shown in FIG.
The cup upper upper outer cover 9 and the cup upper outer cover 19 are moved downward together with the cup 32 and the cup upper cover, and the mist 49 is also carried downward. Therefore, no mist is emitted to the outside of the cup, and no mist is present around the wafer when the wafer is replaced. As a result, the mist does not adhere to the wafer, and a defective development pattern can be prevented.

FIG. 18 shows a rotary developing apparatus according to an eighth embodiment. As a component, a blower 10 having an intake port 11 is provided on a top cover of a conventional example. The blower is equipped with a wind speed measuring device and a control mechanism, and enables stable blowing. It is preferable to have temperature control. The operation is the same as that of the first embodiment, and a more stable air flow from the blower flows into and out of the cup, and it is possible to suppress the mist from flowing into the cup. In addition, a more stable air flow can be obtained without being affected by the environment outside the apparatus, for example, the amount of air blown from the ceiling, thereby preventing mist from adhering to the wafer.

FIG. 19 shows a rotary developing apparatus according to a ninth embodiment. As the constituent elements, the outer peripheral cover part exhaust port 3 and the outer peripheral cover part exhaust pipe 4 are provided in the above embodiment. The blower is provided with a wind speed measuring device and a control mechanism, and enables stable blowing. It is preferable to have temperature control. The operation is the same as that of the eighth embodiment. A stable air volume flows from the blower into the cup and out of the cup, the mist can be suppressed from flowing into the cup, and the mist outside the cup is quickly discharged from the exhaust port 3. The mist is prevented from adhering to the wafer at the time of drawing in and replacing the wafer. In addition, it is possible to obtain more stable air flow without being affected by the environment outside the apparatus, for example, the amount of air blown from the ceiling, and the amount of air drawn into the lower part of the apparatus due to the airflow in the clean room, and to prevent mist from adhering to the wafer.

FIG. 20 shows a rotary developing apparatus according to a tenth embodiment. The component has a foldable cylindrical cup upper bellows-like side cover 12 directly connected to the cup 32 at the cup upper cover 33 of the conventional example. Since the foldable cylindrical cup upper bellows-like side cover 12 is directly connected to the cup 32 as shown in FIG. 21, there is no gap between the conventional cup upper cover and the cup, and the operation occurs in the cup. No mist leaks out. Upper bellows side cover 12 when replacing wafer
Can be moved downward by folding as shown in FIG. 21 (b). Therefore, the wafer can be replaced without mist adhering to the wafer.

[0032]

As is clear from the above description, the present invention has the effect of preventing the mist outside the cup from adhering to the wafer and reducing the pattern defect rate due to defective development.

[Brief description of the drawings]

FIG. 1 is a diagram illustrating a rotary developing apparatus according to a first embodiment of the present invention.

FIG. 2 is a view for explaining the operation of the rotary developing apparatus according to the first embodiment of the present invention;

FIG. 3 is a diagram illustrating a rotary developing apparatus installed in a clean room according to the first embodiment of the present invention.

FIG. 4 is a diagram of a rotary developing apparatus according to a second embodiment of the present invention.

FIG. 5 is a view for explaining the operation of a rotary developing apparatus according to a second embodiment of the present invention.

FIG. 6 is a diagram showing a relationship between an aperture ratio and a pattern defect ratio according to the second embodiment of the present invention.

FIG. 7 is a view for explaining the operation of a conventional rotary developing apparatus.

FIG. 8 is a diagram illustrating a rotary developing apparatus according to a third embodiment of the present invention.

FIG. 9 is a diagram illustrating a rotary developing apparatus according to a third embodiment of the present invention.

FIG. 10 is a view showing a rotary developing apparatus according to a fourth embodiment of the present invention.

FIG. 11 is a view for explaining the operation of a rotary developing apparatus according to a fourth embodiment of the present invention.

FIG. 12 is a view showing a rotary developing apparatus according to a fifth embodiment of the present invention.

FIG. 13 is a view showing parts of a rotary developing apparatus according to a fifth embodiment of the present invention.

FIG. 14 is a diagram illustrating a rotary developing apparatus according to a sixth embodiment of the present invention.

FIG. 15 is a view for explaining the operation of a rotary developing apparatus according to a sixth embodiment of the present invention.

FIG. 16 is a diagram illustrating a rotary developing apparatus according to a seventh embodiment of the present invention.

FIG. 17 is a view for explaining the operation of the rotary developing apparatus according to the seventh embodiment of the present invention.

FIG. 18 is a diagram illustrating a rotary developing apparatus according to an eighth embodiment of the present invention.

FIG. 19 is a diagram illustrating a rotary developing apparatus according to a ninth embodiment of the present invention.

FIG. 20 is a diagram illustrating a rotary developing apparatus according to a tenth embodiment of the present invention.

FIG. 21 is a view for explaining the operation of the rotary developing apparatus according to the tenth embodiment of the present invention.

FIG. 22 is a diagram showing a conventional rotary developing apparatus.

FIG. 23 is a view showing a conventional rotary developing apparatus.

[Explanation of symbols]

 Reference Signs List 1 Peripheral opening of upper cover 2 Large central opening of upper cover 3 Peripheral cover exhaust port 4 Peripheral cover exhaust pipe 5 Peripheral cover perforated exhaust pipe 6 Peripheral cover perforated exhaust pipe exhaust port 7 Three-way pipe 8 Obstacle 9 Cup top upper outer cover 10 Blower 11 Inlet 12 Cup upper bellows side cover 13 Closure plate 14 Drive shaft 15 Step motor 19 Cup upper outer side cover 29 Stitched cover 31 Spinner 32 Cup 33 Cup upper cover 34 Cup inner cover 35 outer cover 36 top cover 37 top cover opening 38 side cover 39 bottom plate 40 wafer loading / unloading opening 41 developing nozzle 42 back rinse nozzle 43 rinse nozzle 44 cup exhaust port 45 cup exhaust pipe 46 cup waste liquid port 47 cup waste liquid pipe 48 wafer 49 Mist 50 Standby wafer 51 Adhered dust 52 Gap 55 Ceiling 56 Ventilated floor 57 Developing device 58 Developing device outer peripheral cover 59 Wall 60 Non-ventilated floor

Claims (11)

[Claims] 1. A spinner unit having a wafer chuck and capable of sucking and rotating a wafer, a cup having an exhaust port and a waste liquid port, a cup upper cover adjacent to the cup and covering an upper part, and a developing nozzle for discharging a developer. A nozzle portion including a rinse nozzle for discharging a rinsing liquid and a back surface rinse nozzle, a side cover that houses the cup upper cover, the entire cup and the nozzle portion, has a wafer take-in / out port, and an outer peripheral cover that includes a bottom plate and a top cover A rotary developing apparatus comprising: a rotary developing device comprising: an opening portion of an upper cover of the outer peripheral cover portion at least at a portion directly above a side cover of the outer peripheral cover portion and a side portion of the cup. 2. A spinner unit having a wafer chuck and capable of sucking and rotating a wafer, a cup having an exhaust port and a waste liquid port, a cup upper cover adjacent to the cup and covering an upper part, and a developing nozzle for discharging a developer. A nozzle portion including a rinse nozzle for discharging a rinsing liquid and a back surface rinse nozzle, a side cover that houses the cup upper cover, the entire cup and the nozzle portion, has a wafer take-in / out port, and an outer peripheral cover that includes a bottom plate and a top cover A rotary development processing apparatus comprising: a driving type shielding plate provided above or below an opening of an upper surface cover of an outer peripheral cover. 3. A spinner unit having a wafer chuck and capable of sucking and rotating a wafer, a cup having an exhaust port and a waste liquid port, a cup upper cover adjacent to the cup and covering an upper part, and a developing nozzle for discharging a developer. A nozzle portion including a rinse nozzle for discharging a rinsing liquid and a back surface rinse nozzle, a side cover that houses the cup upper cover, the entire cup and the nozzle portion, has a wafer take-in / out port, and an outer peripheral cover that includes a bottom plate and a top cover Opening ratio is 10% or more.
A rotary developing apparatus having a top cover of an outer peripheral cover portion of 0% or less. 4. A spinner unit having a wafer chuck and capable of sucking and rotating a wafer, a cup having an exhaust port and a waste liquid port, a cup upper cover adjacent to the cup and covering the upper part, and a drive type developing device for discharging a developer. It consists of a nozzle part consisting of a nozzle and a drive-type rinsing nozzle for discharging a rinsing liquid and a backside rinsing nozzle, a side cover containing the cup upper cover and the entire cup and nozzle part and having a wafer take-in / out port, a bottom plate and a top cover. A rotary development processing apparatus comprising an outer peripheral cover portion provided with a top cover of the outer peripheral cover portion having an opening right above the wafer development processing portion. 5. A spinner unit having a wafer chuck and capable of sucking and rotating a wafer, a cup having an exhaust port and a waste liquid port, a cup upper cover adjacent to the cup and covering an upper part, and a developing nozzle for discharging a developer. A nozzle portion including a rinse nozzle for discharging a rinsing liquid and a back surface rinse nozzle, a side cover that houses the cup upper cover, the entire cup and the nozzle portion, has a wafer take-in / out port, and an outer peripheral cover that includes a bottom plate and a top cover A rotary developing apparatus comprising: an exhaust port at the bottom of the outer peripheral cover or in the vicinity thereof in an outer region of the cup. 6. The rotary developing apparatus according to claim 5, wherein the exhaust port of the outer peripheral cover portion comprises a number of holes on the pipe. 7. The rotary developing apparatus according to claim 1, further comprising an exhaust port of the outer peripheral cover according to claim 5. 8. A spinner unit having a wafer chuck and capable of sucking and rotating a wafer, a cup having an exhaust port and a waste liquid port, a cup upper cover adjacent to the cup and covering an upper part, and a developing nozzle for discharging a developer. A nozzle portion including a rinse nozzle for discharging a rinsing liquid and a back surface rinse nozzle, a side cover that houses the cup upper cover, the entire cup and the nozzle portion, has a wafer take-in / out port, and an outer peripheral cover that includes a bottom plate and a top cover The upper portion of the upper cover of the cup is connected to the outer cover of the upper surface of the cup and the upper cover of the upper surface of the cup is connected to the outer cover of the upper surface of the cup and the upper cover is connected to the outer cover of the upper portion of the cup. Rotary processing equipment with a cup upper outer surface cover that extends to open and close the wafer loading and unloading port Place. 9. A spinner unit having a wafer chuck and capable of adsorbing and rotating a wafer, a cup having an exhaust port and a waste liquid port, a cup upper cover adjacent to the cup and covering an upper part, and a developing nozzle for discharging a developer. A nozzle portion including a rinse nozzle for discharging a rinsing liquid and a back surface rinse nozzle, a side cover that houses the cup upper cover, the entire cup and the nozzle portion, has a wafer take-in / out port, and an outer peripheral cover that includes a bottom plate and a top cover A rotary developing device comprising a blower on an upper surface of an outer peripheral cover portion. 10. The rotary development processing apparatus according to claim 5, further comprising a blower provided at an upper portion of the outer peripheral cover portion according to claim 9, and an exhaust port provided at or near the bottom portion of the outer peripheral cover in a region outside the cup. 11. A spinner unit having a wafer chuck and capable of sucking and rotating a wafer, a cup having an exhaust port and a waste liquid port, a cup upper cover adjacent to the cup and covering an upper part, and a developing nozzle for discharging a developer. A nozzle portion including a rinse nozzle for discharging a rinsing liquid and a back surface rinse nozzle, a side cover that houses the cup upper cover, the entire cup and the nozzle portion, has a wafer take-in / out port, and an outer peripheral cover that includes a bottom plate and a top cover A rotary developing device comprising a cup upper cover and a bellows-shaped folding cylindrical cylindrical upper cup side cover.