JPH10209316A - Package for housing solid state imaging element - Google Patents

Abstract

PROBLEM TO BE SOLVED: To perfectly hermetically seal a vessel for housing a solid state imaging element and activate a photoelectric conversion for a long time, by specifying the thickness of a transparent resin cover of a package for housing this imaging element. SOLUTION: Lead terminals 5 are attached to an insulation board 1 having a transparent resin cover 2 mounted to its top surface through a seal 7 to close a recess 1a of the board 1. A vessel 4 composed of the board 1 and the resin cover 2 is hermetically sealed to hermetically house a solid state imaging element 3. The cover 2 has a thickness ranging between 0.5mm and 2mm. This makes good the hermetic seal of the vessel composed of the board 1 and the cover 2, thereby operating the element 3 housed in the vessel 4 normally and stably for a long time.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a package for accommodating a solid-state image sensing device.

[0002]

2. Description of the Related Art Conventionally, a package for accommodating a solid-state image sensor has been made of an organic resin such as an epoxy resin, an aluminum oxide sintered body, a mullite sintered body, or the like.
An insulating base made of ceramics such as an aluminum nitride-based sintered body, a silicon carbide-based sintered body, and a glass-ceramic sintered body, and having a concave portion for mounting a solid-state imaging device on an upper surface; A plurality of lead terminals that are exposed inside the recess of the base and whose outer ends protrude outside the insulating base; and are attached to the upper surface of the insulating base via a sealing material made of epoxy resin, And a light-transmitting lid made of glass having a thickness of about 2 mm, which seals the solid-state imaging device with a resin adhesive such as an epoxy resin on the bottom surface of the concave portion of the insulating base. Each electrode of the imaging element is electrically connected to the inner end of the lead terminal via a bonding wire, and then a light-transmitting lid made of glass is sealed on the upper surface of the insulating base with epoxy resin. It is bonded via, and the solid-state imaging device by accommodating hermetically the container interior made of solid-state image pickup element and an insulating substrate and the transparent lid.

In the solid-state imaging device, a plurality of lead terminals protruding outside the solid-state imaging device housing package are connected to an external electric circuit, and each electrode of the solid-state imaging device housed inside is connected to the external electric circuit. At the same time, the solid-state imaging device is irradiated with an optical image through a light-transmitting lid to form an image, and the solid-state imaging device performs photoelectric conversion to function as an imaging device such as a video camera.

Further, in the solid-state imaging device housing package, a large thermal stress is generated between the insulating base and the solid-state imaging device due to heat generated when the solid-state imaging device is mounted or when the solid-state imaging device is operated. In order to effectively prevent the solid-state imaging device from cracking or cracking due to the thermal stress, and to effectively prevent the solid-state imaging device from peeling off from the insulating base,
Normally, the insulating substrate has a thermal expansion coefficient of 2.5 × 10 ⁻⁶ / ° C.
5 × 10 ⁻⁶ / ° C.), specifically, an aluminum oxide sintered body or a mullite sintered material having a thermal expansion coefficient of about 3 × 10 ⁻⁶ / ° C. to 10 × 10 ⁻⁶ / ° C. , Sintered body such as aluminum nitride sintered body, silicon carbide based sintered body, glass-ceramic sintered body, etc., or has a thermal expansion coefficient of 10 ×
^{10 -6 / ℃ ~20 × 10 -6} / thermal expansion coefficients in the epoxy resin of about ° C. is formed by the filler and the organic resin large amount is contained in a small silica.

[0005]

However, in the above-mentioned package for accommodating a solid-state image sensor, the light-transmitting lid is generally formed of glass, and the glass is fragile and has poor impact resistance. When an external force (impact force) is applied to the light-transmitting lid when, for example, joining the light-transmitting lid to the insulating base, the light-transmitting lid is partially cut off by the external force and becomes a small piece on the solid-state imaging device. The solid-state imaging device has a drawback that accurate photoelectric conversion corresponding to an optical image cannot be caused.

Therefore, in order to solve the above-mentioned drawbacks, the thickness of about 2
It is conceivable to replace the light-transmitting lid made of glass of about mm with a light-transmitting resin such as a polycarbonate resin, a polyolefin resin, an acrylic resin, and a polymethacrylic acid resin, which hardly causes chipping.

However, when the light-transmitting lid is formed of a light-transmitting resin such as a polycarbonate resin, a polyolefin resin, an acrylic resin, and a polymethacrylic resin,
The coefficient of thermal expansion of the translucent resin such as the polycarbonate resin is about 90 × 10 ⁻⁶ / ° C. to 110 × 10 ⁻⁶ / ° C., and the coefficient of thermal expansion of the insulating base (when the insulating base is formed of ceramics) Is 3 × 10 ⁻⁶ / ° C. to 10 × 10 ⁻⁶ / ° C., and 10 × 10 ⁻⁶ / ° C. to 2 × when formed of an organic resin containing a large amount of filler such as silica having a small coefficient of thermal expansion.
(0 × 10 ⁻⁶ / ° C.), heat is applied to the insulating base and the light-transmitting resin lid after the light-transmitting resin lid is joined to the insulating base via the sealing material. And the heat generates a large thermal stress between the two, and the thermal stress causes the light-transmissive resin lid to separate from the insulating base, or to cause cracks or cracks in the insulating base, and as a result, The airtightness of the container formed of the insulating base and the translucent resin lid is broken, and a defect that the solid-state imaging device accommodated in the container cannot be operated normally and stably for a long period of time is induced.

The present invention has been devised in view of the above-mentioned drawbacks, and has a tough lid for irradiating and imaging an optical image on a solid-state imaging device and hermetically sealing a container for accommodating the solid-state imaging device. An object of the present invention is to provide a package for housing a solid-state imaging device that can make the solid-state imaging device perform accurate photoelectric conversion corresponding to an optical image over a long period of time.

[0009]

According to the present invention, there is provided an insulating base on which a solid-state imaging device is mounted, and a light-transmissive resin lid joined to the insulating base via a sealing material. A package for storing a solid-state imaging device for accommodating an imaging device, wherein the light-transmitting resin lid has a thickness of 0.5 mm to 1.5 mm.
mm.

The present invention is also characterized in that the translucent resin cover is formed of at least one of a polycarbonate resin, a polyolefin resin, an acrylic resin, and a polymethacrylic resin.

According to the package for storing a solid-state imaging device of the present invention, the lid for irradiating and forming an optical image on the solid-state imaging device is made of a tough light-transmitting material such as a polycarbonate resin, a polyolefin resin, an acrylic resin, and a polymethacrylic resin. Even when an external force is applied to the lid, the lid does not become chipped or the like due to being formed of the conductive resin, and as a result, a part of the lid falls and adheres to the solid-state imaging device, and There is almost no adverse effect on the photoelectric conversion, and it is possible to cause the solid-state imaging device to perform accurate photoelectric conversion corresponding to the optical image.

Further, according to the package for housing a solid-state imaging device of the present invention, the thickness of the lid made of a light-transmitting resin such as polycarbonate resin, polyolefin resin, acrylic resin, polymethacrylic acid resin is 0.5 mm to 1.5 mm. When this cover is joined to the insulating base via the sealing material, and heat is applied to the insulating base and the cover, the thermal expansion of both the cover and the insulating base occurs. Thermal stress due to the difference in coefficient is generated, but the thermal stress is absorbed by the joint of the lid being appropriately deformed, and as a result, the lid is peeled off from the insulating base, cracks or The occurrence of cracks and the like is effectively prevented, the hermetic sealing of the container composed of the insulating base and the lid is improved, and the solid-state imaging device accommodated in the container is operated normally and stably for a long period of time. Also possible It made.

[0013]

Next, the present invention will be described in detail with reference to the accompanying drawings. FIG. 1 shows an embodiment of a package for accommodating a solid-state imaging device according to the present invention, wherein 1 is an insulating base, and 2 is a translucent resin lid. The insulating base 1 and the transparent resin lid 2
A container 4 for accommodating the solid-state imaging device 3 is configured by the above.

The insulating substrate 1 has a concave portion 1a for mounting a solid-state image sensor at the center of the upper surface thereof.
The solid-state imaging device 3 is bonded and fixed to the bottom surface of the concave portion 1a via a resinous adhesive such as an epoxy resin.

The insulating substrate 1 is made of an organic resin containing a filler such as silica having a small thermal expansion coefficient in an epoxy resin, an aluminum oxide sintered body, a mullite sintered body, an aluminum nitride sintered body, It consists of ceramics such as a silicon-based sintered body and a glass-ceramic sintered body.
When it is made of an organic resin, it is manufactured by filling a predetermined mold with an epoxy resin containing a silica filler and thermally curing the filled epoxy resin at a temperature of 150 ° C to 200 ° C.

The silica filler contained in the insulating substrate 1 increases the thermal conductivity of the insulating substrate 1 and reduces the coefficient of thermal expansion of the insulating substrate 1 by the coefficient of thermal expansion (2.5%) of the solid-state imaging device 3. × 10 ^-6 /℃~3.5×10 ^-6 / ℃)
And the thermal expansion coefficient of the insulating substrate 1 becomes about 10 × 10 ⁻⁶ / ° C. to 20 × 10 ⁻⁶ / ° C. by containing 70% by weight to 90% by weight of the silica filler.

A plurality of lead terminals are provided on the insulating base 1 such that an inner end thereof is exposed inside the concave portion 1a of the insulating base 1 and an outer end protrudes outside the insulating base 1. Each electrode of the solid-state imaging device 3 is electrically connected to the inner end of the lead terminal 5 via a bonding wire 6 and a portion protruding outside the insulating base 1 is attached to the outside. Connected to electrical circuit.

The lead terminals 5 serve to electrically connect the electrodes of the solid-state image sensor 3 to an external electric circuit. If the outer end of the lead terminal 5 is connected to an external electric circuit, the lead terminals 5 of the solid-state image sensor 3 can be connected. Each electrode is electrically connected to an external electric circuit via the bonding wire 6 and the lead terminal 5.

The lead terminal 5 is made of, for example, a metal material such as an iron-nickel-cobalt alloy, and is subjected to a predetermined rolling or punching process on an ingot made of an iron-nickel-cobalt alloy or the like. It is manufactured in the shape of

The lead terminal 5 is formed by injecting an epoxy resin into a predetermined mold and setting the lead terminal 5 at a predetermined position in the mold at the time of manufacturing the insulating base 1 so that the inner end of the lead terminal 5 can be formed. Are integrally attached to the insulating base 1 such that the inner end of the insulating base 1 is exposed inside the concave portion 1a and the outer end of the base 1 projects outside the insulating base 1.

The insulating substrate 1 to which the lead terminals 5 are attached
Further, a light-transmitting resin lid 2 is attached to the upper surface of the insulating base 1 via a sealing material 7, and the light-transmitting resin lid 2 is
The solid-state imaging device 3 is hermetically accommodated inside the container 4 by hermetically sealing the inside of the container 4 including the insulating base 1 and the translucent resin lid 2.

The translucent resin lid 2 is made of a resin such as a polycarbonate resin, a polyolefin resin, an acrylic resin, or a polymethacrylic resin, and the translucent resin lid 2 hermetically closes the recess 1a of the insulating base 1. At the same time, it functions as a window member for transmitting an external optical image into the concave portion 1 a and irradiating and forming an image on the solid-state imaging device 3.

Since the light-transmitting resin cover 2 made of a resin such as the polycarbonate resin, polyolefin resin, acrylic resin, or polymethacrylic resin is tough, the light-transmitting resin cover 2 is bonded to the insulating base 1. Even when an external force (impact force) is applied in some cases, the external force does not cause a part of the light-transmitting resin lid 2 to be chipped. As a result, a part of the light-transmitting resin lid 2 is There is almost no adverse effect on the photoelectric conversion of the solid-state imaging device 3 by dropping and adhering onto the solid-state imaging device 3, and it is possible to cause the solid-state imaging device 3 to perform accurate photoelectric conversion corresponding to an optical image.

The translucent resin cover 2 made of a resin such as the polycarbonate resin, polyolefin resin, acrylic resin, and polymethacrylic acid resin has a thickness of 0.5 mm.
Since the mechanical strength of the light-transmitting resin lid 2 is appropriate, the light-transmitting resin lid 2 does not crack even when an external force is applied. Not
When the light-transmitting resin lid 2 is bonded to the insulating base 1 via the sealing material 7 and then heat is applied to the insulating base 1 and the light-transmitting resin lid 2, the light-transmitting resin lid 2 2 and the insulating base 1 generate thermal stress due to the difference in the coefficient of thermal expansion between them, and the thermal stress is absorbed by the joint of the translucent resin lid 2 being appropriately deformed, As a result, no undulation is formed on the translucent resin lid 2, the translucent resin lid 2 is not separated from the insulating base 1, and cracks and cracks are not generated in the insulating base 1. The translucent resin lid 2 is flattened, the container 4 composed of the insulating base 1 and the translucent resin lid 2 is airtightly sealed, and the solid-state imaging device 3 housed in the container 4 is kept for a long time. It is possible to operate normally and stably.

If the thickness of the light-transmitting resin lid 2 is less than 0.5 mm, the mechanical strength of the light-transmitting resin lid 2 is reduced, and cracks or the like are easily generated by application of an external force. The solid-state imaging device 3 cannot be housed in an airtight manner, and a large amount of undulations in the light-transmitting resin lid 2 due to thermal stress caused by a difference in thermal expansion coefficient between the light-transmitting resin lid 2 and the insulating base 1. The optical image formed and irradiated on the solid-state imaging device 3 via the translucent resin lid 2 causes distortion, and the solid-state imaging device 3 can cause accurate photoelectric conversion corresponding to the optical image. Will be gone. The thickness is 1.5m
m, the translucent resin lid 2 is bonded to the insulating base 1 via the sealing material 7 and then the insulating base 1 and the translucent resin lid 2 are joined.
When heat is applied to the substrate, the heat generates a large thermal stress between the two, and the thermal stress causes the translucent resin lid 2 to peel off from the insulating base 1 and to cause cracks and cracks in the insulating base 1. As a result, the hermetic sealing of the container 4 is broken, and the solid-state imaging device 3 accommodated in the container 4 cannot be normally and stably operated for a long period of time. Therefore, the transparent resin lid 2 has a thickness of 0.5
mm to 1.5 mm.

The light-transmitting resin cover 2 is made of a resin precursor such as a polycarbonate resin, a polyolefin resin, an acrylic resin, or a polymethacrylic acid resin, and has a thickness of 0.5 m.
A plate material having a wide area of m to 1.5 mm is formed, and thereafter, the plate material is appropriately cut to produce a predetermined shape.

Further, the light-transmitting resin cover 2 made of a resin such as the polycarbonate resin, the polyolefin resin, the acrylic resin, and the polymethacrylic acid resin is lighter in weight than glass, which contributes to the weight reduction of the solid-state imaging device. You can also.

The translucent resin lid 2 is also joined to the upper surface of the insulating base 1 via a sealing material 7, which may be made of, for example, bisphenol A type epoxy resin, novolak type epoxy resin, glycidyl. An amine type curing agent, an imidazole type curing agent, a curing agent such as an acid anhydride type curing agent for an epoxy resin such as an ester type epoxy resin, and further silica,
A resin adhesive to which a filler composed of inorganic particles such as mica and talc and organic particles such as rubber is added is used.

In order to join the insulating base 1 and the translucent resin lid 2 via the sealing material 7, a resin adhesive is applied to the outer periphery of the lower surface of the translucent resin lid 2 by a screen printing method. Then, the translucent resin lid 2 is placed on the upper surface of the insulating substrate 1 so as to sandwich a resin adhesive between them, and finally the transparent resin lid 2 is heated at a temperature of 120 ° C. to 150 ° C. 0.5 ~
The heat treatment is performed for 5 hours to thermally cure the resin adhesive.

Thus, according to the package for storing the solid-state imaging device described above, the solid-state imaging device 3 is bonded and fixed to the bottom surface of the concave portion 1a of the insulating base 1 via an adhesive made of a resin such as an epoxy resin. Each electrode of the element 3 is electrically connected to a lead terminal 5 via a bonding wire 6. Thereafter, the light-transmitting resin lid 2 is bonded to the upper surface of the insulating base 1 via a sealing material 7, and A solid-state imaging device as a product is obtained by housing the solid-state imaging device 3 inside the container 4 including the base 1 and the translucent resin lid 2.

It should be noted that the present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the gist of the present invention. Was formed using an organic resin, but the thermal expansion coefficient of the insulating base 1 was 3 × 10 ⁻⁶ / ° C. to 1
Even when formed of ceramics such as an aluminum oxide sintered body, a mullite sintered body, an aluminum nitride sintered body, a silicon carbide sintered body, a glass-ceramic sintered body of about 0 × 10 ⁻⁶ / ° C. Good.

[0032]

According to the package for storing a solid-state imaging device of the present invention, a lid for irradiating and imaging an optical image on the solid-state imaging device is made of a tough resin such as a polycarbonate resin, a polyolefin resin, an acrylic resin, or a polymethacrylic resin. Since the cover is made of a light-transmitting resin, the cover does not become chipped even when an external force is applied to the cover. There is almost no adverse effect on the photoelectric conversion of the device, and it is possible to cause the solid-state imaging device to perform accurate photoelectric conversion corresponding to the optical image.

According to the package for storing a solid-state image sensor of the present invention, the thickness of the lid made of a light-transmitting resin such as polycarbonate resin, polyolefin resin, acrylic resin, polymethacrylic acid resin is 0.5 mm to 1.5 mm. When this cover is joined to the insulating base via the sealing material, and heat is applied to the insulating base and the cover, the thermal expansion of both the cover and the insulating base occurs. Thermal stress due to the difference in coefficient is generated, but the thermal stress is absorbed by the joint of the lid being appropriately deformed, and as a result, the lid is peeled off from the insulating base, cracks or The occurrence of cracks and the like is effectively prevented, the hermetic sealing of the container composed of the insulating base and the lid is improved, and the solid-state imaging device accommodated in the container is operated normally and stably for a long period of time. Also possible It made.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view illustrating an embodiment of a package for storing a solid-state imaging device according to the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Insulating base 2 ... Translucent resin lid 3 ... Solid-state imaging device 4 ...・ Container 5 ・ ・ ・ ・ ・ ・ ・ ・ ・ Lead terminal 7 ・ ・ ・ ・ ・ ・ ・ ・ ・ Sealant

──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. ⁶ Identification code FI H04N 5/335 H01L 31/02 B

Claims (2)

[Claims] 1. A solid-state imaging device comprising: an insulating base on which a solid-state imaging device is mounted; and a light-transmissive resin lid joined to the insulating base via a sealing material. A package for storing a solid-state imaging device, wherein the thickness of the translucent resin lid is 0.5 mm to 1.5 mm. 2. The solid-state image sensor according to claim 1, wherein the light-transmissive resin cover is formed of at least one of a polycarbonate resin, a polyolefin resin, an acrylic resin, and a polymethacrylic resin. package.