JPH10207919A - Printed cirvuit board cad device and its wiring design method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To read connection information of bundled lines and signal names constituting bundled lines in a short time by displaying bundled lines and pin pair in accordance with respective data of a list of bundled lines, a list of pin pairs, and aboard design. SOLUTION: A pin pair extraction part 11 generates a pin pair list 12 from pin position information and circuit connection information for each of parts stored in a board design data storage part 2. A bundled line detector 13 searches signal names in the pin pair list 12 to discriminates signal names taking a form of (bundle signal name) + (numerical value) as names of bundled lines and describes them in the list of bundled lines. A display control part 15 displays bundled lines in a range designated by an input device 3 as well as bundled lines and bundle signal names, which are based on parts information from the board design data storage part 2 and information in the list of bundled lines, on a display device 4. Bundled lines have a width corresponding to the number of bundled lines so that they can be distinctly distinguished from pin pairs, and their bundle signal name is displayed in the center of bundled lines.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed wiring board CAD apparatus and a wiring design method thereof, and more particularly, to a printed wiring board CAD apparatus having a binding detection display function for detecting an optimum binding path and a wiring designing method thereof.

[0002]

2. Description of the Related Art In a printed wiring board CAD apparatus, when examining the arrangement of components on a printed wiring board (printed board), wiring must be performed unless the flow of a bus line that connects individual components with a plurality of pin pairs, that is, a bundle of wires, is grasped. Becomes difficult. Conventionally,
In this type of printed wiring board CAD apparatus and its wiring design method, a rat nest, which is connection information of pin pairs of individual wirings forming a bundle, is displayed. Here, the pin pair is a line segment connecting two points on the substrate that require wiring.

FIG. 6 is a block diagram showing a general first conventional printed wiring board CAD apparatus. Referring to FIG.
The printed wiring board CAD apparatus includes a rat nest detection unit 100 that generates a rat nest corresponding to bundled wire data, a board design data storage unit 2 that stores design data including component information of a printed circuit board, and a data input keyboard. Input device 3, pin pair list 12, and board design data storage unit 2
And a display device 4 such as a display for displaying a rat nest based on the positions of the pins in the inside.

The rat nest detection unit 100 includes a pin pair extraction unit 11 for creating a terminal pin pair list 12 between components from board design data, and a display control unit 15 for controlling display contents on the display device 4 and the like.

Next, with reference to FIG. 6 and FIG. 7 showing an example of rat nest display, the operation of the conventional first printed wiring board CAD apparatus, that is, the wiring design method will be described. The pin pair list 12 is generated from the component pin position information and the circuit connection information (net list) stored in the board design data storage unit 2.
The display control unit 15 controls the component 7 at the starting point of the pin pair list 11.
The coordinates of the pin 711 of the first part and the pin 731 of the component 73 at the end point are obtained from the data of the board design data storage part 2, and a straight line is connected between the coordinates, that is, a pin pair (rat nest).
R1 is generated, and this rat nest R1 is displayed on the display unit 4. Similarly, a rat nest R2 is displayed between the pin 714 of the component 71 and the pin 732 of the component 73. Similarly, rat nests R3 to R3 are obtained from the data of the pin pair list 12.
9 is generated and displayed on the display device 4.

As described above, the first conventional printed wiring board CAD apparatus and its wiring design method are limited to the display of the rat nest, and do not have the function of detecting and displaying a bundle.

Japanese Unexamined Patent Publication No.
No. 115368, second conventional printed wiring board CA
The D device detects the bundle from the angle difference between the pin pairs. This conventional second bundle detecting device includes a pin pair extracting unit, an angle calculating unit, a pin pair sorting unit, and a bundle grouping unit. The pin pair extracting means extracts a plurality of pin pairs generated from each part for each part, finds the angle of each pin pair by the angle calculating means, sorts the pin pairs in ascending order by the pin pair sorting means, and An angle difference between the sorted adjacent pin pairs is determined, and an angle difference that is equal to or less than a preset limit value is detected as a bundle.

A third conventional printed wiring board CAD apparatus disclosed in Japanese Patent Application Laid-Open No. Hei 3-163667 is an example of a method for displaying a circuit diagram for LSI design. Is given a width or displayed in a different color.

[0009]

The above-described first conventional printed wiring board CAD apparatus has a drawback that it cannot display bundled wires because it performs only rat nest (pin pair) display.

In the conventional second printed wiring board CAD apparatus, since the bundle is detected based on the geometrical information of the angle difference between the pin pairs, the bundle is detected even if the destination of the pin pair is a different part. Or pin pairs that are radially generated with a slight angle difference are all transferred as bundled wires,
There is a disadvantage that a pin pair that is not originally a bundled wire is recognized as a bundled wire.

In the third conventional printed wiring board CAD apparatus, since the number of signal lines is indicated by the width and color of the bundle, only the number of signal lines in the bundle can be determined. There was a disadvantage that signal names could not be confirmed.

SUMMARY OF THE INVENTION It is an object of the present invention to easily discriminate the flow of bundles, to instantly confirm the names of signals constituting the bundles, and to have a function of detecting a bundle intended in circuit design. An object of the present invention is to provide a wiring board CAD device.

[0013]

The printed wiring board CA according to the present invention.
The D device includes a board design data storage unit that stores board design data including component information of a printed board, an input device for inputting input data, and a display device that displays the input data and a processing result. In the board CAD apparatus, a pin pair which is a line segment connecting two points requiring wiring is extracted from the board design data stored in the board design data storage section, and information on the pin pair of each wiring is listed. A pin pair extraction unit that generates a pair list, and a bundle list that detects a bundle that is a wiring bundle composed of a plurality of pin pairs that connect individual components from the data of the pin pair list and lists information of each bundle. A bundle detector that generates
A bundle that includes a display control unit that displays the bundle and the pin pair on the display device from the bundle list data, the pin pair list data, and the board design data in response to an instruction from the input device. It is configured to include a line detection processing unit.

A printed wiring board CAD apparatus according to the present invention uses a board design data including component information of a printed board and input data corresponding to a process to design a component arrangement and a wiring on the printed board. In the wiring design method for a CAD apparatus, a pin pair extraction process for extracting a pin pair which is a line segment connecting two points requiring wiring from the board design data and generating a pin pair list listing information of the pin pair of each wiring. And a bundle detecting process for detecting a bundle which is a wiring bundle composed of a plurality of pin pairs for connecting individual components from the data of the pin pair list and generating a bundle list in which information of each bundle is listed. And, in response to the instruction of the input data, from the data of the binding list, the data of the pin pair list, and the board design data, It is characterized in that comprising a display processing step of displaying the amps on the display device.

[0015]

Next, an embodiment of the present invention will be described with reference to FIG.
Referring to FIG. 1, in which common components are denoted by common reference characters / numerals and similarly shown in blocks, the printed wiring board CAD apparatus of the present embodiment shown in FIG. In addition to the data storage unit 2, the input device 3, and the display device 4, in addition to the rat nest detection unit 100, a bundle detection display unit 1 that detects and controls a bundle from a pin pair list is provided.

The bundle detection display unit 1 is a rat nest detection unit 1.
In addition to a pin pair extraction unit 11 that creates a pin pair list 12 common to 00 and a display control unit 15, a bundle detection unit 13 that detects bundles from the pin pair list 12 and creates a bundle list 14 is provided. .

Next, the operation of the present embodiment will be described with reference to FIG. 1 and FIG. 2 which is a flowchart showing the procedure of the operation in the present embodiment. This operation starts at the time when is performed. First, in a pin pair extraction processing step S1, the pin pair extraction unit 11 generates the pin pair list 12 from the pin position information for each component and the circuit connection information (net list) stored in the board design data storage unit 2.

Next, in the bundle detection process step S2, the bundle detector 12 generates the bundle list 14. In the present embodiment, in the circuit design, the names of the signals to be bundled are DATA0, DATA0,
The format is a bundle signal name + numerical value like DATA1, DATA2,. For this reason, the bundle detection unit 13 searches for the signal name in the pin pair list 12, determines the signal name in the form of bundle signal name + numerical value as the bundle, and describes it in the bundle list 14. To go.

Next, in the display processing step S 3, the display control unit 15 displays the bundles in the range specified by the input device 3 on the display device 4. The display control unit 15 simultaneously displays the bundle and the bundle signal name on the display device 4 based on the component position information from the board design data storage unit 2 and the information of the bundle list 14. The bundled wires are displayed with a width corresponding to the number of bundled wires so that they can be clearly distinguished from rat nests (pin pairs). The bundle signal name is displayed at the center of the bundle. Further, the rat nests other than the bundled wires are displayed simultaneously with the bundled wires by the same display method as the conventional rat nest.

Next, referring to FIG. 3A showing an example of the pin pair list 12 generated by the pin pair extracting unit 11, a specific example of the processing of the present embodiment will be described.
In the record 1 of this example, the pin 711 of the component 71 and the pin 731 of the component 73 are a pin pair, and the signal name is DATA.
01. As described above, the pin pair extracting unit 11 outputs, for all the pin pairs, a certain component pin, another component pin connected thereto, and the signal name of the pin pair to the pin pair list.

The operation will be described with reference to FIG. 4, which is a flowchart showing the procedure of the bundle detection processing step S2. First, in step S21, for each row of the pin pair list 12, the signal name is expressed in the form of bundle signal name + numerical value. Only those that can be decomposed are extracted, and the names of the starting part, the ending part, and the bundle signal are recorded. Next, in step S22, a pin pair whose record of the same start point component name, end point component name, and bundle signal name is n or more is detected as a bundle. At this time, n can be set to an arbitrary number of 2 or more. However, in general, the bit width of a digital signal is 4 bits or more, so that it is usually preferable to set it to 4 or more. Next, in step S23, the detected bundle is output to the bundle list 11.

The bundle list 14 generated by the bundle detector 13
Referring to FIG. 3B, which shows an example, record 1 of this example indicates that there are four bundles of bundle signal name ADRS between component 71 and component 73. This is shown in FIG.
Each of the pin pairs of the records 1, 2, 3, and 4 is detected as a bundle.

The display controller 15 displays the detected bundles on the display device 4 in a width corresponding to the number of bundles. The width of the bundle is
The minimum pattern pitch × (the number of bundled wires−1). Also,
The start point of the bundle is the center of the start part, and the end point is the center of the end part. The bundle signal name is displayed at the same time in the center of the bundle.

FIG. 5 shows an example of a display state according to the present embodiment.
Referring to FIG. 3, the bundle WH1 is the record 1 in FIG.
And the bundle signal between the component 71 and the component 73, indicating that the bundle signal name S1 is ADRS.
Similarly, the bundle WH2 corresponds to the record 2 in FIG.
It is a bundle between the component 72 and the component 73, and the bundle signal name S2 is D
ATA. The rat nest R90 is displayed as a conventional rat nest because it is not determined as a bundle.

[0025]

As described above, the printed wiring board CAD apparatus and the wiring design method of the present invention extract a pin pair from the board design data stored in the board design data storage section and generate a pin pair list. A pin pair extraction unit, a bundle detection unit that detects a bundle from the data of the pin pair list and generates a bundle list, and the bundle list data and the pin pair list data in response to an instruction from the input device. By providing a bundle detection processing unit including a display control unit that displays the bundle and the pin pair on the display device from the board design data, the bundle signal name can be displayed simultaneously with the bundle, so that the connection information of the bundle and There is an effect that the names of the signals constituting the bundle can be read in a short time.

Further, since the bundle detection is performed by using the signal name, there is an effect that a signal intended in circuit design can be a bundle.

[Brief description of the drawings]

FIG. 1 is a block diagram showing one embodiment of a printed wiring board CAD apparatus of the present invention.

FIG. 2 is a flowchart illustrating a wiring design method as an operation of the printed wiring board CAD apparatus according to the present embodiment.

FIG. 3 is a diagram illustrating an example of each of a pin pair list generated by a pin pair extraction unit and a bundle list generated by a bundle detector;

FIG. 4 is a flowchart illustrating an example of an operation of a bundle detection process according to the embodiment;

FIG. 5 is an explanatory diagram illustrating an example of a display state according to the present embodiment.

FIG. 6 is a block diagram showing an example of a conventional printed wiring board CAD apparatus.

FIG. 7 is an explanatory view showing an example of a display state of a conventional wiring design method for a printed wiring board CAD apparatus.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 bundle detection display unit 2 board design data storage unit 3 input device 4 display device 100 rat nest detection unit 11 pin pair extraction unit 12 pin pair list 13 bundle detection unit 14 bundle bundle list 15 display control unit 71 to 73 parts

Claims (3)

[Claims] 1. A printing apparatus comprising: a board design data storage unit storing board design data including component information of a printed board; an input device for inputting input data; and a display device for displaying the input data and a processing result. In the wiring board CAD apparatus, a pin pair that is a line segment connecting two points that require wiring is extracted from the board design data stored in the board design data storage unit, and information on the pin pair of each wiring is listed. A pin pair extraction unit that generates a pin pair list; and a bundle that detects a bundle that is a wiring bundle composed of a plurality of pin pairs that connect individual components from the data of the pin pair list and lists information of each bundle. A bundle detector that generates a list, and the bundle from the data of the bundle list, the data of the pin pair list, and the board design data in response to an instruction from the input device. A printed wiring board CAD apparatus, comprising: a bundle detection processing unit including a display control unit that displays a line and the pin pair on the display device. 2. A printed wiring board C for designing component placement and wiring on a printed board using board design data including component information of the printed board and input data corresponding to processing.
In the wiring design method for an AD device, a pin pair extraction process for extracting a pin pair that is a line segment connecting two points requiring wiring from the board design data and generating a pin pair list listing information of the pin pair of each wiring Steps: a bundle detection process for detecting a bundle which is a wiring bundle composed of a plurality of pin pairs for connecting individual components from the data of the pin pair list and generating a bundle list in which information of each bundle is listed. And a display processing step of displaying the bundle and the pin pair on a display device from the data of the bundle list, the data of the pin pair list, and the board design data in response to the instruction of the input data. A wiring design method for a printed wiring board CAD apparatus, characterized in that: 3. The method according to claim 1, wherein the step of extracting the pair of pins includes, for all the pin pairs, a component name and a pin number of a first component at a start point of the pin pair and a pin name of an end point of the pin pair connected to a pin of the first component. A part name of the second part, a pin number thereof, and a signal name of the first and non-corresponding second styles corresponding to the bundle of the pin pair in the data of the pin pair list; Extracting a bundle candidate pin pair corresponding to the signal name of the first style from the pin pair list; and the same first and second component names and the same signal names of the bundle candidate pin pairs are predetermined. 3. The printed wiring board C according to claim 2, further comprising: a step of detecting the bundle when the number of the bundles exceeds a predetermined number, and a step of outputting the detected bundle to the bundle list.
A wiring design method for an AD device.