JPH10199919A - Capillary having positioning characteristic for wire bonding - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a capillary which is easy to position and re-position at wire bonding in an IC circuit chip package manufacturing process. SOLUTION: A capillary 10 can be incorporated in a wire-bonding machine and has one or more indicators 100, 105, 110 which may be disposed around a capillary. The indictor detection for detecting the angle position of the indicator is made by a detector 160 to determine the angle-alignment of the capillary. To most effectively perform the wire bonding between an integrated circuit chip and lead frame conductors, this angle alignment may be made to correspond to a table of the wire-bonding machine or required shaft of the lead frame. The capillary may have a circular or non-circular face.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention generally relates to a capillary used in a wire bonding step in manufacturing an electronic integrated circuit chip package. More particularly, the present invention relates to a wire bonding capillary having alignment characteristics.

[0002]

2. Description of the Related Art Integrated circuit chip packages are generally
While fixing the integrated circuit chip on the lead frame,
It is formed by combining these two components to form a package. The integrated circuit chip and the lead frame can be sealed. Generally, chips
A number of bonding pads are provided which can be positioned around the periphery of the chip according to a predetermined spacing between the bonding pads. Lead frames generally have a number of leads around their perimeter. One type of lead frame has, for example, a substantially rectangular shape in which each side of the rectangle has many leads. The leads may each have a relatively elongated shape.

A lead frame can be said to have an X direction and a Y direction. The X direction is perpendicular to one pair of opposing sides, and the Y direction is perpendicular to the other pair of opposing sides. Generally, each lead has a relatively elongated shape forming a lead axis. The lead axis for any given lead frame may extend in the X or Y direction or be offset by an angle from the X or Y direction. The angle of the offset can vary from lead to lead. Moving from the center of a given side of the lead frame to the corner, the lead axis may be angularly offset from vertical by an incremental amount. The bonding path is defined by the direction from the bonding pad to the corresponding lead. The bonding wire can extend along this bonding path. For any given set of corresponding bonding pads and leads, the bonding path may extend in the X or Y direction, or may be offset by an angle comprising either the X or Y direction.

[0004] Wire bonding techniques are often used to electrically couple an integrated circuit chip to each lead of a lead frame. The wire bonding machine may have a spool of bonding wire secured to the machine. The bonding wire can be passed through a capillary attached to the horn of the wire bonding machine. The horn can be operated to move the capillary both vertically and horizontally. Generally, wire bonding
The machine is equipped with a device for heating the end of the bonding wire protruding from the outlet at the end of the capillary or for applying a spark to this end. The molten wire can form the shape of a ball, which is placed on the desired bonding pad by manipulating the horn and moving the capillary.

After producing this bonding pad bond, a sufficient amount of bonding wire is released,
The capillary is moved to a location near the inner end of the target lead of the lead frame. The capillary is operated to connect the bonding wire to the inner end of the target lead and cut the bonding wire so that the capillary now has a new wire bond between the new target bonding pad and the target lead. Can be formed freely. Any type of suitable bond can be formed on any of the bonding pads or leads, including ball bonds, stitch bonds and wedge bonds. Ball bonds can be used, for example, with bonding pads. Stitch bonds can be used, for example, in leads. The package may be heated to supplement the bonding process. Also, ultrasonic energy can be applied.

[0006] The problems in wire bonding technology arise in part from the desire to increase the number of leads in a given package and to reduce the size of integrated circuit chips. This may require that the bonding pads located on the chip be smaller and placed closer together. The same can be said for each lead on the lead frame.

[0007] The exit at the tip of the wire bonding capillary is often referred to as the capillary surface. Earlier capillaries had a circular surface. A disadvantage of having a capillary with a circular surface is that the spacing between bonds is limited. After a bond is made at a particular bond pad, for example, if an adjacent bond pad is too close, a capillary surface will be formed on the first bond pad during the process of forming a bond on the adjacent bond pad. Hit the ball bond. One way to overcome this drawback is to use a wire bonding capillary having a non-circular surface.
This type of approach is described, for example, in Test et al. (Test), incorporated herein by reference for all purposes.
et al. U.S. Pat. No. 5,544,804. Test et al. Show a BowTI® capillary having a non-circular surface. This bow tea eye (trade name)
The surface of the capillary can have a shape with a pair of opposing convex surfaces that combine with a pair of opposing concave surfaces. The Bow-T-Eye ™ capillary can be generally described as having a longitudinal axis that extends through the center of the Bow-T-Eye ™ across the midpoint of the concave surface. Bow tea eye (trade name)
Capillaries, for example, make ball bonds closer together as compared to those having circular capillary surfaces. This can be achieved because the concave surface avoids striking adjacent bonds. Bowty Eye ™ capillaries can also form other types of bonds, including stitch bonds.

[0008]

The need arising from the use of capillaries with non-circular surfaces is that the lead frame X
Or to precisely align the longitudinal axis of the capillary surface along either the Y-direction, or along the longitudinal axis of the target lead, or as needed along a predetermined bonding path. Precise alignment of non-circular capillaries is particularly important when the typical capillary surface has relatively small dimensions (eg,
0.10 to 0.20 mm (4 to 8 mils). In particular, improper alignment of the capillaries can lead to defective wire bonds during the manufacturing process, as it reduces the size of the integrated circuit chip package. This is due to a number of factors, including improper positioning of the capillary surface across the bonding pad, lead frame, or both. Defective wire bonding can also occur when the capillary hits and / or damages an existing bond during subsequent bond formation due to improper alignment. There are other problems, shortcomings and shortcomings associated with known capillaries and wire bonding.

[0009]

SUMMARY OF THE INVENTION One object of the present invention is to provide:
Addressing the requirements for capillaries used in wire bonding.

Another object of the present invention is to address the demands on conventional wire bonding technology.

Yet another object of the present invention is to provide a capillary for a wire bonding machine that can easily perform alignment when the capillary is installed in the wire bonding machine.

Still another object of the present invention is to provide a capillary for wire bonding that can easily perform alignment and realignment in a manufacturing process of an integrated circuit chip package.

It is yet another object of the present invention to provide a capillary that can be easily achieved and / or easily inspected when using the capillary.

In order to achieve these and other objects of the present invention, a capillary for wire bonding is provided. The capillary has a tubular body with a longitudinal axis and has at least one indicator incorporated within the tubular body. The angular alignment of the capillary corresponds to the angular position of at least one indicator about the longitudinal axis of the tubular body.

According to various aspects of the invention, the indicators can be passive or active indicators, and contact or non-contact indicators. The indicator can also be an electrical indicator, a mechanical indicator, an optical indicator, or a magnetic indicator. The wire bonding machine may have a detector that detects the indicator, or a detector that detects a signal provided by the indicator.

In accordance with yet another embodiment, a method is provided for performing angular alignment of a capillary. In order to do this, a predetermined first
Angular alignment is achieved. The first indicator is incorporated into the capillary such that the angular position of the first indicator corresponds to the angular alignment of the capillary. The angular position of the first indicator is detected, thereby determining the angular position of the capillary. A first angular position of the first indicator is compared to a first predetermined angular alignment, thereby determining a first angular offset of the capillary from the first predetermined angular alignment. At this time, by the amount of the first angle offset and in the direction of the first angle offset,
Capillary can be rotated.

[0017]

BRIEF DESCRIPTION OF THE DRAWINGS The invention and its features and advantages will be more fully understood from the following description with reference to the accompanying drawings, in which: FIG.

[0018] Wire bonding machines are well known machines. A typical wire bonding machine has a spool of bonding wire. This spool of bonding wire can have a suitable bonding member, such as gold. The bonding wire is supplied through a guide device commonly called a capillary. This capillary also serves as a bonding tool. The capillary is mounted on an arm called a horn of a wire bonding machine. The invention is particularly useful in mounting capillaries on wire bonding machines and during the manufacturing process of manipulating the capillaries for bonding between integrated circuit chips and lead frame leads.
The purpose of the present invention is to support the capillary alignment process by incorporating one or more indicators. The signal from the indicator is received by one or more detectors. These signals indicate alignment with respect to rotation of the capillary, and thus with respect to the direction in which the axis of the capillary surface is extended.

[0019] The wire bonding system can include a wire bonding machine with a horn.
Capillaries are mounted in the horn and guide the bonding wires from the wire source to various bonding locations on the integrated circuit chip package. The capillary can have one or more indicators located thereon. These indicators generate one or more signals, which are received by one or more detectors located remotely from the capillary. These signals indicate alignment to rotation of the capillary. Thus, this signal also indicates the direction of the axis of the plane of the capillary. Each of these signals can have a relative signal strength that is representative of the angular offset of the face of the capillary relative to the predetermined required alignment.

During operation, the capillary can be rotated to the first rotational alignment. In this first rotational positioning, the axis of the capillary surface extends in the first direction. The first signal received by the detector indicates when the first rotational alignment has been achieved. At this time, by guiding the capillary to the first bonding position, the first bonding can be performed at the first bonding position (for example, the position of the bonding pad of the integrated circuit chip).

Next, repositioning can be performed by rotating the capillary to the second rotational position alignment. In this second rotational alignment, the axis of the capillary extends in a second direction different from the first direction. At this time, the second bonding can be performed at the second bonding position by guiding the capillary to the second bonding position (for example, the position of the lead wire of the lead frame).

Next, the capillary can be rotated back in the first direction, or rotated in a third direction (eg, to the position of the third bonding pad of the integrated circuit chip) for the next bonding. Can be. This rotation of the capillary is achieved by the cooperation of the indicator and the detector, and by generating signals that indicate rotational alignment and rotational realignment. The ability to accurately rotate the capillary is particularly beneficial for capillaries having non-circular surfaces. The axis of the non-circular surface is
When bonding is performed, it is typically aligned in the direction of bonding. For example, it may be desirable to align the axis of the capillary surface in the direction of the conductor axis. Further, when wire bonding is performed at the periphery of the integrated circuit chip package, the direction of the bonding will change. The present invention can adapt to changes in the direction of bonding. Another feature of the overall capillary alignment system is the Texas Instruments Inc.
disclosed in U.S. Patent Application Serial No. 60 / 033,860 assigned to Attorney Docket No. TI-24970. This pending patent was accepted on December 19, 1996, and is incorporated herein by reference.

As shown in detail in FIG. 1, a capillary 10 is mounted on a horn 92 of a wire bonding machine. The capillary 10 has a tubular body provided with a shaft portion 20. The shaft portion 20 is formed so as to be integrated with the tip portion 30. The capillary is line A in FIG.
It has a longitudinal axis extending through the interior of the capillary indicated by A. Capillary 10 has an inlet end 40 and an outlet end 50. The bonding wire is at the entrance end 40
And exits the capillary 10 through the interior of the capillary 10 and through the outlet end 50. The capillary preferably has a non-circular surface 60, as shown in FIG. 3 and described in detail below.

The shaft section 20 has the shape of a cylinder and preferably has a circular cross section, as clearly shown in FIG. However, any shape other than a circle can be used as long as the bonding wire can pass through the inside of the capillary 10. For example, the cross section of the capillary can be rectangular or oval. Capillary 1
The inside of 0 is preferably determined by the inner diameter _Di and the outer diameter _Do. Preferably, the inner diameter _Di is constant over the entire length of the capillary 10. However, if the wall thickness of the capillary 10 is constant, _Di is D
_It will change as _o changes.

The tip portion 30 is tapered from a first point 31 to a second point 32. Here, the first point 31 is the point where the tip portion 30 intersects the shaft portion 20, and the second point 32 is the point at the exit end of the capillary 10. The outer diameter of the first point 31 of the tip portion 30 is preferably equal to the outer diameter D _o of the shaft portion 20. The outer diameter of the tip portion 30 at the second point 32 is preferably a predetermined value. This predetermined value is a value smaller than the outer diameter at the first point 31.

The capillary 10 can be made of any appropriate member. However, the capillary 10 is preferably made of a high-strength ceramic member.

As shown in FIG. 2, the capillary 1
0 has a circular cross section. Capillary 10 has an outer surface 11 and an inner surface 12. Multiple indicators 10
0, 105, 110 and 115 are incorporated into the tubular body of the capillary 10. Although four indicators are shown in the figure, the number of indicators used is one or two.
There can be more than one. The indicator is the capillary 10
Is preferably provided in the vicinity of the outer surface 11. These indicators are created separately, and the capillary 10
Is created, an indicator can be attached to the outer surface 11 of the capillary 10. For example, by using an appropriate bonding member that can form a reliable bond between the indicator member and the capillary member according to the type of member used to create a specific indicator. , An indicator on the outer surface 11 of the capillary 10
Can be bonded.

Alternatively, the indicator can be incorporated into the capillary itself during the manufacture of the capillary. For example, an indicator can be provided at the same time that the surface of the capillary is created. This ensures that the indicator is aligned at the correct angle with respect to the longitudinal axis of the capillary surface. During operation, the required angular alignment of the capillary 10 corresponds to the angular position of at least one indicator around the longitudinal axis AA of the tubular body of the capillary 10.

Preferably, at least one of the indicators is a primary indicator. For example, assume that the indicator 100 in FIG. 2 is a primary indicator. Primary indicator 100 can be used, for example, as an indicator that provides accurate initial alignment of capillary 10. The remaining indicators 105 and 11
0 and 115 are secondary indicators. These secondary indicators can be used to determine the angular offset of the capillary 10 and can be used to obtain realignment of the capillary 10 during wire bonding. The primary indicators 100 are secondary indicators 105 and 11
With respect to 0 and 115, they can be located vertically upward or downward. This allows 1
The next indicator can be easily identified. 1 during operation
The next indicator is arranged on the capillary 10 at a position corresponding to a first predetermined angular alignment of the capillary. The secondary indicator is arranged at a position corresponding to a second predetermined angular alignment of the capillary. Each of these indicators is preferably located closer to the inlet end 40 than to the outlet end 50. This provides sufficient clearance between the capillary tip and the indicator, so that the sensing function will not be affected by the operation of the wire bonding machine. Also, if the indicator is very close to the capillary tip, the capillary tip may be damaged by the heat released from the heating element.

The dimensions of the indicator vary depending on the specific application, the type of indicator and the function required of the indicator.
For at least some applications, it is preferred that the horizontal dimension be relatively small and the vertical dimension be relatively large. If the capillary is not properly aligned, the relatively small width of the indicator will limit the detection of the indicator by the detector to a small area. If the length of the indicator is relatively large, the detection function can be performed over a large vertical area. In other words, the indicator can be detected over a large vertical region, or a signal from the indicator can be detected over a large vertical region.
The vertical dimension of the indicator is preferably at least as large as the horizontal dimension. More preferably, the vertical dimension is larger than the horizontal dimension. Still more preferably, the vertical dimension is at least about twice the horizontal dimension. The preferred shape of the indicator will also depend on the type of indicator, the specific application and the function required. An indicator having a rectangular shape can be used. However, other shapes of indicators, such as circular, triangular or elliptical, may be used as appropriate.

As the indicator, various types of indicators including a passive indicator and an active indicator can be used. Preferred indicators are passive indicators. In the case of passive indicators, the need to incorporate power, chemicals, or complex electronics in the indicator can be avoided. The indicator is also preferably a non-contact indicator. This means that the external components do not need components that come into contact with the indicator in order to obtain the necessary detection functions to achieve alignment.

[0032] For example, the indicator can be an optical indicator. The indicator may have a strip of paint mounted on the outside of the capillary. For example, a white capillary may have a strip of black, silver or other colored paint on the outer surface of the capillary to serve as an indicator. Alternatively, the indicator may have a reflector, or a mirror, or a highly polished member.

For example, if strips of paint are used, these strips can be detected by detector 160. The detecting device 160 includes a detector 16 disposed at a position corresponding to the vertical position of the primary indicator.
1 and a detector 162 arranged at a position corresponding to the vertical position of the secondary indicator. Detector 1
60 and 161 detect the indicator or detect the signal provided by the indicator. For example, the detector 160
And 161 may have a laser detector that optically detects a paint strip indicator on the surface of the capillary.

For example, if a mirror is used, a light beam emitted from a light source (not shown) travels toward the mirror, is reflected off the mirror, and is received by one or both detectors. When the indicator is in a position corresponding to the predetermined required alignment, the detector must be arranged to receive the reflected light beam. For example, when the primary indicator 100 is at a predetermined first position, the primary indicator 100 can be positioned on the capillary 10 so that the capillary 10 is in a precisely correct initial alignment. Capillary 10
This is particularly useful when the surface 60 located at the outlet end 50 of the is a non-circular surface. For example, FIG. 3 is an end view of the surface 60 of the capillary 10 as viewed from the end along line 3-3 in FIG. The non-circular capillary surface 60 has a longitudinal axis BB, which may be aligned with the X-axis of the lead frame 70, for example. During operation, the axis BB is preferably aligned with the longitudinal axis of the target conductor (not shown). Primary indicator 1
When 00 is at the predetermined first position, it is preferable that the vertical axis BB of the capillary surface 60 is aligned with the required azimuth. For example, in the initial state, it can be requested that the X axis and the vertical axis BB of the lead frame 70 performing the wire bonding process are aligned.

A second type of non-contact indicator that can be used is a magnetic indicator. In this case, the indicator can be made of a magnetic member, and the corresponding detector can be made of a complementary member that produces a measurable magnetic attraction between the detector and the indicator. When the detector and indicator are closest, the magnetic attraction will of course be the strongest. For a capillary having a shaft with a circular cross section as shown in FIG. 2, for any given indicator,
There will be only one point where the magnetic indicator and detector are closest. For example, when the primary indicator 100 and the detector 161 are closest, they are aligned as required for the initial state (eg, as described above, the X or Y axis of the lead frame 70). Preferably, it has a non-circular capillary surface 60 (aligned with the capillary surface).

A contact type indicator can also be used. One type of contact type indicator is an electrical indicator. The indicator can be made of any conductive material. If the indicator is placed in the proper position where the capillary 10 is aligned as required, for example, a detector having a pair of wires connected to an electrical circuit,
Will contact the indicator. At this time, the indicator closes the electrical circuit. This is the detection of the signal and thus indicates that the capillary is correctly aligned.

[0037] Mechanical indicators can also be used. The mechanical indicator can have notches, holes, protrusions, or other mechanical components that can detect by contacting the detector. As yet another example, some or all of the outer surface of the capillary can be rectangular. The mechanical indicator can also be non-contact. For example, by using a laser as a detector, a mechanical indicator can be detected without physical contact.

The indicator is preferably a proximity type indicator. This determines the detection or sensing depending on how close the indicator is to the detector. In one possible arrangement, sensing occurs only when the indicator and detector are closest to each other. In another arrangement, a detection signal of varying intensity is obtained, and the detection signal is strongest when the indicator and the detector are closest to each other. As the detector and indicator move away from each other, the signal becomes weaker. For example, depending on the type of indicator and detector used, even if the capillary is angularly offset from the initial alignment, a detection signal will still occur. In this case, based on the minimum signal value (when the indicator is farthest from the detector) and the maximum signal value (when the indicator and the detector are closest), the detected signal The offset angle can be determined from the relative strength of the strength.

In another embodiment of the present invention, the capillary 10 can be incorporated into a wire bonding machine 90, as shown in FIG. The wire bonding machine 90 includes: a wire source 91 of a bonding wire;
A horn 92 for holding and manipulating the capillary 10 during wire bonding of the integrated circuit chip to the lead frame 70. In FIG. 4, the primary indicator 1
00 shows a state in which 00 is closest to the detector 161 of the detection device 160. The detection device 160 also
It has a detector 162 for detecting the secondary indicator. FIG. 4 shows an example of the operation of a capillary provided with one or more indicators. If the capillary is correctly aligned by the wire bonding structure of FIG. 4, precise bonding along a particular angular direction can be performed precisely.

If it is necessary to rotate the capillary 10, one or more secondary indicators 105, 110 or 110 may be used to ensure that the capillary 10 is aligned according to the exact amount of angular offset required. 115
Sensing can be achieved. For example, if the capillary 10 is rotated 90 degrees in either direction, the Bow TI ^™ face of the capillary 10 will be perfectly aligned with the bonding of the lead frame 70 in the Y direction. In this case, capillary 1
Depending on which direction 0 is rotated (clockwise or counterclockwise), when the capillary 10 is properly aligned, either the secondary indicator 105 or the secondary indicator 110 Will be detected. Or 1
Sensing the angular offset of the next indicator 100 can achieve this same purpose.

In another embodiment, it may be required to rotate the capillary so as to be angularly offset by a predetermined amount from the X or Y axis. For example, assume that the requested angular offset from the initial point is 30 degrees clockwise from the X axis. In this situation, the detector 161 that detects the primary indicator 100
Signal (or primary indicator 100)
From the detector 161 will be weaker than the detection signal generated if the detector 161 and the indicator 100 are closest. This relative intensity of the detection signal can be used to determine whether the capillary is correctly offset. In other words, by performing a scale test or by other suitable techniques, the signal strength will correspond to a particular angular offset.

In accordance with yet another embodiment of the present invention, the use of one or more indicators allows a capillary 10 to be used.
Is obtained. To achieve correct alignment, a first predetermined angular alignment of the capillary is performed. The first indicator is incorporated into the capillary such that the angular position of the first indicator corresponds to the angular alignment of the capillary. A first angular position of the first indicator is detected, thereby determining an angular alignment of the capillary. A comparison is made between this first angular position of the first indicator and the first predetermined angular alignment, thereby determining a first angular offset of the capillary from the first predetermined angular alignment. . The capillary is rotated in the correct direction by an amount of the first angular offset to align the capillary according to a first predetermined angular alignment.

After the capillary has been rotated, the second angular position of the first indicator is detected, so that the angular alignment of the capillary can be determined. A comparison is made between this second angular position of the first indicator and the first predetermined angular alignment, thereby determining a second angular offset of the capillary from the first predetermined angular alignment. Can be. Then, according to this second offset,
Capillary can be rotated.

The features of this embodiment allow the second indicator to be incorporated into the capillary so that the angular position of the second indicator corresponds to the angular alignment of the capillary. The first angular position of the second indicator can be detected, thereby determining the angular alignment of the capillary. A comparison is made between this first angular position of the second indicator and a predetermined first angular alignment, whereby an angular offset of the capillary from the predetermined first angular alignment can be determined. . According to another feature, the angular offset determined by one indicator can be compared to the angular offset of another indicator to check and set the correct alignment.

In the above, the present invention has been described with reference to a preferred embodiment. These embodiments are merely described as examples, and it is easily understood by those skilled in the art that various modifications can be made to these embodiments within the scope of the present invention. There will be. For example, the indicator can be provided on any type of capillary used in the wire bonding process or an equivalent process.
These capillaries can have circular or non-circular capillaries.

The following items are further disclosed with respect to the above description. (1) a tubular body having a longitudinal axis, and at least one indicator incorporated within the tubular body, and wherein angular alignment of the capillary is at least about the longitudinal axis of the tubular body; A capillary used for wire bonding, corresponding to the angular position of one indicator.

(2) In the capillary according to the first aspect, at least one of the indicators is a primary indicator corresponding to a predetermined first angular alignment of the capillary;
Said capillary having at least one secondary indicator corresponding to a second predetermined angular alignment of said capillary. (3) In the capillary according to item 1, at least one of the indicators has a first indicator and a second indicator, and the first indicator is angularly offset from the second indicator. , The capillary. (4) In the capillary according to item 1, at least one of the indicators has a first indicator and a second indicator, and the first indicator is vertically and angularly offset from the second indicator. The capillary.

(5) The capillary according to item 1, wherein at least one of the indicators is attached to an outer surface of the tubular body. (6) The capillary according to item 1, wherein the tubular body has a circular cross section. (7) The capillary according to item 1, wherein the capillary has a non-circular surface.

(8) The capillary according to item 1, wherein at least one of the indicators is a contact indicator. (9) The capillary according to item 1, wherein at least one of the indicators is a non-contact indicator. (10) In the capillary according to the item (1), at least 1
The capillary, wherein the indicators are active indicators.

(11) In the capillary according to the first item,
The capillary wherein at least one of the indicators is a passive indicator. (12) In the capillary according to the item (1), at least 1
The capillary, wherein the indicators are optical indicators. (13) In the capillary according to the item (1), at least 1
The capillary, wherein the indicators are magnetic indicators.

(14) In the capillary according to the first item,
The capillary wherein at least one of the indicators is an electrical indicator. (15) In the capillary according to the item (1), at least 1
The capillary, wherein the indicators are mechanical indicators.

(16) A wire source of the bonding wire, a capillary for guiding the bonding wire to a target, and the angular position of at least one of the indicators around the longitudinal axis of the capillary is set to the angular position of the capillary. And at least one indicator incorporated into said capillary to correspond to

(17) The wire bonding machine according to item 16, further comprising a detector for detecting an angular position of at least one indicator.

(18) Achieving a predetermined first angular alignment of the capillary, and adjusting the first indicator so that the angular position of the first indicator corresponds to the angular alignment of the capillary. Incorporating the first indicator into the capillary; detecting a first angular position of the first indicator; and determining the first angular offset from a first predetermined angular alignment. Comparing the first angular position of the indicator with the predetermined first angular alignment.

(19) The method of paragraph 18, further comprising rotating the capillary by the first angular offset to align the capillary according to the first predetermined angular alignment. , Said method. (20) In the method according to Item 18, after determining the first angular offset, rotating the capillary and detecting a second angular position of the first indicator;
Determining a second angular offset of the capillary from the predetermined first angular alignment with the second angular position of the first indicator and the predetermined first angular offset;
Comparing with angular alignment.
The method. (21) The method according to (18), wherein the second indicator is incorporated in the capillary such that the angular position of the second indicator corresponds to the angular alignment of the capillary; Detecting the first angular position of the second indicator and the first angular position of the second indicator to determine an angular offset of the capillary from a predetermined first angular alignment. Comparing with a first angular alignment.

(22) The capillary 10 used for wire bonding is obtained. Capillary 10 can be incorporated into a wire bonding machine. The capillary 10 includes one or more indicators 100, 10
5, 110, 115 and these indicators can be placed around the capillary, for example, these indicators can be mounted on the outer surface of the capillary. The detection of the indicator to determine the angular position of the indicator is performed by detector 160, which can determine and / or determine the angular alignment of the capillary. For the most efficient wire bonding between the integrated circuit chip and the lead frame leads, this angular alignment can correspond to the required axis of the table or lead frame of the wire bonding machine. Or the longitudinal axis of the lead frame leads. Capillaries can be of any of a number of different types, including capillaries having circular and non-circular surfaces. Indicators include passive indicators, active indicators, contact indicators, non-contact indicators, electrical indicators, magnetic indicators, optical indicators, or other types of indicators. , Can be in any of a number of different formats.

[Brief description of the drawings]

FIG. 1 is a diagram of a capillary alignment structure according to a first embodiment of the present invention.

2 is a cross-sectional view of the capillary of FIG. 1, taken along arrow 2-2 of FIG. 1;

FIG. 3 is an end view of the capillary of FIG. 1 as viewed from the direction of arrow 3-3 in FIG. 1;

FIG. 4 is a diagram of a wire bonding machine according to a second embodiment of the present invention.

[Explanation of symbols]

 10 Capillary 100,105,110,115 Indicator 160 Detector 161, 162 Detector

Claims (2)

[Claims] 1. A tubular body having a longitudinal axis, at least one indicator incorporated in the tubular body, and wherein angular alignment of a capillary is about the longitudinal axis of the tubular body. A capillary used for wire bonding, corresponding to an angular position of at least one of the indicators. 2. A step of achieving a predetermined first angular alignment of the capillary; and adjusting the first indicator so that an angular position of the first indicator corresponds to an angular alignment of the capillary. Said step of incorporating into a capillary; detecting a first angular position of said first indicator; and said first instruction to determine a first angular offset from a predetermined first angular alignment. Comparing the first angular position of the vessel with the predetermined first angular alignment.