JPH10197596A - Inspection device for semiconductor devices - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a device for inspecting semiconductor devices measurable over a wide band including a high frequency measurement. SOLUTION: An interposition base board 6 is directly attached to a test head 1, and to the board 6 a socket 14 on the test head side is attached directly, and the first 11 and the second guide pin 13 tapered as thinning toward the tips are protruded upward on the side with test head 1 pair by pair and insertion holes 33 and 34 to engage the first 11 and the second guide pin 13 are furnished on the side with a handier base 21. The test head 1 is arranged movably in the horizontal direction relative to the handler base 21, and if the guide pins 11 and 13 are inserted into and engaged by the insertion holes 33 and 34 by sinking the handler base 21, the test head 1 is put in horizontal movement relative to the handier base 21, and the test head 1 can be located in the specified position with respect to the handler base 21.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a device inspection apparatus for automatically evaluating characteristics of a device to be measured such as a semiconductor integrated circuit device (hereinafter, referred to as "IC") used in a high frequency band. In particular, a DUT interposed between a device under test and a test head to transmit a signal required for measurement
(Device Under Test) The present invention relates to a device inspection apparatus having a structure capable of easily aligning a connection portion such as an IC socket directly connected to a board with a handler.

[0002]

2. Description of the Related Art A characteristic evaluation test of a device such as an IC which has been assembled is performed, for example, by supplying a device to be measured to a test head for evaluating characteristics of the device to be measured by a handler. When connecting to the connection portion of the head, it is necessary to accurately position the handler base and the test head. In a conventional device inspection apparatus, a test head on which a DUT board is mounted and an IC socket arranged near a handler are separated to some extent.
The DUT board and the IC socket were connected by a lead wire. Therefore, accurate positioning of the handler and test head was not required. This is because the measurement of high frequency characteristics is not taken into account.

[0003]

However, taking into account the measurement of high-frequency characteristics in a device inspection apparatus,
It is required to connect the DUT board and the IC socket without using lead wires as much as possible. The reason is,
When a lead wire is connected between the DUT board and the IC socket, a low-pass filter that cuts a high-frequency band with L and C0 as constants due to the inductance (L) of the lead wire and the stray capacitance (C0) between the lead wires ( A low-pass filter is formed, and the upper limit of the measurable frequency, that is, the cutoff frequency is determined. In a frequency range higher than the cutoff frequency, the attenuation becomes large, and high frequency measurement cannot be performed. Therefore, to minimize L and C0, DU
It is desirable to connect the IC socket directly to the T board without using lead wires.

[0004] The present invention has been made in view of the above problems, and a first object of the present invention is to provide a device inspection apparatus capable of performing measurement in a wide band including high frequency measurement. A second object is a device having a structure capable of easily aligning a handler with a connection portion disposed on an interposed substrate for transmitting a signal required for measurement by being interposed between a device to be measured and a test head. An object of the present invention is to provide an inspection device. Further, other objects will be clarified sequentially in the contents described below.

[0005]

Means for Solving the Problems The present invention is characterized by taking the following technical means in order to achieve the above object.
In other words, the test device includes a test head that positions, via an intervening substrate, a connection portion to which a device under test transferred by a handler is electrically connected, and tests the characteristics of the device under test electrically connected to the connection portion. In a device inspection apparatus for automatically evaluating by a head, the intervening substrate is directly attached to the test head and the connection portion is directly attached to the intervening substrate, and a guide pin formed in a tapered shape on the test head side is raised. And a plurality of fixing portions are provided so as to project toward the handler, and an engaging portion that engages with the guide pin is provided on the handler side, and at least one of the test head and the handler side moves in the horizontal direction with respect to the other. Movement permitting means that allows at least one of the test head and the handler side to be vertically Movably, the engaging portion and the guide pin are engaged together with the vertical movement and the horizontal movement by the movement permitting means, and the test head and the handler are brought into a predetermined position. It is configured to include positioning means for positioning.

According to this, when one of the test head and the handler is moved toward the other, the engaging portion and the guide pin are engaged, and at the same time, one of the test head and the handler is moved in the horizontal direction. The position of the test head and the handler is determined. In addition, since the connection portion is positioned and fixed to the test head via the intervening substrate,
When the test head and the handler are positioned, the connection and the handler are also positioned at the same time. Furthermore, since the lead wire is not used between the intervening substrate and the connection portion, the upper limit of the measurable frequency is improved, so that a wider band including higher frequencies can be measured.

[0007]

Preferred embodiments of the present invention will be described below in detail with reference to the accompanying drawings. Although the embodiments described below are preferred specific examples of the present invention, various technically preferable limitations are added thereto. However, the scope of the present invention is not limited to the particulars described in the following description. It is not limited to these forms unless otherwise stated.

FIG. 1 is an explanatory view showing an example of the configuration of a device inspection apparatus according to the present invention, and FIG. 2 is a view of the device inspection apparatus of FIG. 1 as viewed from the direction of arrows along line AA. 1 and 2, a test head 1 is mounted on a test head support 4 via a retainer 2 and rolling steel balls 3, and is horizontally (XY) on the test head support 4.
It is possible to move in the direction. Further, on the upper surface of the test head 1, a family board 5 and a DUT board 6, both of which are disc-shaped, are arranged at a central portion thereof so as to be overlapped with a gap therebetween. The center side of the family board 5 and the DUT board 6 is fixed by a pair of fixing screws 7, and the outer peripheral side is fixed to the test head 1 via fixing rings 8 and 9, respectively. The test head 1 includes, for example, a power supply for a sample to be applied to a device to be measured such as an IC, a timing generator output unit, a pattern generator output unit, and an input unit for inputting a device output to an output unit. The family board 5 plays a role of an interface for performing the above-mentioned input / output. Further, on the test head 1, first guide pins 11 each having a conical pin-like tip portion fixed by a fixing screw 10 are respectively provided at positions separated right and left across the family board 5 and the DUT board 6. Are directly attached in a state of protruding upward. In addition, a rough positioning block 12 is detachably attached to one side surface of the test head 1, and a pair of positioning protrusions 12 are attached to the rough positioning block 12.
a is formed to be divided into left and right.

On the upper surface of the DUT board 6, a second guide pin 13 having a conical pin shape is projected upward at a position divided into right and left sides with respect to the center. A socket 14 as a connection portion in which a device to be measured is set is mounted at the center thereof with a fixing screw 15. The amount of protrusion of the second guide pin 13 is set smaller than the amount of protrusion of the first guide pin 11.

Next, the configuration on the handler side will be described. As shown in FIG. 1, the handler base 21 is supported by a handler base 22 so as to be movable in the vertical direction, and is disposed above the test head 1. Also, handler base 2
1 has an insertion hole 23 into which the first guide pin 11 is fitted and inserted and an insertion hole 2 into which the second guide pin 13 is fitted and inserted.
4 are formed at two places, respectively, and a through hole 26 is formed on the handler side at a position corresponding to the socket 14 on the test head 1 side. In addition, on the handler side,
At a position corresponding to the rough positioning block 12 of the test head 1, a rough positioning block 27 is
Is attached detachably with a fixing screw 28. The rough positioning block 27 is formed with a pair of positioning concave portions 27a, which are divided into left and right sides, respectively, corresponding to the positioning protrusions 12a. A device to be measured such as a MOS IC is set in the socket 14. On the other hand, the handler automatically attaches the device under test to the socket 1 by, for example, a suction device (not shown).
4, the device under test is automatically transported to another storage location and stored based on the test results.

Before measuring the device under test set in the socket 14, the handler base 21 located above the test head 1 is lowered, and the tip of the test head side socket 14 is fixed through the through hole 26. You.
The device under test and the test head 1 are electrically connected. At this time, it is necessary that the socket 14 is accurately positioned with respect to the handler.

Therefore, the test head side socket 14
Are mounted at correct positions with respect to two positioning second guide pins 13 provided on the DUT board 6 and two positioning first guide pins 11 directly mounted on the test head 1. There must be. Therefore, in the present embodiment, for example, the positioning gauge 32 shown in FIG. 3 is used as shown by a two-dot chain line in FIG.

That is, the positioning gauge 32 is a thin plate material, and includes two insertion holes 33 into which a pair of first guide pins 11 are fitted and inserted, and a pair of second guide pins 13 similarly. Two insertion holes 3 to be fitted and inserted
4 and a positioning notch 35 are provided.
In the positioning notch 35, a contact surface 35 is provided.
a and 35b are provided, and a relief 35c is formed at a position where the contact surface 35a and the contact surface 35b intersect. Then, as shown in FIG. 2, the gauge 32 has a contact surface with the first guide pin 11 and the second guide pin 13 fitted and inserted into the insertion holes 33 and 34, respectively. The socket 14 is positioned at a predetermined position with respect to the first guide pin 11 and the second guide pin 13 by bringing the outer peripheral surface of the socket 14 into contact with 35 a and 35 b, and this is fixed to the DUT board 6 with the fixing screw 15. Fix and attach. When the positioning of the socket 14 is completed, the gauge 32 is removed.

Next, in the device inspection apparatus configured as described above, first, the test head 1 is set to be freely movable in the horizontal direction with respect to the test head cradle 4, and the rough positioning block 12 is firstly set. Positioning projection 1
2a and positioning recess 27a of the rough positioning block 27
The position is roughly determined in correspondence with the above. When the rough positioning is completed, the rough positioning blocks 12 and 2
7 is removed.

Next, the handler base 21 is lowered by the expansion and contraction operation of the handler base 22. Then, first, the conical tip of the first guide pin 11 is inserted into the insertion hole 23, and the conical tip of the first guide pin 11 engages with the inner peripheral surface of the insertion hole 23. I do. For this reason, the test head 1 mounted on the test head support 4 via the retainer 2 and the rolling steel balls 3 moves on the test head support 4 in the XY directions. Here, since the first guide pins 11 are provided in a pair, the test head 1 not only moves in the XY directions but also performs a rotational movement at the same time. Then, by this movement, the positioning of the second guide pin 13 and the insertion hole 24 is performed.

Further, when the handler base 21 is lowered, the second guide pin 13 and the inner peripheral surface of the insertion hole 24 are engaged, and the X-Y of the test head 1 and the handler base 21 is moved.
Final positioning in the direction is performed. When the positioning between the handler base 21 and the test head 1 is completed, the test head 1 is fixed to the test head receiving table 4.

Thereafter, when the handler base 21 is lowered, the positioning of the socket on the handler and the board is completed at the position where the lowering is completed. After that, the mechanism on the handler side is operated, and the IC of the socket is pushed and measured.
Thereafter, the IC measurement is repeated.

Therefore, according to the present embodiment, when the handler base 21 is moved toward the test head 1, the engaging portions (the insertion holes 23 and 24) and the guide pins (the first guide pin 11 and the second At the same time, the test head 1 is moved in the horizontal direction with respect to the handler side (handler base 21) to position the test head 1 and the handler side (handler base 21). Will be Since the connection portion (socket 14) here is positioned and fixed to the test head 1 via the intervening substrate (DUT board 6), the test head 1 and the handler side are positioned. Furthermore, since the interposed board (DUT board 6) and the connection part (socket 14) are directly attached without using a lead wire, the upper limit of the measurable frequency is improved, and a wide band including a high frequency is improved. Measurement becomes possible.

In the structure of this embodiment, a structure is disclosed in which the test head 1 is moved horizontally with respect to the handler base 21 to perform positioning. On the contrary, the handler base 21 moves horizontally. The structure for performing positioning may be used.

[0020]

As described above, according to the present invention,
It is possible to easily perform alignment between the handler and the connection portion disposed on the intervening substrate that transmits a signal required for measurement by being interposed between the device under test and the test head. In addition, since the lead wire is directly used between the intervening substrate and the connection portion without using a lead wire, effects such as measurement in a wide band including high frequency measurement can be expected.

[Brief description of the drawings]

FIG. 1 is an explanatory diagram showing one configuration example of a test head side of a device inspection apparatus according to the present invention.

FIG. 2 is a view of the device inspection apparatus of FIG. 1 as viewed from a direction of an arrow along a line AA.

FIG. 3 is an explanatory diagram showing an example of a gauge shape.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 Test head 2 Retainer 3 Steel ball 4
Test head holder 5 Family board 6 DUT board (intervening board) 11 First guide pin 13 Second guide pin
14 Socket 21 Handler base 26 Through hole 32 Positioning gauge 33, 34 Insertion hole (engagement part)

Claims (6)

[Claims] A test head for positioning, via an intervening substrate, a connection portion to which a device under test transferred by a handler is electrically connected, the characteristic of a device under test electrically connected to the connection portion being determined. In the device inspection apparatus for automatically evaluating by the test head, the interposition board is directly attached to the test head and the connection portion is directly attached to the interposition board, and a guide pin formed in a tapered shape on the test head side. And projecting upwards to fix and provide multiple
Movement permitting means provided on the handler side for engaging with the guide pin, and at least one of the test head and the handler side can be moved in a horizontal direction with respect to the other; One of the test head and the handler side is movable in the up and down direction, and the engaging portion and the guide pin are engaged with the up and down movement and the horizontal movement by the movement permitting means, Positioning means for positioning the test head and the handler at predetermined positions. 2. A pair of first guide pins which are directly attached on the test head at positions separated left and right with the connection portion therebetween, and the guide pins are separated left and right with the connection portion therebetween. A pair of second guide pins directly attached to the interposition board at the position, and the amount of the second guide pin projecting from the upper surface of the connection portion is smaller than that of the second guide pin. The device inspection device according to claim 1, wherein the device inspection device is formed larger. 3. The device inspection apparatus according to claim 1, further comprising a positioning gauge for positioning the connection portion with respect to the guide pin. 4. The test apparatus according to claim 1, wherein the handler side is provided so as to be vertically movable with respect to the test head, and the test head is provided so as to be movable horizontally with respect to the handler side. The device inspection apparatus according to claim 1. 5. The device inspection apparatus according to claim 1, wherein the entire test head is mounted on a cart via a steel ball, and the whole test head can be moved in a horizontal direction by rolling of the steel ball. 6. The device inspection apparatus according to claim 1, further comprising a positioning block between the handler and the test head for roughly positioning the handler and the test head.