JPH10190163A - Printed board - Google Patents
Printed boardInfo
- Publication number
- JPH10190163A JPH10190163A JP34764496A JP34764496A JPH10190163A JP H10190163 A JPH10190163 A JP H10190163A JP 34764496 A JP34764496 A JP 34764496A JP 34764496 A JP34764496 A JP 34764496A JP H10190163 A JPH10190163 A JP H10190163A
- Authority
- JP
- Japan
- Prior art keywords
- land
- solder
- dummy pattern
- insulating substrate
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
- H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3468—Applying molten solder
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明は、プリント基板に係
り、特に、小さいピッチ間隔のリード端子を備えた電子
部品等の実装に適したプリント基板に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed circuit board, and more particularly, to a printed circuit board suitable for mounting electronic parts having lead terminals with a small pitch.
【0002】[0002]
【従来の技術】従来のプリント基板は、図2に示すよう
に、複数の貫通孔が電子部品のリード端子の配列方向に
沿って形成された絶縁基板1と、この絶縁基板1の下面
の貫通孔に先端が略半円形状のランド103が形成さ
れ、小さいピッチ間隔のリード端子を備えた電子部品等
の実装の場合、電子部品のリード端子の配列方向の鉛直
方向に半田槽で流すとランド103間で半田橋絡が発生
していた。2. Description of the Related Art As shown in FIG. 2, a conventional printed circuit board has an insulating substrate 1 in which a plurality of through holes are formed along the direction in which lead terminals of electronic components are arranged. In the case of mounting an electronic component or the like having a lead terminal with a small semi-circular shape in the hole and having lead terminals at small pitch intervals, the land is formed by flowing the solder in a vertical direction in the arrangement direction of the lead terminals of the electronic component. Solder bridging occurred between the 103s.
【0003】[0003]
【発明が解決しようとする課題】従来のプリント基板
は、電子部品等を実装した場合、ランド103の配列方
向の鉛直方向に半田槽で流すと、半田橋絡が発生すると
いう課題があった。The conventional printed circuit board has a problem that, when electronic components and the like are mounted, solder bridging occurs when the printed circuit board is caused to flow in a solder bath in a vertical direction in which the lands 103 are arranged.
【0004】そこで、本発明の目的は、台形のダミーパ
ターンを配置して半田橋絡を防止するプリント基板を提
供することにある。Accordingly, an object of the present invention is to provide a printed circuit board in which trapezoidal dummy patterns are arranged to prevent solder bridging.
【0005】[0005]
【課題を解決するための手段】上述の課題を解決するた
めに、本発明のプリント基板は、複数の貫通孔が電子部
品のリード端子の配列方向に沿って形成された絶縁基板
と、この絶縁基板に形成された貫通孔の配列方向に対し
て鉛直な1方向に鋭角の先細り突起部を有する第1ラン
ドと、この第1ランドの両側に配置した貫通孔の配列方
向に対して鉛直な2方向各々に点対称で鋭角の先細り突
起部を設けた第2ランドと、上記第1ランドの突起部の
ない側へ配置された台形のダミーパターンとで構成され
たことを特徴とする。In order to solve the above-mentioned problems, a printed circuit board according to the present invention comprises an insulating substrate having a plurality of through-holes formed along a direction in which lead terminals of electronic components are arranged. A first land having a tapered projection formed at an acute angle in one direction perpendicular to the arrangement direction of the through holes formed in the substrate; and a second land perpendicular to the arrangement direction of the through holes arranged on both sides of the first land. It is characterized by being constituted by a second land provided with a pointed symmetrical and acute-angled tapered protrusion in each direction, and a trapezoidal dummy pattern arranged on the side of the first land where the protrusion is not provided.
【0006】[0006]
【発明の実施の形態】次に、本発明の一実施の形態によ
るプリント基板を図面を参照して説明する。Next, a printed circuit board according to an embodiment of the present invention will be described with reference to the drawings.
【0007】図1は、本発明の一実施の形態によるプリ
ント基板の断面図(A)及び構成図(B)である。FIG. 1 is a sectional view (A) and a structural view (B) of a printed circuit board according to an embodiment of the present invention.
【0008】本発明の一実施の形態によるプリント基板
は、図1に示すように、複数の貫通孔2が電子部品5の
リード端子51の配列方向に沿って形成された絶縁基板
1と、この絶縁基板1に形成された貫通孔の配列方向に
対して鉛直な1方向に鋭角の先細り突起部31を有する
第1ランド3と、第1ランド3の両側に配置した貫通孔
の配列方向に対して鉛直な2方向各々に点対称で鋭角の
先細り突起部31を設けた第2ランド3Aと、第1ラン
ド3の突起部31のない側へ配置された台形のダミーパ
ターン6とで構成される。As shown in FIG. 1, a printed circuit board according to an embodiment of the present invention includes an insulating substrate 1 in which a plurality of through holes 2 are formed along the direction in which lead terminals 51 of electronic component 5 are arranged. A first land 3 having a tapered projection 31 formed at an acute angle in one direction perpendicular to the arrangement direction of the through holes formed in the insulating substrate 1, and a through hole arranged on both sides of the first land 3. The second land 3A is provided with a pointed symmetrical and acute-angled tapered projection 31 in each of two vertical directions, and a trapezoidal dummy pattern 6 disposed on the side of the first land 3 where the projection 31 is not provided. .
【0009】本発明の一実施の形態によるプリント基板
は、図1の(B)に示すように、絶縁基板1の下面の貫
通孔2周辺に突起部31を有する第1ランド3と第2ラ
ンド3Aとダミーパターン6とが形成され、図1(A)
に示すように、電子部品5が実装されて電子部品5のリ
ード端子51と第1ランド3と第2ランド3Aとが半田
槽で半田4付けされる場合、第1ランド3と第2ランド
3Aとに余分についた半田4がダミーパターン6に移動
して半田4橋絡を防止する。As shown in FIG. 1B, a printed board according to one embodiment of the present invention has a first land 3 and a second land 3 having a projection 31 around the through hole 2 on the lower surface of the insulating substrate 1. 3A and the dummy pattern 6 are formed, and FIG.
When the electronic component 5 is mounted and the lead terminal 51 of the electronic component 5 and the first land 3 and the second land 3A are soldered 4 in a solder bath, the first land 3 and the second land 3A The extra solder 4 moves to the dummy pattern 6 to prevent bridging of the solder 4.
【0010】[0010]
【発明の効果】以上説明したように、本発明のプリント
基板によれば、絶縁基板の下面の貫通孔に突起部を有す
る第1ランド、第2ランド、ダミーパターンを形成した
ため、電子部品のリード端子の配列方向に対して鉛直方
向に半田槽で流す時、半田槽で発生する隣り合うランド
の半田橋絡を防止する効果がある。As described above, according to the printed circuit board of the present invention, since the first land, the second land, and the dummy pattern having the projections in the through holes on the lower surface of the insulating substrate are formed, the leads of the electronic component are formed. When flowing in a solder bath in a direction perpendicular to the arrangement direction of the terminals, there is an effect of preventing solder bridging between adjacent lands generated in the solder bath.
【図1】本発明の一実施の形態によるプリント基板の断
面図(A)及び構成図(B)である。FIG. 1A is a cross-sectional view of a printed circuit board according to an embodiment of the present invention, and FIG.
【図2】従来のプリント基板の構成図である。FIG. 2 is a configuration diagram of a conventional printed circuit board.
1 絶縁基板 2 貫通孔 3 第1ランド 4 半田 5 電子部品 6 ダミーパターン 3A 第2ランド 31 突起部 51 リード端子 DESCRIPTION OF SYMBOLS 1 Insulating substrate 2 Through hole 3 First land 4 Solder 5 Electronic component 6 Dummy pattern 3A Second land 31 Projection 51 Lead terminal
Claims (1)
配列方向に沿って形成された絶縁基板と、この絶縁基板
に形成された貫通孔の配列方向に対して鉛直な1方向に
鋭角の先細り突起部を有する第1ランドと、この第1ラ
ンドの両側に配置した貫通孔の配列方向に対して鉛直な
2方向各々に点対称で鋭角の先細り突起部を設けた第2
ランドと、上記第1ランドの突起部のない側へ配置され
た台形のダミーパターンとで構成されたことを特徴とす
るプリント基板。An insulating substrate having a plurality of through-holes formed along an arrangement direction of lead terminals of an electronic component; and an acute angle in one direction perpendicular to an arrangement direction of the through-holes formed in the insulating substrate. A second land having a first land having a tapered projection, and a tapered projection having a point-symmetric acute angle in each of two directions perpendicular to the arrangement direction of the through holes arranged on both sides of the first land.
A printed circuit board, comprising: a land; and a trapezoidal dummy pattern disposed on a side of the first land where the first land does not have a protrusion.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP34764496A JPH10190163A (en) | 1996-12-26 | 1996-12-26 | Printed board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP34764496A JPH10190163A (en) | 1996-12-26 | 1996-12-26 | Printed board |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH10190163A true JPH10190163A (en) | 1998-07-21 |
Family
ID=18391623
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP34764496A Pending JPH10190163A (en) | 1996-12-26 | 1996-12-26 | Printed board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH10190163A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013229361A (en) * | 2012-04-24 | 2013-11-07 | Mitsubishi Electric Corp | Printed wiring board |
JP2017080242A (en) * | 2015-10-30 | 2017-05-18 | 株式会社三共 | Board and game machine |
-
1996
- 1996-12-26 JP JP34764496A patent/JPH10190163A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013229361A (en) * | 2012-04-24 | 2013-11-07 | Mitsubishi Electric Corp | Printed wiring board |
JP2017080242A (en) * | 2015-10-30 | 2017-05-18 | 株式会社三共 | Board and game machine |
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