JPH10190163A - Printed board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a printed board for preventing a short circuit of solder bridges. SOLUTION: The printed board comprises: a first land 3 having an accute angle tapered projection part 31 in one direction perpendicular to the array direction of a through hole 2 on a lower face of an insulating substrate 1; a second land 3A provided with the accute angle tapered projection part 31 point- symmetrically, respectively, in two directions perpendicular to the array direction of a through hole disposed on both faces of the first land 3; and a trapezoid dummy pattern 6 disposed on a side having no projection parts 31 of the first land 3. In the case where a lead terminal 51 of electronic parts 5 and the first land 3 and the second land 3A are soldered 4, when solder is made to flow from a solder tub in a direction perpendicular to the array direction of the lead terminal 51, the excessive solder 4 on the first land 3 and the second land 3A is moved to the dummy pattern 6 to prevent a short-circuit of the solder 4 bridge.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed circuit board, and more particularly, to a printed circuit board suitable for mounting electronic parts having lead terminals with a small pitch.

[0002]

2. Description of the Related Art As shown in FIG. 2, a conventional printed circuit board has an insulating substrate 1 in which a plurality of through holes are formed along the direction in which lead terminals of electronic components are arranged. In the case of mounting an electronic component or the like having a lead terminal with a small semi-circular shape in the hole and having lead terminals at small pitch intervals, the land is formed by flowing the solder in a vertical direction in the arrangement direction of the lead terminals of the electronic component. Solder bridging occurred between the 103s.

[0003]

The conventional printed circuit board has a problem that, when electronic components and the like are mounted, solder bridging occurs when the printed circuit board is caused to flow in a solder bath in a vertical direction in which the lands 103 are arranged.

Accordingly, an object of the present invention is to provide a printed circuit board in which trapezoidal dummy patterns are arranged to prevent solder bridging.

[0005]

In order to solve the above-mentioned problems, a printed circuit board according to the present invention comprises an insulating substrate having a plurality of through-holes formed along a direction in which lead terminals of electronic components are arranged. A first land having a tapered projection formed at an acute angle in one direction perpendicular to the arrangement direction of the through holes formed in the substrate; and a second land perpendicular to the arrangement direction of the through holes arranged on both sides of the first land. It is characterized by being constituted by a second land provided with a pointed symmetrical and acute-angled tapered protrusion in each direction, and a trapezoidal dummy pattern arranged on the side of the first land where the protrusion is not provided.

[0006]

Next, a printed circuit board according to an embodiment of the present invention will be described with reference to the drawings.

FIG. 1 is a sectional view (A) and a structural view (B) of a printed circuit board according to an embodiment of the present invention.

As shown in FIG. 1, a printed circuit board according to an embodiment of the present invention includes an insulating substrate 1 in which a plurality of through holes 2 are formed along the direction in which lead terminals 51 of electronic component 5 are arranged. A first land 3 having a tapered projection 31 formed at an acute angle in one direction perpendicular to the arrangement direction of the through holes formed in the insulating substrate 1, and a through hole arranged on both sides of the first land 3. The second land 3A is provided with a pointed symmetrical and acute-angled tapered projection 31 in each of two vertical directions, and a trapezoidal dummy pattern 6 disposed on the side of the first land 3 where the projection 31 is not provided. .

As shown in FIG. 1B, a printed board according to one embodiment of the present invention has a first land 3 and a second land 3 having a projection 31 around the through hole 2 on the lower surface of the insulating substrate 1. 3A and the dummy pattern 6 are formed, and FIG.
When the electronic component 5 is mounted and the lead terminal 51 of the electronic component 5 and the first land 3 and the second land 3A are soldered 4 in a solder bath, the first land 3 and the second land 3A The extra solder 4 moves to the dummy pattern 6 to prevent bridging of the solder 4.

[0010]

As described above, according to the printed circuit board of the present invention, since the first land, the second land, and the dummy pattern having the projections in the through holes on the lower surface of the insulating substrate are formed, the leads of the electronic component are formed. When flowing in a solder bath in a direction perpendicular to the arrangement direction of the terminals, there is an effect of preventing solder bridging between adjacent lands generated in the solder bath.

[Brief description of the drawings]

FIG. 1A is a cross-sectional view of a printed circuit board according to an embodiment of the present invention, and FIG.

FIG. 2 is a configuration diagram of a conventional printed circuit board.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Insulating substrate 2 Through hole 3 First land 4 Solder 5 Electronic component 6 Dummy pattern 3A Second land 31 Projection 51 Lead terminal

Claims (1)

[Claims] An insulating substrate having a plurality of through-holes formed along an arrangement direction of lead terminals of an electronic component; and an acute angle in one direction perpendicular to an arrangement direction of the through-holes formed in the insulating substrate. A second land having a first land having a tapered projection, and a tapered projection having a point-symmetric acute angle in each of two directions perpendicular to the arrangement direction of the through holes arranged on both sides of the first land.
A printed circuit board, comprising: a land; and a trapezoidal dummy pattern disposed on a side of the first land where the first land does not have a protrusion.