JPH10189838A - Heat conductive gel - Google Patents
Heat conductive gelInfo
- Publication number
- JPH10189838A JPH10189838A JP35703296A JP35703296A JPH10189838A JP H10189838 A JPH10189838 A JP H10189838A JP 35703296 A JP35703296 A JP 35703296A JP 35703296 A JP35703296 A JP 35703296A JP H10189838 A JPH10189838 A JP H10189838A
- Authority
- JP
- Japan
- Prior art keywords
- gel
- silicone oil
- heat conductive
- heat
- condensation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は電子機器等に搭載さ
れるパワートランジスタ、ダイオード、ＣＭＯＳ等の発
熱性部材と、熱交換を促す金属製の熱交換部品（ヒート
シンク）との間に介在される放熱シートに関するもので
あり、特にシリコーンゲルを主成分とした高密着性及び
高熱伝導性を有する熱伝導ゲルに係るものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention is interposed between a heat-generating member such as a power transistor, a diode, and a CMOS mounted on an electronic device or the like, and a metal heat exchange part (heat sink) for promoting heat exchange. The present invention relates to a heat dissipation sheet, and more particularly to a heat conduction gel mainly composed of silicone gel and having high adhesion and high heat conductivity.
【０００２】[0002]
【発明の背景】近時、電子機器は可搬性、省スペース性
等が重視されて小型軽量化が求められているとともに、
ノート型パソコン等に代表されるようなマイクロプロセ
ッサを搭載した機器においては、クロックの高速化が進
められている。このようなクロックの高速化は発熱量を
増大させ、更に小型軽量化により、熱が逃げるための空
間確保が困難になっている。2. Description of the Related Art Recently, electronic devices have been required to be small and light because of emphasis on portability, space saving, and the like.
In devices equipped with a microprocessor, such as a notebook personal computer, clocks are being speeded up. Such an increase in the speed of the clock increases the amount of heat generated, and furthermore, the size and weight of the clock make it difficult to secure a space for heat to escape.
【０００３】ところで前記マイクロプロセッサ、パワー
トランジスタ、ダイオード等の発熱性部材で発生した熱
の放熱部材として用いられるヒートシンクは、従来より
種々の素材、形状のものが開発されており、ヒートシン
ク単体の放熱能力は向上しているものの、放熱部材と発
熱性部材とが機械的に密着していないと接触熱抵抗が増
大して熱伝導ロスが生じ、結果として放熱効率は低下し
てしまう。つまり外観上密着しているように見えても、
実際には接触面は凹凸であるため、放熱部材と発熱性部
材とは面接触ではなく点接触となっているのである。従
って接触点以外には熱伝導率が低い（接触熱抵抗の大き
い）空気が介在することとなり、放熱効率を低下させて
しまうのである。By the way, heat sinks used as heat radiating members for heat generated by the heat generating members such as the microprocessor, power transistor and diode have been developed from various materials and shapes. However, if the heat dissipating member and the heat generating member are not in close mechanical contact, the contact thermal resistance increases and heat conduction loss occurs, resulting in a decrease in heat dissipating efficiency. In other words, even if it looks like they are close together,
Actually, since the contact surface is uneven, the heat dissipating member and the heat generating member are not in surface contact but in point contact. Therefore, air having low thermal conductivity (high contact thermal resistance) is interposed except for the contact point, and the heat radiation efficiency is reduced.
【０００４】このような接触熱抵抗を低減するために、
放熱部材と発熱性部材との間に介在させて両者の接触を
密にすべく、接触面にシリコーンオイルを塗布する手法
もあるが、別途放熱部材の固定手段が必要となる。そこ
で放熱部材を保持することのできる「放熱シート」が種
々開発されているのであり、この放熱シートは放熱性
（高熱伝導率）、密着性（柔軟性、弾力性）及び、引き
裂き強度が特性として要求される。一例として特公昭４
７−７１５０号等に開示されるように、主成分をシリコ
ーンゴム（ポリオレフィン系エラストマー、酢酸ビニル
共重合体）等とし、熱伝導性を与えるためにフィラー
（ボロン、窒化ボロン、アルミナ、窒化アルミ、水酸化
アルミ、酸化亜鉛、石英、炭化珪素、黒鉛、酸化マグネ
シウム等）を添加する手法が知られている。In order to reduce such contact thermal resistance,
There is a method in which silicone oil is applied to the contact surface in order to make the contact between the heat radiating member and the heat generating member denser, but a separate fixing means for the heat radiating member is required. Therefore, a variety of "heat radiating sheets" capable of holding a heat radiating member have been developed. The heat radiating sheet has characteristics of heat radiating property (high thermal conductivity), adhesion (flexibility, elasticity) and tear strength. Required. One example is Shoko Sho 4
As disclosed in, for example, No. 7-7150, a main component is silicone rubber (polyolefin-based elastomer, vinyl acetate copolymer) or the like, and a filler (boron, boron nitride, alumina, aluminum nitride, A method of adding aluminum hydroxide, zinc oxide, quartz, silicon carbide, graphite, magnesium oxide, etc.) is known.
【０００５】このような放熱シートの主成分の一例であ
るシリコーンゲルには、付加型と縮合型とがあるが、付
加型ではフィラーによる硬化阻害が生じたり、機械強度
（引っ張り強度、引き裂き強度）の低いものとなってし
まうおそれがある。このため硬化阻害が生じず、高い機
械強度を有する縮合型のゲルがベース素材として好適で
ある。つまり密着性の向上を図る見地からは、柔軟性と
弾力性という機械的性状が要求される一方、熱伝導性の
向上を図る見地から前記フィラーの充填量を高めること
は必須であり、このように密着性及び熱伝導性という異
なる性状を同時に要求するとなると、前述の熱伝導性の
付与の手法が密着性と相反する性状を呈することとな
り、いわば二律背反の技術課題を生じている。[0005] Silicone gel, which is an example of the main component of such a heat-radiating sheet, is classified into an addition type and a condensation type. In the addition type, curing inhibition is caused by a filler or mechanical strength (tensile strength, tear strength). May be low. Therefore, a condensation type gel having no mechanical inhibition and high mechanical strength is suitable as a base material. In other words, from the viewpoint of improving the adhesion, mechanical properties such as flexibility and elasticity are required, while it is essential to increase the filler loading from the viewpoint of improving the thermal conductivity. If different properties such as adhesiveness and thermal conductivity are required at the same time, the above-described method of imparting thermal conductivity will exhibit properties that are inconsistent with the adhesiveness, thus giving rise to two technical problems.
【０００６】[0006]
【開発を試みた技術課題】本発明者はこのような背景の
認識の上に立って、「放熱シート」として要求される密
着性及び熱伝導性を付与した、新規な熱伝導ゲルを開発
することを技術課題としたものである。[Technical Problem Attempted Development] Based on the recognition of such background, the present inventor has developed a novel heat conductive gel provided with adhesion and heat conductivity required as a “heat dissipation sheet”. This is a technical issue.
【０００７】[0007]
【課題を解決するための手段】すなわち請求項１記載の
熱伝導ゲルは、縮合型ゲルと、シリコーンオイルと、熱
伝導性フィラーとを含み、常温でゲル状に硬化している
ことを特徴として成る。この発明によれば、熱伝導ゲル
に高密着性、高機械強度及び高熱伝導率性を付与するこ
とがができる。That is, the heat conductive gel according to claim 1 is characterized in that it contains a condensation type gel, a silicone oil and a heat conductive filler, and is cured in a gel state at normal temperature. Become. According to the present invention, high adhesion, high mechanical strength, and high thermal conductivity can be imparted to the heat conductive gel.
【０００８】また請求項２記載の熱伝導ゲルは、前記要
件に加え、前記縮合型ゲルは、縮合硬化型の液状シリコ
ーンゲルであることを特徴として成る。この発明によれ
ば、硬化阻害を引き起こさないという縮合型の液状シリ
コーンゲルの性状により、フィラー添加により所望の熱
伝導性を与えても、密着性を損なうことがない。The heat conductive gel according to claim 2 is characterized in that, in addition to the above requirements, the condensation gel is a condensation-curable liquid silicone gel. According to the present invention, adhesion properties are not impaired even if a desired thermal conductivity is imparted by adding a filler due to the properties of the condensation type liquid silicone gel which does not cause curing inhibition.
【０００９】更にまた請求項３記載の熱伝導ゲルは、前
記要件に加え、前記シリコーンオイルは、ジメチルシリ
コーンオイル、メチルフェニルシリコーンオイル、アミ
ノ変性シリコーンオイル及びエポキシ変性シリコーンオ
イルより成る群から一種または二種以上の複数種を選択
したことを特徴として成る。この発明によれば、フィラ
ーの添加による高硬度化を防止することができ、密着性
を損なうことがない。Further, in addition to the above requirements, the heat conductive gel according to claim 3, wherein the silicone oil is one or two selected from the group consisting of dimethyl silicone oil, methylphenyl silicone oil, amino-modified silicone oil and epoxy-modified silicone oil. It is characterized in that a plurality of types or more are selected. According to the present invention, the increase in hardness due to the addition of the filler can be prevented, and the adhesion is not impaired.
【００１０】更にまた請求項４記載の熱伝導ゲルは、前
記要件に加え、前記熱伝導性フィラーは、窒化硼素、窒
化珪素、窒化アルミ及び酸化マグネシウムより成る群か
ら一種または二種以上の複数種を選択したことを特徴と
して成る。この発明によれば、熱伝導性の悪い縮合型ゲ
ルに対して、良好な熱伝導性を付与することができる。Further, in addition to the above requirements, the heat conductive gel according to claim 4, wherein the heat conductive filler is one or more than one kind selected from the group consisting of boron nitride, silicon nitride, aluminum nitride and magnesium oxide. Is selected. ADVANTAGE OF THE INVENTION According to this invention, favorable thermal conductivity can be provided with respect to the condensation type gel with poor thermal conductivity.
【００１１】更にまた請求項５記載の熱伝導ゲルは、前
記要件に加え、前記縮合型ゲル及び前記シリコーンオイ
ルの混合物と、前記熱伝導性フィラーとの混合物におけ
る熱伝導性フィラーの混合率は、総重量の２０〜８０％
であることを特徴として成る。この発明によれば、シリ
コーンオイルにより縮合型ゲルの高硬度化を防止して良
好な密着性を付与し、熱伝導性フィラーにより良好な熱
伝導性を付与することができる。Further, in addition to the above requirements, the heat conductive gel according to the present invention preferably has a mixing ratio of the heat conductive filler in a mixture of the mixture of the condensation gel and the silicone oil and the heat conductive filler. 20-80% of the total weight
It is characterized by being. According to the present invention, it is possible to prevent the condensed gel from having a high hardness by using a silicone oil to provide good adhesion, and to provide a thermal conductive filler with good thermal conductivity.
【００１２】更にまた請求項６記載の熱伝導ゲルは、前
記請求項５記載の要件に加え、前記縮合型ゲルと前記シ
リコーンオイルとの混合比は、１：２であることを特徴
として成る。この発明によれば、縮合型ゲルとシリコー
ンオイルとの混合物、または前記縮合型ゲル及びシリコ
ーンオイルの混合物と、熱伝導性フィラーとの混合物に
良好な密着性を付与することができる。Further, the heat conductive gel according to claim 6 is characterized in that, in addition to the requirement according to claim 5, the mixing ratio of the condensation type gel and the silicone oil is 1: 2. According to the present invention, good adhesion can be imparted to a mixture of a condensed gel and silicone oil or a mixture of the condensed gel and silicone oil and a thermally conductive filler.
【００１３】更にまた請求項７記載の熱伝導ゲルは、前
記要件に加え、針入度が５〜２００であることを特徴と
する。この発明によれば、熱伝導ゲルを発熱性部材と放
熱部材との間に介在させることで両者を密着させ、実質
的な面接触状態を得ることができる。Further, in addition to the above requirements, the heat conductive gel according to claim 7 is characterized in that the penetration is 5 to 200. According to the present invention, the thermal conductive gel is interposed between the heat-generating member and the heat-dissipating member so that they are in close contact with each other, and a substantial surface contact state can be obtained.
【００１４】更にまた請求項８記載の熱伝導ゲルは、前
記要件に加え、熱伝導率が０．８〜１．１ｗ／ｍ・ｋで
あることを特徴として成る。この発明によれば、熱伝導
ゲルを発熱性部材と放熱部材との間に介在させることで
発熱性部材から放熱部材への熱伝導を効率的に行うこと
ができる。The heat conductive gel according to claim 8 is characterized in that, in addition to the above requirements, the heat conductivity is 0.8 to 1.1 w / mk. According to the present invention, heat conduction from the heat generating member to the heat radiating member can be efficiently performed by interposing the heat conductive gel between the heat generating member and the heat radiating member.
【００１５】[0015]
【発明の実施の形態】以下、本発明の熱伝導ゲルについ
て具体的に説明する。本発明の熱伝導ゲルは、縮合型ゲ
ル、シリコーンオイル及び熱伝導性フィラーを主成分と
して成る。これら各成分について具体的に説明すると、
前記縮合型ゲルとは、液状シリコーンゲルを配合組成に
起因する硬化反応型で分類した場合の一タイプであり、
ベースポリマー、架橋剤、硬化触媒、充填剤及び添加剤
等を成分として成る。BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, the heat conductive gel of the present invention will be specifically described. The thermal conductive gel of the present invention comprises a condensation gel, silicone oil and a thermally conductive filler as main components. To explain these components in detail,
The condensation type gel is one type when the liquid silicone gel is classified as a curing reaction type caused by the composition,
It comprises a base polymer, a crosslinking agent, a curing catalyst, a filler, an additive and the like as components.
【００１６】また、前記液状シリコーンゲルには一成分
形と二成分形以上の多成分形がある。一成分液状シリコ
ーンゲルは、密封容器中から外部に押し出すことにより
空気中の湿気（水分）と反応し、硬化は表面から始まっ
て内部に進行するものであり、室温で硬化する。一方、
二成分液状シリコーンゲルは性状の異なる二液を混合す
ると、時間経過に従って硬化進行する。この硬化機構は
加水分解縮合反応であり、架橋剤としては主に正ケイ酸
プロピル等のアルコキシシランが用いられ、また触媒と
水の存在が不可欠である。このような縮合型の二成分液
状シリコーンゲルは、一般的に接着性を持たず、硬化阻
害を起こさないという性状を呈する。The liquid silicone gel includes a one-component type and a two-component or more multi-component type. The one-component liquid silicone gel reacts with the moisture (moisture) in the air by being extruded from the sealed container to the outside, and the curing starts from the surface and proceeds inside, and cures at room temperature. on the other hand,
When a two-component liquid silicone gel is mixed with two liquids having different properties, the curing progresses with the passage of time. The curing mechanism is a hydrolysis-condensation reaction, and an alkoxysilane such as propyl orthosilicate is mainly used as a crosslinking agent, and the presence of a catalyst and water is indispensable. Such a condensed two-component liquid silicone gel generally has a property of not having adhesiveness and not inhibiting curing.
【００１７】前記ベースポリマーとしては一例としてポ
リシロキサン（−Ｓｉ−Ｏ−）が用いられる。このポリ
シロキサン（−Ｓｉ−Ｏ−）のケイ素原子上の置換基は
一般的にはメチル基であるが、耐熱性や極低温性付与に
はフェニル基が、耐溶剤性向上にはトリフルオロプロピ
ル基等のフッ素化炭化水酸基が用いられる。As the base polymer, for example, polysiloxane (-Si-O-) is used. The substituent on the silicon atom of the polysiloxane (-Si-O-) is generally a methyl group, but a phenyl group is used for providing heat resistance and cryogenic property, and a trifluoropropyl group is used for improving solvent resistance. A fluorinated hydrocarbon group such as a group is used.
【００１８】前記架橋剤としては、一成分形ではＲＳｉ
Ｘ3 が、二成分形ではＳｉ（ＯＲ）4 等が用いられる
（Ｘ：メトキシ、ケトオキム基等、 Ｒ：メチル、エチ
ル基等）。As the cross-linking agent, one-component RSi
When X 3 is a binary component, Si (OR) 4 or the like is used (X: methoxy, ketokim group, etc., R: methyl, ethyl group, etc.).
【００１９】前記硬化触媒としては、有機スズ化合物、
有機チタン化合物、アミン系化合物等が用いられる。ま
た前記充填剤としては微粉末シリカ、炭酸カルシウム
粉、石英粉等が用いられる。このような縮合型ゲルは、
前記ベースポリマー、架橋剤、硬化触媒、充填剤及び添
加剤等を、ロールミキサー、プラネタリーミキサーまた
は連続混練機等の各種混練機を用いて、各成分を均一に
混合させて製造される。As the curing catalyst, an organotin compound,
Organic titanium compounds, amine compounds and the like are used. As the filler, fine powder silica, calcium carbonate powder, quartz powder and the like are used. Such a condensation type gel is
The base polymer, the cross-linking agent, the curing catalyst, the filler, the additive, and the like are manufactured by uniformly mixing the respective components using a kneader such as a roll mixer, a planetary mixer, or a continuous kneader.
【００２０】次にシリコーンオイルについて説明する。
シリコーンオイルは、ジメチルポリシロキサンを主骨格
とし、様々の有機官能基を側鎖または主鎖末端に導入し
て成る。そして本発明においてはジメチルシリコーンオ
イル、メチルフェニルシリコーンオイル、アミノ変性シ
リコーンオイル及びエポキシ変性シリコーンオイルより
成る群から一種または二種以上の複数種が選択される。Next, the silicone oil will be described.
Silicone oil has dimethylpolysiloxane as a main skeleton and various organic functional groups introduced into a side chain or a main chain terminal. In the present invention, one or two or more kinds are selected from the group consisting of dimethyl silicone oil, methylphenyl silicone oil, amino-modified silicone oil and epoxy-modified silicone oil.
【００２１】次に熱伝導性フィラーについて説明する。
本発明において熱伝導性フィラーは、窒化硼素、窒化珪
素、窒化アルミ及び酸化マグネシウムより成る群から一
種または二種以上の複数種を選択される。このうち窒化
硼素を用いたフィラーの一例について説明すると、この
ものはＢＮの化学式をもつ硼素の窒化物を焼成したセラ
ミックスを、平均粒径３．５〜０．８μｍ程度の微粉末
としたものであり、結晶構造が黒鉛に似た六角網面の積
み重なりとして表されるために、化学的、物理的特質が
黒鉛に似ているものの、極めて高い絶縁性を示し、色は
白色である。その他の特性としては、真比重２．２６、
低誘電損失であり絶縁性が高い等が挙げられる。Next, the heat conductive filler will be described.
In the present invention, the heat conductive filler is selected from one or two or more of a group consisting of boron nitride, silicon nitride, aluminum nitride, and magnesium oxide. An example of a filler using boron nitride will be described. This is a ceramic obtained by firing a nitride of boron having a chemical formula of BN into a fine powder having an average particle size of about 3.5 to 0.8 μm. Yes, the crystal structure is represented as a stack of hexagonal mesh planes similar to graphite, and although it has chemical and physical characteristics similar to graphite, it exhibits extremely high insulating properties and is white in color. Other characteristics include a true specific gravity of 2.26,
Low dielectric loss and high insulation properties.
【００２２】そして、本発明の熱伝導ゲルを製造するに
あたっては、前記縮合型ゲル及び前記シリコーンオイル
の混合物と、前記熱伝導性フィラーとの混合物における
熱伝導性フィラーの混合率を、総重量の２０〜８０％と
して混合して熱伝導ゲルを得るのである。まず縮合型ゲ
ルの主剤に硬化剤を添加して均等に混ざるまで攪拌機等
を用いて充分に攪拌する。その後、シリコーンオイル、
熱伝導性フィラーを混合し、次いで真空ポンプとデシケ
ータを用いて５〜１０分程度脱泡する。更にその後、こ
の混合液をドクターブレード法、カレンダーロール法、
押出法等により、１．５ｍｍ厚程度のシート状にして常
温でゲル状に硬化させ、両面に剥離シートを張り付け、
適宜の大きさに裁断する。In producing the heat conductive gel of the present invention, the mixing ratio of the heat conductive filler in the mixture of the mixture of the condensation type gel and the silicone oil and the heat conductive filler is determined based on the total weight of the mixture. The mixing is performed at 20 to 80% to obtain a heat conductive gel. First, a curing agent is added to the main component of the condensed gel, and the mixture is sufficiently stirred using a stirrer or the like until the mixture is evenly mixed. Then silicone oil,
The thermally conductive filler is mixed, and then degassed for about 5 to 10 minutes using a vacuum pump and a desiccator. Further thereafter, this mixed solution is subjected to a doctor blade method, a calendar roll method,
By extrusion or the like, it is made into a sheet of about 1.5 mm thickness, cured in a gel at room temperature, and a release sheet is attached to both sides,
Cut to the appropriate size.
【００２３】このようにして得られたシート状の熱伝導
ゲルは、ＪＩＳ Ｋ（Ｋ−２２０７−１９８０ ５０ｇ
荷重) で測定された針入度が５〜２００であり、熱伝導
率が０．８〜１．１ｗ／ｍ・ｋ、好ましくは０．９〜
１．０ｗ／ｍ・ｋの特性を有するものである。因みにこ
の熱伝導率は後述する実施例において得られた値であっ
て、熱伝導ゲルの厚さや、周辺環境等により若干の変動
が生ずる。以下、本発明の好ましい実施例について具体
的に説明する。The sheet-like heat conductive gel obtained in this manner is JIS K (K-2207-1980, 50 g).
Penetration measured by (load) is from 5 to 200, and thermal conductivity is from 0.8 to 1.1 w / mk, preferably from 0.9 to 1.1 w / mk.
It has characteristics of 1.0 w / m · k. Incidentally, this thermal conductivity is a value obtained in Examples described later, and a slight variation occurs depending on the thickness of the thermal conductive gel, the surrounding environment, and the like. Hereinafter, preferred embodiments of the present invention will be specifically described.
【００２４】[0024]
【実施例１】縮合型ゲルとして、Ｗａｃｋｅｒ社製ＲＴ
Ｖ２５３１Ｐを用いた。またシリコーンオイルとして、
Ｗａｃｋｅｒ社製ジメチルシリコーンオイルＡＫ３５用
いた。更にまた熱伝導性フィラーとして、電気化学工業
社製ＢＮＢＰを用いた。そして縮合型ゲルと、シリコー
ンオイルとの混合比（重量比）を１：２、また縮合型ゲ
ル及びシリコーンオイルの混合物と、熱伝導性フィラー
との混合比（重量比）を７０：３０とした。このように
して得られた熱伝導性ゲルは、ＪＩＳ Ｋ（Ｋ−２２０
７−１９８０ ５０ｇ荷重) で測定された針入度が８５
であり、また熱伝導率が１．０ｗ／ｍ・ｋという特性が
得られた。Example 1 As a condensation gel, RT manufactured by Wacker Co. was used.
V2531P was used. Also as silicone oil,
Dimethyl silicone oil AK35 manufactured by Wacker was used. Furthermore, BNBP manufactured by Denki Kagaku Kogyo KK was used as the heat conductive filler. The mixing ratio (weight ratio) between the condensed gel and the silicone oil was 1: 2, and the mixing ratio (weight ratio) between the mixture of the condensed gel and the silicone oil and the thermally conductive filler was 70:30. . The heat conductive gel thus obtained is JIS K (K-220
7 to 1980 at a load of 50 g) is 85.
And the characteristic that the thermal conductivity was 1.0 w / mk.
【００２５】[0025]
【実施例２】縮合型ゲルとして、Ｗａｃｋｅｒ社製ＲＴ
Ｖ２５３１Ｐを用いた。またシリコーンオイルとして、
Ｗａｃｋｅｒ社製ジメチルシリコーンオイルＡＫ３５用
いた。更にまた熱伝導性フィラーとして、電気化学工業
社製ＳｉＮＦ１を用いた。そして縮合型ゲルと、シリコ
ーンオイルとの混合比（重量比）を１：２、また縮合型
ゲル及びシリコーンオイルの混合物と、熱伝導性フィラ
ーとの混合比（重量比）を３５：６５とした。このよう
にして得られた熱伝導性ゲルは、ＪＩＳ Ｋ（Ｋ−２２
０７−１９８０ ５０ｇ荷重) で測定された針入度が５
５であり、また熱伝導率が１．０ｗ／ｍ・ｋという特性
が得られた。Example 2 As condensation type gel, RT manufactured by Wacker
V2531P was used. Also as silicone oil,
Dimethyl silicone oil AK35 manufactured by Wacker was used. Furthermore, SiNF1 manufactured by Denki Kagaku Kogyo KK was used as the heat conductive filler. The mixing ratio (weight ratio) between the condensed gel and the silicone oil was 1: 2, and the mixing ratio (weight ratio) between the mixture of the condensed gel and the silicone oil and the thermally conductive filler was 35:65. . The heat conductive gel obtained in this way is JIS K (K-22)
7 to 1980, 50 g load).
5, and a characteristic of a thermal conductivity of 1.0 w / mk was obtained.
【００２６】[0026]
【実施例３】縮合型ゲルとして、Ｗａｃｋｅｒ社製ＲＴ
Ｖ２５３１Ｐを用いた。またシリコーンオイルとして、
Ｗａｃｋｅｒ社製ジメチルシリコーンオイルＡＫ３５用
いた。更にまた熱伝導性フィラーとして、東洋アルミ社
製ＡｌＮＵＭ７０を用いた。そして縮合型ゲルと、シリ
コーンオイルとの混合比（重量比）を１：２、また縮合
型ゲル及びシリコーンオイルの混合物と、熱伝導性フィ
ラーとの混合比（重量比）を３０：７０とした。このよ
うにして得られた熱伝導性ゲルは、ＪＩＳ Ｋ（Ｋ−２
２０７−１９８０ ５０ｇ荷重) で測定された針入度が
５０であり、また熱伝導率が１．０ｗ／ｍ・ｋという特
性が得られた。Example 3 As condensation type gel, RT manufactured by Wacker
V2531P was used. Also as silicone oil,
Dimethyl silicone oil AK35 manufactured by Wacker was used. Further, AlNUM70 manufactured by Toyo Aluminum was used as the heat conductive filler. The mixing ratio (weight ratio) between the condensed gel and the silicone oil was 1: 2, and the mixing ratio (weight ratio) between the mixture of the condensed gel and the silicone oil and the thermally conductive filler was 30:70. . The heat conductive gel obtained in this manner is JIS K (K-2
207-1980 at a load of 50 g), and a characteristic of a thermal conductivity of 1.0 w / mk was obtained.
【００２７】[0027]
【実施例４】縮合型ゲルとして、Ｗａｃｋｅｒ社製ＲＴ
Ｖ２５３１Ｐを用いた。またシリコーンオイルとして、
Ｗａｃｋｅｒ社製ジメチルシリコーンオイルＡＫ３５用
いた。更にまた熱伝導性フィラーとして、電気化学工業
社製ＢＮＢＰ及び電気化学工業社製ＳｉＮＦ１を用い
た。そして縮合型ゲルと、シリコーンオイルとの混合比
（重量比）を１：２とし、前記二種の熱伝導性フィラー
の混合比を１：１とし、更にまた縮合型ゲル及びシリコ
ーンオイルの混合物と、熱伝導性フィラーの混合物との
混合比（重量比）を６０：４０とした。このようにして
得られた熱伝導性ゲルは、ＪＩＳ Ｋ（Ｋ−２２０７−
１９８０ ５０ｇ荷重) で測定された針入度が５０であ
り、また熱伝導率が０．９ｗ／ｍ・ｋという特性が得ら
れた。Example 4 As condensation type gel, RT manufactured by Wacker
V2531P was used. Also as silicone oil,
Dimethyl silicone oil AK35 manufactured by Wacker was used. Furthermore, BNBP manufactured by Denki Kagaku Kogyo and SiNF1 manufactured by Denki Kagaku Kogyo were used as the heat conductive filler. The mixing ratio (weight ratio) of the condensed gel and the silicone oil was 1: 2, the mixing ratio of the two types of thermally conductive fillers was 1: 1, and the mixture of the condensed gel and the silicone oil was further added. The mixing ratio (weight ratio) with the mixture of the heat conductive filler was set to 60:40. The heat conductive gel obtained in this manner is described in JIS K (K-2207-).
(1980, 50 g load), a characteristic of a penetration of 50 and a thermal conductivity of 0.9 w / mk was obtained.
【００２８】[0028]
【発明の効果】本発明の熱伝導ゲルは、以上述べたよう
な構成を有することによって成るものであって、以下の
ような効果を奏する。まずシリコーンオイルにより縮合
型ゲルの高硬度化を防止して良好な密着性を付与し、熱
伝導性フィラーにより良好な熱伝導性を付与することが
できる。そして各請求項記載の構成によりもたらされる
効果が相乗的に作用することによりフィラーの添加によ
る硬化阻害を引き起こさず、引っ張り強度の強い縮合型
シリコーンゲルを用い、この素材に「放熱シート」とし
て要求される密着性及び熱伝導性を具備した熱伝導ゲル
の提供が可能となる。従って熱伝導ゲルを発熱性部材と
放熱部材との間に介在させることで両者を密着させ、実
質的な面接触状態を得ることができ、発熱性部材から放
熱部材への熱伝導を効率的に行うことができる。The thermal conductive gel of the present invention has the above-described structure, and has the following effects. First, it is possible to prevent the condensed gel from having a high hardness by using silicone oil and to provide good adhesion, and to provide good thermal conductivity by using a thermally conductive filler. And the effect brought by the configuration of each claim acts synergistically, does not cause curing inhibition due to the addition of the filler, uses a condensation type silicone gel having a high tensile strength, and is required as a `` heat dissipation sheet '' for this material. It is possible to provide a thermally conductive gel having good adhesiveness and thermal conductivity. Therefore, by interposing the heat conductive gel between the heat generating member and the heat radiating member, the two can be brought into close contact with each other and a substantial surface contact state can be obtained, and the heat conduction from the heat generating member to the heat radiating member can be efficiently performed. It can be carried out.
Claims (8)
伝導性フィラーとを含み、常温でゲル状に硬化している
ことを特徴とする熱伝導ゲル。1. A thermally conductive gel comprising a condensed gel, silicone oil, and a thermally conductive filler, wherein the thermally conductive gel is cured in a gel state at normal temperature.
リコーンゲルであることを特徴とする請求項１記載の熱
伝導ゲル。2. The heat conductive gel according to claim 1, wherein the condensation gel is a condensation-curable liquid silicone gel.
コーンオイル、メチルフェニルシリコーンオイル、アミ
ノ変性シリコーンオイル及びエポキシ変性シリコーンオ
イルより成る群から一種または二種以上の複数種を選択
したことを特徴とする請求項１または２記載の熱伝導ゲ
ル。3. The method according to claim 2, wherein the silicone oil is selected from one or more of a group consisting of dimethyl silicone oil, methylphenyl silicone oil, amino-modified silicone oil and epoxy-modified silicone oil. 3. The heat conductive gel according to 1 or 2.
化珪素、窒化アルミ及び酸化マグネシウムより成る群か
ら一種または二種以上の複数種を選択したことを特徴と
する請求項１、２または３記載の熱伝導ゲル。4. The thermal conductive filler is selected from one, two or more of a group consisting of boron nitride, silicon nitride, aluminum nitride and magnesium oxide. The thermal conductive gel according to the above.
ルの混合物と、前記熱伝導性フィラーとの混合物におけ
る熱伝導性フィラーの混合率は、総重量の２０〜８０％
であることを特徴とする請求項１、２、３または４記載
の熱伝導ゲル。5. The mixing ratio of the heat conductive filler in the mixture of the mixture of the condensation type gel and the silicone oil and the heat conductive filler is 20 to 80% of the total weight.
The heat conductive gel according to claim 1, 2, 3, or 4, wherein
との混合比は、１：２であることを特徴とする請求項５
記載の熱伝導ゲル。6. The mixing ratio of the condensation type gel to the silicone oil is 1: 2.
The thermal conductive gel according to the above.
する請求項１、２、３、４、５または６記載の熱伝導ゲ
ル。7. The heat conductive gel according to claim 1, wherein the penetration is from 5 to 200.
あることを特徴とする請求項１、２、３、４、５、６ま
たは７記載の熱伝導ゲル。8. The heat conductive gel according to claim 1, wherein the heat conductivity is 0.8 to 1.1 w / mk.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP35703296A JP3697645B2 (en) | 1996-12-25 | 1996-12-25 | Thermal conductive gel |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP35703296A JP3697645B2 (en) | 1996-12-25 | 1996-12-25 | Thermal conductive gel |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH10189838A true JPH10189838A (en) | 1998-07-21 |
| JP3697645B2 JP3697645B2 (en) | 2005-09-21 |
Family
ID=18452036
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP35703296A Expired - Fee Related JP3697645B2 (en) | 1996-12-25 | 1996-12-25 | Thermal conductive gel |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3697645B2 (en) |
Cited By (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1149959A (en) * | 1997-08-05 | 1999-02-23 | Toshiba Silicone Co Ltd | Silicone gel composition for flame-retardant heat dissipative sheet and flame-retardant heat dissipative silicone sheet |
| JP2000143808A (en) * | 1998-11-17 | 2000-05-26 | Fuji Kobunshi Kogyo Kk | Heat conductive, electrical insulating silicone gel composition |
| JP2000233452A (en) * | 1999-02-12 | 2000-08-29 | Minnesota Mining & Mfg Co <3M> | Heat conductive silicone gel sheet |
| JP2000327917A (en) * | 1999-05-24 | 2000-11-28 | Fuji Kobunshi Kogyo Kk | Heat conductive and electrical insulating silicone composition |
| JP2002305271A (en) * | 2001-04-06 | 2002-10-18 | Shin Etsu Chem Co Ltd | Heat dissipating structure of electronic component, and heat dissipating sheet used for the same |
| JP2003080640A (en) * | 2001-09-12 | 2003-03-19 | Fuji Kobunshi Kogyo Kk | Heat-softened sheet |
| US6794030B1 (en) | 1999-11-30 | 2004-09-21 | 3M Innovative Properties Company | Heat conductive sheet and method of producing the sheet |
| JP2006332305A (en) * | 2005-05-26 | 2006-12-07 | Matsushita Electric Ind Co Ltd | Method of manufacturing thermal conductive sheet |
| WO2007086443A1 (en) * | 2006-01-26 | 2007-08-02 | Momentive Performance Materials Japan Llc | Heat dissipating member and semiconductor device using same |
| KR100773792B1 (en) * | 2000-06-29 | 2007-11-07 | 쓰리엠 이노베이티브 프로퍼티즈 캄파니 | Thermally conductive sheet and method of producing the same |
| JP2010537150A (en) * | 2007-08-22 | 2010-12-02 | ドイコス・インベストメンツ・リミテッド | Liquid-cooled grate plate including a wear plate and a staircase grate made of this grate plate |
| WO2015102046A1 (en) * | 2014-01-06 | 2015-07-09 | 三菱電機株式会社 | Semiconductor device |
| JP2016117836A (en) * | 2014-12-22 | 2016-06-30 | 住友ベークライト株式会社 | Heat-conductive sheet, cured article of heat-conductive sheet and semiconductor device |
| JP2019102654A (en) * | 2017-12-04 | 2019-06-24 | 三菱電線工業株式会社 | Coating composition for manufacturing heat dissipation sheet, method for manufacturing heat dissipation sheet using the same, and the heat dissipation sheet |
| CN111073300A (en) * | 2019-12-13 | 2020-04-28 | 深圳市丰盛源科技有限公司 | Heat-conducting gel easy to repair and preparation method thereof |
| CN111777994A (en) * | 2020-07-14 | 2020-10-16 | 深圳市乐普泰科技股份有限公司 | Heat-conducting gel and preparation method thereof |
| CN113278292A (en) * | 2021-05-25 | 2021-08-20 | 福建臻璟新材料科技有限公司 | Heat-conducting gel capable of being rapidly cured at room temperature and preparation method thereof |
| CN113308121A (en) * | 2021-07-14 | 2021-08-27 | 合肥工业大学 | Insulating high-thermal-conductivity gel filled with composite thermal-conductive filler based on chemical bond assembly |
| WO2022075213A1 (en) * | 2020-10-05 | 2022-04-14 | デンカ株式会社 | Two-part curing composition set, thermally conductive cured article, and electronic device |
| CN114539782A (en) * | 2022-01-18 | 2022-05-27 | 深圳先进电子材料国际创新研究院 | Method for reducing contact thermal resistance heat-conducting gel and application thereof |
| CN115386232A (en) * | 2022-10-11 | 2022-11-25 | 福建臻璟新材料科技有限公司 | Bi-component heat-conducting silica gel and preparation process thereof |
| CN116023785A (en) * | 2021-10-27 | 2023-04-28 | 万华化学集团股份有限公司 | Heat-conducting gel and preparation method thereof |
-
1996
- 1996-12-25 JP JP35703296A patent/JP3697645B2/en not_active Expired - Fee Related
Cited By (30)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1149959A (en) * | 1997-08-05 | 1999-02-23 | Toshiba Silicone Co Ltd | Silicone gel composition for flame-retardant heat dissipative sheet and flame-retardant heat dissipative silicone sheet |
| JP2000143808A (en) * | 1998-11-17 | 2000-05-26 | Fuji Kobunshi Kogyo Kk | Heat conductive, electrical insulating silicone gel composition |
| JP2000233452A (en) * | 1999-02-12 | 2000-08-29 | Minnesota Mining & Mfg Co <3M> | Heat conductive silicone gel sheet |
| JP2000327917A (en) * | 1999-05-24 | 2000-11-28 | Fuji Kobunshi Kogyo Kk | Heat conductive and electrical insulating silicone composition |
| US6794030B1 (en) | 1999-11-30 | 2004-09-21 | 3M Innovative Properties Company | Heat conductive sheet and method of producing the sheet |
| KR100773792B1 (en) * | 2000-06-29 | 2007-11-07 | 쓰리엠 이노베이티브 프로퍼티즈 캄파니 | Thermally conductive sheet and method of producing the same |
| JP2002305271A (en) * | 2001-04-06 | 2002-10-18 | Shin Etsu Chem Co Ltd | Heat dissipating structure of electronic component, and heat dissipating sheet used for the same |
| JP2003080640A (en) * | 2001-09-12 | 2003-03-19 | Fuji Kobunshi Kogyo Kk | Heat-softened sheet |
| JP2006332305A (en) * | 2005-05-26 | 2006-12-07 | Matsushita Electric Ind Co Ltd | Method of manufacturing thermal conductive sheet |
| WO2007086443A1 (en) * | 2006-01-26 | 2007-08-02 | Momentive Performance Materials Japan Llc | Heat dissipating member and semiconductor device using same |
| US8187490B2 (en) | 2006-01-26 | 2012-05-29 | Momentive Performance Materials Japan Llc | Heat dissipating material and semiconductor device using same |
| US8221645B2 (en) | 2006-01-26 | 2012-07-17 | Momentive Performance Materials Japan Llc | Heat dissipating material and semiconductor device using same |
| JP4993611B2 (en) * | 2006-01-26 | 2012-08-08 | モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 | Heat dissipation material and semiconductor device using the same |
| JP2010537150A (en) * | 2007-08-22 | 2010-12-02 | ドイコス・インベストメンツ・リミテッド | Liquid-cooled grate plate including a wear plate and a staircase grate made of this grate plate |
| WO2015102046A1 (en) * | 2014-01-06 | 2015-07-09 | 三菱電機株式会社 | Semiconductor device |
| JPWO2015102046A1 (en) * | 2014-01-06 | 2017-03-23 | 三菱電機株式会社 | Semiconductor device |
| US10049960B2 (en) | 2014-01-06 | 2018-08-14 | Mitsubishi Electric Corporation | Semiconductor device |
| JP2016117836A (en) * | 2014-12-22 | 2016-06-30 | 住友ベークライト株式会社 | Heat-conductive sheet, cured article of heat-conductive sheet and semiconductor device |
| JP2019102654A (en) * | 2017-12-04 | 2019-06-24 | 三菱電線工業株式会社 | Coating composition for manufacturing heat dissipation sheet, method for manufacturing heat dissipation sheet using the same, and the heat dissipation sheet |
| CN111073300A (en) * | 2019-12-13 | 2020-04-28 | 深圳市丰盛源科技有限公司 | Heat-conducting gel easy to repair and preparation method thereof |
| CN111777994A (en) * | 2020-07-14 | 2020-10-16 | 深圳市乐普泰科技股份有限公司 | Heat-conducting gel and preparation method thereof |
| CN111777994B (en) * | 2020-07-14 | 2022-08-26 | 广东陆祥新材料科技有限公司 | Heat-conducting gel and preparation method thereof |
| WO2022075213A1 (en) * | 2020-10-05 | 2022-04-14 | デンカ株式会社 | Two-part curing composition set, thermally conductive cured article, and electronic device |
| CN113278292A (en) * | 2021-05-25 | 2021-08-20 | 福建臻璟新材料科技有限公司 | Heat-conducting gel capable of being rapidly cured at room temperature and preparation method thereof |
| CN113308121B (en) * | 2021-07-14 | 2022-06-07 | 合肥工业大学 | Insulating high-thermal-conductivity gel filled with composite thermal-conductive filler based on chemical bond assembly |
| CN113308121A (en) * | 2021-07-14 | 2021-08-27 | 合肥工业大学 | Insulating high-thermal-conductivity gel filled with composite thermal-conductive filler based on chemical bond assembly |
| CN116023785A (en) * | 2021-10-27 | 2023-04-28 | 万华化学集团股份有限公司 | Heat-conducting gel and preparation method thereof |
| CN116023785B (en) * | 2021-10-27 | 2024-04-09 | 万华化学集团股份有限公司 | Heat-conducting gel and preparation method thereof |
| CN114539782A (en) * | 2022-01-18 | 2022-05-27 | 深圳先进电子材料国际创新研究院 | Method for reducing contact thermal resistance heat-conducting gel and application thereof |
| CN115386232A (en) * | 2022-10-11 | 2022-11-25 | 福建臻璟新材料科技有限公司 | Bi-component heat-conducting silica gel and preparation process thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3697645B2 (en) | 2005-09-21 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH10189838A (en) | Heat conductive gel | |
| JP3543663B2 (en) | Thermal conductive silicone rubber composition and method for producing the same | |
| JP3444199B2 (en) | Thermal conductive silicone rubber composition and method for producing the same | |
| JP4144998B2 (en) | Material for heat dissipation | |
| TWI635169B (en) | Thermally conductive composite sheet | |
| JP3952184B2 (en) | Thermally conductive sheet | |
| TW549011B (en) | Dissipation of heat from a circuit board having bare silicon chips mounted thereon | |
| JP5015436B2 (en) | Thermally conductive silicone elastomer, thermal conductive medium and thermally conductive silicone elastomer composition | |
| JP2728607B2 (en) | Manufacturing method of heat conductive composite sheet | |
| US6635959B2 (en) | Thermally conductive silk-screenable interface material | |
| JP2008260798A (en) | Heat-conductive cured material and method for producing the same | |
| JP2004352947A (en) | Room temperature-curing type of thermally conductive silicone rubber composition | |
| JP2002294269A (en) | Extrusible crosslinked grease-like radiation material, container in which the material is filled and enclosed, manufacturing method of the container and radiation method using these | |
| TW583275B (en) | A heat radiating component | |
| JP6314915B2 (en) | Heat dissipation putty sheet | |
| JP2007119588A (en) | Thermoconductive silicone rubber composition | |
| JPS61157569A (en) | Thermally conductive adhesive composition | |
| TW201905054A (en) | Thermally conductive polyorganosiloxane composition | |
| JP2010120979A (en) | Thermally conductive silicone gel cured product | |
| JP2006188670A (en) | Surface modified corundum and resin composition | |
| JP3521781B2 (en) | Heat dissipation member | |
| JP2002138205A (en) | Thermal conductive molded article | |
| JP2002121332A (en) | Thermally softenable heat-radiating sheet | |
| JP2002164481A (en) | Heat conductive sheet | |
| TW200536896A (en) | Composition for heat conductive siloxanes heat release and its using method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20050322 |
|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20050520 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20050614 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20050623 |
|
| R150 | Certificate of patent (=grant) or registration of utility model |
Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
| S111 | Request for change of ownership or part of ownership |
Free format text: JAPANESE INTERMEDIATE CODE: R313114 |
|
| S111 | Request for change of ownership or part of ownership |
Free format text: JAPANESE INTERMEDIATE CODE: R313111 |
|
| R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
| S111 | Request for change of ownership or part of ownership |
Free format text: JAPANESE INTERMEDIATE CODE: R313115 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20080715 Year of fee payment: 3 |
|
| R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090715 Year of fee payment: 4 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20100715 Year of fee payment: 5 |
|
| S531 | Written request for registration of change of domicile |
Free format text: JAPANESE INTERMEDIATE CODE: R313531 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20100715 Year of fee payment: 5 |
|
| R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20100715 Year of fee payment: 5 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110715 Year of fee payment: 6 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120715 Year of fee payment: 7 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130715 Year of fee payment: 8 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| LAPS | Cancellation because of no payment of annual fees |