JPH10189627A - Element, semiconductor circuit board and sensor - Google Patents
Element, semiconductor circuit board and sensorInfo
- Publication number
- JPH10189627A JPH10189627A JP8342896A JP34289696A JPH10189627A JP H10189627 A JPH10189627 A JP H10189627A JP 8342896 A JP8342896 A JP 8342896A JP 34289696 A JP34289696 A JP 34289696A JP H10189627 A JPH10189627 A JP H10189627A
- Authority
- JP
- Japan
- Prior art keywords
- sensor
- electrode
- circuit board
- substrate
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0555—Shape
- H01L2224/05552—Shape in top view
- H01L2224/05553—Shape in top view being rectangular
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85909—Post-treatment of the connector or wire bonding area
- H01L2224/8592—Applying permanent coating, e.g. protective coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85909—Post-treatment of the connector or wire bonding area
- H01L2224/85951—Forming additional members, e.g. for reinforcing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01004—Beryllium [Be]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/014—Solder alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/1015—Shape
- H01L2924/10155—Shape being other than a cuboid
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、微細加工技術を用
いて製造される素子に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a device manufactured by using a fine processing technique.
【０００２】[0002]
【従来の技術】図４は、半導体、セラミック、ガラス等
の基板上につくられる流量センサの構造を示す平面図及
び断面図である。全体を符号１で示す流量センサは、回
路基板１０上にセンサ基板４０がとりつけれる。センサ
基板４０は検知部４２を有し、矢印Ｆで示す流体の流れ
を検知して電気信号に変換する。センサ基板４０上に
は、検知部４２の電気信号を伝達する回路４１がプリン
トされており、回路の端部は、センサ部材上に配設され
る一対の電極４４，４６に連結される。2. Description of the Related Art FIG. 4 is a plan view and a sectional view showing the structure of a flow sensor formed on a substrate such as a semiconductor, ceramic, glass, or the like. In the flow rate sensor indicated by reference numeral 1 as a whole, a sensor board 40 is mounted on a circuit board 10. The sensor substrate 40 has a detection unit 42, detects a flow of a fluid indicated by an arrow F, and converts the flow into an electric signal. A circuit 41 for transmitting an electric signal of the detection unit 42 is printed on the sensor board 40, and an end of the circuit is connected to a pair of electrodes 44 and 46 provided on the sensor member.
【０００３】回路基板１０上には、一対の電極２２，３
２が設けてあり、電極２２，３２はプリントされた回路
２０，３０を介してターミナル２４，３４に連結され、
他の機器に接続される。センサ基板４０の電極４４，４
６と、基板１０上に設けられる電極２２，３２の間は、
それぞれワイヤ５０でボンディングされる。そして、こ
れらの電極やワイヤ上には樹脂６０をコーティングして
配線を保護している。A pair of electrodes 22 and 3 are provided on a circuit board 10.
2, electrodes 22 and 32 are connected to terminals 24 and 34 via printed circuits 20 and 30,
Connected to other devices. Electrodes 44, 4 of sensor substrate 40
6 and the electrodes 22 and 32 provided on the substrate 10,
Each is bonded by a wire 50. The electrodes and wires are coated with a resin 60 to protect the wires.
【０００４】しかしながら、この構造の流量センサにあ
っては、コーティング樹脂６０の上面がセンサ基板４０
の上面に盛り上がるので、流体の流れＦを乱して渦など
を生じてしまい、流量、流速などの計測の誤差の原因と
なる。However, in the flow sensor having this structure, the upper surface of the coating resin 60 is
Bulges on the upper surface of the fluid flow, which disturbs the flow F of the fluid and generates eddies and the like, which causes measurement errors such as flow rate and flow velocity.
【０００５】[0005]
【発明が解決しようとする課題】そこで、検知部４２と
電極４４，４６の間の距離を大きくとって、コーティン
グ樹脂による流れの影響を小さくすることが考えられる
が、この構造では流量センサ１の小型化を妨げる要因と
なってしまう。Therefore, it is conceivable to increase the distance between the detecting portion 42 and the electrodes 44 and 46 to reduce the influence of the flow due to the coating resin. This is a factor that hinders miniaturization.
【０００６】図５は、センサ基板４０の端部に穴を設け
て、センサ基板４０上の電極４４，４６と基板１０上の
電極２３，３２を導電性樹脂６０ｂで接続する構造が提
案されている。そして、必要に応じてコーティング樹脂
６０ａで覆う。しかしながら、この構造にあってはセン
サ基板４０に穴を設けたり、導電性樹脂６０ｂによる導
通の確認等の工程が必要となる。そこで本発明は、上述
した不具合を解消する半導体回路基板を提供するもので
ある。FIG. 5 proposes a structure in which a hole is provided at the end of the sensor substrate 40, and the electrodes 44, 46 on the sensor substrate 40 and the electrodes 23, 32 on the substrate 10 are connected by a conductive resin 60b. I have. Then, if necessary, cover with a coating resin 60a. However, in this structure, a step of providing a hole in the sensor substrate 40 or confirming conduction by the conductive resin 60b is required. Therefore, the present invention provides a semiconductor circuit board that solves the above-mentioned problems.
【０００７】[0007]
【課題を解決するための手段】本発明の素子は、基本的
な手段として、塗布後の少なくとも一時期に流動性をも
つ塗布剤を塗布すべき被塗布部分と、この塗布剤が触れ
ることによって不都合が生ずる非被塗布部分とを有し、
非被塗布部分への塗布剤が流れることを防止する手段を
備える。ここで、塗布剤としては、 １）素子の一部を雰囲気から保護するための樹脂系保護
剤 ２）電気的導通を計るための半田や導電性樹脂 ３）接着剤 ４）着色剤 ５）シール材 ６）緩衝剤 などである。具体的には、回路基板と、回路基板上に配
設されるセンサ基板と、センサ基板上に搭載される検知
部及び電極と、回路基板上に配設される電極とセンサ基
板上に配設される電極とを接続するワイヤと、ワイヤと
電極を覆う樹脂と、センサ基板の電極の検知部側に設け
られて樹脂の検知部側への流れを防止する手段を備え
る。そして、塗布剤の非被塗布部への流出を防止する手
段は、基板に形成される溝である。また、塗布剤の非被
塗布部への流出を防止する手段は、基板に形成される突
出部であってもよい。The element of the present invention is disadvantageous in that, as a basic means, a portion to be coated with a flowable coating agent is applied at least at least one time after application, and the coating agent comes into contact with the portion to be applied. And a non-applied portion where
Means are provided for preventing the coating agent from flowing to the non-applied portion. Here, as the coating agent, 1) a resin-based protective agent for protecting a part of the element from the atmosphere 2) Solder or conductive resin for measuring electrical conduction 3) Adhesive 4) Colorant 5) Seal Materials 6) Buffers and the like. Specifically, a circuit board, a sensor board provided on the circuit board, a detection unit and an electrode mounted on the sensor board, and an electrode provided on the circuit board and provided on the sensor board A wire that connects the electrode to be formed, a resin that covers the wire and the electrode, and a unit that is provided on the detection unit side of the electrode of the sensor substrate and that prevents the resin from flowing to the detection unit side. The means for preventing the coating agent from flowing out to the non-coated portion is a groove formed in the substrate. Further, the means for preventing the coating agent from flowing to the non-applied portion may be a projecting portion formed on the substrate.
【０００８】本発明の他の手段として、回路基板と、回
路基板上に配設されるセンサ基板と、センサ基板上に搭
載される検知部及び電極と、回路基板上に配設される電
極とセンサ基板上に配設される電極とを接続するワイヤ
と、ワイヤと電極を覆う樹脂とを備え、センサ基板に段
付部を形成し、センサ基板の高い位置に検知部を配設
し、センサ基板の低い位置に電極を配設してなる手段で
もよい。[0008] As another means of the present invention, a circuit board, a sensor board provided on the circuit board, a detecting portion and an electrode mounted on the sensor board, and an electrode provided on the circuit board are provided. A wire connecting the electrodes provided on the sensor board, and a resin covering the wires and the electrodes; forming a stepped portion on the sensor board; disposing a detection section at a high position on the sensor board; Means in which an electrode is provided at a lower position on the substrate may be used.
【０００９】[0009]
【発明の実施の形態】図１は本発明の流量センサの要部
を示す平面図と断面図である。センサ基板１００上に
は、検知部１４０が設けてあり、センサ側電極１１０の
間はプリント回路１１５で連結される。センサ側電極１
１０と図示を省略する基板側の電極とはワイヤ１２０で
ボンディングされる。センサ側の電極１１０とワイヤ１
２０は樹脂材１６０でコーティングされ、保護される。
検知部１４０は樹脂材１６０に触れると感度の低下等の
不具合を生ずる。FIG. 1 is a plan view and a sectional view showing a main part of a flow sensor according to the present invention. A detection unit 140 is provided on the sensor substrate 100, and the sensor-side electrodes 110 are connected by a printed circuit 115. Sensor side electrode 1
10 is bonded to a substrate-side electrode (not shown) with a wire 120. Sensor side electrode 110 and wire 1
20 is coated with a resin material 160 and protected.
When the detection unit 140 touches the resin material 160, a problem such as a decrease in sensitivity occurs.
【００１０】本流量センサにあっては、センサ基板１０
０の上面の検知部１４０とセンサ側電極１１０との間の
センサ側電極１１０の近傍に溝１５０が形成してある。
センサ側電極１１０とワイヤ１２０上には樹脂１６０が
滴下されてコーティングされる。滴下された樹脂材は温
度変化により硬化するが、滴下直後はある程度の流動性
を有し、検知部１４０側へ流出しようとする。しかしな
がら、溝１５０が設けてあるために、流出する樹脂１６
０は、この溝１５０によりせき止められ、検知部１４０
側へは進出しない。この構成により、検知部１４０とコ
ーティング樹脂との間隔は確保され、検知部１４０を流
れる流体が渦等の乱れによる悪影響を及ぼすことがなく
なる。In the present flow sensor, the sensor substrate 10
A groove 150 is formed in the vicinity of the sensor-side electrode 110 between the detection unit 140 and the sensor-side electrode 110 on the upper surface of the zero.
Resin 160 is dropped and coated on sensor-side electrode 110 and wire 120. The dropped resin material cures due to a change in temperature, but has a certain degree of fluidity immediately after dropping, and tends to flow out to the detection unit 140 side. However, since the groove 150 is provided, the resin 16
0 is blocked by the groove 150,
Does not advance to the side. With this configuration, an interval between the detection unit 140 and the coating resin is ensured, and the fluid flowing through the detection unit 140 does not have an adverse effect due to turbulence such as a vortex.
【００１１】図２は本発明の流量センサの他の例の要部
を示す平面図と断面図である。センサ基板２００上に
は、検知部２４０が設けてあり、センサ側電極２１０の
間はプリント回路２１５で連結される。センサ側電極２
１０と図示を省略する基板側の電極とはワイヤ２２０で
ボンディングされる。センサ側の電極２１０とワイヤ２
２０は樹脂材２６０でコーティングされ、保護される。FIG. 2 is a plan view and a sectional view showing a main part of another example of the flow sensor of the present invention. A detection unit 240 is provided on the sensor substrate 200, and the printed circuit 215 connects between the sensor-side electrodes 210. Sensor side electrode 2
10 and a substrate-side electrode (not shown) are bonded by a wire 220. Sensor side electrode 210 and wire 2
20 is coated with a resin material 260 and protected.
【００１２】本流量センサにあっては、センサ基板２０
０の上面の検知部２４０とセンサ側電極２１０との間の
センサ側電極２１０の近傍に突出部２５０が形成してあ
る。センサ側電極２１０とワイヤ２２０上には樹脂２６
０が滴下されてコーティングされる。滴下された樹脂材
は温度変化により硬化するが、滴下直後はある程度の流
動性を有し、検知部２４０側へ流出しようとする。しか
しながら、突出部２５０が設けてあるために、流出する
樹脂２６０は、この突出部２５０によりせき止められ、
検知部２４０側へは進出しない。この構成により、検知
部２４０とコーティング樹脂との間隔は確保され、検知
部２４０を流れる流体が渦等の乱れによる悪影響を及ぼ
すことがなくなる。In the present flow sensor, the sensor substrate 20
A protruding part 250 is formed near the sensor-side electrode 210 between the detection part 240 and the sensor-side electrode 210 on the upper surface of the zero. Resin 26 is placed on sensor-side electrode 210 and wire 220.
0 is dropped and coated. The dropped resin material cures due to a change in temperature, but has a certain degree of fluidity immediately after dropping, and tends to flow out to the detection unit 240 side. However, since the protrusion 250 is provided, the resin 260 flowing out is blocked by the protrusion 250,
It does not advance to the detection unit 240 side. With this configuration, an interval between the detection unit 240 and the coating resin is ensured, and the fluid flowing through the detection unit 240 does not have an adverse effect due to turbulence such as a vortex.
【００１３】図３は本発明の更に他の例を示す断面図で
ある。回路基板３１０上には、センサ基板３００が搭載
される。センサ基板３００上には検知部３４０が配設さ
れる。板状のセンサ基板３００は傾斜面３０２を介して
薄板部３０４に連結される構成を有し、薄板部３０４上
にセンサ側電極３３０が設けられ、検知部３４０とプリ
ント回路３３５により連結される。センサ側の電極３３
０と基板３１０側の電極３２０はワイヤ３５０でボンデ
ィングされ、樹脂３６０でコーティングされる。FIG. 3 is a sectional view showing still another example of the present invention. The sensor board 300 is mounted on the circuit board 310. The detection unit 340 is provided on the sensor substrate 300. The plate-shaped sensor substrate 300 has a configuration in which the sensor-side electrode 330 is provided on the thin plate portion 304 via the inclined surface 302, and is connected to the detection unit 340 by a printed circuit 335. Electrode 33 on sensor side
0 and the electrode 320 on the substrate 310 side are bonded with a wire 350 and coated with a resin 360.
【００１４】本実施側においては、センサ基板３００に
段差を設けて、高い位置に検知部３４０を配設し、低い
位置に電極３３０を配設してある。したがって、電極を
覆う樹脂３６０も検知部３４０より低い位置に設けられ
る。そこで、検知部３４０上を流れる流体に渦等の発生
による乱れの影響を及ぼすことが防止できる。In the present embodiment, a step is provided on the sensor substrate 300, the detecting section 340 is disposed at a high position, and the electrode 330 is disposed at a low position. Therefore, the resin 360 covering the electrodes is also provided at a position lower than the detection unit 340. Therefore, it is possible to prevent the fluid flowing over the detection unit 340 from being affected by the disturbance due to the generation of the vortex or the like.
【００１５】[0015]
【発明の効果】本発明は以上のように、基板上の電極や
ボンディングワイヤを覆うコーティング樹脂や、基板上
の電極と外部配線とを導通、固定するための半田や導電
性樹脂、基板上の一部と外部とを接着、密着させるため
の接着剤、シール材、その他基板上の一部へ塗布される
着色剤、緩衝剤等が、他の電子部品側へ流出するのを積
極的にせき止めて防止する構造を有するので、流量セン
サ等の検知部等の非被検知部への塗布剤の影響を排除す
ることができる。また、回路基板の配線工程は従来の工
程をそのまま採用することができるので、製造工程も大
幅に変更する必要はない。As described above, the present invention provides a coating resin for covering electrodes and bonding wires on a substrate, a solder and a conductive resin for conducting and fixing the electrodes on the substrate and external wiring, Actively prevent the adhesive, sealant, and other colorants and buffers applied to the part on the board from leaking to other electronic components side, to adhere and adhere the part to the outside. Therefore, the influence of the coating material on non-detected portions such as a detection portion such as a flow rate sensor can be eliminated. Further, since the conventional process can be employed as it is for the wiring process of the circuit board, it is not necessary to largely change the manufacturing process.
【図１】本発明の素子の要部の構造を示す平面図及び断
面図。1A and 1B are a plan view and a cross-sectional view illustrating a structure of a main part of an element of the present invention.
【図２】本発明の素子の要部の構造の他の例を示す平面
図及び断面図。2A and 2B are a plan view and a cross-sectional view illustrating another example of the structure of the main part of the element of the present invention.
【図３】本発明の素子の要部の構造の他の例を示す断面
図。FIG. 3 is a sectional view showing another example of the structure of the main part of the element of the present invention.
【図４】流量センサの構造を示す平面図及び断面図。FIG. 4 is a plan view and a cross-sectional view illustrating a structure of a flow sensor.
【図５】従来の技術を示す断面図。FIG. 5 is a sectional view showing a conventional technique.
１００ センサ基板 １１０ センサ側電極 １２０ ボンディングワイヤ １４０ 検知部 １５０ 溝 １６０ コーティング樹脂 REFERENCE SIGNS LIST 100 sensor substrate 110 sensor-side electrode 120 bonding wire 140 detection unit 150 groove 160 coating resin
───────────────────────────────────────────────────── フロントページの続き (72)発明者 丹村 俊彦 京都府京都市右京区花園土堂町10番地 オ ムロン株式会社内 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Toshihiko Tanmura 10 Okamura Dodocho, Ukyo-ku, Kyoto-shi, Kyoto
Claims (5)
つような塗布剤を塗布すべき被塗布部分とこの塗布剤が
触れる事によって不都合を生じる非被塗布部分とを有す
る素子であって、非被塗布部分へ塗布剤が流れることを
防止する手段を備えることを特徴とする素子。1. An element having a portion to be coated with a coating agent having fluidity at least at least one time after coating and a non-coated portion that causes inconvenience due to contact with the coating agent. An element comprising means for preventing a coating material from flowing to a portion to be coated.
る手段は、基板に形成される溝である請求項１記載の素
子。2. The device according to claim 1, wherein the means for preventing the coating agent from flowing out to the non-coated portion is a groove formed in the substrate.
る手段は、基板に形成される突出部である請求項１記載
の素子。3. The device according to claim 1, wherein the means for preventing the coating material from flowing out to the non-coated portion is a protrusion formed on the substrate.
ンサ基板と、センサ基板上に搭載される検知部及び電極
と、回路基板上に配設される電極とセンサ基板上に配設
される電極とを接続するワイヤと、ワイヤと電極を覆う
樹脂と、センサ基板の電極の検知部側に設けられて樹脂
の検知部側への流れを防止する手段を備える半導体回路
基板。4. A circuit board, a sensor board provided on the circuit board, a detection unit and an electrode mounted on the sensor board, and an electrode provided on the circuit board and provided on the sensor board. A semiconductor circuit board comprising: a wire connecting an electrode to be formed; a resin covering the wire and the electrode; and means provided on a detection unit side of the electrode of the sensor substrate to prevent resin from flowing to the detection unit side.
ンサ基板と、センサ基板上に搭載される検知部及び電極
と、回路基板上に配設される電極とセンサ基板上に配設
される電極とを接続するワイヤと、ワイヤと電極を覆う
樹脂とを備え、センサ基板に段付部を形成し、センサ基
板の高い位置に検知部を配設し、センサ基板の低い位置
に電極を配設してなるセンサ。5. A circuit board, a sensor board provided on the circuit board, a detecting unit and an electrode mounted on the sensor board, and an electrode provided on the circuit board and provided on the sensor board. A wire connecting the electrodes to be connected, and a resin covering the wires and the electrodes, forming a stepped portion on the sensor substrate, disposing a detecting portion at a high position on the sensor substrate, and providing an electrode at a low position on the sensor substrate. Sensor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP34289696A JP3635550B2 (en) | 1996-12-24 | 1996-12-24 | Flow sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP34289696A JP3635550B2 (en) | 1996-12-24 | 1996-12-24 | Flow sensor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH10189627A true JPH10189627A (en) | 1998-07-21 |
| JP3635550B2 JP3635550B2 (en) | 2005-04-06 |
Family
ID=18357360
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP34289696A Expired - Fee Related JP3635550B2 (en) | 1996-12-24 | 1996-12-24 | Flow sensor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3635550B2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2003077317A1 (en) * | 2002-03-08 | 2003-09-18 | Renesas Technology Corp. | Integrated circuit device and method for manufacturing the same |
| WO2018216834A1 (en) * | 2017-05-23 | 2018-11-29 | 주식회사 파트론 | Optical sensor package and method for manufacturing same |
| JP2019121746A (en) * | 2018-01-11 | 2019-07-22 | 三洋テクノソリューションズ鳥取株式会社 | Circuit board |
-
1996
- 1996-12-24 JP JP34289696A patent/JP3635550B2/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2003077317A1 (en) * | 2002-03-08 | 2003-09-18 | Renesas Technology Corp. | Integrated circuit device and method for manufacturing the same |
| WO2018216834A1 (en) * | 2017-05-23 | 2018-11-29 | 주식회사 파트론 | Optical sensor package and method for manufacturing same |
| JP2019121746A (en) * | 2018-01-11 | 2019-07-22 | 三洋テクノソリューションズ鳥取株式会社 | Circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3635550B2 (en) | 2005-04-06 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP5212133B2 (en) | Flow type sensor | |
| JP5271997B2 (en) | Intake air temperature sensor | |
| JP2002221419A (en) | Inertia transducer | |
| US6082609A (en) | Process for producing a sensor arrangement for measuring temperature | |
| US8274797B2 (en) | Electronic component | |
| JP2010043930A (en) | Noncontact temperature sensor | |
| JPH10189627A (en) | Element, semiconductor circuit board and sensor | |
| KR20160147465A (en) | Sensor package and a manufacturing method thereof | |
| US11146893B2 (en) | Sensor system, sensor arrangement, and assembly method using solder for sealing | |
| JPH05291482A (en) | Hybrid integrated circuit device and fabrication thereof | |
| US9063020B2 (en) | Method and device for measuring temperature having a separate structure for terminal areas arranged in unrestricted thermal contact with a process liquid | |
| US20230366743A1 (en) | Measuring device | |
| JP4473070B2 (en) | Manufacturing method of sensor having electrode protection structure | |
| JP4136947B2 (en) | Stress sensor | |
| JP2006194682A (en) | Pressure sensor system with integrated temperature sensor | |
| KR102479586B1 (en) | Sensor and a manufacturing method thereof | |
| JP2010139339A (en) | Thermal type flow sensor | |
| EP3598089A1 (en) | Infrared sensor | |
| JPH04360576A (en) | Solid-state image sensing device | |
| JPH0886848A (en) | Magnetism detector | |
| WO2020179249A1 (en) | Flow-rate measuring device | |
| KR100544713B1 (en) | Pressure detecting apparatus | |
| JP2004226254A (en) | Semiconductor apparatus | |
| JP2533929B2 (en) | Electronic device packaging | |
| JP2001174358A (en) | Sensor and its manufacturing method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20040518 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20040608 |
|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20040805 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20040928 |
|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20041122 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20041214 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20041222 |
|
| R150 | Certificate of patent or registration of utility model |
Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090114 Year of fee payment: 4 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090114 Year of fee payment: 4 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20100114 Year of fee payment: 5 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110114 Year of fee payment: 6 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110114 Year of fee payment: 6 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120114 Year of fee payment: 7 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120114 Year of fee payment: 7 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130114 Year of fee payment: 8 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130114 Year of fee payment: 8 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20140114 Year of fee payment: 9 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| LAPS | Cancellation because of no payment of annual fees |