JPH10181057A - Thermal head - Google Patents

Thermal head

Info

Publication number
JPH10181057A
JPH10181057A JP34951596A JP34951596A JPH10181057A JP H10181057 A JPH10181057 A JP H10181057A JP 34951596 A JP34951596 A JP 34951596A JP 34951596 A JP34951596 A JP 34951596A JP H10181057 A JPH10181057 A JP H10181057A
Authority
JP
Japan
Prior art keywords
protective film
glaze layer
layer
insulating board
insulating substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP34951596A
Other languages
Japanese (ja)
Inventor
Taiu Yagi
大宇 八木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Corp
Original Assignee
Kyocera Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Corp filed Critical Kyocera Corp
Priority to JP34951596A priority Critical patent/JPH10181057A/en
Publication of JPH10181057A publication Critical patent/JPH10181057A/en
Pending legal-status Critical Current

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Abstract

PROBLEM TO BE SOLVED: To prevent peeling of a protective film from occurring in the neighborhood of both end parts of a glaze layer even under the condition that a heat sensitive recording medium or the like is repeatedly and slidingly brought into contact with the surface of the protective film by a method wherein a reinforcing layer extending from both end parts of the glaze layer to the top surface of an insulating board is provided between the glaze layer and the protective film and between the insulating board and the protective film. SOLUTION: Heating resistors 3 and an electrically conductive layer 4a are coveringly formed on the top surface of an insulating board 1, on which a glaze layer is formed. Further, by continuously coating the top surface of the glaze layer and the insulating board 1 with a protective film 5, the heating resistors, the electrically conductive layer 4a and the like are covered with the protective film. Further, a reinforcing layer 6 extending from both the end parts of the glaze layer to the top surface of the insulating board 1 is provided between the protective film 5 and the glaze layer and between the protective film 5 and the insulating board 1. Thus, even when a heat sensitive recording medium P or the like is repeatedly and slidingly brought into contact with the surface of the protective film 5, the protective film 5 does not easily peel in the neighborhood or both end parts of the glaze layer and the favorable covering of the heating resistors 3 and the like with the protective film 5 can be maintained over a long period of time.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、ワードプロセッサ
やファクシミリ等のプリンタ機構として組み込まれるサ
ーマルヘッドの改良に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an improvement of a thermal head incorporated as a printer mechanism of a word processor, a facsimile or the like.

【0002】[0002]

【従来の技術】従来、ワードプロセッサ等のプリンタ機
構として組み込まれるサーマルヘッドは、例えば、アル
ミナセラミックス等から成る絶縁基板の上面にグレーズ
層を帯状に被着させるとともに該グレーズ層上に複数個
の発熱抵抗体及び給電用の導電層を被着させ、更にこれ
ら発熱抵抗体及び導電層を前記グレーズ層の上面から絶
縁基板上面にかけて被着される保護膜によって被覆した
構造を有しており、感熱記録媒体をプラテンローラ等を
用いて発熱抵抗体上に順次、搬送しながら、前記発熱抵
抗体に外部からの電力を印加し、発熱抵抗体を個々に選
択的にジュール発熱させるとともに、該発熱した熱を感
熱記録媒体に伝導させ、感熱記録媒体に所定の印画を形
成することによってサーマルヘッドとして機能する。
2. Description of the Related Art Conventionally, a thermal head incorporated as a printer mechanism of a word processor or the like has a glaze layer formed on an insulating substrate made of, for example, alumina ceramics in a strip shape, and a plurality of heating resistors formed on the glaze layer. A heat-sensitive recording medium having a structure in which a heat-generating resistor and a conductive layer are covered with a protective film that is applied from the upper surface of the glaze layer to the upper surface of the insulating substrate. Is sequentially applied onto the heating resistor using a platen roller or the like, while applying external power to the heating resistor to selectively cause the heating resistors to individually generate Joule heat, and dissipating the generated heat. Conduction to the heat-sensitive recording medium and formation of a predetermined print on the heat-sensitive recording medium function as a thermal head.

【0003】尚、前記グレーズ層はその上面に被着され
る発熱抵抗体の発する熱を適当な温度となるように蓄積
してサーマルヘッドの熱応答特性を良好に維持するため
のもので、例えばガラスから成っている場合、所定のガ
ラスペーストを従来周知のスクリーン印刷等によって絶
縁基板の上面に帯状に印刷・塗布し、これを高温で焼き
付けることによって形成される。
The glaze layer is for accumulating heat generated by a heating resistor attached to the upper surface of the glaze layer to an appropriate temperature to maintain good thermal response characteristics of the thermal head. When it is made of glass, it is formed by printing and applying a predetermined glass paste on the upper surface of the insulating substrate by screen printing or the like in the related art, and baking it at a high temperature.

【0004】また前記保護膜は大気中に含まれている水
分等の接触や感熱記録媒体の摺接等から発熱抵抗体や導
電層を保護するためのものであり、例えば、窒化珪素や
酸化珪素等を従来周知のスパッタリング法等によって所
定厚みに被着させることにより形成される。
The protective film is for protecting the heating resistor and the conductive layer from contact with moisture and the like contained in the air, sliding contact of the heat-sensitive recording medium, etc., for example, silicon nitride or silicon oxide. Are formed to a predetermined thickness by a conventionally known sputtering method or the like.

【0005】[0005]

【発明が解決しようとする課題】しかしながら、この従
来のサーマルヘッドにおいては、グレーズ層をスクリー
ン印刷等の厚膜手法によって形成した際、グレーズ層の
端部が、図5に示すように急峻に立ち上がった形状とな
り、このようなグレーズ層12が被着されている絶縁基
板11上に保護膜15をスパッタリング法等によって被
着させると、グレーズ層12の両端部近傍に被着されて
いる保護膜15中に大きな内部応力が発生する。このた
め、印画に際して保護膜15の表面に感熱記録媒体P等
を繰り返し摺接させると、グレーズ層12の両端部近傍
で保護膜15が破損し、容易に膜剥がれを起こしてしま
う。その結果、保護膜15で発熱抵抗体13等を良好に
被覆しておくことができなくなり、保護膜としての機能
が短期間のうちに喪失されてしまう欠点を有していた。
However, in this conventional thermal head, when the glaze layer is formed by a thick film technique such as screen printing, the end of the glaze layer rises sharply as shown in FIG. When the protective film 15 is applied by sputtering or the like on the insulating substrate 11 on which the glaze layer 12 is applied, the protective film 15 applied near both ends of the glaze layer 12 is formed. Large internal stress occurs inside. For this reason, if the thermal recording medium P is repeatedly slid on the surface of the protective film 15 at the time of printing, the protective film 15 is damaged near both ends of the glaze layer 12 and easily peels off. As a result, the heating resistor 13 and the like cannot be covered well with the protective film 15, and the function as the protective film is lost in a short period of time.

【0006】[0006]

【課題を解決するための手段】本発明は上記欠点に鑑み
案出されたもので、絶縁基板の上面に帯状のグレーズ層
を被着させ、該グレーズ層上に複数個の発熱抵抗体及び
導電層を被着させるとともに、これら発熱抵抗体及び導
電層を前記グレーズ層の上面から絶縁基板上面にかけて
被着する保護膜によって被覆してなるサーマルヘッドに
おいて、前記グレーズ層及び絶縁基板と、保護膜との間
に、該グレーズ層の両端部から絶縁基板の上面にかけて
延びる補強層を設けたことを特徴とするものである。
SUMMARY OF THE INVENTION The present invention has been devised in view of the above-mentioned drawbacks. A belt-like glaze layer is provided on the upper surface of an insulating substrate, and a plurality of heating resistors and conductive materials are formed on the glaze layer. A thermal head, wherein the heating resistor and the conductive layer are covered with a protective film to be applied from the upper surface of the glaze layer to the upper surface of the insulating substrate, wherein the glaze layer and the insulating substrate, A reinforcing layer extending from both ends of the glaze layer to the upper surface of the insulating substrate.

【0007】また本発明のサーマルヘッドは、前記補強
層が、前記導電層と同一材料から成っていることを特徴
とするものである。
The thermal head according to the present invention is characterized in that the reinforcing layer is made of the same material as the conductive layer.

【0008】[0008]

【発明の実施の形態】以下、本発明を添付図面に基づい
て詳細に説明する。図1は本発明のサーマルヘッドの一
形態を示す平面図、図2は図1の要部拡大図、図3は図
2のX−X線断面図であり、1は絶縁基板、2はグレー
ズ層、3は発熱抵抗体、4a〜4cは導電層、5は保護
膜、6は補強層である。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described in detail with reference to the accompanying drawings. 1 is a plan view showing one embodiment of the thermal head of the present invention, FIG. 2 is an enlarged view of a main part of FIG. 1, FIG. 3 is a sectional view taken along line XX of FIG. 2, 1 is an insulating substrate, and 2 is a glaze. The layers 3, 3 are heating resistors, 4a to 4c are conductive layers, 5 is a protective film, and 6 is a reinforcing layer.

【0009】前記絶縁基板1はアルミナセラミックス等
の電気絶縁性材料により形成されており、その上面でグ
レーズ層2や発熱抵抗体3,導電層4a〜4c,保護膜
5等を支持する作用を為す。
The insulating substrate 1 is formed of an electrically insulating material such as alumina ceramics, and has an upper surface that functions to support the glaze layer 2, the heating resistor 3, the conductive layers 4a to 4c, the protective film 5, and the like. .

【0010】前記絶縁基板1は、アルミナセラミックス
から成る場合、アルミナ、シリカ、マグネシア等のセラ
ミックス原料粉末に適当な有機溶剤、溶媒を添加混合し
て泥漿状と成すとともにこれを従来周知のドクターブレ
ード法やカレンダーロール法等を採用することによって
セラミックグリーンシートを形成し、しかる後、前記セ
ラミックグリーンシートを所定の長方形状に打ち抜き加
工するとともに高温で焼成することによって製作され
る。
When the insulating substrate 1 is made of alumina ceramics, a ceramic material powder such as alumina, silica, magnesia or the like is mixed with an appropriate organic solvent and a solvent to form a slurry, which is formed into a slurry by a conventionally known doctor blade method. A ceramic green sheet is formed by adopting a calender roll method or the like, and then the ceramic green sheet is punched into a predetermined rectangular shape and fired at a high temperature.

【0011】また前記絶縁基板1の上面に被着されてい
るグレーズ層2はガラスやポリイミド樹脂等の低熱伝導
性材料から成り、絶縁基板1の一長辺に沿って例えば2
0〜60μmの厚みをもって帯状に被着されている。
The glaze layer 2 applied on the upper surface of the insulating substrate 1 is made of a material having low thermal conductivity such as glass or polyimide resin.
It is attached in a belt shape with a thickness of 0 to 60 μm.

【0012】前記グレーズ層2は、その上に配置される
複数個の発熱抵抗体3を上方に突出させて感熱記録媒体
Pに対する押圧力(印圧)を有効に高めるとともに、こ
れら発熱抵抗体3の発する熱を適当な温度となるように
蓄積及び放散してサーマルヘッドの熱応答特性を良好に
維持する蓄熱層としての作用を為す。
The glaze layer 2 has a plurality of heating resistors 3 disposed thereon projecting upward to effectively increase the pressing force (printing pressure) on the thermosensitive recording medium P, and to increase the heating resistors 3. The heat generated by the thermal head accumulates and dissipates to an appropriate temperature and acts as a heat storage layer for maintaining good thermal response characteristics of the thermal head.

【0013】尚、前記グレーズ層2は、所定のガラス粉
末に適当な有機溶剤、有機溶媒等を添加混合して得たガ
ラスペーストを従来周知のスクリーン印刷法等によって
絶縁基板1の上面に帯状に印刷・塗布するとともに、こ
れを高温で焼き付けることによって形成され、このと
き、グレーズ層2は外形は両端部で急峻に立ち上がった
形状となる。
The glaze layer 2 is formed by adding a suitable organic solvent, an organic solvent and the like to a predetermined glass powder and mixing the glass paste to form a strip on the upper surface of the insulating substrate 1 by a conventionally known screen printing method or the like. It is formed by printing and coating and baking it at a high temperature. At this time, the outer shape of the glaze layer 2 has a sharply rising shape at both ends.

【0014】また前記部分グレーズ層2上に配置される
複数個の発熱抵抗体3は所定のピッチ、例えば62.5
μmのピッチで高密度に被着・配列されており、その各
々がTaSiO2 やTiSiO2 ,TiCSiO2 等の
電気抵抗材料により形成されているため、その両端に接
続される導電層4a,4b等を介して外部からの電力が
印加されるとジュール発熱を起こし、感熱記録媒体Pに
印画を形成するのに必要な温度に発熱する作用を為す。
The plurality of heating resistors 3 arranged on the partial glaze layer 2 have a predetermined pitch, for example, 62.5 mm.
high density at a pitch of μm are deposited and arrangements, since each is formed by an electrical resistance material such as TaSiO 2 or TiSiO 2, TiCSiO 2, conductive layer 4a connected to both ends thereof, 4b, etc. When electric power is applied from the outside via the device, Joule heat is generated, and the heat is generated to a temperature necessary for forming a print on the thermosensitive recording medium P.

【0015】更に前記発熱抵抗体3の両端に接続される
導電層4a,4bは部分グレーズ層2上及び絶縁基板1
の上面に所定のパターンをもって被着されており、Al
やCu,Ni等の金属により0.7〜1.2μmの厚み
をもって形成され、発熱抵抗体3に外部電源からの電力
を印加する給電用導体としての作用を為す。
The conductive layers 4a and 4b connected to both ends of the heating resistor 3 are formed on the partial glaze layer 2 and on the insulating substrate 1.
Is attached in a predetermined pattern on the upper surface of
And a metal such as Cu, Ni or the like having a thickness of 0.7 to 1.2 μm, and functions as a power supply conductor for applying power from an external power supply to the heating resistor 3.

【0016】尚、前記発熱抵抗体3及び導電層4a,4
bは、部分グレーズ層2が形成された絶縁基板1の上面
に例えばTaSiO2 膜及びAl膜を従来周知の薄膜手
法(スパッタリング法等)によって順次被着させ、これ
らをフォトリソグラフィー技術によって所定パターンに
加工することにより被着形成される。このとき、導電層
4aは絶縁基板1の一長辺側で発熱抵抗体3の各一端に
共通接続されたうえ絶縁基板1の他の長辺側まで導出さ
れ、導電層4bは部分グレーズ層2上で発熱抵抗体3の
各他端に個別に接続されたうえ絶縁基板1の上面に配置
されるドライバーIC5の近傍まで導出される。
The heating resistor 3 and the conductive layers 4a, 4a
b, for example, a TaSiO 2 film and an Al film are sequentially deposited on the upper surface of the insulating substrate 1 on which the partial glaze layer 2 is formed by a conventionally known thin film method (sputtering method or the like), and these are formed into a predetermined pattern by photolithography technology. It is formed by processing. At this time, the conductive layer 4a is commonly connected to one end of the heating resistor 3 on one long side of the insulating substrate 1 and led out to the other long side of the insulating substrate 1, and the conductive layer 4b is formed on the partial glaze layer 2 It is individually connected to the other ends of the heating resistors 3 and led out to the vicinity of a driver IC 5 arranged on the upper surface of the insulating substrate 1.

【0017】またこのような複数個の発熱抵抗体3や導
電層4a,4bが被着されているグレーズ層2の上面及
び絶縁基板の上面には保護膜5が連続的に被着されてお
り、この保護膜5によって発熱抵抗体3や導電層4a,
4b等を被覆している。
A protective film 5 is continuously applied on the upper surface of the glaze layer 2 on which the plurality of heating resistors 3 and the conductive layers 4a and 4b are applied and on the upper surface of the insulating substrate. The protective film 5 allows the heating resistor 3 and the conductive layer 4a,
4b and the like.

【0018】前記保護膜5は大気中に含まれている水分
等の接触や感熱記録媒体Pの摺接等から発熱抵抗体3や
導電層4a,4bを保護するためのもので、例えば、窒
化珪素や酸化珪素等から成り、従来周知のスパッタリン
グ法等を採用することによって被着・形成される。
The protective film 5 is for protecting the heating resistor 3 and the conductive layers 4a and 4b from contact with moisture and the like contained in the air, sliding contact of the thermal recording medium P, and the like. It is made of silicon, silicon oxide, or the like, and is deposited and formed by employing a conventionally known sputtering method or the like.

【0019】そしてこのような保護膜5と、前述したグ
レーズ層2及び絶縁基板1との間には、グレーズ層2の
両端部から絶縁基板1の上面にかけて延びる補強層6が
設けられている。
A reinforcing layer 6 extending from both ends of the glaze layer 2 to the upper surface of the insulating substrate 1 is provided between the protective film 5 and the above-mentioned glaze layer 2 and insulating substrate 1.

【0020】前記補強層6は導電層4a,4bと同一の
材料(AlやCu,Ni等の金属)で、同一の厚み
(0.7〜1.2μm)にて形成されており、保護膜5
やグレーズ層2,絶縁基板1との馴染みが全て良好であ
るため、保護膜5をグレーズ層2の両端部近傍でグレー
ズ層2及び絶縁基板1に対して強固に接着させておくこ
とができ、印画に際して保護膜5の表面に感熱記録媒体
P等を繰り返し摺接させても、保護膜5がグレーズ層2
の両端部近傍で容易に膜剥がれを起こすことはない。こ
れにより、発熱抵抗体3等を保護膜5によって長期間に
わたり良好に被覆しておくことができ、サーマルヘッド
の信頼性が格段に向上される。
The reinforcing layer 6 is made of the same material (metal such as Al, Cu, Ni, etc.) as the conductive layers 4a and 4b, and is formed with the same thickness (0.7 to 1.2 μm). 5
And the compatibility with the glaze layer 2 and the insulating substrate 1 are all good, so that the protective film 5 can be firmly adhered to the glaze layer 2 and the insulating substrate 1 near both ends of the glaze layer 2, Even when the thermal recording medium P is repeatedly slid on the surface of the protective film 5 during printing, the protective film 5
The film does not easily peel off near both ends. As a result, the heating resistor 3 and the like can be satisfactorily covered with the protective film 5 for a long period of time, and the reliability of the thermal head is significantly improved.

【0021】しかも、前記補強層6は導電層4a,4b
と同一の材料で形成されていることから、導電層4a〜
4dをスパッタリング法やフォトリソグラフィー技術に
よって形成する際にフォトマスクのパターンを変更する
だけで補強層6も同時に形成することができ、補強層6
の形成のために別途、成膜工程等を必要としない。
Further, the reinforcing layer 6 is formed of the conductive layers 4a and 4b.
Are formed of the same material as that of the conductive layers 4a to 4a.
When the 4d is formed by a sputtering method or a photolithography technique, the reinforcing layer 6 can be formed simultaneously only by changing the pattern of the photomask.
There is no need for a separate film formation step or the like for the formation of the film.

【0022】また、このような絶縁基板1の上面には前
述した発熱抵抗体3の配列と略平行に並んで複数個のド
ライバーIC5が配列・搭載されている。
On the upper surface of the insulating substrate 1, a plurality of driver ICs 5 are arranged and mounted substantially in parallel with the arrangement of the heating resistors 3 described above.

【0023】前記ドライバーIC5は、その下面に前述
した導電層4b等に電気的に接続される複数個の端子電
極が設けられ、内部にシフトレジスタ、ラッチ回路、ス
イッチングトランジスタ等の電気回路を有しているた
め、導電層4cを介して外部からの印画制御信号等が供
給されると、これに基づいて発熱抵抗体3に導電層4b
を介して所定の出力を発し、発熱抵抗体3を個々に選択
的にジュール発熱させることができる。
The driver IC 5 has a plurality of terminal electrodes electrically connected to the above-described conductive layer 4b and the like on the lower surface thereof, and has therein an electric circuit such as a shift register, a latch circuit, and a switching transistor. Therefore, when an external printing control signal or the like is supplied through the conductive layer 4c, the heating resistor 3 is connected to the conductive layer 4b
, A predetermined output is generated, and the heating resistors 3 can be individually and selectively caused to generate Joule heat.

【0024】尚、前記導電層4cは外部からの印画制御
信号等をドライバーIC5に供給するためのもので、前
述した導電層4a,4bと同様の材料、同様の形成方法
によって絶縁基板1の他の長辺側よりドライバーIC5
の近傍まで導出するようにして形成される。
The conductive layer 4c is for supplying a print control signal or the like from the outside to the driver IC 5, and is made of the same material and the same forming method as the conductive layers 4a and 4b. Driver IC5 from the long side
Is formed so as to be led out to the vicinity of.

【0025】かくして上述したサーマルヘッドは、感熱
記録媒体Pを発熱抵抗体3上に搬送しながらドライバー
IC5の駆動に伴って導電層4a,4b間に所定の電力
を印加し、発熱抵抗体3を個々に選択的にジュール発熱
させるとともに、該発熱した熱を感熱記録媒体Pに伝導
させ、感熱記録媒体Pに所定の印画を形成することによ
ってサーマルヘッドとして機能する。
Thus, in the above-described thermal head, a predetermined power is applied between the conductive layers 4a and 4b as the driver IC 5 is driven while the thermal recording medium P is conveyed onto the heating resistor 3, and the heating resistor 3 is turned on. Joule heat is selectively generated individually, and the generated heat is conducted to the heat-sensitive recording medium P to form a predetermined print on the heat-sensitive recording medium P, thereby functioning as a thermal head.

【0026】尚、本発明は上述した形態に限定されるも
のではなく、本発明の要旨を逸脱しない範囲において種
々の変更、改良等が可能であり、例えば上述の形態で
は、導電層4aと補強層6をそれぞれ別個に独立させて
設けるようにしたが、これに代えて、図4に示すよう
に、絶縁基板1上の導電層4a(共通電極)の一部をグ
レーズ層2の両端部上まで延在させ、この延在部を補強
層として用いても構わない。
It should be noted that the present invention is not limited to the above-described embodiment, and various changes and improvements can be made without departing from the gist of the present invention. For example, in the above-described embodiment, the conductive layer 4a and the reinforcement The layers 6 are provided separately and independently. Instead, as shown in FIG. 4, a part of the conductive layer 4a (common electrode) on the insulating substrate 1 is formed on both ends of the glaze layer 2. It may be extended to this, and this extended part may be used as a reinforcement layer.

【0027】[0027]

【発明の効果】本発明のサーマルヘッドによれば、補強
層が保護膜をグレーズ層及び絶縁基板に対して強固に接
着することから、印画に際して保護膜の表面に感熱記録
媒体等を繰り返し摺接させても、保護膜がグレーズ層の
両端部近傍で容易に膜剥がれを起こすことはない。これ
により、発熱抵抗体等を保護膜によって長期間にわたり
良好に被覆しておくことができ、サーマルヘッドの信頼
性が格段に向上される。しかも、前記補強層を導電層と
同一材料で形成すれば、導電層をスパッタリング法やフ
ォトリソグラフィー技術によって形成する際に補強層も
同時に形成することができ、補強層の形成のために別
途、成膜工程等を必要としない。
According to the thermal head of the present invention, since the reinforcing layer firmly adheres the protective film to the glaze layer and the insulating substrate, the thermal recording medium is repeatedly slid on the surface of the protective film during printing. Even if it does, the protective film does not easily peel off near the both ends of the glaze layer. As a result, the heating resistor and the like can be favorably covered with the protective film for a long period of time, and the reliability of the thermal head is significantly improved. Moreover, if the reinforcing layer is formed of the same material as the conductive layer, the reinforcing layer can be formed at the same time when the conductive layer is formed by a sputtering method or a photolithography technique, and separately formed for forming the reinforcing layer. No film process is required.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明のサーマルヘッドの一形態を示す平面図
である。
FIG. 1 is a plan view showing one embodiment of a thermal head according to the present invention.

【図2】図1の要部拡大平面図である。FIG. 2 is an enlarged plan view of a main part of FIG.

【図3】図2のX−X線断面図である。FIG. 3 is a sectional view taken along line XX of FIG. 2;

【図4】本発明のサーマルヘッドの変形例を示す平面図
である。
FIG. 4 is a plan view showing a modified example of the thermal head of the present invention.

【図5】従来のサーマルヘッドの要部拡大断面図であ
る。
FIG. 5 is an enlarged sectional view of a main part of a conventional thermal head.

【符号の説明】[Explanation of symbols]

1・・・・・・・絶縁基板 2・・・・・・・グレーズ層 3・・・・・・・発熱抵抗体 4a〜4c・・・導電層 6・・・・・・・補強層 1 ····· Insulating substrate 2 ····· Glaze layer 3 ····· Heating resistor 4a-4c ··· Conductive layer 6 ····· Reinforcing layer

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】絶縁基板の上面に帯状のグレーズ層を被着
させ、該グレーズ層上に複数個の発熱抵抗体及び導電層
を被着させるとともに、これら発熱抵抗体及び導電層を
前記グレーズ層の上面から絶縁基板上面にかけて被着す
る保護膜によって被覆してなるサーマルヘッドにおい
て、 前記グレーズ層及び絶縁基板と、保護膜との間に、該グ
レーズ層の両端部から絶縁基板の上面にかけて延びる補
強層を設けたことを特徴とするサーマルヘッド。
1. A belt-like glaze layer is deposited on an upper surface of an insulating substrate, a plurality of heating resistors and a conductive layer are deposited on the glaze layer, and the heating resistor and the conductive layer are bonded to the glaze layer. A thermal head, which is covered with a protective film to be applied from the upper surface of the glaze layer to the upper surface of the insulating substrate; A thermal head comprising a layer.
【請求項2】前記補強層が、前記導電層と同一材料から
成っていることを特徴とする請求項1に記載のサーマル
ヘッド。
2. The thermal head according to claim 1, wherein the reinforcing layer is made of the same material as the conductive layer.
JP34951596A 1996-12-27 1996-12-27 Thermal head Pending JPH10181057A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP34951596A JPH10181057A (en) 1996-12-27 1996-12-27 Thermal head

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP34951596A JPH10181057A (en) 1996-12-27 1996-12-27 Thermal head

Publications (1)

Publication Number Publication Date
JPH10181057A true JPH10181057A (en) 1998-07-07

Family

ID=18404264

Family Applications (1)

Application Number Title Priority Date Filing Date
JP34951596A Pending JPH10181057A (en) 1996-12-27 1996-12-27 Thermal head

Country Status (1)

Country Link
JP (1) JPH10181057A (en)

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