JPH10177977A - Brush cleaning device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To enable the contact pressure of a cleaning brush imposed on a cleaning object to be mechanically set without using a servo motor by a method wherein a first sliding body is made to slide downward through the intermediary of a first regulating mechanism, and a second sliding body is made to slide upward through the intermediary of a second sliding body. SOLUTION: When a rod 106 of a cylinder 105 is driven in the direction of projection, a link 101 is made to pivot in a counterclockwise direction, whereby a first regulating mechanism 91 is made to descend, and a second regulating mechanism 92 is made to ascend. By this setup, a first and a second sliding body 62, and 63, interlock with the movements o the regulating mechanisms 91 and 92. That is, when the rod 106 of the cylinder 105 is driven up to a forward limit in the direction of projection, an upper cleaning brush 51 is made to descend, and a lower cleaning brush 52 is made to ascend, whereby the cleaning brushes 51 and 52 are positioned so as to come into contact with the upside and underside of a semiconductor wafer respectively. Moreover, the descent of the upper brush 51 and the ascent of the lower brush 52 by the operation of the cylinder 105 are balanced in weight.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a brush cleaning apparatus for cleaning the upper and lower surfaces of a cleaning object with a roll-shaped cleaning brush while rotating the object.

[0002]

2. Description of the Related Art In a semiconductor device manufacturing process, there is a process that requires a semiconductor wafer as an object to be cleaned to be cleaned with high cleanliness. As a method of cleaning the semiconductor wafer, there are a dip method in which a plurality of semiconductor wafers are immersed in a cleaning liquid, and a single-wafer method in which a cleaning liquid is sprayed onto the semiconductor wafer to wash one by one. And the cost-effective single-wafer method is often adopted.

A brush cleaning apparatus using a cleaning brush is known as one of the single-wafer systems. This brush cleaning device holds a semiconductor wafer so that it can be driven to rotate in a substantially horizontal state, and arranges a pair of roll-shaped cleaning brushes on both upper and lower surfaces so that the cleaning brush can be driven up and down. The upper and lower surfaces of the semiconductor wafer are cleaned by rotating the semiconductor wafer and the cleaning brush while contacting the upper and lower surfaces of the semiconductor wafer and supplying a cleaning liquid to the contact portions.

In order to clean the upper and lower surfaces of the semiconductor wafer with a predetermined degree of cleanliness, it is required that the pressure at which the pair of cleaning brushes contact the upper and lower surfaces of the semiconductor wafer can be adjusted.

Conventionally, a brush driving mechanism shown in FIG. 8 has been used to adjust the pressure at which a pair of cleaning brushes contact the upper and lower surfaces of a semiconductor wafer. This brush drive mechanism has a first slide body 2 and a second slide body 3 that are slidably provided by guide portions 1a and 1b, respectively, so that their axes are vertically slidable.

An upper cleaning brush 4 is provided at the upper end of the first slide body 2 so as to be driven to rotate with its axis being horizontal, and a lower cleaning brush 5 is provided at the upper end of the second slide body 3. Are provided so as to be rotationally driven with the axis lined along the horizontal direction. The upper cleaning brush 4 cleans the upper surface of the semiconductor wafer U as an object to be cleaned, and the lower cleaning brush 5 cleans the lower surface. The semiconductor wafer U is held by a rotating body (not shown) and is driven to rotate.

[0007] First nut bodies 2a, 3a are screwed to lower ends of the slide bodies 2, 3, respectively.
a is provided with engaging pins 6a and 6b. Engaging grooves 7a formed at both ends of the link 7 are slidably engaged with the engaging pins 6a and 6b. An intermediate portion of the link 7 is rotatably supported by a support shaft 8.

At one end of the link 7, a second nut body 9 is rotatably provided. This second nut body 9
, A drive screw shaft 11 is fixed. The drive screw shaft 11 is connected to a rotation shaft 12a of a servo motor 12. The servo motor 12 is driven and controlled by a control device 13.

Therefore, when the servomotor 12 is operated and the drive screw shaft 11 is driven to rotate, the link 7 is rotated counterclockwise as indicated by an arrow with the support shaft 8 as a fulcrum. The upper cleaning brush 4 is lowered to contact the upper surface of the semiconductor wafer U, and the lower cleaning brush 5 is raised to contact the lower surface.

In the above arrangement, the contact pressure of the cleaning brushes 4, 5 with respect to the upper and lower surfaces of the semiconductor wafer U is adjusted as follows. First, Servomotor 1
2 to rotate the link 7 counterclockwise to bring the upper cleaning brush 4 and the lower cleaning brush 5 into contact with the upper and lower surfaces of the semiconductor wafer U. Remember.

At this time, the nuts 2a, 3a provided at the lower ends of the slides 2, 3 are rotated to engage the engaging pins 6a,
By moving 6b, the upper cleaning brush 4 and the lower cleaning brush 5 can be adjusted so as to contact the upper surface and the lower surface of the semiconductor wafer U with the same pressure at the zero point.

Next, the contact pressure is set based on the zero point. That is, the amount of movement of each of the cleaning brushes 4 and 5 from the zero point to obtain a predetermined contact pressure is calculated, and the number of rotations of the drive screw 11 by the servo motor 12 is controlled according to the calculated value. It is set by the device 13. Further, the control device 13 sets the link 7 to be rotated clockwise by a predetermined angle after the cleaning is completed so that the cleaning brushes 4 and 5 are retracted.

With the above setting, the control device 13
The cleaning brushes 4 and 5 are brought into contact with the upper and lower surfaces of the semiconductor wafer U at a predetermined pressure for cleaning, and when the cleaning is completed, the semiconductor wafer U is taken out and retracted to supply a new semiconductor wafer U. Become.

However, if the contact pressure of the cleaning brushes 4 and 5 against the semiconductor wafer U is controlled by the servo motor 12, the servo motor 1 which is an expensive component is used.
2 and a control device 13 for controlling the control device 2 are required, which not only increases the cost and complicates the configuration, but also makes the setting work difficult.

[0015]

As described above, since a servomotor is conventionally used to set the contact pressure of the cleaning brush with the object to be cleaned, the cost is increased and the configuration is complicated. , And the setting work was troublesome.

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and has as its object to provide a brush capable of mechanically setting the contact pressure of a cleaning brush on an object to be cleaned without using a servomotor. A cleaning device is provided.

[0017]

According to a first aspect of the present invention, there is provided a brush cleaning apparatus for cleaning an upper surface and a lower surface of an object to be cleaned which is rotationally driven by bringing an upper cleaning brush and a lower cleaning brush into contact with each other. A mounting member erected along a vertical direction substantially perpendicular to the plate surface of the object to be cleaned, and provided on the mounting member at predetermined intervals in a direction intersecting the vertical direction and along the vertical direction. A pair of guide bodies, a first slide body slidably provided on one of the pair of guide bodies, a second slide body slidably provided on the other of the pair of guide bodies, and a first slide body. Upper holding means provided at an upper end portion of the upper cleaning brush for rotatably holding the upper cleaning brush on the upper surface side of the object to be cleaned with the axis substantially parallel to the upper surface of the object to be cleaned, and an upper end of the second slide body Provided in the department A lower holding means for rotatably holding the lower cleaning brush with the axis thereof being substantially parallel to the lower surface of the object to be cleaned on the lower surface side of the object to be cleaned, and the guide at the lower end side of the first slide body; A first adjusting mechanism slidably provided on one side of the body for adjusting a sliding position of the first sliding body along a vertical direction; and a lower end of the second sliding body slidably on the other side of the guide body. A second adjusting mechanism for adjusting a sliding position of the second sliding body along the vertical direction, and an intermediate part is rotatably mounted on the mounting member and one end is rotated by the first adjusting mechanism. A link that is freely connected and the other end of which is rotatably connected to the second adjustment mechanism; and that the link is rotationally driven to move the first slide body in a downward direction via the first adjustment mechanism. Slide and wash above Drive means for bringing the brush into contact with the upper surface of the object to be cleaned, and simultaneously sliding the second slide body in the ascending direction via the second adjusting mechanism to bring the lower cleaning brush into contact with the lower surface of the object to be cleaned; And characterized in that:

According to a second aspect of the present invention, in the first aspect of the present invention, the mounting member is provided so as to be capable of adjusting a rotation angle about an axis along a direction intersecting the vertical direction. I do.

According to a third aspect of the present invention, in the first aspect of the invention, the first and second adjusting mechanisms are slidably provided on the guide body, and the ends of the links are rotatably connected. An adjusting body formed on a base and a taper surface slidably provided on the base along a direction intersecting the guide body and having an upper surface slidably in contact with lower ends of the first and second slide bodies; And an adjustment screw that drives each of the slides along the vertical direction of the guide by driving the adjuster in a direction intersecting with the guide.

According to a fourth aspect of the present invention, in the first aspect of the present invention, the upper and lower holding means include a pair of supporting portions,
A support shaft rotatably provided on each support portion and having a first engagement portion formed at a distal end portion, and a nut body screwed to the support shaft and having a distal end portion formed at a tapered convex portion. The upper and lower cleaning brushes include a brush shaft having a brush member provided on an outer peripheral surface thereof, and the brush shaft formed at both ends of the brush shaft and detachably engaged with the first engagement portions. A second engaging portion for rotating the shaft integrally with the support shaft; and a second engaging portion formed on an end face of the brush shaft for maintaining an engaged state between the first engaging portion and the second engaging portion. A taper recess is provided, in which the taper projection engages by moving the nut body toward the end face of the brush shaft.

According to a fifth aspect of the present invention, in the first aspect of the present invention, the object to be cleaned is supported at its peripheral portion by a rotationally driven support pin, and the support pin rotates to rotate the object to be cleaned. The support pin is configured such that the support pin is mounted on a drive shaft that is driven to rotate, and a pressing member detachably mounted on an upper end of the base shaft.
A support member is detachably held at an upper end of the base shaft portion by the pressing member and supports a peripheral portion of the object to be cleaned.

According to the first aspect of the present invention, the adjustment of the contact pressure between the upper cleaning brush and the lower cleaning brush with respect to the object to be cleaned is mechanically performed by the first adjusting mechanism and the second adjusting mechanism. Each cleaning brush was driven by a driving unit. Since the adjustment of the contact pressure of each cleaning brush and the driving can be performed separately, complicated control is not required, and expensive components are not required.

According to the second aspect of the present invention, since the angle of the mounting member provided with the cleaning brush and the adjusting mechanism can be adjusted with respect to the object to be cleaned, the cleaning brush is positioned parallel to the object to be cleaned. Can be.

According to the third aspect of the present invention, the first and second adjusting mechanisms are composed of the adjusting body having the upper surface formed on the tapered surface and the adjusting screw for driving the adjusting body. With such a configuration, the position of the slide body provided with the cleaning brush can be surely adjusted.

According to the fourth aspect of the present invention, when the cleaning brush is held and fixed to the support shaft as holding means for holding the cleaning brush, the tapered projection of the nut body is formed on the brush shaft of the cleaning brush. Because it was made to engage with the tapered recess,
The brush axis of the cleaning brush can be accurately matched with the axis of the support shaft.

According to the fifth aspect of the present invention, the support pin for supporting the object to be cleaned is constituted by the base shaft, the pressing member and the support member, and if the support member for supporting the object to be cleaned is worn due to its use. Can be exchanged.

[0027]

BRIEF DESCRIPTION OF THE DRAWINGS FIG.
This will be described with reference to FIGS. The brush cleaning device shown in FIG. A partition plate 22 is provided inside the housing 21, and the partition plate 22 is formed between the upper chamber 23 and the lower chamber 2.
4 The upper chamber 23 is provided with a holding mechanism 25 for holding and rotating a semiconductor wafer U as an object to be cleaned. In the holding mechanism 25, four inner support pins 26 and outer support pins 27 are arranged at 90-degree intervals in the circumferential direction.

As shown in FIG. 7, each of the support pins 26 and 27 has a base shaft portion 29a detachably screwed into a screw portion 28a at the upper end of the drive shaft 28. The base shaft portion 29a is formed of a synthetic resin such as a peak material, and a pressing member 29b formed of a fluorine resin or the like is detachably attached to the upper end surface thereof with a screw 31. A step 32 is formed at the lower end of the outer peripheral surface of the pressing member 29b,
The step portion 32 is provided with a ring-shaped support member 29c made of a material having a high coefficient of friction such as rubber, and is held and fixed between the upper end surface of the base shaft portion 29a.

The support members 29c of the four inner support pins 26
A semiconductor wafer U1 having a predetermined diameter as shown by a chain line in FIG.
Are held with their peripheral portions engaged and mounted. Therefore, if the inner support pin 26 is driven to rotate in the counterclockwise direction indicated by the arrow in the drawing, the semiconductor wafer U1 is driven to rotate in the opposite clockwise direction by the contact friction with the support member 29c. ing.

A semiconductor wafer U2, which is larger in diameter than the semiconductor wafer U1 supported by the inner support pins 26, is held by the four outer support pins 27 by engaging the peripheral portions thereof. If the outer support pin 27 is driven to rotate counterclockwise as indicated by the arrow,
The semiconductor wafer U2 is rotated clockwise by contact friction with the support member 29c. That is,
By providing the inner support pins 26 and the outer support pins 27, semiconductor wafers U1 and U2 of different sizes can be held.

The semiconductor wafer U is connected to the outer support pins 27.
When holding 2, the inner support pin 26 is removed from the threaded portion 28 a of the drive shaft 28. Each of the support pins 26, 2
As shown in FIG. 3, the drive shaft 28 to which the shaft 7 is mounted is rotatably supported at its upper and lower portions by bearings 32a. Each of the bearing cylinders 32 is inserted into a through hole 33 formed in the partition plate 22 and stands upright on a mounting plate 34 horizontally disposed in the lower chamber 24.

The portion of the bearing cylinder 32 located in the upper chamber 23 is covered by an upper cover 35. The upper cover 35 is formed to have a diameter larger than that of the through hole 33.
As shown in the figure, two sets of inner support pins 26 and outer support pins 2
7 is set to be large enough to cover.

The upper cover is provided around the through hole 33.
A lower cover 36 that penetrates into the inside of 35 is provided upright. Accordingly, a labyrinth structure is provided to prevent the cleaning liquid used for cleaning the semiconductor wafer U from entering the lower surface of the partition plate 22 from the through holes 33.

A drive shaft 28 for rotating and driving the support pins 26 and 27 protrudes from the lower surface of the mounting plate 34, and a driven gear 38 is fitted to each protruding end. Inner support pin 26
The driven gear 38 fitted on the drive shaft 28 of the outer support pin 27 is located above the driven gear 38 fitted on the drive shaft 28 of the outer support pin 27.

Each driven gear 38 meshes with a driving gear 39. The drive gear 39 has an upper gear portion 39a and a lower gear portion 39b formed integrally with each other.
The driven gear 38 of the inner support pin 26 meshes with a, and the driven gear 38 of the outer support pin 26 meshes with the lower gear portion 39b.

The drive gear 39 is mounted on a rotating shaft 41a of a drive motor 41. The drive motor 41 is mounted on the mounting plate 34 via a bracket 42. Therefore, when the drive motor 41 is operated and the drive gear 39 is rotated, the driven gear 3 linked with this rotation is driven.
The drive shaft 28, that is, the inner support pin 26 and the outer support pin 27 are rotatably driven via 8.

As shown in FIG. 7, each support pin 26,
A recess 43 is formed at the lower end of the base shaft portion 29a of the base member 27,
The upper cover 35 is provided with a flange 44 projecting into the recess 43. Thus, the upper cover 35 has a labyrinth structure for preventing the cleaning liquid from entering the portion of the upper cover 35 through which the drive shaft 28 is inserted.

A plurality of discharge pipes 45 communicating with the upper surface are connected to the lower surface of the partition plate 22. Each discharge pipe 45
Is connected to the gas-liquid separator 4 via a tube 46 as shown in FIG.
7 is connected. The gas-liquid separator 47 separates gas and liquid discharged from the discharge pipe 45. The separated liquid is drained by a drain pipe 48, and the gas is discharged by an exhaust pipe 4.
9 to exhaust.

The upper and lower surfaces of the semiconductor wafer U held by the inner support pins 26 or the outer support pins 27 are brush-cleaned by an upper cleaning brush 51 and a lower cleaning brush 52. Each of the cleaning brushes 51 and 52 is driven by a drive mechanism 53 into a cleaning state in which the upper and lower surfaces of the semiconductor wafer U are brought into contact with each other and a retracted state in which the cleaning brushes are retracted to a position separated from the upper and lower surfaces of the semiconductor wafer U by a predetermined distance. ing.

As shown in FIG. 2, the drive mechanism 53 has a base plate 54 vertically fixed to the lower surface of the mounting plate 34 with its upper end fixed. As shown in FIG. 6, one plate surface of a flat mounting member 55 is joined to one plate surface side of the base plate 54, and is rotatably held by a support shaft 56.

As shown in FIG. 1, the mounting member 55 has four long holes 57 with a predetermined radius around the support shaft 56.
Are formed in the base plate 54 through the long holes 57.
8 is screwed. Therefore, by loosening the screw 58, the mounting member 55 can be rotated left and right around the support shaft 56 within the range of the elongated hole 57.

The other plate surface of the mounting member 55
A pair of guide members 61 (shown in FIG. 6) are provided at predetermined intervals and along the vertical direction. A first slide body 62 is slidably provided on one guide body 61, and a second slide body 63 is provided on the other guide body 61.
Are slidably provided.

As shown in FIG. 1, each of the slides 62 and 63 has a base 65 provided with a slider 64 which is slidably engaged with the guide 61, and a column standing upright on the upper end surface of the base 65. 66.

The support 66 of each of the slides 62 and 63 is
The upper chamber 23 passes through a through hole 67 formed in the partition plate 22.
Protruding. As shown in FIG. 1, the penetrating portion has a labyrinth structure in which the upper cover 70a and the lower cover 70b prevent the cleaning liquid from entering.

An upper support plate 68 is horizontally mounted on the upper end of the support 66 of the first slide body 62, and a lower support plate 69 is horizontally mounted on the upper end of the support 66 of the second slide 63. Have been.

As shown in FIGS. 4 and 5, a pair of support portions 71 are formed on each of the support plates 68 and 69 at predetermined intervals by U-shaped concave portions 71a. A support shaft 72 is rotatably supported by bearings 73 on each of the support portions 71 so that their axes coincide with each other. A screw 74 is formed at one end of each support shaft 72 protruding toward the concave portion 71a,
The screw 74 has a nut body 75 and this nut body 75
A fixing nut 76 is screwed in to prevent the movement of the nut. The tip end of the nut body 75 is formed as a tapered projection 77 whose outer peripheral surface is inclined. Further, an engagement recess 78 as a first engagement portion is formed in the distal end surface of the support shaft 72 so as to penetrate in the radial direction.

The rear end of one support shaft 72 protrudes from the bearing 73, and a driven pulley 79 is fitted to the protruding end. An upper drive motor 81 is arranged on one end of the upper surface of the upper support plate 68 in the width direction, and a lower drive motor 82 is arranged on the other end of the upper surface of the lower support plate 69 in the width direction. A drive pulley 83 is fitted to the rotation shafts 81a and 82a of the respective drive motors 81 and 82.

A drive pulley 83 of the upper drive motor 81 and a driven pulley provided on one of the support shafts 72 of the upper support plate 68.
A first drive belt 84 is stretched over the wheel 79, and is connected to a drive pulley 83 of the lower drive motor 82 and a driven pulley 79 provided on one support shaft 72 of the lower support plate 69. Has a second drive belt 85 stretched.

The pair of support shafts 72 of the upper support plate 68 hold the upper cleaning brush 51, and the pair of support shafts 72 of the lower support plate 69 support the lower cleaning brush 52. Therefore, when the drive motors 81 and 82 operate, the cleaning brushes 51 and 52 are driven to rotate.

Each of the cleaning brushes 51 using the support shaft 72,
The support structure of 52 is as shown in FIG. That is, the cleaning brushes 51 and 52 have the brush shaft 86. A cylindrical brush member 87 such as a sponge is mounted on the outer peripheral surface of the brush shaft 86. Both ends of the brush shaft 86 protrude from the brush member 87, and at its protruding end, an engaging projection 88 engaging with the engaging recess 78 of the support shaft 72 is formed over the entire length in the radial direction. Further, an annular tapered concave portion 89 is formed on the end surface of the brush shaft 86 so that a tapered convex portion 77 formed at the tip of the nut body 75 is engaged.

Therefore, each of the cleaning brushes 51, 52
In a state where the nut bodies 75 screwed to the respective support shafts 72 are retracted as shown by a chain line in FIG. 5, the engagement protrusions 88 formed at both ends of the brush shaft 86 are connected to the pair of support shafts 72. The engaging concave portion 78 is engaged.

Next, the nut body 75 is rotated in the forward direction indicated by a solid line in FIG. 5 so that the nut body 75 covers the engaging portion between the engaging concave portion 78 and the engaging convex portion 88, and The state is maintained, and the taper projection 77 at the distal end engages with the taper recess 89, so that the axis of the brush shaft 86 coincides with the axis of the support shaft 72.

That is, each of the cleaning brushes 51 and 52 is connected and fixed in a state where the axis thereof is aligned with the support shaft 72 by rotating the nut body 75 from the retracted position in the forward direction.

As shown in FIG. 1, the first slide body 62 and the second slide body 63 are attached to the mounting member 55.
A first adjustment mechanism 91 and a second adjustment mechanism 92 are provided below the first and second adjustment mechanisms, respectively.

Each of the adjusting mechanisms 91 and 92 has a substantially triangular plate-shaped base 93 slidably provided on each guide body 61 via a slider 93a. This base 9
3 has a substantially horizontal upper surface, and L
A letter-shaped table 94 is provided. This table 9
An adjusting body 9 having an upper surface formed on a tapered surface 95a is provided on the upper surface 4.
5 is slidably provided in the horizontal direction along the table 94.

An adjusting screw 96 is provided at one end of the adjusting body 95.
Is screwed. The adjusting screw 96 is rotatably supported by a support portion 97 provided at one end in the width direction of the base 93, and a handle 98 is provided at the other end. Therefore, by rotating the adjusting screw 96, the adjusting body 95 can be slid along the table 94.

A cam follower 99 provided at the lower end of each of the slide bodies 61 and 62 is in contact with the taper surface 95a of the adjusting body 95. Therefore, when the adjustment body 95 slides, the slide bodies 61 and 62 move up and down along the guide body 61 provided on the mounting member 55. The adjusting screw 96 is non-rotatably fixed by a stopper 96a shown in FIG. Thereby, the adjusting body 95 is prevented from sliding.

As shown in FIG. 1, an intermediate portion of a link 101 is rotatably supported by a support shaft 102 at a lower end of the mounting member 55 and at an intermediate portion between the pair of slide bodies 61 and 62. Long holes 103 are formed at both ends of the link 101, respectively.

At the lower end of the plate surface of the base 93 of each of the adjusting mechanisms 91 and 92, a locking shaft 104 is protruded. Each locking shaft 104 is engaged with the long hole 103 of the link 101.

A rod 106 of a cylinder 105 as a driving means is rotatably connected to the link 101. As shown in FIG. 2, the cylinder 105 is
4, a support member 1 provided integrally with the base plate 54.
07 are swingably connected to each other by a stud 107a.

FIG. 1 shows a state in which the upper cleaning brush 51 and the lower cleaning brush 52 are retracted from the upper and lower surfaces of the semiconductor wafer U. In this retracted state, the link 101 is in the first position.
The one end connected to the adjusting mechanism 91 is inclined in a state where it is located at the upper side, and the cylinder 105
Are connected. In this retracted state, the rod 106 of the cylinder 105 is at the retreat limit in the retracting direction.

When the rod 106 of the cylinder 105 is driven in the projecting direction, the link 101 rotates counterclockwise as indicated by an arrow in FIG. As a result, the first adjusting mechanism 91 is lowered and the second adjusting mechanism 92 is raised, so that the movement of the adjusting mechanisms 91 and 92 causes the first slide body 62 and the second slide body 63 to interlock. . That is,
When the rod 106 of the cylinder 105 is driven to the forward limit in the protruding direction, the upper cleaning brush 51 is lowered, the lower cleaning brush 52 is raised, and these cleaning brushes contact the upper and lower surfaces of the semiconductor wafer U, respectively. Will be positioned as described later.

The lowering of the upper cleaning brush 51 by the cylinder 105 and the raising of the lower cleaning brush 52 are balanced in weight. Therefore, each of the cleaning brushes 5
Up and down driving of the first and the second 52 can be performed by the small cylinder 105.

A dial gage 108 is provided on one side of the base 65 of the first and second slide bodies 62 and 63, respectively. Spindle 1 of each dial gauge 108
08a comes into contact with the contact members 109 provided on both sides of the mounting member 55 when the cleaning brushes 51 and 52 are displaced to the cleaning state.

In the cleaning state, the cleaning liquid is supplied to the upper and lower surfaces of the semiconductor wafer U from a cleaning liquid supply nozzle (not shown). Next, in the brush cleaning apparatus having the above-described configuration, an operation of setting the pressure at which the upper cleaning brush 51 and the lower cleaning brush 52 are brought into contact with the semiconductor wafer U, that is, the pressing amount before cleaning the semiconductor wafer U will be described. .

First, the rod 10 of the cylinder 105 is
6 is projected from the retreat limit shown in FIG. 1 to the forward limit. As a result, the link 101 rotates counterclockwise as indicated by the arrow in FIG. 1, so that the upper cleaning brush 51 moves down and the lower cleaning brush 52 moves up.

Next, the adjusting screw 9 of the first adjusting mechanism 91
By rotating the adjustment body 95 by rotating the handle 6 by the handle 98 and raising or lowering the upper cleaning brush 51, the brush member 87 is positioned so as to be in contact with the upper surface of the semiconductor wafer U without being deformed. In this state, the dial of the dial gauge 108 is rotated, and the pointer is adjusted to the zero point. That is, the upper cleaning brush 51
Is set at a point where the upper surface contacts the upper surface of the semiconductor wafer U without applying pressure.

After the zero point of the upper cleaning brush 51 has been set, the adjusting screw 96 is rotated to slide the adjusting body 95 in the retreating direction, and the upper cleaning brush 51 is lowered, so that a predetermined surface is formed on the upper surface of the semiconductor wafer U. Pressure contact with pressure. At this time, the brush member 87 of the upper cleaning brush 51 is elastically deformed, and the amount of the deformation can be recognized by the diamond gauge 108. Therefore, the pressing force of the upper cleaning brush 51 against the semiconductor wafer U can be set to a predetermined value.

Similarly, the lower cleaning brush 52 is brought into contact with the lower surface of the semiconductor wafer U with a predetermined pressing force. That is, if the zero point at which the lower cleaning brush 52 comes into contact with the lower surface of the semiconductor wafer U without being elastically deformed is set, the state is adjusted to 0 on the dial of the dial gauge 108, and the second position is set from that position. Adjusting body 95 of the adjusting mechanism 92
Is driven in the forward direction to raise the lower cleaning brush 52 through the second slide body 63 by a predetermined dimension. Thereby, the pressing force of the lower cleaning brush 52 against the semiconductor wafer U can be set to a predetermined value.

When the pressing force of each of the cleaning brushes 51 and 52 on the upper and lower surfaces of the semiconductor wafer U is set in this manner, the adjusting screw 96 of each of the adjusting mechanisms 91 and 92 is set in that state.
Is fixed non-rotatably by the stopper 96a,
The setting state can be maintained. That is, until the brush member 87 of each of the cleaning brushes 51 and 52 is worn by a predetermined amount, the cleaning brushes 51 and 52 on the semiconductor wafer U are removed.
Can be maintained in a predetermined range.

That is, according to the brush cleaning apparatus having the above-described structure, the cleaning brushes 51 and 52 which are driven up and down and the cylinder 105 which drives these cleaning brushes up and down are provided.
With the adjustment mechanisms 91 and 92 interposed therebetween, the contact pressures of the cleaning brushes 51 and 52 on the upper and lower surfaces of the semiconductor wafer U in the cleaning state can be mechanically set by the adjustment mechanisms 91 and 92.

In addition, since the retracted state of each of the cleaning brushes 51 and 52 is performed by driving the rod 106 of the cylinder 105 to the limit of the forward movement, when the respective cleaning brushes 51 and 52 are driven from the cleaning state to the retracted state. Can also be performed mechanically.

That is, a pair of cleaning brushes 51 and 52 are mechanically brought into a cleaning state and a retracted state without controlling the driving by a control device as in the conventional case using a servomotor. Since it can be moved, not only does not need to adopt a complicated control structure, but also each cleaning brush 51,
The setting of the contact force of 52 does not cause a decrease in accuracy.

Each of the cleaning brushes 51 and 52 has a brush shaft 86.
By engaging the taper projections 77 at the distal end of the nut body 75 screwed to the support shaft 72 with the taper recesses 89 formed on both end surfaces of the support shaft 72, the taper recesses 89 are connected and fixed to the support shaft 72. ing. Therefore, the taper convex portion 77 and the taper concave portion 8 are formed.
9 can make the axis of the brush shaft 86 coincide with the axis of the support shaft 72.
It is possible to make the mounting accuracy of 1, 52 constant.

The mounting member 55 in which the cleaning brushes 51 and 52 are slidably held via the first slide body 62 and the second slide body 63 is rotated by a support shaft 56 with respect to the base plate 54. It is provided so that the angle of the moving direction can be freely adjusted. Therefore, the axis of each of the cleaning brushes 51 and 52 can be set to be parallel to the plate surface of the semiconductor wafer U. Can be uniformly contacted.

As shown in FIG. 7, the inner support pin 26 or the outer support pin 27 which supports and rotates the semiconductor wafer U is supported by a support member 29c with which the peripheral portion of the semiconductor wafer U engages with the base shaft portion 29a. Has a removable structure. Therefore, the support member 29c can be used for a long time.
Is worn out, only the support member 29c can be replaced with a new one, so that the cost can be greatly reduced as compared with the case where the entire support pins 26 and 27 are replaced.

The present invention is not limited to the above embodiment,
Various modifications can be made without departing from the spirit of the invention. For example, although a dial gage is used to set the pressing force of each cleaning brush against the semiconductor wafer, the pressing force may be set by the number of rotations of the adjusting screw without using the dial gage. Of course it is good.

The object to be cleaned is not limited to a semiconductor wafer, but may be a glass substrate for liquid crystal. In other words, the present invention can be applied to any object that needs to be accurately cleaned.

Although a cylinder is used as a driving means for driving the upper and lower cleaning brushes, a linear motor may be used instead of the cylinder. In short, the link is controlled within a predetermined range without computer control. Anything that can be rotated may be used.

[0080]

According to the first aspect of the present invention, the adjustment of the contact pressure between the upper cleaning brush and the lower cleaning brush with respect to the object to be cleaned is mechanically performed by the first adjusting mechanism and the second adjusting mechanism. The cleaning brushes were driven by driving means.

Therefore, the adjustment of the contact pressure of each cleaning brush and the driving can be performed separately, so that complicated control using expensive parts such as a servomotor as in the prior art is not required. In addition to simplifying the configuration, the cost can be reduced.

According to the second aspect of the present invention, the angle of the mounting member provided with the cleaning brush and the adjusting mechanism can be adjusted with respect to the object to be cleaned, so that the cleaning brush is positioned parallel to the object to be cleaned. Can be.

Therefore, the axial direction of the cleaning brush can be uniformly pressed against the object to be cleaned over the entire length, so that the entire surface of the object to be cleaned can be uniformly cleaned. According to the third aspect of the present invention, the first and second adjusting mechanisms include the adjusting body having the upper surface formed on the tapered surface and the adjusting screw for driving the adjusting body.

Therefore, the positioning of the slide member provided with the cleaning brush can be reliably adjusted with a simple structure. According to the fourth aspect of the invention, when the cleaning brush is held and fixed to the support shaft, the tapered projection of the nut body is engaged with the tapered recess formed on the brush shaft of the cleaning brush. .

Therefore, the axis of the cleaning brush can be accurately matched with the axis of the support shaft, so that the cleaning brush can be mounted with high precision without causing misalignment.

According to the fifth aspect of the present invention, the support pin for supporting the object to be cleaned is composed of the base shaft, the pressing member and the support member, and if the support member for supporting the object to be cleaned is worn due to its use. Since the support pins can be replaced, the cost can be reduced as compared with the related art in which the entire support pin has to be replaced.

[Brief description of the drawings]

FIG. 1 is a front view showing a mechanism for vertically driving a pair of cleaning brushes according to an embodiment of the present invention.

FIG. 2 is a side view of the same.

FIG. 3 is a sectional view of a mechanism for rotating and driving the semiconductor wafer.

FIG. 4 is a plan view of the arrangement state of the cleaning brush.

FIG. 5 is a cross-sectional view of the cleaning brush supporting structure.

FIG. 6 is a sectional view of a supporting structure of the slide body.

FIG. 7 is a sectional view showing the structure of the support pin.

FIG. 8 is an explanatory view showing a conventional structure.

[Explanation of symbols]

 26, 27: Support pin 29a: Base 29b: Holding member 29c: Support member 51: Lower cleaning brush 52: Upper cleaning brush 55: Mounting member 61: Guide body 62: First slide body 63: Second slide body 68 69, a support plate (holding means) 71, a support portion 72, a support shaft 75, a nut body 77, a taper projection 78, a first engagement portion 86, a brush shaft 87, a brush member 88, a second engagement member Joining part 89 ... Taper recess 91 ... First adjusting mechanism 92 ... Second adjusting mechanism 93 ... Base body 95 ... Adjusting body 95a ... Taper surface 96 ... Adjusting screw 101 ... Link 105 ... Cylinder (driving means) U ... Semiconductor wafer (member to be cleaned)

Claims (5)

[Claims] 1. A brush cleaning apparatus for cleaning an upper surface and a lower surface of an object to be rotated which is rotationally driven by bringing an upper cleaning brush and a lower cleaning brush into contact with each other, wherein the brush is substantially perpendicular to a plate surface of the object to be cleaned. A pair of guide members provided at a predetermined interval in a direction intersecting with the above-mentioned vertical direction and provided along the vertical direction; A first slide body slidably provided on one of the guide bodies, a second slide body slidably provided on the other side, and the upper cleaning brush provided on an upper end of the first slide body. An upper holding means rotatably holding an axis substantially parallel to an upper surface of the object to be cleaned on an upper surface side of the object to be cleaned, and the lower cleaning brush provided at an upper end of the second slide body; Lower holding means rotatably holding an axis substantially parallel to the lower surface of the object to be cleaned on the lower surface side of the object to be cleaned, and slidably provided on one of the guide members at the lower end side of the first slide member; A first adjusting mechanism for adjusting a sliding position of the first slide body along a vertical direction; and a second slide slidably provided on the other end of the guide body at a lower end side of the second slide body. A second adjusting mechanism for adjusting a sliding position along a vertical direction of the body, an intermediate portion rotatably mounted on the mounting member, one end of which is rotatably connected to the first adjusting mechanism, and the other end of which is rotatable. A link rotatably connected to the second adjusting mechanism; and a link rotatably driven to slide the first slide body in the downward direction via the first adjusting mechanism to cover the upper cleaning brush. Touch the top of the cleaning object At the same time, driving means for sliding the second slide body in the ascending direction via the second adjusting mechanism to contact the lower cleaning brush with the lower surface of the object to be cleaned. Brush cleaning equipment. 2. The brush cleaning device according to claim 1, wherein the attachment member is provided so as to be capable of adjusting a rotation angle about an axis along a direction intersecting the vertical direction. 3. The first and second adjustment mechanisms are provided on the guide body so as to be slidable, and an end of the link is rotatably connected to the base body, and intersect the guide body with the base body. An adjusting body formed on a taper surface slidably provided along the direction and having an upper surface slidably in contact with the lower ends of the first and second sliding bodies, and intersecting the adjusting body with the guide body; 2. The brush cleaning device according to claim 1, further comprising an adjusting screw that slides each of the slide members along a vertical direction of the guide member by driving the slide members in a vertical direction. 4. The upper and lower holding means are provided rotatably on a pair of support portions and each support portion, and a first end is provided at a tip end portion.
And a nut body screwed to the support shaft and having a tip formed in a tapered projection. The upper and lower cleaning brushes have brushes on the outer peripheral surface. A brush shaft provided with a member, and a second engagement member formed at both ends of the brush shaft and detachably engaged with the first engagement portions to rotate the brush shaft integrally with the support shaft. A mating portion; and a first engagement portion formed on an end face of the brush shaft and a second engagement portion.
And a taper concave portion with which the taper convex portion engages by moving the nut body toward the end face of the brush shaft in order to maintain the engagement state with the engaging portion. The brush cleaning device according to claim 1, wherein 5. The object to be cleaned is supported at its periphery by a support pin that is driven to rotate, and the support pin is rotated to rotate the object to be cleaned. A base shaft portion attached to a driven shaft to be driven; a pressing member detachably mounted on an upper end of the base shaft portion; and a peripheral portion of the object to be cleaned held removably on the upper end of the base shaft portion by the pressing member. The brush cleaning device according to claim 1, further comprising a support member for supporting the brush.