JPH10173238A - Light emitting diode - Google Patents
Light emitting diodeInfo
- Publication number
- JPH10173238A JPH10173238A JP8326989A JP32698996A JPH10173238A JP H10173238 A JPH10173238 A JP H10173238A JP 8326989 A JP8326989 A JP 8326989A JP 32698996 A JP32698996 A JP 32698996A JP H10173238 A JPH10173238 A JP H10173238A
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- straight line
- led chips
- emitting diode
- cutouts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/32257—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic the layer connector connecting to a bonding area disposed in a recess of the surface of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Led Device Packages (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明はＬＥＤランプとも称
され、リードフレーム、ＬＥＤチップ、モールドケース
などが組立てられて、１個のランプ状とされた発光ダイ
オードに関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a light-emitting diode, which is also called an LED lamp, in which a lead frame, an LED chip, a molded case, and the like are assembled into one lamp.
【０００２】[0002]
【従来の技術】従来の、この種の発光ダイオード９０の
構成の例を示すものが図５であり、マウント用リードフ
レーム９１には略ロート状としたホーン９１ａが設けら
れ、このホーン９１ａの底面にＬＥＤチップ９２がマウ
ントされ、他方の極が金ワイヤ９３などにより配線用リ
ードフレーム９４に接続されている。2. Description of the Related Art FIG. 5 shows a conventional example of the structure of a light emitting diode 90 of this type. A mounting lead frame 91 is provided with a substantially funnel-shaped horn 91a, and a bottom surface of the horn 91a is provided. An LED chip 92 is mounted on the other end, and the other pole is connected to a wiring lead frame 94 by a gold wire 93 or the like.
【０００３】そして、前記リードフレーム９１、９４の
先端部分とＬＥＤチップ９２とを覆い透明樹脂によるモ
ールドケース９５が設けられるものとされるが、このと
きに、このモールドケース９５の先端部分には球面など
としたレンズ部９５ａが設けられ、前記ＬＥＤチップ９
２からの光に対し光軸Ｚを中心とする適宜な照射角を与
えるものとされている。[0003] A mold case 95 made of transparent resin is provided to cover the tip portions of the lead frames 91 and 94 and the LED chip 92. At this time, the tip portion of the mold case 95 has a spherical surface. The LED chip 9 is provided with a lens portion 95a such as
An appropriate irradiation angle about the optical axis Z is given to the light from 2.
【０００４】[0004]
【発明が解決しようとする課題】しかしながら、前記し
た従来の発光ダイオード９０においては、前記ホーン９
１ａおよびレンズ部９５ａが何れも光軸Ｚを中心とする
回転面として形成されるものであるので、この光軸Ｚに
直交する断面に表れる配光特性は必然的に円形状のもの
となる。However, in the conventional light emitting diode 90 described above, the horn 9
Since both the lens portion 1a and the lens portion 95a are formed as rotating surfaces around the optical axis Z, the light distribution characteristics appearing in a cross section orthogonal to the optical axis Z are necessarily circular.
【０００５】従って、例えばバーコードの読取時など縦
横比（アスペクトレシオ）が大きい被写体を照明しよう
とする場合には、照明の切れ目をなくするために被写体
の照明される照度は無視し、図６に示すように、個々の
配光特性が連続するものと成るように、被写体の長手方
向に沿い発光ダイオード９０の複数を整列配置しなけれ
ば成らなくなる。Therefore, when illuminating an object having a large aspect ratio (aspect ratio), for example, when reading a bar code, the illuminance illuminated by the object is ignored in order to eliminate a break in illumination, and FIG. As shown in (1), a plurality of light emitting diodes 90 must be arranged along the longitudinal direction of the subject so that individual light distribution characteristics are continuous.
【０００６】よって、照度面で見た場合には過剰な光量
で照明されるものとなることが多く、余分な光を照射し
無駄なエネルギーを消費しているものとなる問題点を生
じている。また、上記したように複数の発光ダイオード
９０を整列配置する場合、照明ムラを避けるためには取
付けに傾きなどを生じないように慎重な作業が要求さ
れ、工程が煩雑化する問題点も生じ、これらの点の解決
が課題とされるものとなっている。[0006] Therefore, when viewed from the illuminance surface, the light is often illuminated with an excessive amount of light, which causes a problem that extra light is irradiated and wasteful energy is consumed. . In addition, when a plurality of light emitting diodes 90 are arranged and arranged as described above, in order to avoid illumination unevenness, careful work is required so as not to cause a tilt or the like in mounting, and there is a problem that a process becomes complicated. The solution of these points is an issue.
【０００７】[0007]
【課題を解決するための手段】本発明は、前記した従来
の課題を解決するための具体的な手段として、一方向に
切欠部を設けたホーンを有するマウント用リードフレー
ムの一対を、直線状で且つこの直線に対し前記切欠部が
直角方向でお互いが反対向となるように配置し、前記ホ
ーン内にはそれぞれにＬＥＤチップがマウントされ、そ
れぞれの前記ＬＥＤチップに対応する部分を、前記直線
と平行方向の曲面の径よりも前記直線と直角方向の曲面
の径を大きくし且つ前記切欠部が設けられた方向に軸を
傾けた形状とするレンズ部を有する一体のモールドケー
スが設けられていることを特徴とする発光ダイオードを
提供することで課題を解決するものである。According to the present invention, as a specific means for solving the above-mentioned conventional problems, a pair of mounting lead frames having a horn provided with a notch in one direction is formed by a straight line. The notches are arranged so as to be opposite to each other in a direction perpendicular to the straight line, and LED chips are mounted in the horn, respectively, and portions corresponding to the respective LED chips are defined by the straight lines. And an integral mold case having a lens portion having a shape in which the diameter of the curved surface in the direction perpendicular to the straight line is larger than the diameter of the curved surface in the direction parallel to the straight line and the axis of which is inclined in the direction in which the cutout portion is provided. It is an object of the present invention to provide a light emitting diode characterized by having the above feature.
【０００８】[0008]
【発明の実施の形態】つぎに、本発明を図に示す実施形
態に基づいて詳細に説明する。図１に符号１で示すもの
は本発明に係る発光ダイオードであり、この発光ダイオ
ード１はマウント用リードフレーム２、３、ＬＥＤチッ
プ４、金ワイヤ５、配線用リードフレーム６およびモー
ルドケース７で形成されるものである点は従来例のもの
と同様である。Next, the present invention will be described in detail based on an embodiment shown in the drawings. 1 is a light emitting diode according to the present invention. The light emitting diode 1 is formed by mounting lead frames 2, 3, an LED chip 4, a gold wire 5, a wiring lead frame 6, and a mold case 7. This is the same as that of the conventional example.
【０００９】ここで、本発明では前記マウント用リード
フレームとして、第一のマウント用リードフレーム２と
第二のマウント用リードフレーム３（以下、第一のフレ
ーム２、第二のフレーム３と略称する）の一対を使用す
るものであり、これにより当然に使用されるＬＥＤチッ
プ４も２個となる。Here, in the present invention, as the mounting lead frame, a first mounting lead frame 2 and a second mounting lead frame 3 (hereinafter, abbreviated as first frame 2 and second frame 3). ) Is used, so that two LED chips 4 are naturally used.
【００１０】そして、前記第一のフレーム２には、ＬＥ
Ｄチップ４の側面から放射される光を従来例と同様に光
軸Ｚ１方向に向けて反射するホーン２ａが設けられる
が、本発明により前記ホーン２ａは一方向に切欠部２ｂ
が設けられ、光軸Ｚ１方向から見た状態で略Ｕ字状の形
状とされている。また、前記第二のフレーム３に設けら
れるホーン３ａにも同様な切欠部３ｂが設けられるもの
とされている。The first frame 2 has LE
A horn 2a for reflecting light emitted from the side surface of the D chip 4 in the direction of the optical axis Z1 in the same manner as in the conventional example is provided. According to the present invention, the horn 2a is
Are provided, and have a substantially U-shape when viewed from the optical axis Z1 direction. The horn 3a provided on the second frame 3 is also provided with a similar notch 3b.
【００１１】ここで、第一のフレーム２と第二のフレー
ム３とは後に説明する配線用リードフレーム６（以下に
配線フレーム６と略称する）と共に直線Ｙ上に配置され
るものであるが、前記第一のフレーム２の切欠部２ｂ
と、第二のフレーム３の切欠部３ｂとは、前記各フレー
ム２、３、６が配列された直線Ｙに対し直角方向で、且
つ、お互いが反対方向を向くものとされている。Here, the first frame 2 and the second frame 3 are arranged on a straight line Y together with a wiring lead frame 6 (hereinafter abbreviated as a wiring frame 6) which will be described later. Notch 2b of the first frame 2
And the notch 3b of the second frame 3 are oriented in a direction perpendicular to the straight line Y on which the frames 2, 3, and 6 are arranged, and in directions opposite to each other.
【００１２】そして、前記ホーン２ａ、３ａのそれぞれ
にはＬＥＤチップ４がマウントされ、配線フレーム６か
ら第一のフレーム２にマウントされたＬＥＤチップ４の
他方の極に渡り金ワイヤ５による配線が行われ、第一の
フレーム２から第二のフレーム３にマウントされたＬＥ
Ｄチップ４の他方の極に渡り金ワイヤ５による配線が行
われている。従って、２個のＬＥＤチップ４、４は配線
フレーム６と第二のフレーム３との間で直列接続されて
いるものとなる。An LED chip 4 is mounted on each of the horns 2a and 3a, and wiring is performed by a gold wire 5 from the wiring frame 6 to the other pole of the LED chip 4 mounted on the first frame 2. The LE mounted from the first frame 2 to the second frame 3
The wiring by the gold wire 5 is performed over the other pole of the D chip 4. Accordingly, the two LED chips 4 are connected in series between the wiring frame 6 and the second frame 3.
【００１３】上記のようにＬＥＤチップ４のマウントお
よび配線が行われた後には、例えばエポキシ樹脂による
ポッテイングモールドなどが行われ、モールドケース７
が形成されるものとなるが、本発明では、一体のモール
ドケース７において、第一のフレーム２にマウントされ
たＬＥＤチップ４に対応する第一のケース部分７１と、
第二のフレーム３にマウントされたＬＥＤチップ４に対
応する第二のケース部分７２とが形状が異なるものとさ
れている。After the mounting and wiring of the LED chip 4 are performed as described above, for example, potting molding with epoxy resin is performed, and the molding case 7 is formed.
According to the present invention, a first case portion 71 corresponding to the LED chip 4 mounted on the first frame 2 is provided in the integrated mold case 7,
The second case portion 72 corresponding to the LED chip 4 mounted on the second frame 3 has a different shape.
【００１４】図２は、モールドケース７が形成された後
の発光ダイオード１を正面から示すものであり、第一の
フレーム２にマウントされたＬＥＤチップ４に対応する
第一のケース部分７１と、第二のフレーム３にマウント
されたＬＥＤチップ４に対応する第二のケース部分７２
とは、この正面視の状態では、半円弧間を直線で接続し
た長円状とされている。FIG. 2 shows, from the front, the light emitting diode 1 after the mold case 7 has been formed, a first case portion 71 corresponding to the LED chip 4 mounted on the first frame 2, Second case portion 72 corresponding to LED chip 4 mounted on second frame 3
In this state, when viewed from the front, an oval is formed by connecting straight lines between semicircular arcs.
【００１５】従って、例えば第一のケース部分７１のみ
で見た場合、前記直線Ｙに沿う方向の外径Ｄ１は、この
直線ＹとＬＥＤチップ４の位置を交点として直角に交差
する交差線Ｘに沿う方向の外径Ｄ２よりも小さいものと
成り、前記第一のケース部分７１の先端に凸レンズ状と
して形成される第一のレンズ部７１ａは、直線Ｙに沿う
方向の曲面の径が交差線Ｘに沿う方向の径よりも小さい
ものとして形成されている。尚、これは第二のケース部
分７２においても同様である。Accordingly, for example, when viewed only from the first case portion 71, the outer diameter D1 in the direction along the straight line Y is defined by an intersection line X which intersects the straight line Y and the position of the LED chip 4 at a right angle. The first lens portion 71a formed as a convex lens at the tip of the first case portion 71 has an outer diameter D2 along the direction along the straight line Y. Is smaller than the diameter in the direction along. This is the same for the second case portion 72.
【００１６】図３は前記第一のケース部分７１を交差線
Ｘに沿う断面、即ち、第一のフレーム２にマウントされ
たＬＥＤチップ４を通過する断面で示したものであり、
本発明では、上記の直線Ｙ方向と交差線Ｘ方向との曲率
を変えるのみでなく、その第一のケース部分７１（およ
び第二のケース部分７２）の軸Ｚ２にもホーン２ａの形
状に応じる変更が行われている。FIG. 3 shows the first case portion 71 in a cross section along the intersection line X, that is, a cross section passing through the LED chip 4 mounted on the first frame 2.
According to the present invention, not only the curvature in the direction of the straight line Y and the direction of the cross line X are changed, but also the axis Z2 of the first case portion 71 (and the second case portion 72) depends on the shape of the horn 2a. Changes have been made.
【００１７】ここで、前記ホーン２ａには図示の状態で
左側に切欠部２ｂが設けられるものとされているので、
本発明においては第一のケース部分７１の軸Ｚ２を適宜
に左側に向かうように傾けるものであり、図示は省略す
るが、この状態で反対側、言い換えれば右側に切欠部３
ｂが設けられているホーン３ａに対応する第二のケース
部分７２においては第二のレンズ部７２ａの軸は右側に
向かうように傾けられている。Here, since the horn 2a is provided with a cutout 2b on the left side in the state shown in the figure,
In the present invention, the axis Z2 of the first case portion 71 is appropriately inclined toward the left side. Although not shown, the notch 3 is formed on the opposite side, in other words, on the right side in this state.
In the second case portion 72 corresponding to the horn 3a provided with b, the axis of the second lens portion 72a is inclined to the right.
【００１８】上記のように形成されたことで、本発明の
発光ダイオード１においては、モールドケース７の第一
のケース部分７１からは、この第一のケース部分７１の
軸Ｚ２が左側に向かう傾きを与えられたこと、前記ホー
ン２ａの左側に切欠部２ｂが設けられたこと、および直
線Ｙに沿う方向には曲率が強く、交差線Ｘに沿う方向に
は曲率が弱い第一のレンズ部７１ａが設けられたことに
よる作用が相乗された光を照射するものと成る。With the above-described configuration, in the light emitting diode 1 of the present invention, the axis Z2 of the first case portion 71 is inclined leftward from the first case portion 71 of the mold case 7. , The notch 2b is provided on the left side of the horn 2a, and the first lens portion 71a has a strong curvature in a direction along the straight line Y and a small curvature in a direction along the cross line X. Are provided, and the light emitted is a synergistic effect.
【００１９】即ち、第一のレンズ部７１ａにより、曲率
が強い直線Ｙ方向には照射角が狭く、曲率が弱い交差線
Ｘ方向には照射角が広い略長円状の配光特性が得られる
ものとなるが、第一のレンズ部７１ａが左側に向かい傾
けられたことで、上記の配光特性は左側に移動するもの
となり、更に左側に切欠部２ｂが設けられ左側に向かう
ＬＥＤチップ４からの直射光が増加する。尚、上記の説
明は何れも発光ダイオード１を正面から見た状態であ
る。That is, the first lens portion 71a provides a substantially elliptical light distribution characteristic having a narrow irradiation angle in the straight line Y direction having a strong curvature and a wide irradiation angle in the cross line X direction having a weak curvature. However, since the first lens portion 71a is tilted to the left, the light distribution characteristics described above move to the left, and the notch 2b is further provided on the left, and the LED chip 4 from the left goes to the left. Direct light increases. In the above description, the light emitting diode 1 is viewed from the front.
【００２０】従って、図４に示す配光特性の図では左右
が逆転するものとなり、上記第一のケース部分７１から
の配光特性Ｈ７１は正面から右寄りのものとなり、同様
に第二のケース部分７２からの配光特性Ｈ７２は正面か
ら左寄りのものとなり、両配光特性Ｈ７１、Ｈ７２の総
合の配光特性Ｈは左右方向が幅広な長円状のものとなる
のである。よって、本発明の発光ダイオード１では１個
で例えばバーコードなどアスペクトレシオの大きい被写
体の照明を可能とするのである。Accordingly, in the light distribution characteristics shown in FIG. 4, the light distribution characteristics H71 from the first case portion 71 are rightward from the front, and the light distribution characteristics H71 from the first case portion 71 are similarly shifted from the front. The light distribution characteristic H72 from the front 72 is leftward from the front, and the total light distribution characteristic H of the two light distribution characteristics H71 and H72 is an oval shape wide in the left-right direction. Therefore, the light emitting diode 1 of the present invention can illuminate a subject having a large aspect ratio such as a bar code with one light emitting diode.
【００２１】[0021]
【発明の効果】以上に説明したように本発明により、一
方向に切欠部を設けたホーンを有するマウント用リード
フレームの一対を、直線状で且つこの直線に対し前記切
欠部が直角方向でお互いが反対向となるように配置し、
前記ホーン内にはそれぞれにＬＥＤチップがマウントさ
れ、それぞれの前記ＬＥＤチップに対応する部分を、前
記直線と平行方向の曲面の径よりも前記直線と直角方向
の曲面の径を大きくし且つ前記切欠部が設けられた方向
に軸を傾けた形状とするレンズ部を有する一体のモール
ドケースが設けられている発光ダイオードとしたこと
で、上記切欠部とレンズ部とで、それぞれのＬＥＤチッ
プからの光にお互いが反対方向に広く拡がる配光特性を
与え、総合の配合特性を縦横比の大きいものとし、例え
ばバーコードなどアスペクトレシオの大きい被写体の照
明を実質的には１個の発光ダイオードで照明できるもの
として、発光ダイオードの使用個数を低減し、部品点数
と組立て工数の低減を可能として、コストダウンに極め
て優れた効果を奏するものである。As described above, according to the present invention, a pair of mounting lead frames each having a horn provided with a notch in one direction are linearly connected to each other in a direction perpendicular to the straight line. Are arranged so that they face each other,
An LED chip is mounted in each of the horns, and a portion corresponding to each of the LED chips is formed such that a diameter of a curved surface in a direction perpendicular to the straight line is larger than a diameter of a curved surface in a direction parallel to the straight line, and With the light-emitting diode provided with an integrated mold case having a lens portion having a shape in which the axis is inclined in the direction in which the portion is provided, the light from each LED chip is provided by the cutout portion and the lens portion. To provide light distribution characteristics that spread widely in opposite directions to each other, make the overall compounding characteristics a large aspect ratio, and can illuminate an object having a large aspect ratio such as a bar code with a single light emitting diode. As a result, the number of light emitting diodes used can be reduced, and the number of parts and assembling man-hours can be reduced. It is intended.
【図１】 本発明に係る発光ダイオードの実施形態を一
部を透視した状態で示す斜視図である。FIG. 1 is a perspective view showing an embodiment of a light emitting diode according to the present invention in a partially transparent state.
【図２】 同じ発光ダイオードの正面図である。FIG. 2 is a front view of the same light emitting diode.
【図３】 図２のＡ―Ａ線に沿う断面図である。FIG. 3 is a sectional view taken along the line AA in FIG. 2;
【図４】 同じ発光ダイオードの配光特性を示すグラフ
である。FIG. 4 is a graph showing light distribution characteristics of the same light emitting diode.
【図５】 従来例を一部を透視した状態で示す斜視図で
ある。FIG. 5 is a perspective view showing a conventional example in a partially transparent state.
【図６】 従来例の使用状態を示す説明図である。FIG. 6 is an explanatory diagram showing a use state of a conventional example.
【符号の説明】 １……発光ダイオード ２……第一のマウント用リードフレーム ２ａ……ホーン ３……第二のマウント用リードフレーム ３ａ……ホーン ４……ＬＥＤチップ ５……金ワイヤ ６……配線用リードフレーム ７……モールドケース ７１……第一のケース部分 ７１ａ……第一のレンズ部 ７２……第二のケース部分 ７２ａ……第二のレンズ部 Ｙ……各フレームが配列された直線 Ｘ……交差線 Ｚ１、Ｚ２……光軸[Description of Signs] 1... Light-emitting diode 2... First mounting lead frame 2a... Horn 3... Second mounting lead frame 3a. Wiring lead frame 7 Mold case 71 First case part 71a First lens part 72 Second case part 72a Second lens part Y Each frame is arranged. Straight line X: intersection line Z1, Z2: optical axis
Claims (1)
マウント用リードフレームの一対を、直線状で且つこの
直線に対し前記切欠部が直角方向でお互いが反対向とな
るように配置し、前記ホーン内にはそれぞれにＬＥＤチ
ップがマウントされ、それぞれの前記ＬＥＤチップに対
応する部分を、前記直線と平行方向の曲面の径よりも前
記直線と直角方向の曲面の径を大きくし且つ前記切欠部
が設けられた方向に軸を傾けた形状とするレンズ部を有
する一体のモールドケースが設けられていることを特徴
とする発光ダイオード。1. A pair of mounting lead frames each having a horn provided with a notch in one direction are arranged in a straight line so that the notches are perpendicular to the straight line and are opposite to each other. An LED chip is mounted in each of the horns, and a portion corresponding to each of the LED chips is formed such that a diameter of a curved surface in a direction perpendicular to the straight line is larger than a diameter of a curved surface in a direction parallel to the straight line, and A light-emitting diode, comprising: an integrated mold case having a lens portion having a shape whose axis is inclined in a direction in which the portion is provided.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8326989A JPH10173238A (en) | 1996-12-06 | 1996-12-06 | Light emitting diode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8326989A JPH10173238A (en) | 1996-12-06 | 1996-12-06 | Light emitting diode |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH10173238A true JPH10173238A (en) | 1998-06-26 |
Family
ID=18194069
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8326989A Pending JPH10173238A (en) | 1996-12-06 | 1996-12-06 | Light emitting diode |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH10173238A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007280714A (en) * | 2006-04-05 | 2007-10-25 | Matsushita Electric Works Ltd | Lamp module for switching device, and manufacturing method therefor |
| JP2010506377A (en) * | 2006-05-03 | 2010-02-25 | クリー インコーポレイテッド | Multi-element LED lamp package |
-
1996
- 1996-12-06 JP JP8326989A patent/JPH10173238A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007280714A (en) * | 2006-04-05 | 2007-10-25 | Matsushita Electric Works Ltd | Lamp module for switching device, and manufacturing method therefor |
| JP4622922B2 (en) * | 2006-04-05 | 2011-02-02 | パナソニック電工株式会社 | LAMP MODULE FOR SWITCH DEVICE AND METHOD FOR MANUFACTURING THE SAME |
| JP2010506377A (en) * | 2006-05-03 | 2010-02-25 | クリー インコーポレイテッド | Multi-element LED lamp package |
| US8629459B2 (en) | 2006-05-03 | 2014-01-14 | Cree, Inc. | Multi-element LED lamp package |
| US8847242B2 (en) | 2006-05-03 | 2014-09-30 | Cree, Inc. | Multi-element LED lamp |
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