JPH10172903A - Remote operating method and semiconductor aligner - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent exposure by harmful illumination and to make smooth remote operation possible, by causing a semiconductor aligner to inhibit remote operation individually as occasion demands. SOLUTION: When operation is performed from a semiconductor aligner 1 a controlling unit 3 controls a body part 4 by operation from an operating unit 2. On the occasion of performing on-line operation, an operation command is inputted from a host computer 5. This operation command is reported to the control unit 3 of the semiconductor aligner 1 through a communication line 6, and the control unit 3 controls the body part 4 similarly to the operation from the operating unit 2. Next, when an on-line operation inhibit command is inputted from the operating unit 2 of the semiconductor aligner 1, the control unit 2 reports it to the host computer 5 through the communication line 6. In the host computer 5, an operation input command to the corresponding semiconductor aligner 1 is inhibited and displays its inhibited state. As the result, the semiconductor aligner 1 which operated an on-line operation inhibition function becomes in an on-line operation inhibited state.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor exposure apparatus and a remote control method for the semiconductor exposure apparatus.

[0002]

2. Description of the Related Art Conventionally, in a semiconductor manufacturing plant, a remote control system of a semiconductor exposure apparatus called an online system has been introduced for the purpose of unmanned operation and labor saving in a clean room. This online system allows an operator to control a plurality of semiconductor exposure apparatuses using a host computer or a personal computer without entering the clean room.

Hereinafter, such a conventional remote control system for a semiconductor exposure apparatus will be described with reference to FIG. FIG. 5 is an external view of an online system of a conventional semiconductor exposure apparatus, showing a host computer to which a plurality of semiconductor exposure apparatuses are connected and one of the plurality of semiconductor exposure apparatuses. In FIG. 1, reference numeral 1 denotes a semiconductor exposure apparatus for exposing a semiconductor, which is installed in a clean room (not shown). Reference numeral 2 denotes an operation unit for operating the semiconductor exposure apparatus 1, 5 denotes a host computer for operating the semiconductor exposure apparatus 1 and another semiconductor exposure apparatus (not shown), and 6 denotes a host computer and a plurality of This is a communication line for connecting a semiconductor exposure apparatus.

When a semiconductor exposure apparatus 1 to be operated is specified from a host computer 5 and an operation command is input, the semiconductor exposure apparatus 1 performs a predetermined operation through a communication line 6.

On the other hand, there is a case where a lock function is provided so that the remote controller cannot be operated from the operation unit 2 of the semiconductor exposure apparatus 1. In this case, the remote operation state is released from the host computer 5 so that the operation can be performed from the operation unit 2 of the semiconductor exposure apparatus 1 again.

[0006] For the sake of simplicity of work, there has been a remote control system in which a remote control device for performing remote control is connected to a communication line instead of a host computer. FIG.
FIG. 1 is an external view showing such a remote control system.
In the figure, reference numerals 2 and 11 denote operation units of the semiconductor exposure apparatus 1, 8 denotes a remote operation apparatus, and 10 denotes an apparatus selection switch for selecting a semiconductor exposure apparatus to be remotely operated from a plurality of connected semiconductor exposure apparatuses.

[0007]

As described above, the clean room is basically unmanned,
It is inevitable that work in the semiconductor exposure apparatus occurs due to regular maintenance or the like. When the apparatus is operated during operation in the semiconductor exposure apparatus, there is a danger that the operator may be involved in driving the apparatus or may be exposed to harmful lighting. The door of the temperature control chamber that is a part is locked,
When the door of the temperature control chamber is opened, the device stops.

[0008] However, some of these operations require that the apparatus be put into operation and access inside the apparatus. In order to perform such an operation, a means for unlocking the temperature control chamber by an operation from the semiconductor exposure apparatus is provided, so that the inside of the apparatus can be accessed without stopping the apparatus. Therefore, in such a case, if a drive command is input from the host computer without noticing the work in the semiconductor exposure apparatus, the worker working in the semiconductor exposure apparatus may be involved in driving the apparatus, There was a danger of exposure to harmful lighting.

As described above, at the time of performing the operation after releasing the danger prevention function of the semiconductor exposure apparatus, even if the danger prevention function as described above is provided, there is a danger to the operator due to unexpected remote operation.

An object of the present invention is to provide a semiconductor exposure apparatus and a remote operation method for the semiconductor exposure apparatus, which can prevent such danger and enable smooth remote operation.

[0011]

According to the present invention, there is provided a method for remotely controlling a semiconductor exposure apparatus, wherein one or more semiconductor exposure apparatuses are remotely controlled from a remote control apparatus capable of remotely controlling the semiconductor exposure apparatus. The semiconductor exposure apparatus prohibits remote operation individually as needed. The danger as described above is prevented by preventing remote control of the corresponding semiconductor exposure apparatus during the operation of the remote control prohibition function.

Preferably, when remote control is prohibited from the semiconductor exposure apparatus, the fact that remote control of the semiconductor exposure apparatus is prohibited is displayed on a device that performs remote control via a communication line. According to such a remote control method, in the operation state of the remote control prohibition function of the semiconductor exposure apparatus,
Check for remote control operation failure from the remote control device.
Such misrecognition can be avoided.

In the remote control method according to the present invention, a specific operation from the semiconductor exposure apparatus such as an operation to release the danger prevention function or a remote operation is automatically prohibited in conjunction with a specific operation of the semiconductor exposure apparatus. You may. Here, the danger prevention function means, for example, an automatic stop function of the semiconductor exposure apparatus in conjunction with the unlocking of the door of the temperature control chamber. In this way, by automatically operating the remote operation prohibition function in conjunction with a specific operation, it is possible to prevent danger even if the remote operation prohibition function is forgotten to be operated. Preferably, when the prohibition state of the remote operation is released, when the danger prevention function is activated again, the danger prevention function is released in conjunction therewith.

The device manufacturing method of the present invention is a method of manufacturing a semiconductor device by remotely controlling a semiconductor exposure apparatus by the above-described remote control method of the present invention. According to this device manufacturing method, a repair operation can be performed safely even when the semiconductor exposure apparatus fails, and a semiconductor device can be manufactured.

The present invention also relates to a semiconductor exposure apparatus in which one or a plurality of semiconductor exposure apparatuses are remotely controlled from a remote control apparatus capable of remotely controlling the semiconductor exposure apparatuses. It is characterized by having means.

The semiconductor exposure apparatus of the present invention preferably operates the remote control inhibiting means automatically in conjunction with a specific operation from the semiconductor exposure apparatus or the operation of the semiconductor exposure apparatus, similarly to the invention of the operation method. Have means to do so.

[0017]

Embodiments of the present invention will be described below. However, in the description of the present embodiment, a system for controlling one or more semiconductor exposure apparatuses from a remote location by a host computer is an online system, and an operation for inputting an operation command from the host computer to the semiconductor exposure apparatus is an online operation. Call.

(Embodiment 1) FIG. 1 shows functional blocks of a remote control system for a semiconductor exposure apparatus according to this embodiment. In FIG. 1, reference numeral 1 denotes a semiconductor exposure apparatus, 2 denotes an operation unit for operating the semiconductor exposure apparatus, 3 denotes a control unit that controls the main body of the semiconductor exposure apparatus 1 in accordance with an operation from the operation unit, and 4 denotes a semiconductor exposure apparatus. Is a host computer for controlling one or more semiconductor exposure apparatuses from a remote location, and 6 is a communication line for bidirectionally transmitting and receiving various information between the semiconductor exposure apparatus and the remote operation apparatus.

The external view of the online system of the semiconductor exposure apparatus according to the present embodiment is the same as the conventional online system, and is shown in FIG.

Hereinafter, remote control of the semiconductor exposure apparatus according to this embodiment will be described with reference to these drawings.

First, the operation of the host computer 5 and the semiconductor exposure apparatus 1 in a state where the online operation is not prohibited will be described. When the operation is performed from the semiconductor exposure apparatus 1, the control unit 3 is operated by the operation unit 2 to
Control. When performing an online operation, an operation command is input from the host computer 5. The operation command is notified to the control unit 3 of the semiconductor exposure apparatus 1 through the communication line 6, and the control unit 3 controls the main unit 4 in the same manner as the operation from the operation unit 2.

Next, the function of prohibiting online operation from the semiconductor exposure apparatus 1 will be described. When an online operation prohibition command is input from the operation unit 2 of the semiconductor exposure apparatus 1, the control unit 3 notifies the host computer 5 via the communication line 6. The host computer 5 prohibits input of an operation command to the corresponding semiconductor exposure apparatus 1, and displays the prohibited state.

The semiconductor exposure apparatus 1 having activated the online operation prohibiting function in this way enters the online operation prohibiting state. However, online operation of a semiconductor exposure apparatus (not shown) in which the online operation prohibition function is not activated can be performed as before.

Unless the online operation inhibition function is released from the semiconductor exposure apparatus 1 in the online operation inhibition state,
The online operation prohibition state of the semiconductor exposure apparatus 1 continues. The online operation prohibition function is released by inputting a release command from the operation unit 2.

(Embodiment 2) In this embodiment, the online operation prohibition function of Embodiment 1 is linked to the operation of releasing the danger prevention function such as locking of the door of the temperature control chamber of the semiconductor exposure apparatus, and automatically. It is what you do.

In order to operate the semiconductor exposure apparatus inside the semiconductor exposure apparatus 1 while operating the semiconductor exposure apparatus, it is necessary to release a danger prevention function such as unlocking a door of a temperature control chamber.
Thus, the danger prevention function is released by inputting a danger prevention function release command from the operation unit 2 of the semiconductor exposure apparatus 1, and the inside of the operable semiconductor exposure apparatus can be accessed.

When these specific commands are input, the control unit 3 automatically notifies the host computer 5 via the communication line 6 of an online operation prohibition command in conjunction therewith. The host computer 5 prohibits input of an operation command to the corresponding semiconductor exposure apparatus 1, and indicates that the semiconductor exposure apparatus 1 is in an online operation prohibited state. The semiconductor exposure apparatus 1 in which the danger prevention function has been released in this way.
Automatically disables online operation.

As in the manual online operation prohibition operation of the first embodiment, the online operation prohibition state of the semiconductor exposure apparatus 1 is continued unless the online operation prohibition function is released from the semiconductor exposure apparatus 1 in the online operation prohibition state.

As described above, according to the online operation system of the present embodiment, it is possible to avoid a danger to the operator due to an unexpected online operation that occurs when the danger prevention function is released. The operator can prevent the danger by activating the online operation prohibition function before canceling the danger prevention function. However, the operator may not realize that online operation is possible or may simply forget to operate. In order to prevent such online operation prohibition function from being forgotten,
As in the present embodiment, it is effective to automatically activate the online operation prohibition function in conjunction with the release of the danger prevention function.

Next, the release of the online operation prohibition function of the semiconductor exposure apparatus 1 which has automatically become the online operation prohibition state will be described.

In this embodiment, there are the following two methods for releasing the online operation prohibition function from the semiconductor exposure apparatus 1. The first method is a method of canceling by inputting a cancel command from the operation unit 2 as in the manual operation. The second method is based on the idea that automatically activated functions are automatically released, and the control unit 3 determines that all danger prevention functions are activated again and automatically prohibits online operation. This is a method to cancel the function. In this method, it is necessary that the control unit 3 recognizes whether or not the online operation is prohibited before the release of the danger prevention function.

With respect to automatic release of the online operation prohibition function, only the first method or both methods are prepared.

(Embodiment 3) In Embodiments 1 and 2,
The remote control and control of the semiconductor exposure apparatus were performed from an input device such as a terminal of a host computer, but instead of this, an apparatus having only the remote control and its control function was connected to a communication line for convenience of operation. It is also possible to control the semiconductor exposure apparatus.

Hereinafter, an embodiment of the control of the remote control device and the semiconductor exposure apparatus will be described.

FIG. 2 shows functional blocks of a remote control system for a semiconductor exposure apparatus according to this embodiment. In FIG. 2, reference numeral 7 denotes a remote operation prohibition state display unit for displaying an operation state of the remote operation prohibition function, 8 denotes a remote operation device for remotely operating the semiconductor exposure apparatus, and 9 denotes a semiconductor connected to the remote operation device 8. A remote operation prohibition state display unit for displaying the operation state of the remote operation prohibition function of the exposure apparatus, 10 is a device selection switch for selecting a semiconductor exposure device to be remotely operated, 11 is an operation unit in the remote operation device, 12 Is a remote operation target switching unit that switches a semiconductor exposure apparatus remotely operated according to an apparatus selection switch, 13 is a remote operation inhibition switch for activating / deactivating a remote operation inhibition function, and 14 is an operation unit of the semiconductor exposure apparatus 1 An operation switching unit for switching between 2 and the remote operation device 8 side. In FIG. 2, the same reference numerals as in FIG. 1 denote the same components.

FIG. 3 is an external view of a remote control system for a semiconductor exposure apparatus according to this embodiment. However, in FIG. 3, the same reference numerals as in FIG. 2 denote the same components. Hereinafter, remote control of the semiconductor exposure apparatus according to the present embodiment will be described with reference to FIGS.

When the semiconductor exposure apparatus 1 is not remotely operated, the operation section 2 is connected to the control section 3 in the operation switching section 14, and the control section 3 controls the main body section 4 by operation from the operation section 2. . At this time, if the remote operation prohibited state display section 9 of the remote operation device 8 does not display the remote operation prohibited state for the target semiconductor exposure apparatus 1,
The device 1 can be remotely controlled.

When remote control is performed from such a state, the semiconductor exposure apparatus 1 to be remotely controlled is selected by the device selection switch 10 of the remote control device 8. The remote operation target switching unit 12 connects the operation unit 11 to the communication line 6 to the designated semiconductor exposure apparatus 1 and
Requests the semiconductor exposure apparatus 1 specified through the remote control to switch to remote operation. When the semiconductor exposure apparatus 1 receives a request for remote operation from the communication line 6, the operation switching unit 1
Reference numeral 4 disconnects the operation unit 2, connects the remote operation device 8 and the control unit 3, and makes the remote operation device 8 remotely operable.

Conversely, when canceling the remote control, the selection of the semiconductor exposure apparatus 1 which is remotely controlled is released from the device selection switch 10 of the remote control device 8. The remote operation target switching unit 12 disconnects the communication line 6 from the operation unit 11 to the semiconductor exposure apparatus 1 that is remotely operated, and notifies the semiconductor exposure apparatus 1 of the release of the remote operation through the communication line 6. In the semiconductor exposure apparatus 1, the communication line 6
When the release of the remote operation is notified from the user, the operation switching unit 14
Disconnects the connection between the remote operation device 8 and the control unit 3 and again connects the operation unit 2 and the control unit 3 to release the remote operation state.

Next, a remote operation prohibition function from the semiconductor exposure apparatus 1 will be described. The remote operation inhibition switch 13 of the semiconductor exposure apparatus 1 can be operated even when the exposure apparatus 1 is remotely operated. When an operation request for the remote operation prohibition function is input from the remote operation prohibition switch 13 of the semiconductor exposure apparatus 1, the operation switching unit 14 forcibly connects the operation unit 2 and the control unit 3 regardless of the remote operation state. At the same time, the operation switching unit 14 notifies the remote operation device 8 via the communication line 6 that the remote operation inhibition function has been activated. The remote operation prohibited state display section 9 of the semiconductor exposure apparatus 1 displays that the remote operation has been prohibited. When the remote operation device 8 receives a notification from the semiconductor exposure apparatus 1 via the communication line 6 that the remote operation inhibition function has been activated, the remote operation target switching unit 12 inhibits switching to the corresponding semiconductor exposure apparatus 1 and prohibits remote operation. The status display section 9 indicates that the corresponding semiconductor exposure apparatus 1 is in the selection prohibited state. Until the remote operation inhibition state is released, the operation selection switch 10 of the corresponding semiconductor exposure apparatus 1 becomes invalid.

The semiconductor exposure apparatus 1 having activated the remote control prohibiting function in this way enters a remote control prohibiting state. However, remote control of another semiconductor exposure apparatus (not shown) in which the remote control prohibition function is not operated can be performed as before.

Semiconductor exposure apparatus 1 in remote operation prohibited state
The remote operation prohibition state of the semiconductor exposure apparatus 1 continues unless the remote operation prohibition function is released from. The release of the remote control prohibition function is performed by inputting a release request from the remote control prohibition switch 13.

(Embodiment 4) This embodiment corresponds to Embodiment 3
The present invention relates to a remote control system for a semiconductor exposure apparatus, which automatically performs a remote operation prohibition function of the semiconductor exposure apparatus in conjunction with an operation of releasing a danger prevention function such as locking of a door of a temperature control chamber of the semiconductor exposure apparatus.

FIG. 4 is a diagram showing functional blocks of a remote control system for a semiconductor exposure apparatus according to this embodiment.
The functions of the operation switching unit and the control unit are different from those of the third embodiment. In the figure, 15 is an operation switching unit 14
This is a control unit for determining a specific command from the server. However, in FIG. 4, the components denoted by the same reference numerals as those in FIG. 2 indicate the same components.

In FIG. 4, the release of the danger prevention function of the semiconductor exposure apparatus 1 is performed by operating the operation unit 2 of the semiconductor exposure apparatus 1.
It is necessary to input the command for release from. The control unit 15 has a function of recognizing these specific commands. When recognizing these commands, the control unit 15 instructs the operation switching unit 14 to issue a command equivalent to the input of a remote operation prohibition function activation request input from the remote operation prohibition switch 13. Perform When this command is received, the operation switching unit 14 forcibly connects the operation unit 2 and the control unit 15 as in the case of manually inputting the operation request of the remote operation inhibition function. Operation switching unit 14 at the same time
Notifies the remote operation device 8 via the communication line 6 that the remote operation prohibition function has been activated. Semiconductor exposure apparatus 1
The remote-operation-prohibited state display section 7 indicates that the remote operation has been prohibited.

Thereafter, the control unit 15 releases the danger prevention function of the semiconductor exposure apparatus 1. When the remote operation device 8 receives a notification from the semiconductor exposure apparatus 1 via the communication line 6 that the remote operation inhibition function has been activated, the remote operation target switching unit 12 inhibits switching to the corresponding semiconductor exposure apparatus 1 and prohibits remote operation. The status display section 9 indicates that the corresponding semiconductor exposure apparatus 1 is in the selection prohibited state. The device selection switch 10 of the corresponding semiconductor exposure apparatus 1 becomes invalid until the remote operation inhibition state is released. In this manner, the semiconductor exposure apparatus 1 from which the danger prevention function has been released automatically enters the remote control prohibited state.

As in the operation for manually prohibiting remote operation in the third embodiment, the remote operation prohibition state of the semiconductor exposure apparatus 1 continues unless the remote operation prohibition function is released from the semiconductor exposure apparatus 1 in the remote operation prohibition state.

The operation and effects of this embodiment are the same as those of the second embodiment.

(Embodiment 5) Next, a method for producing a device using the above-described exposure apparatus will be described.

FIG. 7 shows a flow of manufacturing micro devices (semiconductor chips such as ICs and LSIs, liquid crystal panels, CCDs, thin-film magnetic heads, micro machines, etc.). Step S1
In (circuit design), a circuit of a semiconductor device is designed. In step S2 (mask production), a mask on which the designed pattern is formed is produced. On the other hand, in step S3 (wafer manufacturing), a wafer is manufactured using a material such as silicon or glass. Step S4 (wafer process) is called a pre-process, and an actual circuit is formed on the wafer by lithography using the prepared mask and wafer. The next step S5 (assembly) is called a post-process, and is a process of forming a semiconductor chip using the wafer produced in step S4, and includes processes such as an assembly process (dicing and bonding) and a packaging process (chip encapsulation). including. In step S6 (inspection), step S5
Inspections such as an operation confirmation test and a durability test of the semiconductor device manufactured in the above are performed. Through these steps, a semiconductor device is completed and shipped (step S7).

FIG. 5 shows a detailed flow of the wafer process. In step S11 (oxidation), the surface of the wafer is oxidized. In step S12 (CVD), an insulating film is formed on the wafer surface. In step S13 (electrode formation), electrodes are formed on the wafer by vapor deposition. Step S14
In (ion implantation), ions are implanted into the wafer. In step S15 (resist processing), a photosensitive agent is applied to the wafer. In step S16 (exposure), the circuit pattern of the mask is printed onto the wafer by exposure using an exposure apparatus having a means for confirming the suitability of the above-described exposure. Step S17
In (development), the exposed wafer is developed. Step S1
In step 8 (etching), portions other than the developed resist image are removed. In step S19 (resist stripping), unnecessary resist after etching is removed. By repeatedly performing these steps S11 to S19,
Multiple circuit patterns are formed on the wafer.

In the present embodiment, in the above-described repetitive steps, when the work inside the semiconductor exposure apparatus is performed due to failure repair or the like, the work is performed safely by prohibiting online processing from the semiconductor exposure apparatus side.

[0053]

As described above, according to the present invention, in a semiconductor exposure apparatus which can be operated online, by providing a function of prohibiting the online operation on the semiconductor exposure apparatus side, an operator can use the semiconductor exposure apparatus. It is possible to prevent various dangers caused by unexpectedly switching to online operation during work.

In addition, since the operation state of the online operation prohibition function can be confirmed on the host computer side as well, it is possible to avoid erroneous recognition that the online operation from the host computer is malfunctioning in the online operation prohibition state. Equipment operation rate can be improved.

Furthermore, the function for automatically activating the online operation prohibition function in conjunction with a specific operation such as the release of the danger prevention function allows the user to manually activate the online operation prohibition function even if the user forgets to manually activate the online operation prohibition function. Danger can be prevented.

[Brief description of the drawings]

FIG. 1 is a functional block diagram of a remote control system for a semiconductor exposure apparatus according to a first embodiment.

FIG. 2 is a functional block diagram of a remote control system for a semiconductor exposure apparatus according to a third embodiment.

FIG. 3 is an external view of a remote control system of the semiconductor exposure apparatus of FIG. 2;

FIG. 4 is a functional block diagram of a remote control system for a semiconductor exposure apparatus according to a fourth embodiment.

FIG. 5 is an external view of a remote control system of the semiconductor exposure apparatus remotely controlled by a host computer.

FIG. 6 is an external view showing an example of a conventional remote control system for a semiconductor exposure apparatus.

FIG. 7 is a flowchart showing a manufacturing process of a micro device.

FIG. 8 is a detailed flowchart of the wafer process of FIG. 7;

[Explanation of symbols]

1: semiconductor exposure apparatus, 2, 11: operation unit, 3, 15: control unit, 4: main unit, 5: host computer, 6: communication line, 7, 9: remote operation prohibited state display unit, 8: remote operation Apparatus, 10: apparatus selection switch, 12: remote operation target switching section, 13: remote operation inhibition switch, 14: operation switching section.

Claims (9)

[Claims] 1. A method of remotely controlling a semiconductor exposure apparatus in which one or more semiconductor exposure apparatuses are remotely controlled from a remote control apparatus capable of remotely controlling the semiconductor exposure apparatuses, wherein the semiconductor exposure apparatuses individually perform the remote control as needed. Remote control method characterized by prohibiting the operation. 2. When the remote operation is prohibited from the semiconductor exposure apparatus, the fact that the remote operation of the semiconductor exposure apparatus is prohibited is displayed on the apparatus performing the remote operation via a communication line. The remote control method according to claim 1, wherein 3. The remote control according to claim 1, wherein the remote control is automatically prohibited in conjunction with a specific operation from the semiconductor exposure apparatus or a specific operation of the semiconductor exposure apparatus. Method. 4. The remote control method according to claim 3, wherein the specific operation is an operation for releasing a danger prevention function of the semiconductor exposure apparatus. 5. The remote control method according to claim 4, wherein the danger prevention function is a function of automatically stopping the semiconductor exposure apparatus when a door of the temperature control chamber is opened. 6. The remote operation according to claim 4, wherein when the danger prevention function is activated again in the remote operation prohibited state, the remote operation prohibited state is released in conjunction with the operation. Method. 7. A device manufacturing method, wherein a device is manufactured by operating a semiconductor exposure apparatus by the remote operation method according to claim 1. 8. A semiconductor exposure apparatus in which one or a plurality of semiconductor exposure apparatuses are remotely controlled from a remote control apparatus capable of remotely controlling the semiconductor exposure apparatus, wherein the semiconductor exposure apparatuses each have a remote operation prohibition unit for prohibiting a remote operation. A semiconductor exposure apparatus characterized by the above-mentioned. 9. The semiconductor device according to claim 8, further comprising means for automatically activating said remote control inhibiting means in conjunction with a specific operation from said semiconductor exposure apparatus or an operation of said semiconductor exposure apparatus. Exposure equipment.