JPH10170582A - Inspection jig for printed wiring board and inspection device therefor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To attain high reliability of inspection of printed wiring board with a high wiring density. SOLUTION: If a second insulation substrate 27A is pushed to a printed wiring board side in the state that a penetration hole 38A of the first insulation substrate 29A and the inspection point of a printed wiring board 21 overlap each other, both insulation substrates approach to each other, tip ends of each probe 34A in each penetration hole 38A of the first insulation substrate approach the inspection points and spring member 33A shrinks. After the tip ends of each probe touch the inspection points, as each probe 34A bends between the second insulation substrate and the printed wiring board, it gives pushing pressure to each inspection point. When the gap between the first and the second insulation substrates 29A and 27A becomes minimum, a ring member 33A touches the both substrates to terminate the approach and each probe stops increase of the pushing pressure given to the inspection points to optimize the pushing pressure and forms a state capable of inspection.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed wiring board inspection jig and an inspection apparatus using the same, and more particularly to a printed wiring board inspection jig suitable for inspecting a printed wiring board having a high wiring density. The present invention relates to an inspection device using the same.

[0002]

2. Description of the Related Art Generally, when manufacturing electronic equipment, printed wiring boards on which components such as a resistor, a capacitor, a diode, and a CPU can be mounted and which have an arbitrary wiring pattern are widely used.

In this type of printed wiring board, each component is mounted at a predetermined position to form a predetermined electronic circuit. Here, if there is an abnormality in the wiring pattern of the printed wiring board,
The circuit does not operate properly, and the electronic device becomes defective.

Therefore, usually, before mounting each component, the characteristics of each component are inspected, and the wiring pattern of the printed wiring board is also inspected for the suitability of conduction and insulation.
This type of printed wiring board inspection apparatus is disclosed in, for example,
It is disclosed in JP-A-9-1119279.

FIG. 11 is a schematic diagram showing the configuration of such a printed wiring board inspection apparatus. In this inspection apparatus, probes (inspection terminals) 4 are provided at positions corresponding to the through-hole portions 3 of a printed circuit board 2 to be inspected in an insulating terminal holding plate 1 so as to be able to freely advance and retreat, and the tip thereof is provided. Each of the probes 4 is provided with a spring 6 so that the portion 5 projects from the surface of the terminal holding plate 1 by a considerable distance.

[0006] Each probe 4 is connected to a measuring instrument 7 having a computer, and the terminal holding plate 1 is overlapped on the printed circuit board 2 and pressed. , And electrically connected to each other, and in this state, the presence or absence of a conduction state between the through-hole portions 3 is checked.

However, recent electronic devices tend to use printed wiring boards having fine wiring patterns, as typified by mobile phones and electronic organizers. Therefore, in the inspection device shown in FIG. 11, since the large probe 4 is used, there is a problem in that when inspecting a fine wiring pattern, adjacent probes 4 are in contact with each other and cannot be inspected.

Further, when wiring from the probe 4 to the measuring instrument 7 is performed, the connecting portion between the probe 4 and the wiring necessarily has a thick structure, and the adjacent probes 4 come into contact with each other at this connecting portion. Therefore, there is a problem that inspection cannot be performed.

From the viewpoint of solving this problem, by using a position conversion board and an anisotropic conductive member instead of the probe, high-precision inspection can be performed. An inspection apparatus for ensuring the reliability of electrical connection between the two is disclosed in Japanese Patent Application Laid-Open No. 3-183974.

FIG. 12 is a schematic diagram showing the configuration of such an inspection apparatus. The inspection apparatus includes an inspection head 11 having a large number of inspection electrodes 10, an intermediate pin system 12, a position conversion board (off-grid adapter) 13, a printed circuit board 14,
And a back adapter 15.

The mediating pin system 12 includes one anisotropic conductive sheet 12a, mediating pins 12b, and the other anisotropic conductive sheet 12c, and extends in a direction perpendicular to the surface of the printed wiring board 14 to be inspected. A function to absorb dimensional errors,
The anisotropic conductive sheet 12a,
It has a function of preventing a current from spreading in the horizontal direction inside 12c and maintaining a one-to-one correspondence between the inspection electrode 11 and the inspection target.

[0012]

However, such an inspection apparatus as described above has a limit in the reliability of the anisotropic conductive sheets 12a and 12c in the insulating direction (lateral direction). There is a problem that inspection is limited. For example, the reliability is insufficient to support inspection points at intervals of 250 μm or less.

The printed wiring board 14 and the anisotropic conductive sheets 12a and 12c, and the anisotropic conductive sheets 12a and 12c
In addition, there are many points of contact, such as wiring between the position conversion board 13 and the wiring between the position conversion board 13 and the inspection machine, so that there is a problem that an error easily occurs in the inspection and the reliability of the inspection is low.

Further, when inspecting a printed wiring board having a high wiring density, since the positions of densely inspected points are changed,
Since the position conversion board 13 needs to be multilayered, the inspection cost increases.

The present invention has been made in view of the above circumstances, and provides a printed wiring board inspection jig and an inspection apparatus using the same that are capable of highly reliably inspecting a printed wiring board having a high wiring density. The purpose is to do. A second object of the present invention is to provide an inspection jig for a printed wiring board which can prevent an increase in inspection cost and can be realized at low cost, and an inspection apparatus using the same.

[0016]

According to a first aspect of the present invention, there is provided an inspection jig for a printed wiring board for inspecting the presence or absence of a conduction abnormality and / or an insulation abnormality with respect to a wiring pattern of the printed wiring board. A first substrate having a contact surface in contact with a printed wiring board, a plurality of first through holes formed in advance corresponding to a plurality of inspection points of the wiring pattern individually, Also has a small diameter, a plurality of conductive wires whose tip is loosely inserted into each of the first through holes from the surface opposite to the contact surface, the contact surface in the first substrate on the surface opposite to the contact surface A second substrate having a plurality of second through holes that are arranged to face each other and individually penetrate the conductive wires, to which the conductive wires inserted into the second through holes are fixed; and When one substrate and the second substrate approach each other, the two substrates An elastic member that biases at least the first substrate so as to separate them from each other, and when the first substrate and the second substrate approach each other, at least the first member so as to determine a minimum gap between the two substrates. A gap determining mechanism that contacts one substrate, and a wire that individually holds a portion from a base end of each of the conductive wires to the second substrate at an interval wider than an interval between the second through holes. This is an inspection jig for a printed wiring board provided with a receiving jig.

According to a second aspect of the present invention, there is provided the inspection jig for a printed wiring board according to the first aspect, wherein the second substrate includes a thermoplastic adhesive for fixing the conductive wires. This is an inspection jig for a printed wiring board to which is applied.

According to a third aspect of the present invention, in the printed wiring board inspection jig according to the first aspect, a reinforcing member is partially bonded to the first substrate and / or the second substrate. This is an inspection jig for a printed wiring board.

According to a fourth aspect of the present invention, in the inspection apparatus for a printed wiring board using the inspection jig according to the first aspect, the distance between the first substrate and the second substrate is equal to or less than the distance. An energization state measuring means for selectively energizing a plurality of conductive wires among the conductive wires when the minimum gap is present, and measuring an energization state between the energized conductive wires; and Inspection of a printed wiring board, comprising: abnormality determination means for determining the presence or absence of an abnormality based on a measurement result by the measurement means and a predetermined inspection reference value; and a determination result output means for outputting a determination result by the abnormality determination means. Device.

According to a fifth aspect of the present invention, in the inspection apparatus for a printed wiring board according to the fourth aspect, a thermoplastic adhesive for fixing the conductive wires is used as the second substrate. This is an inspection device for the printed wiring board to which the coating is applied.

According to a sixth aspect of the present invention, in the inspection apparatus for a printed wiring board according to the fourth aspect, a reinforcing member is partially joined as the first substrate and / or the second substrate. This is a printed wiring board inspection device. (Supplementary Explanation) Next, the present invention as described above will be supplementarily described.

Since the conductive wire is movable in the first through hole, the first substrate desirably has a certain thickness and rigidity from the viewpoint of reliably guiding the tip of the conductive wire. In addition, the first substrate is required to have high hole workability from the viewpoint of forming the first through hole with high accuracy,
Furthermore, a high degree of dimensional stability that does not easily cause expansion and contraction is required.

Furthermore, the first substrate is required to have high flatness because it has a function of correcting the warpage of the printed wiring board when the first substrate comes into contact with the printed wiring board during inspection. As a material for the first substrate, engineering plastics such as polyether ether ketone, polyphenylene sulfide, and polyimide, ceramics, and sapphire glass can be used.

It is to be noted that it is difficult to form a highly accurate hole in the first substrate in proportion to the thickness of the material. Therefore, it may be thinned by engraving only in the vicinity of the hole making process, or the first substrate may be formed by joining a reinforcing member. In other words, the first substrate may be configured so that the rigidity is reinforced with a reinforcing member by forming the substrate main body with a material and a thickness capable of highly accurate drilling, even if the rigidity is somewhat sacrificed. Satisfies both requirements of rigidity and high precision drilling.

Examples of the reinforcing member include a frame-like member, a substrate having a through hole having a diameter larger than that of the substrate body of the first substrate, and the like. In addition, the above supplementary description regarding the first substrate is also applied to the second substrate.

The number of conductive wires corresponding to the number of points to be inspected is used. It is desirable that the material of the conductive wire has appropriate rigidity, and from the viewpoint of reducing inspection errors, it is preferable that the material has high electrical conductivity. Specifically, for example, high-speed steel is suitable.

Further, since there is a possibility that adjacent conductive wires may come into contact with each other, it is preferable to perform insulation treatment such as Teflon coating on portions other than both ends. In the present invention, the leading end of the conductive wire comes into contact with the printed wiring board, and the conductive wire bends and attempts to recover, thereby obtaining an appropriate pressing force between the conductive wire and the printed wiring board. The rigidity of the wire is very important. When the rigidity is low, the pressing force becomes insufficient, and the contact resistance value increases during the inspection.
When the rigidity is high, the pressing force becomes excessive, and the surface of the printed wiring board at the point to be inspected is damaged.

The second substrate only needs to have the second through hole at a position substantially identical to the first through hole in the first substrate when the second substrate is opposed to the first substrate. The reason is, if there is a large difference between the position of the first substrate and the large position, the conductive wire is inclined between the first substrate and the second substrate, and the side wall of each of the first through hole and the second through hole is formed. This is because the conductive wire is pressed strongly. That is, this is to avoid a problem that the conductive wire does not move smoothly when pressed, and the pressing force on the printed wiring board becomes inappropriate.

If the formation positions of the through holes are significantly different between the first substrate and the second substrate, the above-described problem occurs. However, as long as the operation of the probe is not hindered, the first through holes and the second It is preferable that the formation position is different from that of the through hole. The conductive wires are arranged at a high density and bend at the time of inspection. However, if the direction of bending is undefined, adjacent conductive wires may come into contact with each other, which hinders the operation.

Therefore, when aligning the bending directions of the conductive wires, it is effective to make the hole positions different between the first and second substrates. For example, a hole is formed at substantially the same position on the first substrate and the second substrate, and a state in which the first substrate is slightly rotated about the center thereof or a state in which the entire first substrate is shifted is mentioned. Can be The amount by which the hole positions are varied depends on the amount of deflection of the conductive wire, but is at most about 2 mm.

The second substrate is required to have such a strength that it is not deformed by a restoring force against the bending of each conductive wire. Specifically, a pressing force is applied to the printed wiring board from the end of the conductive wire corresponding to the restoring force against the bending of the conductive wire. On the other hand, this pressing force is also applied to the fixed portion of the conductive wire on the second substrate. Specifically, this pressing force is about 1 to 10 g per one conductive wire, but since there are several thousand conductive wires, it becomes several thousand times 1 to 10 g and becomes a second substrate. Join.
Therefore, the second substrate needs to have such strength that it does not deform even if it receives this pressing force.

The elastic member can easily obtain a desired stroke and can withstand repeated inspections.
Springs are preferred. The gap determining mechanism has a function of determining a minimum gap between the first substrate and the second substrate when pressed, for example, a rod-shaped member having one end as a free end, a ring member passed through the rod-shaped member, or the like is used. It is possible. The minimum gap between the two substrates is important because the conductive wire is fixed to the second substrate and thus substantially determines the pressure at which the conductive wire pushes the printed wiring board. The gap determining mechanism needs to reliably determine the minimum gap between the two substrates and to keep the minimum gap constant during the inspection period.

The wire receiving jig is a jig for keeping the interval between the conductive wires larger than the interval fixed to the second substrate and facilitating wiring to the inspection device. For example, a connector having connection terminals wider than the second through holes or a board having through holes wider than the second through holes can be applied.

By increasing the distance between the conductive wires, a short circuit with another conductive wire is prevented when wiring to the inspection device. Also, since the distance between the conductive wires can be sufficiently enlarged, the connection between each conductive wire and the wire receiving jig may be clamped with a clip-shaped receiving jig or swaged with the receiving jig. Various methods such as soldering can be selected.

Further, since a connection method having high electrical reliability can be selected, it is possible to reliably connect electrically. Similarly, the connection between the wire receiving jig and the cable to the inspection device can be obtained with high reliability.

Since the conductive wires are fixed to the second substrate, even if the distance between the conductive wires between the second substrate and the wire receiving jig is increased, the first substrate and the second substrate are not fixed. It does not affect the state of the conductive wire between the two.

The conduction measuring means is electrically connected to the conductive wires, and measures the resistance (may be a current value or a voltage (drop) value) between the conductive wires so that the two conductive wires can be measured. A switching means for selecting a conductive wire. This switching is performed sequentially, and the resistance value between each probe is measured.

The abnormality judging means sets a reference resistance value for judging conduction / insulation in advance, compares the reference resistance value with a measured value of the resistance by the conduction measuring means, and judges conduction or insulation. In this case, there is a determination method in which a certain resistance value is stored, and a measurement value equal to or higher than the resistance value is set to “insulated”, and a measurement value not exceeding the resistance value is set to “continuity”.
However, in the inspection of a printed wiring board, the following method is widely used in order to confirm whether or not the originally required performance of the printed wiring board is satisfied.

That is, since the points to be inspected on the printed wiring board are originally binarized into a conductive state or an insulated state,
They have completely different resistance values, for example, XΩ or less when in a conductive state and YΩ or more in an insulated state.

For this reason, a method is used in which the numerical values of XΩ and YΩ are stored in advance in the abnormality judging means, and when the measurement result is between XΩ and YΩ, it is judged to be defective. Accordingly, when the measurement result is between XΩ and YΩ, an abnormality can be detected as a poor conduction state where conduction is insufficient or a poor insulation state where insulation is insufficient.

Furthermore, it is determined whether or not the determination result indicating the conduction / insulation is valid using the connection information at the time of design, and the presence or absence of an abnormality is double inspected. Subsequently, advantages of the thermoplastic adhesive will be described.

According to the present invention, since the conductive wire is fixed to the second substrate, the tip of the conductive wire may be bent or worn due to repetition of the inspection, and the contact resistance may be increased. In this case, repairs such as cutting the end of the conductive wire or correcting it to an appropriate position may be performed. Here, by using a thermoplastic adhesive to fix the conductive wire to the second substrate in advance, there is an advantage that the conductive wire can be easily opened only by applying heat to the fixing portion at the time of repair.

Although the thermoplastic adhesive can be melted by applying heat, the second substrate and the conductive wire (or the coating material of the conductive wire) are used from the viewpoint of preventing adverse effects on others at the time of melting. Has a melting point lower than the melting point. Needless to say, it has a melting point higher than the ambient temperature. Specifically, a thermoplastic adhesive having a melting point in the range of about 100 ° C. to 120 ° C. is commercially available. For example, an adhesive for hot melt or an EVA adhesive can be used. (Operation) Therefore, according to the invention corresponding to claim 1, the first substrate is printed such that the first through hole of the first substrate and the inspection point of the printed wiring board overlap with each other. When the second substrate is pushed toward the printed wiring board while in contact with the wiring board, the first substrate and the second substrate approach each other, and the leading end of each conductive wire in each first through hole of the first substrate. Approaching the point to be inspected on the printed wiring board, the elastic member shrinks, and the tip of each conductive wire comes into contact with the point to be inspected on the printed wiring board. A pressure is applied to each point to be inspected on the printed wiring board as it bends between the two substrates. When a predetermined minimum gap is formed between the two substrates, the gap determining mechanism contacts at least one of the two substrates and Stop the approach of the substrate and reduce the pressing force applied to the point to be inspected by each conductive wire. Pressurized stops properly the pressing force,
Since a testable state is formed, a test for a printed wiring board having a high wiring density can be realized with high reliability by applying a current between the respective conductive wires through a wire receiving jig. In addition, an increase in inspection cost can be prevented, and the cost can be reduced.

According to a second aspect of the present invention, each conductive wire is fixed to the second substrate by a thermoplastic adhesive. Since the conductive wire can be easily released from the second substrate, even if each conductive wire is damaged, it can be repaired easily and at low cost.

According to a third aspect of the present invention, a reinforcing member is partially joined as the first substrate and / or the second substrate. By adopting a configuration that reinforces the rigidity of the substrate main body, the substrate main body can be formed of a material and a thickness that can be drilled with higher precision, and thus a printed wiring board having a higher density wiring pattern can be inspected. be able to.

According to a fourth aspect of the present invention, there is provided the inspection jig according to the first aspect, wherein the energization state measuring means determines that the distance between the first substrate and the second substrate is a minimum gap. ,
A plurality of conductive wires of each conductive wire are selectively energized, the energized state between the energized conductive wires is measured, and the abnormality determination unit performs a predetermined test with a measurement result obtained by the energized state measurement unit. The presence / absence of an abnormality is determined based on the reference value, and the determination result output means outputs the determination result by the abnormality determination means. You can expect.

Further, in the invention corresponding to claim 5, since each conductive wire is fixed to the second substrate by the thermoplastic adhesive, the functions corresponding to both claim 4 and claim 2 are simultaneously exhibited. Can be.

Further, in the invention corresponding to claim 6, since the reinforcing member is partially joined as the first substrate and / or the second substrate, the operation corresponding to both claim 4 and claim 3 is achieved. Can be performed simultaneously.

[0049]

Embodiments of the present invention will be described below with reference to the drawings. (First Embodiment) FIG. 1 is a schematic diagram showing a configuration of an inspection jig according to a first embodiment of the present invention, and FIG. 2 is an external view showing a configuration of the inspection jig. This inspection jig
It consists of two inspection heads 20A and 20B that are arranged facing each other along the vertical direction.
By sandwiching the printed wiring board 21 from above and below at B, the wiring pattern of the printed wiring board 21 can be inspected.

Since each of the inspection heads 20A and 20B has the same structure, the lower inspection head is given the suffix “A” and the upper inspection head is given the suffix “B”. Inspection head 20 with lower configuration
A will be described as a representative.

As shown in FIG. 2, this inspection head 20A
Is an octagonal bottom plate 22A, four stand plates 23A,
A plurality of conductive wires 24A, a connector 25A, a second reinforcing member 26A, a second insulating substrate 27A, a first reinforcing member 28A,
It includes a first insulating substrate 29A, an outer shaft 30A, an inner shaft 31A, a ring member 32A, and a spring member 33A.

The bottom plate 22A has an octagonal shape composed of four long sides and four short sides, and is formed so as to have long sides and short sides alternately. Each stand plate 23A is formed in a substantially H-shape rotated by 90 degrees so as to have a narrower width at the center portion than the upper and lower widths, and stands on the bottom plate 22A along its long side. Has been established. A connector 25A as a wire receiving jig for individually fixing the base end of each conductive wire 24A of each conductive wire 24A is attached to the stand plate 23A.

Each conductive wire 24A is made of, for example, high-speed steel having a length of about 20 cm and a diameter of 0.1 mm.
Rhodium plating is performed using nickel plating as a base plating from the viewpoint of preventing oxidation. Further, each conductive wire 2
4A is covered with Teflon except for about 5 mm at each end. In this embodiment, the conductive wire 24A is 5
Although each of the first and second insulating substrates 29A and 27A has five through holes, thousands of conductive wires 2 are actually used.
4A is used and thousands of through holes are formed.

Further, the conductive wire 24A has a probe function for inspection and a connector 25 from the probe area.
A and a wire function for transmitting an electric signal until A are continuously unified. The probe function corresponds to a region between the tip (inside the first insulating substrate 29A) and the second insulating substrate 27A in the conductive wire 24A, and the wire function is:
In the conductive wire 24A, it corresponds to a region between the second insulating substrate 27A and the connector 25A. Therefore, in the following description, the portion between the tip and the second insulating substrate 27A of the conductive wire 24A is also referred to as a probe 34A.

The connector 25A is attached to the stand plate 23A so as to penetrate the stand plate 23A. On the inner surface side, for example, the base ends of the conductive wires 24A are fixed by soldering at an interval of 1.27 mm. . The outer surface of the connector 25A is connected to each conductive wire 2 fixed to the inner surface.
It has a normal multi-pin portion that electrically connects to the 4A and that detachably holds a cable to the inspection device.

The second reinforcing member 26A has a rectangular frame shape having four long sides, and the lower part of each long side is attached to the upper part of the stand plate 23A. The material of the second reinforcing member 26A is preferably, for example, aluminum from the viewpoint of light weight, high strength, ease of processing, low cost, and the like.

As the second insulating substrate 27A, a resin substrate having a thickness of 2.5 mm is formed in a square shape, and the conductive wire 24
A for fixing with thermoplastic adhesive 35A through A.
Five through holes 36A having a diameter of 15 mm are formed and fixed on the second reinforcing member 26A.

The second insulating substrate 27A and the second reinforcing member 26A are each formed with two through holes 37A at four corners along a diagonal line. On the other hand, the first reinforcing member 28
A is also made of aluminum and has a square frame shape,
The first insulating substrate 29A is fixed on the upper part.

As the first insulating substrate 29A, a resin substrate having a thickness of 2.5 mm is formed in a square shape, and the conductive wire 24
5A, five through holes 38A having a diameter of 0.11 mm for guiding the tip of the probe 34A in and out freely.
That is, each conductive wire 24A is formed on the second insulating substrate 27A.
Is fixed with a thermoplastic adhesive 35A, but is not fixed to the first insulating substrate 29A.

Further, two shafts 30A and 31A are erected along the diagonal lines below four corners of the first reinforcing member 28A. The lower end of each shaft 30A, 31A is
The through holes 37A at the four corners of the second insulating substrate 27A and the second reinforcing member 26A are loosely inserted from above.

Here, in order to determine the minimum gap between the second insulating substrate 27A and the first reinforcing member 28A, the outer peripheral side shaft 30A has a larger diameter and a minimum height than each through hole 37A. A stainless steel ring member 32A that matches the gap is passed through, and further outside the ring member 32A,
A spring member 33A is passed so as to separate the second insulating substrate 27A from the first reinforcing member 28A. In addition, the ring member 32A is provided from the viewpoint that the minimum gap can be finely adjusted.
It is preferable to use a plurality of rings. Also,
When a plurality of rings are used, the heights of the rings may be different from each other, for example, according to functions for coarse adjustment and fine adjustment.

Further, the inner peripheral shaft 31A is provided with a limit point for separation by the spring member 33A. Therefore, after being loosely inserted into the inner peripheral through hole 37A, a lower end protruding from the through hole 37A has a through hole. A head 39A larger in diameter than 37A is attached. Note that the separation point corresponds to the maximum gap between the second insulating substrate 27A and the first reinforcing member 28A.

The difference between the maximum gap and the minimum gap (stroke gap) between the second insulating substrate 27A and the first insulating substrate 29A is adjusted to 1 mm. That is, the height of the ring member 32A is adjusted so that the distance between the lower part of the first reinforcing member 28A and the upper part of the ring member 32A is 1 mm. In addition, the probe 34
A tip is the first insulating substrate 29 at the time of non-inspection (at the time of the maximum gap).
A is substantially flush with the surface of A, and at the time of inspection (at the time of the minimum gap), it bends by about 1 mm in contact with the printed wiring board 21 and urges the printed wiring board 21 in accordance with the amount of bending. Will do. However, the numerical values relating to the stroke gap and the probes 34A and 34B are merely examples, and it goes without saying that various modifications can be made.

The inspection jig as described above is connected to the inspection device via a cable 40 connected to the connector 25A, as shown in FIG. This inspection device has a flat pressure unit 4
1, a switch 42, a power supply S, a galvanometer G, an input unit 43, an operation control unit 44, a memory 45, a comparison determination unit 46, and an output display unit 47.

The flat pressure section 41 has a press plate 48 on the upper side and a platen 49 on the lower side. The press plate 48 or the platen is attached to an operating rod of a hydraulic or pneumatic cylinder, and is relatively moved by hydraulic or pneumatic pressure. In the vertical direction and press each other. The upper press plate 4
8 has an inspection head 20B attached thereto, and a lower surface plate 49.
The inspection head 20A is attached to the
, The printed wiring board 21 on the inspection head 20A is sandwiched between the inspection heads 20A and 20B.

The switch 42 can be, for example, a multiplexer, and can switch the connection between the input terminal and the output terminal under the control of the operation control unit 44, and is connected to the connectors 25A and 25B of the inspection jig. Cable 40
Are individually connected to the ten output terminals.
The switch 42 has one of two input terminals connected to the positive terminal of the power source S and the positive terminal of the galvanometer G, and the other input terminal connected to the negative terminal of the power source S and the negative terminal of the galvanometer G. It is connected.

The input unit 43 is operated by an input operation of the operator.
It has a function of controlling the operation control unit 44. For example, a control signal input switch, dial, button, or the like, or a keyboard and a combination thereof can be used.

The operation control section 44 has a function of controlling on / off of the power supply S under the control of the input section 43 and a memory 45.
The function of controlling the connection state in the switch 42 based on the connection information in the switch and the function of controlling the start of the comparison judgment of the comparison judgment section 46 and the judgment signal received from the comparison judgment section 46 are given to the output display section 47. It has a function.

The memory 45 is readable / writable from the comparison / determination unit 46 and the operation control unit 44, and
The connection information indicating the continuity or insulation between the lands in the wiring pattern at the time of design 1 and the inspection reference value for judging the continuity or insulation with respect to the measurement result are stored. As the inspection reference value, for example, a current value, a resistance value, or a voltage drop amount can be used. However, here, the conduction determination resistance value Rlo and the insulation determination resistance value Rhi are used as the inspection reference values.

The comparing / determining section 46 compares the measured value measured by the galvanometer G with the inspection reference value in the memory 45 to determine the presence or absence of an abnormality. Specifically, under the control of the operation control unit 44, the comparison determination unit 46 refers to the inspection reference value in the memory 45 and determines the state indicated by the measured value as one of conduction / insulation, conduction failure / insulation failure. Function and
Based on this determination result and the connection information in the memory 45,
It has a function of giving a determination signal indicating the presence or absence of an abnormality to the output display unit 47 via the operation control unit 44.

The output display section 47 receives a determination signal given from the comparison / determination section 46 via the operation control section 45,
This is for outputting / displaying the presence / absence of an abnormality. For example, an alarm device such as a buzzer and a lamp, an image display device such as a CRT display, a printer, and the like can be used.

Next, the operation of the inspection apparatus configured as described above will be described. Note that, for convenience of description, reference numerals A and B are described in parallel, but an element of reference A acts on another element of reference A, and an element of reference B acts on another element of reference B. Needless to say. (Installation of Inspection Object) Now, in the lower inspection head 20A, the printed wiring board 21 to be inspected is placed on the first insulating substrate 29A such that each land in the lower wiring pattern and each through hole 38A overlap. Will be laid. Here, in each of the inspection heads 20A and 20B, the gap between the second insulating substrates 27A and 27B and the first reinforcing members 28A and 28B has a maximum value, and the tips of the probes 34A and 34B are shown in FIG. Thus, the through holes 38A, 3A of the first insulating substrates 29A, 29B
Within 8B, it is substantially flush with the surfaces of the first insulating substrates 29A and 29B. In addition, each ring member 32A, 32B
Is 1 mm away from the upper first reinforcing member 28A and the upper second insulating substrate 27B.

Subsequently, due to the pressing operation of the flat pressure portion 41, the upper inspection head 20B descends and the first insulating substrate 29B comes into contact with the printed wiring board 21, as shown in FIG.
Here, the through holes 38B of the inspection head 20B and the lands on the upper side of the printed wiring board 21 overlap each other as described above.

When the inspection head 20B further descends, if the printed wiring board 21 has warpage or distortion, the warp or the like is corrected to be flat, and the printed wiring board 21 is tightly sandwiched between the inspection heads 20A and 20B. It is.

Further, when the inspection head 20B descends, each spring member 33A,
As 33B shrinks, the gap between the first reinforcing members 28A, 28B and the second insulating substrates 27A, 27B becomes smaller, and the tips of the probes 34A, 34B are attached to the first insulating substrate 29.
A, 29B gradually approaches the surface. Each spring member 33A, 3
When 3B shrinks slightly, as shown in FIG.
The tips of A and 34B reach the surfaces of the first insulating substrates 29A and 29B and come into contact with the lands of the printed wiring board 21.

When the inspection head 20B further descends, as shown in FIG. 7, the probes 34A and 34B
Are the second insulating substrates 27A and 27B and the printed wiring board 21.
, And urges the printed wiring board 21 in accordance with the amount of bending. That is, the tip of each probe 34 </ b> A presses and contacts each land of the printed wiring board 21.

Further, as the inspection head 20B descends and the spring members 33A and 33B are prevented from contracting by the ring members 32A and 32B, as shown in FIG. 8, the second insulating substrates 27A and 27B. And the first reinforcing member 28
The gap between A and 28B becomes the minimum value, and the pressing operation of the flat pressure portion 41 ends. As a result, the printed wiring board 21 is ready for inspection.

Note that this testable state corresponds to a time when each of the spring members 33A and 33B is contracted by 1 mm. Also,
About 1 mm after the tips of the probes 34A and 34B come into contact with the lands correspond to the amount of bending or the pressing force of the probes 34A and 34B. That is, the inspection is performed under the same pressing condition. The (inspection) input unit 43 controls the operation control unit 44 by an input operation of the operator.

The operation control section 44 turns on the power supply S under the control of the input section 43, and controls the connection state between the input terminal and the output terminal of the switch 42 based on the connection information in the memory 45. , Each probe 34A, 34B
A voltage is applied between predetermined lands via. Thereafter, the operation control unit 44 causes the comparison determination unit 46 to start the comparison determination.

The comparison / determination section 46 refers to the inspection reference value in the memory 45 and determines the state indicated by the measured value of the galvanometer G as conduction / insulation or conduction failure / insulation failure. For example, the resistance value R1 is obtained from the current value measured by the galvanometer G, and the resistance value R1 is compared with the conduction determination resistance value Rlo and the insulation determination resistance value Rhi in the memory 45.

Here, when R1 ≦ Rlo, it is determined that the lands being measured are in a conductive state. When Rlo <R1 <Rhi, it is determined that the continuity between the lands is poor or the insulation is poor.

When Rhi ≦ R1, it is determined that each land is in an insulated state. The comparison / determination unit 46 creates a determination signal indicating the presence or absence of an abnormality based on the determination result and the connection information in the memory 45, and sends the determination signal to the output display unit 47 via the operation control unit 44. I do.

More specifically, the determination result is stored in the memory 45
When the connection information at the time of design matches, a determination signal indicating that there is no abnormality is transmitted. On the other hand, the judgment result and the memory 45
When the connection information does not match the connection information at the time of design, a determination signal indicating that there is an abnormality is transmitted. Note that information indicating the degree of abnormality, such as a conduction failure state or an insulation state, may be added to the determination signal.

The output display section 47 outputs / displays the presence or absence of an abnormality based on the determination signal. As mentioned above, the first
According to the embodiment, the first insulating boards 29A and 29B contact the printed wiring board 21 so that the through holes 38A and 38B of the first insulating boards 29A and 29B overlap the inspection points of the printed wiring board 21. In the state, the second insulating substrates 27A, 27
When B is pushed toward the printed wiring board 21, the first insulating substrates 29A and 29B and the second insulating substrates 27A and 27B approach each other, and the through holes 38 of the first insulating substrates 29A and 29B.
A, the tip of each probe 34A, 34B in 38B approaches the inspection point of the printed wiring board 21, and the spring member 3
After the ends of the probes 34A and 34B have contracted and the tips of the probes 34A and 34B have come into contact with the points to be inspected on the printed wiring board 21, the probes 34A and 34B are connected to the second insulating substrates 27A and 27B.
Pressing force is applied to each point to be inspected on the printed wiring board 21 as it bends between the first and second insulating boards 29A, 27A and between the first and second insulating boards 29B, 27B. When the minimum gap is reached, the ring members 33A and 33B come into contact with each other and approach the two substrates 29A and 27A, as well as the two substrates 29B and 29B.
Since the approach of the probe 27B is stopped and the increase of the pressing force applied to the point to be inspected by each of the probes 34A and 34B is stopped, the pressing force is optimized and the inspection can be performed, so that the desired conductive wires 24A and 24B can be formed. By energizing through the connectors 25A and 25B in between, the inspection of the printed wiring board with high wiring density can be realized with high reliability.

The probe function and the wire function (wiring)
And conductive wires 24A, 24
B, the probe 34A, 3
Since it is not necessary to provide a connection space between the 4B and the wire, it is possible to easily cope with a high-density wiring pattern. Inspection can be performed with high reliability.

Further, unlike the related art, since no position conversion board is used, an increase in inspection cost can be prevented, and the cost can be reduced. Further, the number of connection points from the probes 34A and 34B to the inspection device is small. For example, the probe area and the wire area are continuously realized by one conductive wire 24A and 24B, and the conductive wires 24A and 24B and the connector are connected. Since the connections between the cables 25A and 25B and the connectors 25A and 25B and the cable 40 to the inspection device have high reliability, unlike the conventional case, errors are less likely to occur in the inspection, and the reliability of the inspection can be improved.

Further, the conductive wires 24A, 24B are connected to the second insulating substrate 27 by the thermoplastic adhesives 35A, 35B.
A and 27B, the desired conductive wires 24A and 24B can be easily applied to the second insulating substrate 2 by applying heat.
7A and 27B, each conductive wire 24
Even if A and 24B are damaged, it can be easily and inexpensively repaired.

Further, since the bottom plates 22A and 22B are octagonal, the shafts 30A, 31A, 30B and 31B can be easily pulled out, so that the value of the minimum gap can be easily changed by replacing the ring members 32A and 32B. ing.

The first insulating substrates 29A, 29B and the second insulating substrates 27A, 27B are formed by frame-shaped reinforcing members 26A, 2B.
8A, 26B, and 28B are joined, so that the reinforcing members 26A, 28A, 26B, and 28B are compared with the case where the present invention is implemented without the reinforcing members 26A, 28A, 26B, and 28B.
28B, the insulating substrates 29A and 29B and the second insulating substrate 27
By reinforcing the rigidity of the A and 27B main bodies, the insulating substrate can be formed of a material and a thickness capable of more accurate drilling, so that a printed wiring board having a higher density wiring pattern is inspected. be able to.

At the time of actual inspection, the first reinforcing member 28
When the distance between A, 28B and the second insulating substrates 27A, 27B is the minimum gap, the operation control unit 44 selectively energizes two of the conductive wires 24A, 24B, and makes a comparison judgment. The unit 46 measures the energized state between the conductive wires 24A and 24B that are energized, determines whether there is an abnormality based on the measurement result and a predetermined inspection reference value, and outputs the determination result to the output display unit 47. , It is possible to expect a quick response when an abnormality is detected. (Second Embodiment) Next, an inspection apparatus according to a second embodiment of the present invention will be described.

FIG. 9 is a schematic diagram showing the configuration of an inspection jig in this inspection apparatus. FIG. 10 is an external view showing the configuration of this inspection jig. Parts corresponding to FIG. 1 to FIG. The same reference numerals are given and the detailed description is omitted, and only different portions are described here.

That is, the present embodiment is a modified configuration of the first embodiment, in which the wire receiving jig is changed. Specifically, as shown in FIGS. , 25B, stand plates 23A, 23B and bottom plate 2
Instead of 2A, 22B, four columns 51A, 51B erected at the four inner corners of the second reinforcing members 26A, 26B,
And rectangular resin substrates 52A and 52B having four corners fixed to the tips of the columns 51A and 51B.

Here, the resin substrates 52A and 52B function as wire receiving jigs, and are formed with through holes 53A and 53B for passing the conductive wires 24A and 24B. As the material of the resin substrates 52A and 52B, the same materials as the first and second insulating substrates 29A, 27A, 29B and 27B can be used.

Further, after penetrating the resin substrates 52A and 52B, a part of the conductive wires 24A and 24B is removed. The stripped portions are individually soldered to the wiring in the cable 40 leading to the inspection device.

With the above configuration, the same effects as those of the first embodiment can be obtained. (Other Embodiments) In the first embodiment,
The case where the inspection is performed by sandwiching the printed wiring board 21 from above and below using the two inspection heads 20A and 20B has been described. However, the present invention is not limited to this. Even with a configuration that inspects the wiring pattern of the printed wiring board using only the head,
The present invention can be implemented in a similar manner to obtain similar effects.

In the first embodiment, in the positional relationship between the second reinforcing members 26A, 26B and the second insulating substrates 27A, 27B, the second reinforcing members 26A, 26B are more closely connected to the stand plates 23A, 23B. However, the position of the second reinforcing members 26A, 26B and the second insulating substrates 27A, 27B is reversed, and the second insulating substrates 27A, 27B are positioned on the stand plate. 23A, 23
Even with the configuration located on the B side, the present invention can be implemented in the same manner and the same effect can be obtained.

Further, in the first embodiment, the case where the shape of the stand plates 23A and 23B is defined to be substantially H-shaped has been described. However, the present invention is not limited to this, and if the connectors 25A and 25B can be attached. Even if the shape is changed to an arbitrary shape, the present invention can be similarly implemented and the same effect can be obtained. Similarly,
Bottom plates 22A, 22B, first insulating substrates 29A, 29B, first reinforcing members 28A, 28B, second insulating substrates 27A, 27
Either B or the second reinforcing members 26A, 26B can be changed to an arbitrary shape, and even if the shape is changed, the present invention can be implemented in the same manner and the same effect can be obtained.

More specifically, the stand plates 23A, 23
B and the bottom plates 22A and 22B may be omitted depending on the installation environment of the inspection head. For example, the second reinforcing member 26
A, 26B holding means (stand plates 23A, 23B
The means (stand plates 23A, 23B) for holding the connectors 25A, 25B and the connectors 25A, 25B may be replaced by at least a vertically movable arm or a worktable.

Further, in the first embodiment, the substantially circular ring members 32A, 32B are connected to the outer shaft 30.
The case where the ring members 32A and 30B are passed has been described. However, the present invention is not limited to this case. And the same effect can be obtained.

Similarly, as a modification, the second insulating substrate 27
A, near the shaft 27B, the shaft 30A, 30B (or 31)
A, 31B) in the direction perpendicular to the axial direction is provided, and the shafts 30A, 30B (or 31A,
31B), the first insulating substrates 29A and 29B and the second insulating substrates 27A and 27B are inserted.
The present invention can be implemented in the same manner and the same effect can be obtained even when the minimum gap between the two is determined. In this case, a claw member may be provided instead of inserting the pin into the hole. Also, the shafts 30A, 30B (or 31A,
31B) is narrowed by a desired movable range with respect to the locations of the second insulating substrates 27A and 27B and the second reinforcing members 26A and 26B, and the movable portions of the second insulating substrates 27A and 27B and the second reinforcing members 26A and 26B are moved. The range may be determined.

In the first embodiment, the case where the ring members 32A and 32B and the spring members 33A and 33B are provided on the outer peripheral shafts 30A and 30B has been described.
The invention is not limited thereto, and the ring members 32A, 32B and / or the spring members 33A, 33B
It is needless to say that the present invention can be implemented in the same manner and the same effect can be obtained even in the configuration provided with.

In the first embodiment, the spring members 33A and 33B are interposed between the first reinforcing members 28A and 28B and the second insulating substrates 27A and 27B, and the first reinforcing members 28A and 28B ( Although the case where both the first insulating substrates 29A and 29B) and the second insulating substrates 27A and 27B are urged has been described, the present invention is not limited to this, and the spring members 33A and 33B are not limited thereto.
B (the second insulating substrates 27A and 27B and the second reinforcing member 2).
6A, 26B) without contacting the first reinforcing members 28A,
28B and the bottom plates 22A, 22B, and among the first and second insulating substrates, the first insulating substrates 29A, 29B
Even when only the first reinforcing members 28A and 28B are urged, the same effect can be obtained by implementing the present invention in the same manner.

Similarly, in the first embodiment, the ring members 32A, 32B are interposed between the first reinforcing members 28A, 28B and the second insulating substrates 27A, 27B, and the first reinforcing members 28A, 28B (First insulating substrate 29A, 29B)
The case where the minimum gap is determined by contacting both the second insulating substrate 27A and the second insulating substrate 27B has been described. However, the present invention is not limited to this, and the ring members (gap determining mechanism; The first and second insulating substrates are interposed between the first reinforcing members 28A and 28B and the bottom plates 22A and 22B (without contact with the insulating substrates 27A and 27B and the second reinforcing members 26A and 26B). Even if the minimum gap is determined by contacting only one of the insulating substrates 29A and 29B (first reinforcing members 28A and 28B), the same effect can be obtained by implementing the present invention in the same manner.

In the first embodiment, the thermoplastic adhesives 35A, 35A are used for fixing the conductive wires 24A, 24B.
5B was used, but is not limited to this.
Instead of A and 35B, a configuration in which the conductive wires 24A and 24B are fixed using a non-thermoplastic adhesive or a stopper, etc., can also implement the present invention in the same manner and obtain the same effects. it can.

In the first embodiment, the first and second reinforcing members 28A, 28B and 26A, 26B are used. However, the present invention is not limited to this, and the first reinforcing members 28A, 28B
Even if the second reinforcing members 28A, 28B are omitted and / or the inspection heads 20A, 20B are appropriately modified within a range of a design change in which materials, dimensions, and the like are changed, the present invention can be similarly implemented. The same effect can be obtained.

In the first embodiment, the method of positioning the printed wiring board 21 has not been described. However, the present invention is not limited to this. Two through holes are formed on the diagonal line of 29B, and the tip of each image fiber in two fiber cameras (or two optical fiber scopes) is inserted into each through hole of the first insulating substrate and fixed, and each image fiber is fixed. The present invention can be implemented in the same manner and the same effect can be obtained even in a configuration in which the printed wiring board is aligned based on the video obtained from the above.

Further, as a modified configuration of this type of alignment method, for example, a through hole is formed in the first insulating substrate 29B, and a rod-shaped optical acrylic tip is inserted into the through hole to make the optical acrylic first. A configuration in which the printed wiring board is fixed to the insulating substrate 29B or another reinforcing member or the like and the printed wiring board is aligned based on an image obtained from the optical acrylic can be applied. It is needless to say that the optical acrylic may be optical plastic or optical glass. In addition, the present invention can be implemented with various modifications without departing from the scope of the invention.

[0108]

As described above, according to the first aspect of the present invention, the first substrate contacts the printed wiring board so that the first through hole of the first substrate and the inspection point of the printed wiring board overlap. When the second substrate is pushed toward the printed wiring board in the state, the first substrate and the second substrate approach each other, and the leading end of each conductive wire in each first through hole of the first substrate is formed on the printed wiring board. After approaching the point to be inspected, the elastic member shrinks, and the tip of each conductive wire comes into contact with the point to be inspected on the printed wiring board, each conductive wire is bent between the second substrate and the printed wiring board. Along with this, a pressing force is applied to each point to be inspected on the printed wiring board, and when a predetermined minimum gap is formed between the two boards, the gap determining mechanism contacts at least one of the two boards and stops approaching the two boards. To stop the increase in the pressing force that each conductive wire exerts on the point to be inspected. And a testable state is formed. By applying a current between the desired conductive wires through a wire receiving jig, a high-density printed wiring board can be inspected with high reliability. In addition, it is possible to provide an inspection jig for a printed wiring board, which can prevent an increase in inspection cost and can be realized at low cost.

According to the second aspect of the present invention, since each conductive wire is fixed to the second substrate by the thermoplastic adhesive, in addition to the effect of the first aspect, by applying heat, each conductive wire is fixed. Since the wire can be easily released from the second substrate, it is possible to provide a printed wiring board inspection jig that can be easily and inexpensively repaired even if each conductive wire is damaged.

Further, according to the third aspect of the present invention, the first substrate and / or the second substrate are partially joined to the reinforcing member. Inspection of a printed wiring board that can form a board body with a material and thickness that enables more accurate drilling by reinforcing the rigidity of the printed wiring board, and thus can inspect a printed wiring board with a higher-density wiring pattern Jig can be provided.

According to the invention of claim 4, according to claim 1,
When the distance between the first substrate and the second substrate is the minimum gap, the current is selectively supplied to a plurality of conductive wires among the conductive wires. Measuring the energized state between the energized conductive wires, the abnormality determining means determines the presence or absence of an abnormality based on the measurement result by the energized state measuring means and a predetermined inspection reference value, and a determination result output means However, since the result of the judgment by the abnormality judging means is output, it is possible to provide a printed wiring board inspection apparatus which can expect a quick response when an abnormality is detected, in addition to the effect of the first aspect.

According to the fifth aspect of the present invention, since each conductive wire is fixed to the second substrate by the thermoplastic adhesive, the printed wiring board having the advantages of both the fourth and second aspects simultaneously. Can be provided.

Furthermore, according to the invention of claim 6, since the reinforcing member is partially joined as the first substrate and / or the second substrate, the effects of both claim 4 and claim 3 can be simultaneously achieved. It is possible to provide a printed wiring board inspection device that plays.

[Brief description of the drawings]

FIG. 1 is a schematic diagram showing a configuration of an inspection jig according to a first embodiment of the present invention.

FIG. 2 is an external view showing a configuration of an inspection jig in the embodiment.

FIG. 3 is a schematic diagram showing a configuration of an inspection apparatus using the inspection jig in the embodiment.

FIG. 4 is a schematic diagram for explaining an operation in the embodiment.

FIG. 5 is a schematic diagram for explaining an operation in the embodiment.

FIG. 6 is a schematic diagram for explaining an operation in the embodiment.

FIG. 7 is a schematic diagram for explaining an operation in the embodiment.

FIG. 8 is a schematic diagram for explaining an operation in the embodiment.

FIG. 9 is a schematic diagram showing a configuration of an inspection jig according to a second embodiment of the present invention.

FIG. 10 is an external view showing a configuration of an inspection jig according to the embodiment.

FIG. 11 is a schematic view showing a configuration of a conventional printed wiring board inspection apparatus.

FIG. 12 is a schematic diagram showing a configuration of a conventional printed wiring board inspection apparatus.

[Explanation of symbols]

20A, 20B ... inspection head 21 ... printed wiring board 22A, 22B ... bottom plate 23A, 23B ... stand plate 24A, 24B ... conductive wire 25A, 25B ... connector 26A, 26B ... second reinforcing member 27A, 27B ... second insulating substrate 28A, 28B ... first reinforcing member 29A, 29B ... first insulating substrate 30A, 30B ... outer peripheral shaft 31A, 31B ... inner peripheral shaft 32A, 32B ... ring member 33A, 33B ... spring member 34A, 34B ... probe 35A, 35B: Thermoplastic adhesive 36A-38A, 36B-38B, 53A, 53B ... Through-hole 39A, 39B ... Head 40 ... Cable 41 ... Flat pressure unit 42 ... Switch 43 ... Input unit 44 ... Operation control unit 45 ... Memory 46: comparison / determination unit 47: output display unit 51A, 51B: column 52A, 52B: resin substrate S: Power supply G ... galvanometer

Claims (6)

[Claims] 1. A wiring pattern of a printed wiring board,
An inspection jig for a printed wiring board for inspecting the presence or absence of a conduction abnormality and / or an insulation abnormality. A first substrate having a plurality of first through holes formed therein, having a smaller diameter than each of the first through holes, and having a tip from the surface opposite to the contact surface to each of the first through holes. A plurality of conductive wires to be loosely inserted, and a plurality of second through-holes arranged to face each other on a surface opposite to the contact surface of the first substrate, so that the conductive wires can be individually inserted, A second substrate to which each conductive wire inserted into each second through hole is fixed, and when the first substrate and the second substrate approach each other,
An elastic member that biases at least the first substrate so as to separate the two substrates from each other, when the first substrate and the second substrate approach each other,
A gap determining mechanism that contacts at least the first substrate so as to determine a minimum gap between the two substrates; and a part between the base end of each of the conductive wires and the second substrate through each of the second through holes. An inspection jig for a printed wiring board, comprising: a wire receiving jig which is individually held at an interval wider than an interval between holes. 2. The printed circuit board inspection jig according to claim 1, wherein said second substrate is coated with a thermoplastic adhesive for fixing said conductive wires. Inspection jig for wiring board. 3. The printed wiring board inspection jig according to claim 1, wherein the first substrate and / or the second substrate are partially joined with a reinforcing member. Plate inspection jig. 4. The inspection apparatus for a printed wiring board using the inspection jig according to claim 1, wherein when the distance between the first substrate and the second substrate is the minimum gap, Conducting state measuring means for selectively energizing a plurality of conductive wires among the conducting wires and measuring an energizing state between the energized conductive wires, a measurement result obtained by the conducting state measuring means and a predetermined inspection An inspection apparatus for a printed wiring board, comprising: an abnormality determination unit that determines the presence or absence of an abnormality based on a reference value; and a determination result output unit that outputs a determination result by the abnormality determination unit. 5. The printed wiring board inspection apparatus according to claim 4, wherein the second substrate is coated with a thermoplastic adhesive for fixing the conductive wires. Board inspection equipment. 6. The printed wiring board inspection apparatus according to claim 4, wherein the first substrate and / or the second substrate are partially joined with a reinforcing member. Inspection equipment.