JPH10163262A - Jig and method for exchanging surface mounted semiconductor package, circuit module having surface mounted semiconductor package, and electronic apparatus having the circuit module - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain an exchanging jig capable of suppressing the thermal effect on the periphery of a semiconductor package extremely to a low level, not having the necessity of secoring a space for exclusive use around this semiconductor package either as well, capable of performing the removing work of the semiconductor package easily, and making high-density packaging possible. SOLUTION: An exchanging jig 31 on the occasion of removing surface mounted semiconductor package 11 from a circuit board 10 has a flay jig body 32. The jig body 32 is supported by the package body 20 of the semiconductor package, is put between the package body and the circuit board, and generates heat and raises its temperature, or is heated to a temperature high enough to melt solder for joining a solder bump with a pad. And this jig body 32 has a plurality of openings 34 for letting the above-mentioned solder bumps to be inserted.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a jig used for exchanging a surface-mounted semiconductor package having a large number of solder balls such as a ball grid array, a method for exchanging the semiconductor package, and a method for exchanging a semiconductor package. The present invention relates to a circuit module surface-mounted on a substrate, and further to an electronic device such as a portable computer equipped with the circuit module.

[0002]

2. Description of the Related Art A ball grid array type (hereinafter referred to as BGA) semiconductor package is known as a surface mount type semiconductor package. This type of semiconductor package includes a plastic BGA using a printed circuit board as a package base, a ceramic BGA using a ceramic for the package base, and a tape BGA using a film for the package base. They are used properly according to the purpose.

[0003] Among such BGAs, the plastic BGA has an IC chip bonded to a printed board, and a synthetic resin mold material for molding the IC chip. A flat box-shaped package body is formed.

A large number of ball-shaped solder bumps are arranged in a matrix on the back surface of a printed circuit board. The solder bump functions as an external terminal of the semiconductor package, and is soldered to the back surface of the printed circuit board.

[0005] The BGA type semiconductor package is mounted on a circuit board. This circuit board has a mounting surface on which a semiconductor package is mounted. A large number of pads are arranged on the mounting surface in a matrix. The pads are electrically connected to conductor patterns formed on the circuit board, and solder bumps of a semiconductor package are soldered to these pads.

By the way, in this type of semiconductor package, only a peripheral portion is soldered because a soldering portion between a solder bump and a pad is located in a minute gap between a package body and a circuit board. QFP (quad flat pa
As in the case of (ckage), the soldered portion cannot be directly exposed to the outside.

For this reason, when it is necessary to replace a semiconductor package due to a defect of an IC chip or the like, conventionally, heat is applied to a mounting portion of the semiconductor package by a dedicated facility such as air reflow, and solder bumps and pads are applied. The semiconductor package is removed from the mounting surface of the circuit board by melting the solder joining the semiconductor package and the semiconductor package.

However, according to this configuration, not only the semiconductor package to be replaced but also other circuit components and semiconductor packages located around the semiconductor package are heated to a high temperature. The heat effect becomes extremely large, which causes failure.

In the case where a circuit component having low heat resistance is located around a semiconductor package to be replaced,
Before heating the mounting part of the semiconductor package, temporarily remove the low heat-resistant circuit components from the circuit board in advance,
It is necessary to prevent circuit components from being damaged by heat. For this reason, the number of work steps increases, and a problem arises in that the work of removing the semiconductor package requires a great deal of labor and labor.

In order to cope with such a problem, a replacement jig which can directly heat a soldered portion between the solder bump and the pad has been devised. This replacement jig has a jig main body including a plurality of flat heating portions in a comb shape. The jig main body is made of a material having thermal conductivity, and a connection port into which a heat source such as a soldering iron or a heater is inserted is formed at one end of the jig main body.

In order to remove a semiconductor package from a circuit board using such a replacement jig, first insert a heating section of the jig body into a gap between the circuit board and the package body, and place the heating section adjacent to the heating section. It is located between matching solder bumps. Since the heating unit is heated by heat transfer from the heat source, the heat of the heating unit is intensively transmitted to the soldering portion between the solder bump and the pad, and the solder joining the solder bump and the pad melts. .

Therefore, the soldering between the solder bumps and the pads can be easily released while suppressing the thermal effect on the circuit components around the semiconductor package to be replaced, and the semiconductor package can be removed.

[0013]

However, in the above-mentioned conventional replacement jig, it is necessary to insert a comb-shaped jig body into a gap between the semiconductor package and the circuit board. If another circuit component is disposed around the jig, the circuit component hinders the insertion of the jig body into the gap.

Therefore, in order to use the replacement jig, first, the circuit components located around the semiconductor package to be replaced are temporarily removed from the circuit board, and the jig body is placed around the semiconductor package. Space must be secured. Therefore, the number of work steps increases,
There is a problem that a great deal of labor and labor are required for the work of removing the semiconductor package.

In addition, since the replacement jig cannot be used unless there is a space around the semiconductor package, it is impossible to mount a large number of circuit components on the mounting surface of the circuit board at a high density. As a result, a dead space is generated on the circuit board, and the arrangement of the circuit components including the semiconductor package becomes unreasonable, and the circuit board becomes large in size.

The present invention has been made in view of such circumstances, and it is possible to minimize the influence of heat on the periphery of a semiconductor package to be removed, and to secure a dedicated space around the semiconductor package. It is possible to easily perform the work of removing the semiconductor package without having to perform the work, and to obtain a replacement jig and a replacement method that enable high-density mounting, and a circuit module, and furthermore, an electronic device equipped with the circuit module. is there.

[0017]

In order to achieve the above object, according to the present invention, a semiconductor package having a large number of solder bumps arranged in a matrix on a back surface of a package body is provided. Is a replacement jig used when detached from a circuit board having a large number of soldered pads, the replacement jig is supported by the package body, and is provided between the package body and the circuit board. A flat jig body that is interposed and heats or heats to a temperature sufficient to melt the solder that joins the solder bump and the pad; and a plurality of openings formed in the jig body and into which the solder bump enters. Part;

In such a configuration, to remove the semiconductor package from the circuit board, first, the jig body of the replacement jig is heated or heated. Then, since the solder bump is located inside the opening of the jig body, the heat of the jig body is directly transmitted to the solder joining the solder bump and the pad through the opening periphery of the opening. This solder melts. When the solder is melted, the replacement jig is slid along with the semiconductor package along the circuit board. By this slide, the opening periphery of the opening comes into contact with the solder in a molten state, and the solder is divided. As a result, the soldering between the solder bumps and the pads is released, and the semiconductor package can be removed from the circuit board.

Since such a replacement jig is mounted on the circuit board together with the semiconductor package in advance, the soldering portion between the solder bump and the pad can be directly and intensively heated, and the periphery of the semiconductor package can be heated. The thermal effect on the surface is reduced.

Moreover, it is not necessary to insert the jig body into a minute gap between the semiconductor package and the circuit board.
There is no problem even if other circuit components are arranged around the semiconductor package. Therefore, the troublesome and troublesome work of temporarily removing the circuit components around the semiconductor package is not required, and the number of work steps is reduced, and the work of removing the semiconductor package can be easily performed.

At the same time, there is no need to secure a space around the semiconductor package to be removed for the replacement jig to be taken in and out, so that a dead space can be eliminated from the circuit board, and high-density mounting is possible. .

According to a second aspect, the semiconductor package according to the first aspect has a plurality of bump rows in which a plurality of solder bumps are arranged in a row, and the bump rows are spaced from each other. And the openings of the jig main body are in the form of slits extending in the direction of the bump rows, and the number of these openings corresponds to the number of the bump rows. .

In this configuration, when the replacement jig is slid along the direction in which the bump rows are arranged, the solder bonding the plurality of solder bumps and pads on the bump rows is cut at a time. Therefore, the replacement jig need only be slid by an amount substantially corresponding to the arrangement interval of the bump rows, and the sliding amount of the replacement jig can be reduced.

As a result, a large space is not required around the semiconductor package to allow the replacement jig to slide, which is convenient for realizing high-density mounting, and a large number of solder bumps and pads are separated. Work can be performed efficiently in a short time.

According to a third aspect, the jig body according to the first aspect is made of a material having thermal conductivity.
The jig body includes a heat receiving unit to which a heat source is detachably connected.

In this configuration, when the semiconductor package generates heat during operation, the heat of the semiconductor package is transmitted to the jig main body, and this heat is diffused to the jig main body and radiated into the air by natural air cooling due to the diffusion. Is done. Therefore, when there is no need to replace the semiconductor package, the replacement jig can be used as a heat sink for the semiconductor package.

Further, since the jig body is heated by heat transfer from a heat source connected to the heat receiving portion, it is not necessary to incorporate a heat source in the jig body. Therefore, the configuration of the replacement jig can be simplified and provided at a low cost.

According to a fourth aspect of the present invention, there is provided a semiconductor package in which a large number of solder bumps are arranged in a matrix on a back surface of a package body. A replacement jig used when detaching from the circuit board having the pads, the replacement jig is supported by the package body, and has a temperature sufficient to melt the solder for joining the solder bumps and the pads. A jig body to be heated or heated; and a plurality of solder cutting portions formed on the jig body and interposed between adjacent solder bumps.

In this configuration, to remove the semiconductor package from the circuit board, first, the jig body of the replacement jig is heated or heated. Then, since the solder cutting portion of the jig main body is adjacent to the solder bump, the heat of the jig main body is directly transmitted to the solder joining the solder bump and the pad through the solder cutting portion, and this solder Melts. When the solder is melted, the replacement jig is slid along with the semiconductor package along the circuit board. With this slide, the edge of the solder cutting portion comes into contact with the molten solder, and the solder is cut. As a result, the soldering between the solder bumps and the pads is released, and the semiconductor package can be removed from the circuit board.

Since such a replacement jig is mounted on the circuit board together with the semiconductor package in advance, the soldering portion between the solder bump and the pad can be directly and intensively heated. The thermal effect on the surface is reduced.

Moreover, it is not necessary to insert the jig body into a minute gap between the semiconductor package and the circuit board.
There is no problem even if other circuit components are arranged around the semiconductor package. Therefore, the troublesome and troublesome work of temporarily removing the circuit components around the semiconductor package is not required, and the number of work steps is reduced, and the work of removing the semiconductor package can be easily performed.

At the same time, there is no need to secure a space around the semiconductor package to be removed for the replacement jig, so that a dead space can be eliminated from the circuit board, and high-density mounting is possible. .

According to a fifth aspect, the semiconductor package according to the fourth aspect has a plurality of bump rows in which a plurality of solder bumps are arranged in a row, and the bump rows are spaced from each other. Are arranged in parallel with each other, and the solder cutting portions of the jig body each have a bar shape extending along the direction of the bump rows, and the bump rows are arranged between these solder cutting sections. I have.

In this configuration, when the replacement jig is slid along the direction in which the bump rows are arranged, the solder joining the plurality of solder bumps and pads on the bump rows is cut at once by the solder cutting section. You. Therefore, the replacement jig need only be slid by an amount substantially corresponding to the arrangement interval of the bump rows, and the sliding amount of the replacement jig can be reduced.

As a result, it is not necessary to provide a large space around the semiconductor package to allow the replacement jig to slide, which is convenient for realizing high-density mounting, and is effective in separating a large number of solder bumps and pads. Work can be performed efficiently in a short time.

According to a sixth aspect of the present invention, there is provided a semiconductor package having a large number of solder bumps arranged in a matrix and a circuit having a large number of pads to which the solder bumps are soldered. A method of detaching from a substrate and exchanging, comprising preparing an exchange jig having a plurality of solder cutting portions interposed between the solder bumps, attaching the exchange jig to the semiconductor package, and A first step of interposing a solder cutting portion of the jig between adjacent solder bumps of the semiconductor package;
The second step of soldering the solder bumps of the semiconductor package to the pads on the circuit board and positioning the solder cutting portion of the replacement jig between the semiconductor package and the circuit board; A third step of melting the solder joining the solder bumps and pads by heating or heating the replacement jig; and connecting the replacement jig with the semiconductor package in a state where the solder is melted. A fourth step of sliding along the board and cutting the solder at the solder cutting portion of the replacement jig to separate the solder bumps and the pads from each other; a direction in which the replacement jig is moved away from the circuit board And removing the semiconductor package from the circuit board by moving the semiconductor package to the circuit board.

According to this method, the replacement jig is previously mounted on the circuit board together with the semiconductor package.
The soldered portion between the solder bump and the pad can be directly and intensively heated, and the influence of heat on the periphery of the semiconductor package is reduced. Moreover, when the solder is melted, it is not necessary to insert the jig body into a minute gap between the semiconductor package and the circuit board. Even if other circuit components are arranged around the semiconductor package, no trouble occurs. Absent. Therefore, the troublesome and troublesome work of temporarily removing the circuit components around the semiconductor package as in the related art is not required at all, and the work man-hour is reduced accordingly, and the work of removing the semiconductor package can be easily performed. .

At the same time, there is no need to secure a space around the semiconductor package to be removed for inserting and removing the replacement jig, so that a dead space can be eliminated from the circuit board, and high-density mounting becomes possible. .

According to a seventh aspect of the present invention, there is provided a semiconductor package in which a large number of solder bumps are arranged in a matrix on a back surface of a package body; and a mounting surface on which the semiconductor package is mounted. A circuit board having a large number of pads corresponding to the solder bumps arranged in a matrix on the mounting surface; and soldering the solder bumps of the semiconductor package to the pads of the circuit board. It is assumed that the circuit module consists of And, a jig used when exchanging the semiconductor package is arranged between the semiconductor package and the circuit board, and the jig has thermal conductivity,
In addition, there is provided a flat plate-shaped jig body which is heated or heated to a temperature sufficient to melt the solder for bonding the solder bump and the pad, and the jig body is supported by the package body. And a plurality of openings into which the solder bumps enter.

In this configuration, to remove the semiconductor package from the circuit board, first, the jig body of the replacement jig is heated or heated. Then, since the solder bump is located inside the opening of the jig body, the heat of the jig body is directly transmitted to the solder joining the solder bump and the pad through the opening periphery of the opening. This solder melts. When the solder is melted, the replacement jig is slid along with the semiconductor package along the circuit board. By this slide, the opening periphery of the opening comes into contact with the solder in a molten state, and the solder is divided. As a result,
The soldering between the solder bumps and the pads is released, and the semiconductor package can be removed from the circuit board.

Since such a replacement jig is mounted on the circuit board together with the semiconductor package in advance, the soldering portion between the solder bump and the pad can be directly and intensively heated, and the periphery of the semiconductor package can be heated. The thermal effect on the surface is reduced. Moreover, when melting the solder, it is not necessary to insert the jig body into a minute gap between the semiconductor package and the circuit board. Even if other circuit components are arranged around the semiconductor package, no trouble is caused. Absent. Therefore, the troublesome and troublesome work of temporarily removing the circuit components around the semiconductor package as in the related art is not required, and accordingly, the number of work steps is reduced, and the work of removing the semiconductor package can be easily performed. .

At the same time, there is no need to secure a space for inserting and removing the replacement jig around the semiconductor package to be removed, so that a dead space can be eliminated from the circuit board, and high-density mounting is possible. .

According to claim 8, the semiconductor package according to claim 7 has a plurality of bump rows in which a plurality of solder bumps are arranged in a row, and these bump rows are spaced apart from each other. And the openings of the jig main body are in the form of slits extending in the direction of the bump rows, and the number of these openings corresponds to the number of the bump rows. .

In this configuration, when the replacement jig is slid in the direction in which the bump rows are arranged, the solder joining the plurality of solder bumps and pads on the bump rows is cut at a time. Therefore, the replacement jig need only be slid by an amount substantially corresponding to the arrangement interval of the bump rows, and the sliding amount of the replacement jig can be reduced.

As a result, there is no need for a large space around the semiconductor package to allow the replacement jig to slide, which is convenient for realizing high-density mounting, and is effective in separating a large number of solder bumps and pads. Work can be performed efficiently in a short time.

In order to achieve the above object, an invention according to claim 9 is a semiconductor package in which a large number of solder bumps are arranged in a matrix on the back surface of a package body; a mounting surface on which the semiconductor package is mounted. A circuit board having a large number of pads corresponding to the solder bumps arranged in a matrix on the mounting surface; and soldering the solder bumps of the semiconductor package to the pads of the circuit board. It is assumed that the circuit module consists of And, a jig used when exchanging the semiconductor package is arranged between the semiconductor package and the circuit board, and the jig has thermal conductivity,
In addition, it has a jig body that is heated or heated to a temperature sufficient to melt the solder that joins the solder bump and the pad. The jig body is supported by the package body and is adjacent to the jig body. It has a plurality of solder cutting portions interposed between the solder bumps.

In this configuration, to remove the semiconductor package from the circuit board, first, the jig body of the replacement jig is heated or heated. Then, since the solder cutting portion of the jig main body is adjacent to the solder bump, the heat of the jig main body is directly transmitted to the solder joining the solder bump and the pad through the solder cutting portion, and this solder Melts. When the solder is melted, the replacement jig is slid along with the semiconductor package along the circuit board. With this slide, the edge of the solder cutting portion comes into contact with the molten solder, and the solder is cut. As a result, the soldering between the solder bumps and the pads is released, and the semiconductor package can be removed from the circuit board.

Since such a replacement jig is mounted on the circuit board together with the semiconductor package in advance, the soldering portion between the solder bump and the pad can be directly and intensively heated, and the periphery of the semiconductor package can be heated. The thermal effect on the surface is reduced.

Further, it is not necessary to insert the jig body into a minute gap between the semiconductor package and the circuit board.
There is no problem even if other circuit components are arranged around the semiconductor package. Therefore, the troublesome and troublesome work of temporarily removing the circuit components around the semiconductor package is not required, and the number of work steps is reduced, and the work of removing the semiconductor package can be easily performed.

At the same time, there is no need to secure a space around the semiconductor package to be removed for the replacement jig, so that a dead space can be eliminated from the circuit board, and high-density mounting is possible. .

According to a tenth aspect, the semiconductor package according to the ninth aspect has a plurality of bump rows in which a plurality of solder bumps are arranged in a row.
The solder cutting portions of the jig body are formed in a bar shape extending along the direction of the bump rows, and are arranged in parallel with an interval therebetween. Columns are arranged.

In this configuration, when the replacement jig is slid along the direction in which the bump rows are arranged, the solder joining the plurality of solder bumps and pads on the bump rows is separated at a time by the solder cutting section. You. Therefore, the replacement jig need only be slid by an amount substantially corresponding to the arrangement interval of the bump rows, and the sliding amount of the replacement jig can be reduced.

As a result, it is not necessary to provide a large space around the semiconductor package to allow the replacement jig to slide, which is convenient for realizing high-density mounting. In addition, a large number of solder bumps and pads can be separated. Work can be performed efficiently in a short time.

According to the eleventh aspect, the jig body according to the ninth aspect includes a heat receiving portion to which a heat source is detachably connected. In this configuration, when the semiconductor package generates heat during operation, the heat of the semiconductor package is transmitted to the jig main body, and the heat is diffused to the jig main body and is radiated into the air by natural air cooling due to the diffusion. Therefore, when there is no need to replace the semiconductor package, the replacement jig can be used as a heat sink for the semiconductor package.

Further, since the jig body is heated by heat transfer from a heat source connected to the heat receiving portion, it is not necessary to incorporate a heat source in the jig body. Therefore, the configuration of the replacement jig can be simplified and provided at a low cost.

In order to achieve the above object, an electronic device according to the twelfth aspect is provided with a box-shaped housing; an input means arranged on an upper surface of the housing for inputting information; A circuit board that is removably housed inside the body and has a mounting surface on which a number of pads are arranged in a matrix; and a surface that is surface-mounted on the mounting surface of the circuit board and has a back surface facing the mounting surface, A semiconductor package having a large number of solder bumps soldered to the pads on the back surface; and a replacement jig supported by the semiconductor package and mounted on the circuit board integrally with the semiconductor package. I have. The replacement jig has thermal conductivity and has a jig body interposed between the semiconductor package and the circuit board, and the jig body joins the solder bumps and the pads. It is heated or heated to a temperature sufficient to melt the solder to be soldered, and includes a plurality of solder cutting portions interposed between the adjacent solder bumps.

In this configuration, to remove the semiconductor package from the circuit board, the circuit board is taken out of the housing and the jig body of the replacement jig is heated or heated. Then, since the solder cutting portion of the jig main body is adjacent to the solder bump, the heat of the jig main body is directly transmitted to the solder joining the solder bump and the pad through the solder cutting portion, and this solder Melts. When the solder is melted, the replacement jig is slid along with the semiconductor package along the circuit board. With this slide, the edge of the solder cutting portion comes into contact with the molten solder, and the solder is cut. As a result, the solder bump and the pad are separated from each other, and the semiconductor package can be removed from the circuit board.

Since such a replacement jig is mounted on the circuit board together with the semiconductor package in advance, the soldering portion between the solder bump and the pad can be directly and intensively heated, and the periphery of the semiconductor package can be heated. The thermal effect on the surface is reduced.

Further, it is not necessary to insert the jig body into a minute gap between the semiconductor package and the circuit board.
There is no problem even if other circuit components are arranged around the semiconductor package. Therefore, the troublesome and troublesome work of temporarily removing the circuit components around the semiconductor package is not required, and the number of work steps is reduced, and the work of removing the semiconductor package can be easily performed.

At the same time, it is not necessary to secure a space around the semiconductor package to be removed for the replacement jig, so that a dead space can be eliminated from the circuit board, and high-density mounting is possible. .

Since the jig body has thermal conductivity,
When the semiconductor package generates heat during operation, the heat of the semiconductor package is transmitted to the jig body. This heat is diffused into the jig main body, and is radiated to the inside of the housing by natural air cooling due to the diffusion, and is released outside through the housing. Therefore, when there is no need to replace the semiconductor package, the replacement jig can be used as a heat sink for the semiconductor package.

[0062]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a first embodiment of the present invention will be described with reference to FIGS. FIG. 1 shows a portable computer 1 as an electronic device. This computer 1 has a flat box-shaped housing 2
And a flat display unit 3 supported by the housing 2.

The housing 2 is divided into a base 4 and an upper cover 5 detachably connected to the base 4. The base 4 has a flat bottom wall 4a. The upper cover 5 has an upper wall 5a facing the bottom wall 4a. A front portion of the upper wall 5a is a flat armrest 6, and a keyboard 7 as a means for inputting information is disposed behind the armrest 6.

The display unit 3 is supported at the rear end of the housing 2 via a hinge shaft 8. Therefore, the display unit 3 is rotatable between a closed position that covers the armrest 6 and the keyboard 7 from above and an open position that stands up behind the keyboard 7.

A circuit module 9 is housed inside the housing 2. The circuit module 9 includes a circuit board 10 and
The semiconductor device includes a BGA type semiconductor package 11 mounted on the circuit board 10 and other circuit components 12 disposed adjacent to the semiconductor package 11.

The circuit board 10 is detachably supported on the bottom wall 4 a of the housing 2. This circuit board 10
As shown in FIG. 6A, an insulating substrate 13 made of, for example, glass epoxy or polyimide is provided. On the insulating substrate 13, a conductor pattern 14 is formed.

The surface of the insulating substrate 13 has a flat mounting surface 13.
a. As shown in FIG. 7, a large number of pads 15 are arranged in a matrix on the mounting surface 13a. These pads 15 are connected to the conductive patterns 14.
Is electrically connected to Each pad 15 has a circular planar shape, and the surface of each pad 15 is
6. The solder layer 16 is formed by printing a solder paste on the surface of the pad 15.

The insulating substrate 13 is covered with a solder resist layer 18. This solder resist layer 18
Is removed at the portion corresponding to the pad 15.

As shown in FIG. 2, the semiconductor package 11 has a package body 20. The package body 20 has a flat rectangular box shape. The package body 20 includes a printed circuit board 21 as a package base material, an IC chip 22 mounted on the surface 21 a of the printed circuit board 21 and generating heat during operation, and a synthetic resin for molding the IC chip 22 on the printed circuit board 21. Alternatively, a mold member 23 made of ceramic is provided. A wiring pattern 24 is formed on the front surface 21a of the printed circuit board 21, and the IC chip 22 is wire-bonded to the wiring pattern 24.

The back surface 21b of the printed circuit board 21 is not covered with the molding material 23. On the back surface 21b, a large number of connection pads 26 as shown in FIG. I have. Connection pad 2
6 is electrically connected to the wiring pattern 24. The back surface 21b of the printed board 21 is covered with a solder resist layer 25. The solder resist layer 25 is removed at a position corresponding to the connection pad 26.

The connection pads 26 of the printed circuit board 21
The spherical solder bumps 27 are respectively joined. The outer peripheral surfaces of the solder bumps 27 are each covered with a solder layer 28, and the solder bumps 27 and the connection pads 26 are joined to each other by the solder layer 28.

The solder bump 27 is connected to the semiconductor package 11
Of the circuit board 1
0 so as to correspond to the pad 15 of the printed circuit board 2.
They are arranged in a matrix on one back surface 21b. That is, as shown in FIG.
Reference numeral 7 denotes a plurality of bump arrays 29 on the back surface 21b of the printed circuit board 21. In each of the bump rows 29, a plurality of solder bumps 27 are arranged in a row with an interval therebetween, and the bump rows 29 are arranged in parallel with an interval between each other. Therefore, a gap 30 is formed between the adjacent solder bumps 27.

The solder bump 27 is made of solder having a higher melting point than the solder layers 16 and 28. The semiconductor package 11 having such a configuration is mounted on the circuit board 10 by a reflow soldering method. Describing this mounting procedure, first, the semiconductor package 11 is supplied to the mounting surface 13a of the circuit board 10, and the solder bumps 27 are made to correspond to the desired pads 15. Next, the circuit board 10 and the semiconductor package 11 are housed in a reflow furnace, and the circuit board 10 and the semiconductor package 11 are stored.
Heat. By this heating, the solder layers 16 and 28 are melted and integrated with each other, and the solder bump 27 and the pad 15 are joined via the solder layers 16 and 28. As a result, the semiconductor package 11 is electrically connected to the pads 15 and is fixed to the circuit board 10.

Incidentally, a replacement jig 31 as shown in FIG. 8 is integrally mounted on a mounting portion of the semiconductor package 11 in the circuit module 9. The replacement jig 31 is used when removing the semiconductor package 11 from the circuit board 10. The replacement jig 31 will be described below.

As shown in FIGS. 2 and 8, the replacement jig 31 includes a jig main body 32. The jig body 32
It is made of a lightweight aluminum alloy material with excellent thermal conductivity. The jig main body 32 has a flat plate shape having a slightly larger planar shape than the package main body 20 of the semiconductor package 11. The thickness of the jig body 32 is set to be smaller than the diameter of the solder bump 27.

A plurality of openings 34 are formed in the jig body 32. The opening 34 is provided in the semiconductor package 1.
Each of the bump rows 29 corresponds to one of the bump rows 29, and has a slit shape extending in the longitudinal direction of the bump row 29. The length L1 of the opening 34 in the long axis direction is set larger than the entire length of the bump row 29, and the length L2 of the opening 34 in the end axis direction is set larger than the diameter of the solder bump 27. ing. The openings 34 are arranged in parallel with an interval therebetween, and the number of the openings 34 matches the number of the bump rows 29.

A plurality of solder cutting portions 35 are formed between adjacent openings 34. The solder cutting portion 35 has a bar shape extending in the direction of the bump row 29, and these solder cutting portions 35 are connected to the opening periphery 34 a of the opening 34.

The jig body 32 is overlaid on the back surface 21 b of the printed circuit board 21 of the semiconductor package 11. In this case, the bump rows 29 of the semiconductor package 11 enter the insides of the openings 34 of the jig main body 32, and the solder cutting sections 35 are inserted into the gaps 30 between the adjacent bump rows 29.
Is arranged. Then, as shown in FIG. 6A, the opening edge 34a connected to the solder cutting portion 35 and the solder bump 27 face each other. This opening edge 3
4a and the outer surface of the jig main body 32 including the solder cutting portion 35,
It is covered with an insulating film 36 having both heat resistance and electric insulation. Therefore, the jig body 32 and the solder bump 2
7 and the printed circuit board 21 are kept electrically insulated.

The jig body 32 includes a pair of heat receiving portions 37a, 37a.
7b are integrally provided. The heat receiving portions 37 a and 37 b are arranged on the outer peripheral portion of the jig main body 32 so as to be separated from each other in the longitudinal direction of the opening 34. Therefore, the heat receiving portions 37a and 37b face each other with the opening 34 interposed therebetween.

At the corners defined by the lower ends of the heat receiving portions 37a and 37b and the upper surface of the jig body 32, engagement grooves 38a and 3 are formed.
8b are formed, and the printed board 21 of the semiconductor package 11 is detachably engaged with the engagement grooves 38a and 38b. By this engagement, the jig body 3
2 and the semiconductor package 11 are integrated, and the jig body 3
2 is superimposed on the back surface 21b of the printed circuit board 21.

Therefore, when the semiconductor package 11 is mounted on the circuit board 10, the jig main body 32 is interposed between the semiconductor package 11 and the circuit board 10.

The heat receiving portions 37a and 37b are respectively
It has. The end of the insertion port 40 is connected to the jig main body 32.
The sheath heater 41 as a heat source is removably inserted into these insertion ports 40.

Therefore, the sheath heater 4 is
1 is inserted, the heat of the sheath heater 41 is
The heat is transmitted to the jig main body 32 through 7a and 37b, and the jig main body 32 is heated to a temperature sufficient to melt the solder layers 16 and 28 joining the solder bump 27 and the pad 15. ing.

A procedure for replacing the semiconductor package 11 when a defect occurs in the IC chip 22 of the semiconductor package 11 in such a configuration will be described. First, the circuit board 10 is taken out of the housing 2 and
The sheath heater 41 is inserted into the insertion opening 40 of the replacement jig 31 mounted on the circuit board 10 together with the semiconductor package 11.

The heat of the sheath heater 41 is transferred to the heat receiving section 37.
a, 37b, and is transmitted to the jig body 32, and the solder cutting portion 35 including the opening peripheral edge 34a is heated to a temperature sufficient to melt the solder layers 16, 28 joining the pad 15 and the solder bump 27. .

Then, the opening peripheral edge 34a of the jig body 32
Is adjacent to the solder bump 27, the heat of the jig body 32 is directly transmitted to the solder layers 16, 28, and the solder layers 16, 28 are melted. When the solder layers 16 and 28 are melted, the replacement jig 31 is moved together with the semiconductor package 11 along the mounting surface 13a of the circuit board 10 into the bump row 29, as shown by arrows in FIG. 6B and FIG. Slide in the array direction.

By this slide, the opening periphery 34 a of the opening 34, that is, the solder cutting portion 35 comes into contact with the solder layers 16 and 28 in the molten state, and the plurality of solder bumps 27 and the pads 15 on the bump row 29 are connected. Solder layer 1 joined
Cut 6,28 at a time. As a result, the solder bump 27
And the pad 15 are separated, and the soldering of the semiconductor package 11 is released.

Finally, the semiconductor package 11 is pulled up in a direction away from the mounting surface 13a of the circuit board 10, and the semiconductor package 11 is removed from the circuit board 10, thereby completing a series of operations.

According to such a configuration, the replacement jig 31 to be heated is mounted on the circuit board 10 together with the semiconductor package 11 in advance, and the solder cutting portion 35 of the jig body 32 is provided.
Are adjacent to the solder layers 16 and 28 joining the solder bumps 27 and the pads 15, so that the solder layers 16 and 28
Can be directly and intensively heated. Therefore, the influence of heat on other circuit components 12 located around the semiconductor package 11 can be reduced.

Further, it is not necessary to insert the replacement jig 31 into a minute gap between the semiconductor package 11 and the circuit board 10, and even if another circuit component 12 is arranged around the semiconductor package 11, No problem occurs. Therefore, the troublesome and troublesome work of once removing the circuit component 12 located around the semiconductor package 11 as in the related art becomes unnecessary, and the work man-hour is reduced by that much, and the work of removing the semiconductor package 11 becomes easy. Can be performed.

In particular, the replacement jig 31 is slid in the direction in which the bump rows 29 are arranged, and the solder cutting portion 35 of the replacement jig 31 is interposed between the adjacent bump rows 29. By simply sliding the replacement jig 31 by an amount corresponding to the arrangement interval of the bump rows 29, the solder layers 16, 28 joining all the solder bumps 27 and the pads 15 can be separated.

Therefore, the sliding amount of the replacement jig 31 is small, and a large space for allowing the replacement jig 31 to slide around the semiconductor package 11 is not required. Therefore, it is convenient for realizing high-density mounting, and the work of separating a large number of solder bumps 27 and pads 15 can be efficiently performed in a short time.

At the same time, according to the above configuration, the replacement jig 31 is mounted on the circuit board 10 integrally with the semiconductor package 11 in advance, so that the replacement jig 31 is placed around the semiconductor package 11 to be removed. There is no need to secure space for access. Therefore, the circuit board 10
Dead space can be eliminated from above, and high-density mounting is possible.

The replacement jig 31 has a heat receiving portion 37.
Since the sheath is heated to a desired temperature by inserting the sheath heater 41 into the a and 37b, it is not necessary to incorporate a heat source in the replacement jig 31, and the configuration of the replacement jig 31 can be simplified. Therefore, the cost of the replacement jig 31 can be reduced.

Further, a jig body 32 having thermal conductivity is provided.
Is in contact with the semiconductor package 11, and when the semiconductor package 11 generates heat with the operation of the computer 1, the heat of the semiconductor package 11 is transferred to the jig main body 32.
Transmitted to. The heat of the semiconductor package 11 is diffused to the jig main body 32, is radiated to the inside of the housing 2 by natural air cooling by the diffusion, and is released into the air through the housing 2.

Therefore, when there is no need to replace the semiconductor package 11, the replacement jig 31 can be used as a heat sink for the semiconductor package 11. Therefore, it is not necessary to house a dedicated heat sink inside the housing 2, and the inside of the housing 2 having a limited size can be effectively used.

Note that the present invention is not limited to the first embodiment, and FIG. 9 shows a second embodiment of the present invention. In the second embodiment, a replacement jig 31 is used.
Is different from that of the first embodiment, and the other configuration is the same as that of the first embodiment. Therefore, in the second embodiment, the same components as those in the first embodiment are denoted by the same reference numerals, and description thereof will be omitted.

As shown in FIG. 9, a pulse power source 51 is detachably connected to the jig main body 32 of the replacement jig 31 via a lead wire 50. This pulse power supply 51
Is to heat the jig body 32 by instantaneously applying a large current to the jig body 32. By changing the current value, the heating temperature of the jig body 32 can be set in a plurality of steps. It can be changed freely.

According to such a configuration, the temperature of the jig main body 32 can be freely set in a plurality of steps. Therefore, for example, before the jig for replacement 31 is slid along the circuit board 11, the jig for replacement is The tool 31 itself is connected to the solder layer 16,
28, and when the solder cutting portion 35 of the replacement jig 31 contacts the solder layers 16 and 28, the replacement jig 31 is raised to a temperature higher than the melting temperature. Control such as heating can be performed.

Therefore, the solder layers 16 and 28 joining the pad 15 and the solder bump 27 can be reliably separated, and the reliability when the soldering of the semiconductor package 11 is released is further improved.

FIG. 10 to FIG. 12 disclose a third embodiment of the present invention. The third embodiment is different from the first embodiment in the configuration for heating the replacement jig 31, and the other configurations are the same as the first embodiment. Therefore, also in the third embodiment, the same components as those in the first embodiment are denoted by the same reference numerals, and description thereof will be omitted.

In the third embodiment, a replacement jig 31 is used.
Is heated using a heating medium such as hot air or steam. As shown in FIGS. 10 and 11, inside one heat receiving portion 37 a of the jig body 31,
A medium supply chamber 61 is formed, and a medium discharge chamber 62 is formed inside the other heat receiving section 37b.

The first and second medium passages 63 are provided on both sides of the jig main body 32 connected to the heat receiving portions 37a and 37b.
a, 63b are formed. First medium passage 63a
Is connected to the medium supply chamber 61. The second medium passage 63b is connected to the medium discharge chamber 62.

The first and second medium passages 63a, 63a,
63b face each other with the opening 34 interposed therebetween, and extend linearly along the arrangement direction of the openings 34. Then, the first and second medium passages 63a, 63
b communicate with each other via a plurality of communication paths 64. The communication passage 64 is arranged corresponding to the solder cutting portion 35 of the jig main body 32, and extends through the inside of the solder cutting portion 35.

A medium supply pipe 65 is detachably connected to the medium supply chamber 61 of the heat receiving section 37a. The medium supply pipe 65 is connected to a medium supply source (not shown).
Further, a medium discharge pipe 66 is detachably connected to the medium discharge chamber 62 of the heat receiving section 37b.

In order to heat the replacement jig 31 having such a configuration, the circuit board 10 is taken out of the housing 2, and the medium supply pipe 65 is connected to the medium supply chamber 61 of the jig main body 32. The medium discharge pipe 66 is connected to the medium discharge chamber 62. The heating medium supplied from the medium supply pipe 65 is guided to the first medium passage 63 a through the medium supply chamber 61, and flows into the communication passage 64 from here. Due to the circulation of the heating medium, the solder cutting portion 35 of the jig main body 32 mainly
28 is heated to a temperature sufficient to melt. And
The heating medium flowing through the communication passage 64 is supplied to the second medium passage 6.
It is guided to the medium discharge chamber 62 through 3b, and is discharged from the jig body 32 through the medium discharge pipe 66 from here.

Therefore, according to the third embodiment, the solder cutting portion 35 of the jig main body 32 can be heated by the heating medium flowing through the communication path 64. Therefore, as in the first embodiment, when the replacement jig 11 is slid along the circuit board 10, the pad 15 and the solder bump 27 are joined by the heated solder cutting portion 35. The solder layers 16 and 28 can be separated,
The soldering of the semiconductor package 11 can be released.

In the first embodiment, the jig body is formed with a number of openings corresponding to a plurality of bump rows. However, the present invention is not limited to this. It may be formed in such a size that a row can be inserted.

Further, by dividing the opening of the jig main body along the length direction of the bump row, the solder cut portion may be formed in a lattice shape. Furthermore, the material of the replacement jig is not limited to aluminum alloy,
For example, it may be made of another metal material such as brass, molybdenum, magnesium or stainless steel.

[0110]

According to the present invention described in detail above, since the replacement jig is mounted on the circuit board together with the semiconductor package in advance, the soldering portion between the solder bump and the pad is directly and intensively heated. And the influence of heat on the periphery of the semiconductor package is reduced.

In addition, since it is not necessary to insert the jig body into a minute gap between the semiconductor package and the circuit board,
There is no problem even if other circuit components are arranged around the semiconductor package. Therefore, the troublesome and troublesome work of temporarily removing the circuit components around the semiconductor package is not required, and the number of work steps is reduced, and the work of removing the semiconductor package can be easily performed. At the same time, there is no need to secure a space for inserting and removing the replacement jig around the semiconductor package to be removed, so that dead space can be eliminated from the circuit board and high-density mounting is possible. is there.

According to the twelfth aspect of the present invention, when there is no need to replace the semiconductor package, the replacement jig can be used as a heat sink for the semiconductor package. Therefore, it is not necessary to arrange a dedicated heat sink for promoting heat radiation of the semiconductor package inside the housing, and the mounting efficiency inside the housing can be improved.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view of a portable computer having a circuit board on which a surface-mount type semiconductor package is mounted according to a first embodiment of the present invention.

FIG. 2 is a cross-sectional view showing a state where a surface-mount type semiconductor package and a replacement jig are separated from each other.

FIG. 3 is a cross-sectional view showing the relationship between a surface-mount type semiconductor package in which a replacement jig is integrated and a circuit board.

FIG. 4 is a cross-sectional view showing a state where the replacement jig and the surface-mount type semiconductor package are soldered to a circuit board.

FIG. 5 is an arrow view along the line AA in FIG. 3;

FIG. 6A is a sectional view taken along line BB of FIG. 5; (B)
FIG. 4 is a cross-sectional view showing a state in which soldering between a pad of a circuit board and a solder bump of a semiconductor package is released by sliding a replacement jig.

FIG. 7 is a plan view showing the positional relationship between the opening of the jig main body and the pad when the replacement jig is slid.

FIG. 8 is a perspective view of a replacement jig.

FIG. 9 is a cross-sectional view showing a state in which a replacement jig and a surface-mount type semiconductor package are soldered to a circuit board according to the second embodiment of the present invention.

FIG. 10 is a cross-sectional view showing a state where a replacement jig and a surface-mount type semiconductor package are soldered to a circuit board in the third embodiment of the present invention.

FIG. 11 is a sectional view of a replacement jig.

FIG. 12 is a sectional view taken along the line CC of FIG. 11;

[Explanation of symbols]

 Reference Signs List 2 housing 7 input means (keyboard) 9 circuit module 10 circuit board 11 semiconductor package 13a mounting surface 15 pad 20 package body 27 solder bump 31 replacement jig 32 jig body 34 … Opening part 35… Solder cutting part

Claims (12)

[Claims] 1. A replacement jig for removing a semiconductor package having a large number of solder bumps arranged in a matrix on the back surface of a package body from a circuit board having a large number of pads to which the solder bumps are soldered. A flat plate supported by the package body, interposed between the package body and the circuit board, and heated or heated to a temperature sufficient to melt the solder for joining the solder bump and the pad. A jig body; and a plurality of openings formed in the jig body and into which the solder bumps enter. 2. The semiconductor package according to claim 1, wherein the semiconductor package has a plurality of bump rows in which a plurality of solder bumps are arranged in a row, and the bump rows are arranged in parallel with an interval therebetween. In addition, the opening of the jig main body has a slit shape extending along the direction of the bump rows, and the number of these openings corresponds to the number of the bump rows. Replacement jig. 3. The jig body according to claim 1, wherein the jig body is made of a material having thermal conductivity, and the jig body includes a heat receiving portion to which a heat source is detachably connected. A replacement jig. 4. A replacement jig used when a semiconductor package having a large number of solder bumps arranged in a matrix on the back surface of a package body is removed from a circuit board having a large number of pads to which the solder bumps are soldered. A jig body supported by the package body and heated or heated to a temperature sufficient to melt the solder for joining the solder bump and the pad; and an adjacent solder bump formed on the jig body. A plurality of solder cutting portions interposed therebetween. 5. The semiconductor package according to claim 4, wherein the semiconductor package has a plurality of bump rows in which a plurality of solder bumps are arranged in a row, and the bump rows are arranged in parallel with an interval therebetween. In addition, the solder cutting portion of the jig body has a bar shape extending along the direction of the bump row, and the bump row is arranged between these solder cutting sections. Replacement jig. 6. A method for removing and replacing a semiconductor package having a large number of solder bumps arranged in a matrix from a circuit board to which the solder bumps are soldered, wherein the semiconductor package is interposed between the solder bumps. A replacement jig having a plurality of solder cutting portions is prepared, and the replacement jig is attached to the semiconductor package, and the solder cutting portion of the replacement jig is interposed between adjacent solder bumps of the semiconductor package. A first step of soldering; soldering the solder bumps of the semiconductor package to pads on the circuit board;
A second step of positioning the solder cutting portion of the replacement jig between the semiconductor package and the circuit board; and bonding the solder bumps and pads by heating or heating the replacement jig. A third step of melting the solder that has been melted; sliding the replacement jig along with the semiconductor package along with the circuit board in a state where the solder is melted; A fourth step of separating the solder bumps and pads from each other by cutting; a fifth step of moving the replacement jig in a direction away from the circuit board and removing the semiconductor package from the circuit board; A method of exchanging a semiconductor package, comprising: 7. A semiconductor package in which a large number of solder bumps are arranged in a matrix on the back surface of a package body; and a mounting surface on which the semiconductor package is mounted, the mounting surface having a number corresponding to the solder bumps. A circuit board on which pads of the semiconductor package are arranged in a matrix, and wherein solder bumps of the semiconductor package are soldered to the pads of the circuit board, between the semiconductor package and the circuit board. A jig used when exchanging the semiconductor package is disposed, and the jig has heat conductivity and generates or heats to a temperature sufficient to melt the solder for joining the solder bump and the pad. The jig body is supported by the package body and receives the solder bumps. Circuit module, characterized in that it comprises a plurality of openings writing. 8. The semiconductor package according to claim 7, wherein the semiconductor package has a plurality of bump rows in which a plurality of solder bumps are arranged in a row, and the bump rows are arranged in parallel with a space therebetween. The openings of the jig main body have a slit shape extending along the direction of the bump rows, and the number of these openings corresponds to the number of the bump rows. Circuit module. 9. A semiconductor package in which a large number of solder bumps are arranged in a matrix on the back surface of a package body; and a mounting surface on which the semiconductor package is mounted. A circuit board on which pads of the semiconductor package are arranged in a matrix, and wherein solder bumps of the semiconductor package are soldered to the pads of the circuit board, between the semiconductor package and the circuit board. A jig used when exchanging the semiconductor package is disposed, and the jig has heat conductivity and generates or heats to a temperature sufficient to melt the solder for joining the solder bump and the pad. The jig body is supported by the package body, and the adjacent solder bumps Circuit module, characterized in that it comprises a plurality of solder cuts interposed. 10. The semiconductor package according to claim 9, wherein the semiconductor package has a plurality of bump rows in which a plurality of solder bumps are arranged in a row, and the bump rows are arranged in parallel with an interval therebetween. In addition, the solder cutting portion of the jig body has a bar shape extending along the direction of the bump row, and the bump row is arranged between these solder cutting sections. Circuit module to do. 11. The circuit module according to claim 9, wherein the jig body includes a heat receiving portion to which a heat source is detachably connected. 12. A box-shaped housing; input means for inputting information, which is disposed on the upper surface of the housing; and a plurality of pads which are removably accommodated inside the housing and are arranged in a matrix. A circuit board having a mounting surface arranged side by side; a surface mounted on the mounting surface of the circuit board, having a back surface facing the mounting surface, and having on the back surface a number of solder bumps soldered to the pads. A semiconductor package; and a replacement jig supported by the semiconductor package and integrally mounted on the circuit board together with the semiconductor package. The replacement jig has thermal conductivity, A jig body interposed between the semiconductor package and the circuit board, the jig body being heated to a temperature sufficient to melt the solder joining the solder bump and the pad; Or while being heated, an electronic apparatus, characterized in that it comprises a plurality of solder cutting part interposed between the solder bump adjacent the.