JPH10154771A - Semiconductor package - Google Patents

Abstract

PROBLEM TO BE SOLVED: To enhance the bonding strength of a semiconductor package after moisture absorption without imparing the characteristics, which are superior in non-residual bubble property and non-outflow resin property, of an epoxy resin bonding agent by a method wherein first and second substrates are bonded together with the epoxy resin bonding agent, which contains an epoxy resin, a polyphenylene ether resin, an epoxy resin curing agent and a peroxide as its essential component. SOLUTION: A semiconductor package is manufactured using a first organic substrate 11a having a substrate opening part 13 formed penetratingly the substrate 11a, a second organic substrate 11b with conductor circuits 12b for bonding pad use, which are formed on the surface on one side of the surfaces of the substrate 11b, and an epoxy resin sheetlike bonding agent 15 having a bonding agent opening part 16 of roughly the same size as that of the opening part 13 formed in the substrate 11a. The bonding agent 5, which is used for the manufacture of the package, contains an epoxy resin, a polyphenylene ether resin, an epoxy resin curing agent and a peroxide as its essential component. Thereby, the bonding strength subsequent to moisture absorption of the package can be enhanced without imparing characteristics, which are superior in bubble non-residual property and resin non-outflow property and are the characteristics of the epoxy resin bonding agent 15.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor package used for manufacturing a semiconductor device.

[0002]

2. Description of the Related Art A semiconductor device such as a pin grid array is, for example, as shown in FIG.
A concave semiconductor element disposition portion 17 formed so as to be able to dispose the semiconductor element 21 and a bonding pad 32 formed around the semiconductor element disposition portion 17 and being a conductor circuit formed so as to be connectable to the bonding wire 22 and the like; And an electrode 18 electrically connected to the bonding pad 32 on the other surface of the substrate 11, and a terminal connected to the electrode 18 and mounted on a motherboard (a printed wiring board on which a semiconductor device is mounted). Semiconductor package 1 including 20
After the semiconductor element 21 is mounted by using the bonding pad 32, the bonding pad 32 and the semiconductor element 21 are connected with the bonding wire 22 or the like, and then the semiconductor device 21 is sealed with a sealing material 23.

[0003] In recent years, the required number of bonding pads 32 tends to increase with the advancement of the functions of semiconductor devices. Therefore, in addition to the bonding pad 32a formed on the surface layer as shown in FIG. 2, a bonding pad 32b exposed inside the semiconductor element arrangement portion 17 is also formed to increase the number of bonding pads 32a and 32b. A semiconductor device using the package 10 is being studied.

The semiconductor package 10 in which the number of the bonding pads 32a and 32b is increased is manufactured by, for example, a method as shown in FIG. As shown in FIG. 1A, an organic substrate 11a (hereinafter referred to as a first substrate 11a) having a conductive circuit formed on one surface (a lower surface in the drawing) and having a substrate opening 13 formed therethrough. ) And an organic substrate 11b (hereinafter referred to as a second substrate 11) having a conductor circuit 12b for bonding pads or the like formed on one surface (upper surface in the figure).
b) and a sheet-like adhesive 15 is used. At this time, as the adhesive 15, the substrate opening 1 of the first substrate 11a is used.
An adhesive 15 having an adhesive opening 16 of substantially the same size as 3 is used.

The substrate opening 13 and the adhesive opening 1
After laminating between the first substrate 11a and the second substrate 11b with the adhesive 15 interposed therebetween so that the positions of 6 substantially coincide with each other,
When bonding is performed by applying heat and pressure, as shown in FIG. 1B, a concave semiconductor element arrangement portion 17 in which the conductor circuit 12b for a bonding pad or the like is exposed is formed. Then, as shown in FIG. 1 (c), a conductor circuit 12a for bonding pads, an electrode 18 and the like are formed on the surface layer, and a through-hole metal layer 19 for connecting the conductor circuits 12a, 12b,. Manufactured.

The surfaces of the first substrate 11a and the second substrate 11b adhered by the adhesive 15 have irregularities due to the formation of the conductor circuits 12b for bonding pads and the like. When bonding the surface having the irregularities, it is necessary to use an adhesive 15 having a certain degree of fluidity so that air bubbles do not remain in the concave portions, and a thermosetting resin generally called a prepreg is semi-cured to form a sheet-like adhesive. Agent 15 is used. When the semi-cured thermosetting resin adhesive 15 is heated for bonding, once the viscosity is reduced and liquefied, the resin flows, and when further heated, the resin hardens and the resin does not flow, so that bubbles remain in the concave portions. It has the characteristic of being difficult to use, and is generally used.

However, if the fluidity is increased so that no air bubbles remain in the concave portion, as shown in FIG. 3, the pressure of the adhesive 15 is increased when the first substrate 11a and the second substrate 11b are bonded.
May flow out to the portion of the conductor circuit 12b for the bonding pad exposed in the semiconductor element arrangement portion, and the adhesive 15 may be cured while covering the portion of the conductor circuit 12b. The portion of the conductor circuit 12b covered with the adhesive 15 has a problem that the connection with the bonding wire or the like becomes insufficient, and the reliability of the electrical connection may not be secured.

[0008] The adhesive 15 is applied to the conductor circuit 11b.
It is very important to balance the ease of flow into the gap between the recesses and the difficulty of flowing into the semiconductor element arrangement portion. It has been studied to use an epoxy resin-based adhesive 15 to achieve the balance. Have been.

However, in the case of a semiconductor package using the epoxy resin-based adhesive 15 in which the above balance is maintained, there is a problem that the adhesive strength after absorbing moisture tends to decrease. For this reason, it is difficult for bubbles to remain in the recesses between the conductor circuits 11b (hereinafter referred to as “bubble non-residual”), and a small amount of resin flowing out to the conductor circuits 11b exposed in the semiconductor element disposition portion (hereinafter referred to as “resin non-outflow”). There is a demand for a semiconductor package having excellent adhesive strength after moisture absorption without impairing the characteristics of the semiconductor package.

[0010]

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and an object of the present invention is to provide a semiconductor device having at least one of them having a plurality of conductor circuits formed therein. Laminating and bonding two organic substrates, with a sheet-like epoxy resin adhesive interposed between each substrate, and forming a concave semiconductor element arrangement portion where the conductive circuit is exposed at a predetermined position An object of the present invention is to provide a semiconductor package which is manufactured by the above method and which has excellent adhesive strength after absorbing moisture without impairing the characteristics of excellent non-residual bubbles and non-outflow of resin.

[0011]

According to a first aspect of the present invention, there is provided a semiconductor package comprising a plurality of organic substrates forming a conductive circuit on at least one of the substrates, and a plurality of organic substrates formed between the substrates. With a sheet-like epoxy resin adhesive interposed,
In a semiconductor package manufactured by laminating and adhering while forming a concave semiconductor element arrangement portion where a conductive circuit is exposed at a predetermined position, the adhesive is epoxy resin, polyphenylene ether resin, epoxy resin curing agent and It is characterized by containing a peroxide.

According to a second aspect of the present invention, there is provided the semiconductor package according to the first aspect, wherein the polyphenylene ether resin has a number average molecular weight of 1,000 to 2,
000.

According to a third aspect of the present invention, there is provided the semiconductor package according to the first or second aspect, wherein the epoxy resin, the polyphenylene ether resin, the epoxy resin curing agent and the peroxide contained in the adhesive are contained. ,
It is characterized by being impregnated in glass cloth.

According to the present invention, since the adhesive is used for bonding with an adhesive containing an epoxy resin, a polyphenylene ether resin, a curing agent for the epoxy resin and a peroxide, the properties of the epoxy resin-based adhesive such as non-residual air bubbles and A semiconductor package having excellent adhesive strength after moisture absorption can be obtained without impairing the property of excellent resin non-leaching property.

[0015]

DESCRIPTION OF THE PREFERRED EMBODIMENTS A semiconductor package according to the present invention will be described with reference to the drawings. FIG. 1 is a process chart showing a manufacturing method of one embodiment of a semiconductor package according to the present invention.

FIG. 1 shows a semiconductor package according to the present invention.
(A) As shown in FIG.
3, an organic second substrate 11b having a conductor circuit 12b for bonding pads or the like formed on one surface (the upper surface in the figure), and a substrate opening of the first substrate 11a. It is manufactured using an epoxy resin sheet adhesive 15 having an adhesive opening 16 having substantially the same size as the part 13.

The surface of the first substrate 11a that is not in contact with the adhesive 15 (the upper surface in the figure) may form a conductor circuit, or may have a conductor foil such as a copper foil on the entire surface. . In addition,
The conductor may not be provided when no conductor circuit is provided on the surface layer of the semiconductor package to be manufactured, or when the semiconductor package is formed by an additive method after bonding. Also, the first substrate 11a
The surface in contact with the adhesive 15 (the lower surface in the figure) may or may not form a conductor circuit.

The surface of the second substrate 11b that is not in contact with the adhesive 15 (the lower surface in the figure) may form a conductor circuit, and may have a conductor foil such as copper foil on the entire surface. The conductor may not be provided. The surface (upper surface in the figure) of the second substrate 11b in contact with the adhesive 15 has the conductor circuit 12b formed at least at a position corresponding to the substrate opening 13 formed in the first substrate 11a. Is limited to

The method of forming the conductor circuit 12b is not particularly limited, and a method of forming the conductor foil by etching the conductor foil using an organic substrate having a conductor foil on the surface or a method of forming the conductor foil on the surface is used. A method in which a resist film is formed on a portion where a circuit is not formed using an organic substrate having no resist, and then formed by applying electroless plating or the like. In addition, as a metal forming the conductor circuit 12b,
Copper, aluminum, brass, nickel and the like alone, alloys and the like are listed, but copper and a copper plated layer formed on the surface of copper are preferable from the viewpoint of electrical reliability.

The substrates 11a and 11b used in the present invention are not particularly limited as long as they are organic, and examples thereof include epoxy resin, phenol resin, polyimide resin, unsaturated polyester resin, and polyphenylene ether resin. Thermosetting resin, or a plate of these thermosetting resins mixed with an inorganic filler or the like, inorganic fibers such as glass, polyester, polyamide, a cloth of organic fibers such as cotton, a substrate such as paper, A plate bonded with the above-mentioned thermosetting resin or the like can be used.

The first substrate 11a and the second substrate 11b may have a through hole formed with a metal layer on the wall surface, and may have a conductor circuit formed therein. The second substrate 11b may also have a substrate opening.

The adhesive 15 used in the present invention includes an epoxy resin, a polyphenylene ether resin, a curing agent for the epoxy resin (hereinafter simply referred to as a curing agent) and a thermosetting resin essentially containing a peroxide, if necessary. After heating and forming a sheet, inorganic fibers such as glass, polyester, polyamide, cloth of organic fibers such as cotton, and a substrate such as paper, impregnating the thermosetting resin with the above, if necessary Heated sheets may be used.

After impregnating the base material with the thermosetting resin,
In the case of a sheet, the first substrate 11 after bonding
a and the second substrate 11b can be reliably formed, so that even if a conductor circuit is formed on both of the opposing surfaces of the first substrate 11a and the second substrate 11b, both conductors The insulation interval between circuits can be reliably formed,
Insulation reliability is excellent and preferable. In particular, a glass cloth impregnated is preferable because of its excellent flame retardancy.

When the adhesive 15 contains an epoxy resin, a polyphenylene ether resin, a curing agent and a peroxide,
Without impairing the properties of the epoxy resin-based adhesive 15 that are excellent in non-residual bubbles and non-outflow properties of resin,
A semiconductor package having excellent adhesive strength after moisture absorption can be obtained.

The epoxy resin used for the adhesive 15 is not particularly limited. For example, bisphenol A epoxy resin, bisphenol F epoxy resin,
Bisphenol S type epoxy resin, phenol novolak type epoxy resin, bisphenol A novolak type epoxy resin, bisphenol F novolak type epoxy resin, cresol novolak type epoxy resin, diaminodiphenylmethane type epoxy resin, and hydrogen atom in these epoxy resin structures Epoxy resins and the like which have been made flame-retardant by partially halogenating them may be mentioned, and two or more kinds may be used in combination.

The polyphenylene ether resin used for the adhesive 15 is a compound also called polyphenylene oxide resin, for example, poly (2,6-dimethyl-1,4-phenylene oxide). Such polyphenylene ether resins are, for example, USP
It can be synthesized by the method disclosed in the specification of US Pat. No. 4,059,568. In addition, when the number average molecular weight of the polyphenylene ether resin is 1,000 to 2,000, the balance between the effect of improving the adhesive strength after moisture absorption and the impregnation property of the base material is excellent, which is preferable.

When the polyphenylene ether resin used as a raw material has a number average molecular weight of more than 2,000, it is preferable to cut the skeleton of the polyphenylene ether resin having a large molecular weight so as to fall within the above range before use. As a method of cutting the skeleton, the skeleton can be cut to reduce the molecular weight by heating and reacting using a peroxide such as benzoyl peroxide.

Examples of the curing agent used for the adhesive 15 include amide-based curing agents such as dicyandiamide and aliphatic polyamide; amine-based curing agents such as diaminodiphenylmethane, metaphenylenediamine, ammonia, triethylamine and diethylamine; and bisphenol A , Phenol novolak resin, cresol novolak resin, p-
A phenolic curing agent such as xylene-novolak resin,
Examples thereof include acid anhydrides and the like, and two or more kinds may be used in combination.

As the peroxide used for the adhesive 15,
Benzoyl peroxide and the like. This peroxide is considered to function as a radical initiator for radicalizing the polyphenylene ether resin when the adhesive 15 is cured. In addition, when the peroxide used for cutting the skeleton of the polyphenylene ether resin having a large molecular weight is contained, it can be commonly used without newly blending.

The epoxy resin, polyphenylene ether resin, curing agent and peroxide are contained in an amount of 100 to 300 parts by weight of epoxy resin and 3 parts of curing agent per 100 parts by weight of polyphenylene ether resin.
About 20 parts by weight and about 3 to 20 parts by weight of peroxide are suitable.

The adhesive 15 may contain a curing accelerator, an inorganic filler, and the like, if necessary. As a curing accelerator that can be contained, for example, imidazoles such as 2-methylimidazole, 2-ethyl-4-methylimidazole, and 2-phenylimidazole;
1,8-diaza-bicyclo [5.4.0] undecene-
7, tertiary amines such as triethylenediamine and benzyldimethylamine; organic phosphines such as tributylphosphine and triphenylphosphine; and tetraphenylboron salts such as tetraphenylphosphonium tetraphenylborate and triphenylphosphine tetraphenylborate. Two or more types may be used in combination.

Examples of the inorganic filler that can be contained include inorganic powder fillers such as silica, calcium carbonate, aluminum hydroxide and talc, and fibrous fillers such as glass fiber, pulp fiber, synthetic fiber and ceramic fiber. Materials.

The substrate opening 13 of the first substrate 11a
Then, the adhesive 15 is laminated between the first substrate 11a and the second substrate 11b with the adhesive 15 interposed therebetween such that the positions of the adhesive openings 16 of the adhesive 15 substantially match. Each of the substrates 11
The number of the adhesives 15 interposed between a and 11b is not limited to one, and a plurality of adhesives 15 may be laminated.

The surfaces of the conductor circuits 12b formed on the second substrate 11b and the like are roughened by polishing or the like.
When laminated with the adhesive 15, the conductor circuit 12b
It is preferable because the adhesive strength between the adhesive 15 and the adhesive 15 is improved.

The surface can be roughened by mechanically shaving the surface with a buff, scrub, or the like, a roughening treatment solution containing sulfuric acid and hydrogen peroxide, or a rough surface containing ammonium persulfate. And a method of chemically etching the surface with a surface treatment liquid to roughen the surface. In the case of the method of roughening by etching, the unevenness of the roughening can be increased as compared with the method of mechanically shaving, so that the adhesive strength can be particularly improved.

Further, a thermosetting resin such as a solder resist is applied to the conductor circuits except for the conductor circuits 12b which are to be exposed in the semiconductor element arrangement portion, and then cured without applying pressure to form recesses between the conductor circuits. After the filling, it is preferable to laminate with the adhesive 15 because the non-residual air bubbles are further excellent.

Next, when bonding is performed by applying heat and pressure, FIG.
As shown in (b), a recessed semiconductor element disposing portion 17 in which the conductor circuit 12b for a bonding pad or the like is exposed is formed, and the first substrate 11a, the second substrate 11b, and the adhesive 15 are integrated. .

Next, as shown in FIG. 1 (c), a conductor circuit 12a for bonding pads, an electrode 18, etc. are formed on the surface layer, and the conductor circuits 12a,.
A semiconductor package is manufactured by forming a through-hole metal layer 19 and the like connecting the electrodes 8 and the like, and then forming a needle-like or spherical terminal 20 connected to the electrode 18. Note that the terminal 20 may be formed after the semiconductor element is mounted.

The first substrate 11a and the second substrate 11b
Although the embodiment in which the substrate is manufactured has been described above, the present invention is not limited to the case where two substrates (11a, 11b) are used, but is provided between the first substrate 11a and the second substrate 11b.
Although not shown, an organic substrate having a substrate opening formed therethrough and having a conductor circuit for bonding pads or the like formed on the surface thereof may be interposed therebetween, and a conductor circuit may be formed on the surface outside the second substrate. An organic substrate or the like on which is formed may be laminated.

[0040]

【Example】

(Example 1) A glass substrate polyimide resin double-sided copper-clad laminate (manufactured by Matsushita Electric Works, trade name: R-4785, copper foil thickness: 18 µm) having a size of 50 x 50 cm and a thickness of 0.5 mm excluding copper foil was used. It was used as a material for the first substrate and the second substrate. After etching the copper foil on one side of the laminate to form a conductor circuit, the laminate has a side of about 20
A plurality of rectangular substrate openings having a square
A substrate was used.

The copper foil on one side of the laminate was etched to form a conductor circuit, which was used as a second substrate. In addition,
The conductor circuit formed on the second substrate was formed at both a position corresponding to the substrate opening formed on the first substrate and a position corresponding to a portion other than the substrate opening formed on the first substrate.

Next, the surfaces of the conductor circuits formed on the first substrate and the second substrate were buffed and roughened.

Further, the epoxy resin composition is 0.1 m thick.
m impregnated in a glass cloth [manufactured by Asahi Schwebel KK, trade name: 216L], and then heated to form a sheet-like adhesive.

The epoxy resin composition used for this adhesive was prepared by the following method. Polyphenylene ether [manufactured by Nippon GE Plastics, trade name 640-111]
100 parts by weight, 5 parts by weight of benzoyl peroxide, and 5 parts by weight of bisphenol A are dissolved in 100 parts by weight of toluene, reacted at 90 ° C. for 60 minutes to cut the polyphenylene ether skeleton, and the number average molecular weight is 1400. This was polyphenylene ether. The number average molecular weight of polyphenylene ether was measured by gel permeation chromatography (GPC).

Then, 100 parts by weight of a styrene solution containing polyphenylene ether having a number average molecular weight of 1400, benzoyl peroxide and bisphenol A, and a tetrabromobisphenol A type epoxy resin having an epoxy equivalent of 500 [manufactured by Toto Kasei Co., Ltd. , Trade name YDB-500], 100 parts by weight of solid content, 1 part by weight of diaminodiphenylmethane, and 2-ethyl-4
1 part by weight of -methylimidazole was blended to obtain an epoxy resin composition for impregnation.

After adjusting the viscosity of the epoxy resin composition by adding toluene, the glass cloth is impregnated with the epoxy resin composition, and then heated at 150 ° C. for 3 minutes to obtain an epoxy resin composition having a resin amount of 53% by weight. An adhesive in which the object was uniformly impregnated in the glass cloth was obtained. Then, the adhesive is sized to 50
After cutting to a size of × 50 cm, an adhesive opening having substantially the same size as the substrate opening was formed at a position corresponding to the substrate opening formed in the first substrate.

Next, one adhesive was laminated between the first substrate and the second substrate such that the position of the opening of the first substrate and the position of the adhesive opening of the adhesive almost coincided. . In addition, the conductor circuits formed on the first substrate and the second substrate were laminated such that they were in contact with the adhesive. Then, the maximum temperature 1
Heating and pressurizing was performed at 70 ° C. and a pressure of 2 MPa for 60 minutes to obtain a semiconductor package for evaluation in which a concave semiconductor element arrangement portion where a conductor circuit was exposed was formed.

(Example 2) The surfaces of the conductor circuits formed on the first substrate and the second substrate were roughened by etching with a roughening solution containing sulfuric acid and hydrogen peroxide.
Solder resist [Asahi Kaken Co., Ltd.] is provided in the recess between the conductive circuit formed on the substrate and the conductive circuit formed on the second substrate other than the portion corresponding to the substrate opening of the first substrate. Product name, CCR-232CF
V] was applied to fill the recesses, and then cured by heating at 130 ° C. for 30 minutes, and then laminated with an adhesive.
In the same manner as in the above, a semiconductor package for evaluation was obtained.

Comparative Example 1 Example 1 was repeated except that an epoxy resin composition containing the following two types of epoxy resin, a curing agent, a curing accelerator and a solvent was used as the epoxy resin composition used for the adhesive. In the same manner as in the above, a semiconductor package for evaluation was obtained.

The epoxy resin composition used was a tetrabromobisphenol A type epoxy resin having an epoxy equivalent of 500 as an epoxy resin [trade name: Y, manufactured by Toto Kasei Co., Ltd.]
DB-500] as a solid content, 94 parts by weight, a cresol novolak type epoxy resin having an epoxy equivalent of 220 [YDCN-220, manufactured by Toto Kasei Co., Ltd.] as a solid content, 13 parts by weight, and dicyandiamide as a curing agent. 2.8 parts by weight, 0.1 part by weight of 2-ethyl-4-methylimidazole as a curing accelerator, and N, N- as a solvent
Dimethylformamide was used in an amount of 25 parts by weight.

Comparative Example 2 The procedure of Example 2 was repeated except that the same adhesive as that used in Comparative Example 1 was used.
An evaluation semiconductor package was obtained.

(Evaluation and Results) The semiconductor packages obtained in Examples 1 and 2 and Comparative Examples 1 and 2 were evaluated for adhesive strength, non-residual air bubbles, and non-outflow of resin.

The adhesive strength was evaluated by conducting a pressure cooker test at 121 ° C., 2 atm, and 100% relative humidity for 200 hours, and then conducting a test between the conductive circuit having a width of 5 mm formed on the second substrate and the cured adhesive. In the 90 degree direction
The film was peeled off at a speed of / min, and the peel strength was measured.

The method for evaluating non-residual bubbles is as follows. After the first semiconductor substrate portion and the adhesive portion of the obtained semiconductor package are scraped off to expose the conductive circuit formed on the second substrate, Of the conductor circuits formed in the above, it was visually evaluated whether or not bubbles remained between the conductor circuits of the portion bonded with the adhesive, and those having no bubbles were marked with ◎, and those with slight bubbles remaining were marked with ○. And the one in which a large number of air bubbles remained was evaluated as x.

As a method for evaluating the resin non-leaching property,
The length of the resin flowing out to the portion of the conductor circuit exposed in the semiconductor element arrangement portion of the obtained semiconductor package was evaluated with a 10-fold magnifying glass.
Those exceeding μm were marked as x.

As shown in Table 1, it was confirmed that Example 1 was superior to Comparative Example 1 and Example 2 was superior to Comparative Example 2 in adhesive strength after moisture absorption. Was. In addition, it was confirmed that each of the examples was excellent in non-residual air bubbles and non-outflow of resin, similarly to each comparative example.

[0057]

[Table 1]

[0058]

The semiconductor package according to the present invention is characterized by the properties of an epoxy resin-based adhesive because the semiconductor package is bonded with an adhesive containing an epoxy resin, a polyphenylene ether resin, a curing agent for the epoxy resin, and a peroxide. Without impairing the properties of excellent non-residual air bubbles and non-outflow properties of resin,
A semiconductor package having excellent adhesive strength after moisture absorption is obtained.

[Brief description of the drawings]

FIG. 1 is a process chart showing a manufacturing method of an embodiment of a semiconductor package according to the present invention.

FIG. 2 is a cross-sectional view illustrating a conventional semiconductor package.

FIG. 3 is a perspective view of a main part for explaining a conventional semiconductor package.

FIG. 4 is a cross-sectional view illustrating a conventional semiconductor device.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Semiconductor package 11, 11a, 11b Substrate 12a, 12b Conductor circuit 13 Substrate opening 15 Adhesive 16 Adhesive opening 17 Semiconductor element arrangement part 18 Electrode 19 Through hole metal layer 20 Terminal 21 Semiconductor element 22 Bonding wire 23 Sealing material 32 , 32a, 32b Bonding pad

Claims (3)

[Claims] At least one of the plurality of organic substrates (11) forming a conductor circuit (12b) is provided.
a, 11b) with a sheet-like epoxy resin-based adhesive (15) interposed between the substrates (11a, 11b) to form a concave semiconductor element arrangement part () in which the conductor circuit (12b) is exposed. A semiconductor package manufactured by laminating and bonding while forming 17) in a predetermined position, wherein the adhesive (15) contains an epoxy resin, a polyphenylene ether resin, a curing agent for the epoxy resin, and a peroxide. Semiconductor package. 2. The semiconductor package according to claim 1, wherein the polyphenylene ether resin has a number average molecular weight of 1,000 to 2,000. 3. The glass cloth is impregnated with an epoxy resin, a polyphenylene ether resin, a curing agent for the epoxy resin, and a peroxide contained in the adhesive (15). The semiconductor package as described.