JPH10154559A - コネクタ組立体 - Google Patents
コネクタ組立体Info
- Publication number
- JPH10154559A JPH10154559A JP9292120A JP29212097A JPH10154559A JP H10154559 A JPH10154559 A JP H10154559A JP 9292120 A JP9292120 A JP 9292120A JP 29212097 A JP29212097 A JP 29212097A JP H10154559 A JPH10154559 A JP H10154559A
- Authority
- JP
- Japan
- Prior art keywords
- connector
- printed circuit
- circuit board
- signal
- impedance
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 abstract description 8
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract description 5
- 229910052782 aluminium Inorganic materials 0.000 abstract description 5
- QHZSDTDMQZPUKC-UHFFFAOYSA-N 3,5-dichlorobiphenyl Chemical compound ClC1=CC(Cl)=CC(C=2C=CC=CC=2)=C1 QHZSDTDMQZPUKC-UHFFFAOYSA-N 0.000 abstract description 3
- XVIZMMSINIOIQP-UHFFFAOYSA-N 1,2-dichloro-3-(2-chlorophenyl)benzene Chemical compound ClC1=CC=CC(C=2C(=CC=CC=2)Cl)=C1Cl XVIZMMSINIOIQP-UHFFFAOYSA-N 0.000 abstract description 2
- 150000003071 polychlorinated biphenyls Chemical class 0.000 abstract 1
- 239000000463 material Substances 0.000 description 8
- 230000000712 assembly Effects 0.000 description 5
- 238000000429 assembly Methods 0.000 description 5
- 239000011152 fibreglass Substances 0.000 description 3
- 230000001902 propagating effect Effects 0.000 description 3
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 230000001934 delay Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 230000008054 signal transmission Effects 0.000 description 2
- 230000007704 transition Effects 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 1
- 230000001143 conditioned effect Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/7082—Coupling device supported only by cooperation with PCB
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/646—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00 specially adapted for high-frequency, e.g. structures providing an impedance match or phase match
- H01R13/6473—Impedance matching
- H01R13/6474—Impedance matching by variation of conductive properties, e.g. by dimension variations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R31/00—Coupling parts supported only by co-operation with counterpart
- H01R31/06—Intermediate parts for linking two coupling parts, e.g. adapter
- H01R31/065—Intermediate parts for linking two coupling parts, e.g. adapter with built-in electric apparatus
Landscapes
- Details Of Connecting Devices For Male And Female Coupling (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US741,088 | 1996-10-30 | ||
| US08/741,088 US5823795A (en) | 1996-10-30 | 1996-10-30 | Connector between a daughterboard and a motherboard for high-speed single-ended electrical signals |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH10154559A true JPH10154559A (ja) | 1998-06-09 |
| JPH10154559A5 JPH10154559A5 (enExample) | 2005-06-16 |
Family
ID=24979343
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9292120A Pending JPH10154559A (ja) | 1996-10-30 | 1997-10-24 | コネクタ組立体 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US5823795A (enExample) |
| JP (1) | JPH10154559A (enExample) |
| DE (1) | DE19729162C2 (enExample) |
| GB (1) | GB2318923B (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107658587A (zh) * | 2017-07-31 | 2018-02-02 | 芜湖宏景电子股份有限公司 | 电路板与线束插接结构 |
Families Citing this family (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5978873A (en) * | 1997-09-24 | 1999-11-02 | Intel Corporation | Computer system including right angle processor and add-on card connectors |
| US6280201B1 (en) | 2000-01-21 | 2001-08-28 | Hewlett-Packard Company | Laminated 90-degree connector |
| US6510050B1 (en) * | 2000-11-21 | 2003-01-21 | Sun Microsystems, Inc. | High density packaging for multi-disk systems |
| US6979202B2 (en) | 2001-01-12 | 2005-12-27 | Litton Systems, Inc. | High-speed electrical connector |
| US6910897B2 (en) * | 2001-01-12 | 2005-06-28 | Litton Systems, Inc. | Interconnection system |
| US6843657B2 (en) | 2001-01-12 | 2005-01-18 | Litton Systems Inc. | High speed, high density interconnect system for differential and single-ended transmission applications |
| US6617526B2 (en) * | 2001-04-23 | 2003-09-09 | Lockheed Martin Corporation | UHF ground interconnects |
| US6639144B1 (en) | 2001-08-31 | 2003-10-28 | Gateway, Inc. | Electromagnetic interference reduction system |
| US6712620B1 (en) * | 2002-09-12 | 2004-03-30 | High Connection Density, Inc. | Coaxial elastomeric connector system |
| US6929482B2 (en) * | 2003-01-27 | 2005-08-16 | Litton Systems, Inc. | Interconnection arrangement |
| CN2626161Y (zh) * | 2003-04-28 | 2004-07-14 | 华为技术有限公司 | 一种双面插背板 |
| US6997753B2 (en) * | 2003-10-22 | 2006-02-14 | Gore Enterprise Holdings, Inc. | Apparatus, system and method for improved calibration and measurement of differential devices |
| US7112067B1 (en) * | 2005-04-11 | 2006-09-26 | Hon Hai Precision Ind. Co., Ltd | Connector assembly for printed circuit board interconnection |
| TW200712841A (en) * | 2005-09-30 | 2007-04-01 | Tyan Computer Corp | Processor configuration architecture of multi-processor system |
| US20090027844A1 (en) * | 2007-07-23 | 2009-01-29 | Hau Jiun Chen | Translator for supporting different memory protocols |
| US20100254109A1 (en) | 2009-03-19 | 2010-10-07 | Olympus Corporation | Mount assembly and method for manufacturing mount assembly |
| CN105792515A (zh) * | 2014-12-25 | 2016-07-20 | 台达电子工业股份有限公司 | 电路板组合及其组装方法 |
| KR102651499B1 (ko) * | 2021-08-20 | 2024-03-27 | 현대모비스 주식회사 | 양방향 시그널핀 모듈, 이를 포함한 파워 모듈 및 이의 제조 방법 |
Family Cites Families (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4869676A (en) * | 1981-09-11 | 1989-09-26 | Amp Incorporated | Connector assembly for use between mother and daughter circuit boards |
| DE3528912A1 (de) * | 1985-08-12 | 1987-02-19 | Winchester Electronics Divisio | Steckverbinder fuer leiterkarten |
| US4798544A (en) * | 1986-01-06 | 1989-01-17 | Minnesota Mining And Manufacturing Company | Low profile clip connector with integral contact support insert |
| US4678252A (en) * | 1986-05-27 | 1987-07-07 | Rockwell International Corporation | Electrical connector for circuit boards |
| US4867696A (en) * | 1988-07-15 | 1989-09-19 | Amp Incorporated | Laminated bus bar with power tabs |
| US4917616A (en) * | 1988-07-15 | 1990-04-17 | Amp Incorporated | Backplane signal connector with controlled impedance |
| US5205739A (en) * | 1989-11-13 | 1993-04-27 | Augat Inc. | High density parallel interconnect |
| US4971574A (en) * | 1989-12-08 | 1990-11-20 | W. L. Gore & Associates, Inc. | Shielded connector assembly for flat cable |
| EP0514055B1 (en) * | 1991-05-13 | 1997-01-02 | Fujitsu Limited | Impedance-matched electrical connector |
| US5152700A (en) * | 1991-06-17 | 1992-10-06 | Litton Systems, Inc. | Printed circuit board connector system |
| US5212348A (en) * | 1991-07-17 | 1993-05-18 | W. L. Gore & Associates, Inc. | Partially-stripped reinforced electric signal cable and processes for manufacture and termination thereof |
| FR2685555B1 (fr) * | 1991-12-23 | 1994-03-25 | Souriau Cie | Connecteur electrique destine a recevoir un support plat. |
| US5199895A (en) * | 1992-02-04 | 1993-04-06 | Chang Lien Ker | Low insertion force, self-locking connecting apparatus for electrically connecting memory modules to a printed circuit board |
| US5277595A (en) * | 1992-06-29 | 1994-01-11 | E. I. Du Pont De Nemours And Company | Power receptacle for a daughterboard |
| US5244417A (en) * | 1992-12-30 | 1993-09-14 | Perretta Frederick A | Backshell interface system |
| DE4332996C2 (de) * | 1993-09-28 | 1997-09-25 | Siemens Ag | Steckverbinder zur Kontaktierung einer Leiterplatte |
| US5417584A (en) * | 1994-03-14 | 1995-05-23 | W. L. Gore & Associates, Inc. | Flat cable/connector strain relief connection and method thereof |
| US5498167A (en) * | 1994-04-13 | 1996-03-12 | Molex Incorporated | Board to board electrical connectors |
| JP3007812U (ja) * | 1994-05-25 | 1995-02-28 | モレックス インコーポレーテッド | 表面実装用電気コネクタ |
| DE19502408A1 (de) * | 1995-01-26 | 1996-08-01 | Siemens Ag | Leiterplatten-Anschlußeinrichtung mit einer Vielzahl von elektrischen Kontaktierungsstellen in der Bestückungsebene der Leiterplatte |
-
1996
- 1996-10-30 US US08/741,088 patent/US5823795A/en not_active Expired - Fee Related
-
1997
- 1997-07-08 DE DE19729162A patent/DE19729162C2/de not_active Expired - Fee Related
- 1997-10-08 GB GB9721375A patent/GB2318923B/en not_active Expired - Fee Related
- 1997-10-24 JP JP9292120A patent/JPH10154559A/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107658587A (zh) * | 2017-07-31 | 2018-02-02 | 芜湖宏景电子股份有限公司 | 电路板与线束插接结构 |
Also Published As
| Publication number | Publication date |
|---|---|
| US5823795A (en) | 1998-10-20 |
| DE19729162A1 (de) | 1998-05-07 |
| DE19729162C2 (de) | 2001-05-03 |
| GB2318923A (en) | 1998-05-06 |
| GB9721375D0 (en) | 1997-12-10 |
| GB2318923B (en) | 2000-10-18 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20040914 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20040914 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20070313 |
|
| A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20070330 |
|
| A602 | Written permission of extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A602 Effective date: 20070404 |
|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20070912 |
|
| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20071023 |