JPH10151253A - Game machine - Google Patents

Game machine

Info

Publication number
JPH10151253A
JPH10151253A JP31401796A JP31401796A JPH10151253A JP H10151253 A JPH10151253 A JP H10151253A JP 31401796 A JP31401796 A JP 31401796A JP 31401796 A JP31401796 A JP 31401796A JP H10151253 A JPH10151253 A JP H10151253A
Authority
JP
Japan
Prior art keywords
coating layer
board
base board
electric parts
cpu
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP31401796A
Other languages
Japanese (ja)
Other versions
JP4032318B2 (en
Inventor
Narutoshi Hayashi
成歳 林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Okumura Yu Ki Co Ltd
Original Assignee
Okumura Yu Ki Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Okumura Yu Ki Co Ltd filed Critical Okumura Yu Ki Co Ltd
Priority to JP31401796A priority Critical patent/JP4032318B2/en
Publication of JPH10151253A publication Critical patent/JPH10151253A/en
Application granted granted Critical
Publication of JP4032318B2 publication Critical patent/JP4032318B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/28Applying non-metallic protective coatings
    • H05K3/284Applying non-metallic protective coatings for encapsulating mounted components

Landscapes

  • Pinball Game Machines (AREA)

Abstract

PROBLEM TO BE SOLVED: To effectively prevent getting a control baseboard converted and to make it possible to infallibly find such converting if any. SOLUTION: A print base board 11 on a main base board 5 is installed with a CPU 12, memories 13 such as ROM, RAM or others, a resistor 14 and such electric parts. The both upper and lower faces of a print base board 11 are all covered with a transparent epoxy resin coating layer 21 except at the connector part 15. This coating layer 21 is formed by spraying liquid made of epoxy resin solved by solvent and is so completely covering electric parts such as the CPU 12 and the outer face of the print base board 11 that those electric parts cannot be touched by hand.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、遊技内容を制御す
るために、中央処理装置やメモリ等の電子部品を用いて
構成される制御基板を備えたパチンコ機等の遊技機に関
する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a game machine such as a pachinko machine having a control board for controlling game contents using electronic components such as a central processing unit and a memory.

【0002】[0002]

【従来の技術】パチンコ機等の遊技機の遊技内容は、プ
リント基板に中央処理装置(CPU)やROM、RAM
等のメモリ等の電子部品を配置して構成される制御基板
で制御されるが、特にパチンコ機での大入賞口の開放状
態等は、賭博性を少なくするため法律により規制される
ため、この規制に従って遊技内容が制御されている。し
かしこれらの電子部品の交換や回路変更等により、制御
基板を改造し、遊技内容を賭博性の高いものに変更され
る虞れがあるため、このような不正な改造を防止或は発
見する手段を供する必要がある。そこで例えば特公平5
−43820号公報には、所望の電子部品毎と、その電
子部品が配置されるプリント基板のケースとに封印紙を
貼付すると共に、電子部品毎の封印状態を検査できるよ
うに、前記ケースに窓等の観察手段を設けて、封印紙を
破って改造がなされた場合には発見可能とする発明が開
示されている。
2. Description of the Related Art Game contents of a game machine such as a pachinko machine include a central processing unit (CPU), a ROM and a RAM on a printed circuit board.
It is controlled by a control board configured by arranging electronic parts such as memories, etc., especially the open state of the big winning opening in pachinko machines etc. is regulated by law to reduce gambling, The game content is controlled according to regulations. However, there is a risk that the control board will be remodeled by replacing these electronic components or changing the circuit, and the content of the game will be changed to one with a high gambling property. Need to be provided. So, for example, Tokuho 5
JP-A-43820 discloses a method in which a sealing paper is attached to each desired electronic component and a case of a printed circuit board on which the electronic component is arranged, and a window is formed on the case so that the sealing state of each electronic component can be inspected. There is disclosed an invention in which an observation means such as the above is provided so that if the seal paper is broken and remodeled, it can be found.

【0003】[0003]

【発明が解決しようとする課題】しかし上記封印紙によ
る封印は、電子部品毎に封印しても、特殊な薬品を用い
て封印紙を破らずにはがしたり、偽造したりすることが
可能なため、結局制御基板の改造を簡単にさせてしまう
上、検査においてもこれを発見することができず、制御
基板の改造防止効果は薄かった。
However, the sealing with the sealing paper can be performed without breaking the sealing paper by using a special chemical or forging, even if each electronic component is sealed. In the end, the modification of the control board is simplified, and this cannot be found even in the inspection, and the effect of preventing the modification of the control board is small.

【0004】そこで請求項1に記載の発明は、制御基板
の改造を効果的に防止すると共に、改造の発見も確実に
行うことができる遊技機を提供することを目的としたも
のである。
Accordingly, an object of the present invention is to provide a gaming machine which can effectively prevent modification of a control board and can surely find a modification.

【0005】[0005]

【課題を解決するための手段】上記目的を達成するため
に、請求項1に記載の発明は、前記プリント基板は、少
なくとも所望の前記電子部品と共に樹脂コーティングに
より覆うものであることを特徴とするものである。又請
求項2に記載の発明は、請求項1による効果を一層向上
させるために、前記樹脂コーティングを前記プリント基
板の両面において行ったものである。
According to a first aspect of the present invention, the printed circuit board is covered with a resin coating together with at least the desired electronic components. Things. According to a second aspect of the present invention, in order to further improve the effect of the first aspect, the resin coating is performed on both sides of the printed circuit board.

【0006】[0006]

【発明の実施の形態】以下本発明の実施の形態を図面に
基づいて説明する。図1は遊技機の一例としてのパチン
コ機1を裏面から見た説明図で、機枠2に開閉自在に蝶
着される機構盤3には、遊技盤4が設けられ、その遊技
盤4の裏側に、大入賞口の開放状態等の主要な遊技内容
を制御する主基板5の他、図柄表示器や装飾用ランプ等
の制御用の基板群6が設置されている。又その上方に
は、入賞時に払い出す遊技球を貯留する賞球タンク7
が、その側方には、賞球払出装置8が夫々設けられてい
る。尚9は賞球払出基板、10は遊技球の発射装置ユニ
ットである。
Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is an explanatory view of a pachinko machine 1 as an example of a gaming machine as viewed from the back side. A mechanism board 3 hinged to a machine frame 2 to open and close is provided with a gaming board 4. On the back side, in addition to a main board 5 for controlling main game contents such as an open state of a special winning opening, a control board group 6 such as a symbol display and a decoration lamp are provided. Above it, a prize ball tank 7 for storing game balls to be paid out at the time of winning.
However, a prize ball payout device 8 is provided on each side. Reference numeral 9 denotes a prize ball payout board, and reference numeral 10 denotes a game ball launching device unit.

【0007】又図2は主基板5の説明図で、主基板5
は、CPU12やROM、RAM等のメモリ13,13
・・、抵抗14等の電子部品を配置すると共に、外部の
他の基板や制御部品と接続される接続端子のコネクタ部
15を備えたプリント基板11を、金属製のベース16
にネジ止めし、更にその上方から箱状のカバー17を被
せてベース16にネジ止めして形成される。このカバー
17は透明な合成樹脂製で、その内面には、対向する二
辺の側面部19,19と、その側面部19,19と一体
の格子状の上面部20とからなる金属製の補強板18が
嵌め込まれている。尚17a,17a・・は放熱孔であ
る。そしてこのプリント基板11における上下両面に
は、図3(A)にも示すように、エポキシ樹脂による透
明なコーティング層21,21が、コネクタ部15を除
いてほぼ全面に形成されている。このコーティング層2
1は、上記エポキシ樹脂を溶剤で液状にし、これを表面
にスプレーした後、固化させて形成されるもので、この
状態でCPU12やメモリ13等の電子部品及びその周
囲のプリント基板11の外面を完全に被覆し、電子部品
を直接手で触れることができないようにしている。
FIG. 2 is an explanatory view of the main substrate 5.
Are memories 13, 13 such as a CPU 12, a ROM, and a RAM.
.. A printed circuit board 11 on which electronic parts such as a resistor 14 are arranged and a connector part 15 of a connection terminal connected to another external board or a control part is mounted on a metal base 16.
, And a box-shaped cover 17 is placed from above to screw it to the base 16. The cover 17 is made of a transparent synthetic resin and has on its inner surface a metal reinforcement made up of two opposing side surfaces 19, 19 and a lattice-shaped upper surface 20 integral with the side surfaces 19, 19. A plate 18 is fitted. Reference numerals 17a, 17a,. As shown in FIG. 3A, transparent coating layers 21 and 21 made of epoxy resin are formed on almost the entire upper and lower surfaces of the printed circuit board 11 except for the connector portion 15. This coating layer 2
Reference numeral 1 denotes a liquid epoxy resin which is made into a liquid state by a solvent, sprayed on the surface, and then solidified. It is completely covered so that electronic components cannot be touched directly by hand.

【0008】よってこのように構成された主基板5にお
いては、例えばCPU12やメモリ13等のICを交換
する場合は、図3(B)のように該当する電子部品の周
囲のコーティング層21を除去しなければならないた
め、部品の交換や回路変更に非常に手間がかかり、不正
改造の防止に繋がる。特にプリント基板11の両面にコ
ーティング層21が形成されているため部品の取り外し
はより面倒になり、不正改造防止効果は一層高まる。而
もこのように不正改造が行われたときは、コーティング
層21が、交換等された電子部品13aの箇所で除去さ
れていることで簡単に確認できるため、検査も迅速に行
える。更に不正改造後に改造者が再度樹脂コーティング
を行ったとしても、図3(C)のように元のコーティン
グ層21と新しいコーティング層22が自然に繋がら
ず、厚みが不連続となる箇所22a,22aが形成され
るため、この場合も容易に改造を発見できる。このよう
に不正改造が簡単に発見されることで、延いては不正改
造の防止効果がより増進されることにもなる。
Therefore, in the main substrate 5 having such a configuration, when replacing the IC such as the CPU 12 and the memory 13, for example, the coating layer 21 around the corresponding electronic component is removed as shown in FIG. Therefore, it takes a lot of time to replace parts and change circuits, which leads to prevention of unauthorized modification. In particular, since the coating layers 21 are formed on both sides of the printed circuit board 11, the removal of components becomes more troublesome, and the effect of preventing unauthorized alteration is further enhanced. In this way, when the tampering is performed in this manner, the inspection can be performed quickly because the coating layer 21 can be easily confirmed by being removed at the place of the replaced electronic component 13a. Furthermore, even if the remodeler performs resin coating again after the illegal remodeling, the original coating layer 21 and the new coating layer 22 are not naturally connected as shown in FIG. Is formed, so that the modification can be easily found in this case as well. By easily detecting such unauthorized alteration, the effect of preventing unauthorized alteration is further enhanced.

【0009】尚このコーティング層はプリント基板の全
面に形成するものでなく、例えばCPU、ROM、RA
M等の重要なICのみとする等、所望の電子部品を選択
してその部分のみに樹脂コーティングを行うようにして
も良い。この場合、例えば選択された電子部品以外をマ
スキングしてエポキシ樹脂等を噴き付け、その後マスキ
ングを剥すことで簡単に行える。又プリント基板の両面
でなく、電子部品側の片面のみにコーティング層を形成
したり、電子部品の種類に応じてコーティング層の厚み
を変えたりすることもできる。更に上記形態では、遊技
内容の重要な制御を行う主基板のみに樹脂コーティング
を行うものとしたが、先に説明した賞球払出基板9や基
板群6内の任意の基板等、主基板以外の所望の制御基板
にも同様に樹脂コーティングを行って差し支えない。そ
の他樹脂の種類やコーティング層の形成方法も上記形態
に限定するものではなく、樹脂の種類として例えば塩化
ビニルや酢酸ビニル、その他の樹脂系接着剤を採用した
り、コーティング層の形成方法として例えば浸漬法を採
用したりする等、本発明の趣旨を逸脱しない範囲で適宜
変更可能である。
Note that this coating layer is not formed on the entire surface of the printed circuit board.
It is also possible to select a desired electronic component such as only an important IC such as M and to apply resin coating only to that portion. In this case, for example, it can be easily performed by masking a part other than the selected electronic component and spraying an epoxy resin or the like, and then removing the masking. Further, a coating layer can be formed only on one side of the electronic component side, not on both sides of the printed circuit board, or the thickness of the coating layer can be changed according to the type of the electronic component. Further, in the above embodiment, the resin coating is performed only on the main board that performs important control of the game content. However, other than the main board, such as the prize ball payout board 9 and any board in the board group 6 described above. A desired control board may be similarly coated with a resin. The type of the other resin and the method of forming the coating layer are not limited to the above-described embodiments, and examples of the type of the resin include vinyl chloride and vinyl acetate, and other resin-based adhesives. The method can be appropriately changed without departing from the spirit of the present invention, such as adopting a law.

【0010】[0010]

【発明の効果】請求項1に記載の発明によれば、プリン
ト基板を少なくとも所望の電子部品と共に樹脂コーティ
ングで覆うものとしたことで、部品の交換や回路変更が
困難になり、不正改造の防止に効果的となる。又改造が
行われても樹脂コーティングの状態で直ちに発見できる
ため、検査も容易となり、延いては不正改造防止にも繋
がる。又請求項2に記載の発明によれば、プリント基板
の両面に樹脂コーティングを行ったことで、部品交換等
がより困難となり、請求項1の不正改造防止効果が一等
高められる。
According to the first aspect of the present invention, since the printed circuit board is covered with at least a desired electronic component with a resin coating, it is difficult to replace the component or change the circuit, and to prevent unauthorized modification. It is effective for Further, even if the modification is performed, it can be immediately found in the state of the resin coating, so that the inspection becomes easy, which leads to prevention of unauthorized modification. According to the second aspect of the present invention, since the resin coating is performed on both sides of the printed circuit board, it becomes more difficult to replace parts and the like, and the effect of preventing the unauthorized alteration of the first aspect is enhanced.

【図面の簡単な説明】[Brief description of the drawings]

【図1】パチンコ機を裏面から見た説明図である。FIG. 1 is an explanatory diagram of a pachinko machine viewed from the back.

【図2】主基板の説明図である。FIG. 2 is an explanatory diagram of a main substrate.

【図3】(A)コーティング層の説明図である。 (B)部品を交換した場合のコーティング層の説明図で
ある。 (C)再コーティングした場合のコーティング層の説明
図である。
FIG. 3A is an explanatory view of a coating layer. (B) It is explanatory drawing of the coating layer at the time of replacing parts. (C) It is explanatory drawing of the coating layer at the time of recoating.

【符号の説明】[Explanation of symbols]

1・・パチンコ機、2・・機枠、5・・主基板、11・
・プリント基板、12・・CPU、13・・メモリ、1
4・・抵抗、16・・ベース、17・・カバー、18・
・補強板、21・・コーティング層。
1. Pachinko machine 2. Machine frame 5. Main board 11.
・ Printed circuit board, 12 ・ ・ CPU, 13 ・ ・ Memory, 1
4 ··· Resistance, 16 ·· base, 17 ·· cover, 18 ·
-Reinforcement plate, 21-Coating layer.

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】 プリント基板に電子部品を配置して遊技
内容を制御する制御基板を構成した遊技機であって、 前記プリント基板は、少なくとも所望の前記電子部品と
共に樹脂コーティングにより覆うものであることを特徴
とする遊技機。
1. A game machine comprising a control board for arranging electronic components on a printed board to control game contents, wherein the printed board is covered with at least a desired electronic component together with a resin coating. A gaming machine characterized by the following.
【請求項2】 前記樹脂コーティングを前記プリント基
板の両面において行った請求項1に記載の遊技機。
2. The gaming machine according to claim 1, wherein said resin coating is performed on both sides of said printed circuit board.
JP31401796A 1996-11-25 1996-11-25 Pachinko machine Expired - Fee Related JP4032318B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP31401796A JP4032318B2 (en) 1996-11-25 1996-11-25 Pachinko machine

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP31401796A JP4032318B2 (en) 1996-11-25 1996-11-25 Pachinko machine

Publications (2)

Publication Number Publication Date
JPH10151253A true JPH10151253A (en) 1998-06-09
JP4032318B2 JP4032318B2 (en) 2008-01-16

Family

ID=18048209

Family Applications (1)

Application Number Title Priority Date Filing Date
JP31401796A Expired - Fee Related JP4032318B2 (en) 1996-11-25 1996-11-25 Pachinko machine

Country Status (1)

Country Link
JP (1) JP4032318B2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011024621A (en) * 2009-07-21 2011-02-10 Kita Denshi Corp Game machine board and game machine board case
JP2012105955A (en) * 2010-10-25 2012-06-07 Toppan Printing Co Ltd Wiring board equipped with electronic component
JP2014140450A (en) * 2013-01-23 2014-08-07 Sammy Corp Board case unit

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011024621A (en) * 2009-07-21 2011-02-10 Kita Denshi Corp Game machine board and game machine board case
JP2012105955A (en) * 2010-10-25 2012-06-07 Toppan Printing Co Ltd Wiring board equipped with electronic component
JP2014140450A (en) * 2013-01-23 2014-08-07 Sammy Corp Board case unit

Also Published As

Publication number Publication date
JP4032318B2 (en) 2008-01-16

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