JP2012105955A - Wiring board equipped with electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a wiring board in which a trace of replacement remains and illegal replacement is easily detectable when electronic components is removed and replaced by illegal electric components in the wiring board equipped with the electronic components.SOLUTION: A pin 21 of the electronic component 2 is inserted into and put through a through hole provided in the wiring board 1, a pin end part projecting from an opposite side is electrically connected to a pad of a wiring board by a solder 3. The wiring board includes: an intermediate resin layer 4 which is provided by covering its connection part; and a wavelength conversion layer 5 which is provided on the intermediate resin layer and emits a beam with a wavelength different from an incident beam with a predetermined specific wavelength. When peel-off is performed, although a part of the intermediate resin layer 4 remains, the wavelength conversion layer 5 does not remain and is completely peeled off. Thus, the infrared ray with specific wavelength is radiated, to examine the presence or absence of the peel-off by the presence or absence of an emitted beam.

Description

  The present invention relates to a wiring board on which electronic parts such as a CPU and a ROM are mounted. When the electronic parts are illegally replaced, traces of the replacement remain, and therefore, the wiring that can easily detect unauthorized replacement. It relates to a substrate. The present invention can be used, for example, as a control board for a pachinko game machine.

  The control board of the pachinko game machine is configured by mounting electronic components such as a CPU, a ROM, and a RAM on a wiring board, and the number of hits and prize balls is controlled by these electronic components.

  This wiring board is formed by forming an electric circuit on one or both sides of an insulating substrate called a glass epoxy (glass epoxy) board. Generally, a through hole is provided in a pad of the electric circuit, and an inner wall of the through hole is provided. Has been plated with metal. And the pin of an electronic component is inserted and penetrated to this through-hole, and the pin protruded on the opposite side is fixed to the said pad with solder. In addition to this, the insulating substrate is not provided with a through hole, and the tip of the pin of the electronic component is electrically connected to the pad of the electric circuit by solder, or the pad provided on the wiring substrate. There are also known devices in which electrodes of electronic components are electrically connected by solder.

  By the way, in the pachinko industry, there is a concern about fraudulent acts in which a genuine electronic component is removed from this wiring board and replaced with a counterfeit electronic component, and in fact, such fraudulent behavior will not end. . Therefore, there is a need for a technology that prevents unauthorized replacement of electronic components, and in the unlikely event that unauthorized replacement is performed, there is a need for technology that can easily detect that unauthorized replacement has been performed. It has been.

  By the way, there are various known techniques for detecting such illegal replacement when a part of the product is illegally replaced. For example, Patent Document 1 discloses a technique of molding a connection portion between a connector and a wiring board used in a pachinko game machine with a transparent resin. In order to replace this wiring board with an unauthorized wiring board, it is necessary to destroy the mold resin, and since it is possible to easily determine whether or not the mold resin is destroyed, the unauthorized replacement can be easily detected. . However, even in this technique, it is difficult to detect if the resin is replaced with an unauthorized wiring board and then molded again with a transparent resin.

  Patent document 2 relates to a sealing tool used for electric power equipment, and discloses a sealing tool coated with a fluorescent material. Fluorescence is emitted by irradiating a genuine seal with ultraviolet light, but when the lens is replaced with an unauthorized seal, the emission of fluorescence cannot be observed. it can. However, in this technique, there is a possibility that the fluorescent material remains when the genuine seal is removed. When the fluorescent material remains, if an ultraviolet ray is irradiated after attaching an unauthorized seal, fluorescence is emitted by the residual fluorescent material, and the unauthorized exchange cannot be detected.

  Patent Document 3 discloses a technique of using a sealing seal coated with a fluorescent material as a sealing seal for a storage case for storing a control board used in a pachinko game machine. When the genuine seal is irradiated with ultraviolet light, it emits fluorescence.On the other hand, after opening and replacing the internal control board with an illegal control board, it is sealed again with an illegal seal. Since the fluorescence emission cannot be observed even when irradiated with ultraviolet rays, the unauthorized exchange can be easily detected. However, even in this technique, if the fluorescent substance remains when the genuine seal is peeled off, the unauthorized exchange cannot be detected.

JP 2004-209282 A JP 2005-156857 A Utility Model Registration No. 3038245

  Therefore, the present invention provides a wiring board on which an electronic component is mounted, and when the electronic component is removed and replaced with an unauthorized electronic component, the trace of the replacement remains, and therefore the unauthorized replacement can be easily detected. An object is to provide a substrate.

  That is, according to the first aspect of the present invention, the pin of the electronic component is inserted through the through hole provided in the wiring board and penetrated, and the pin tip protruding from the opposite side of the through hole is soldered to the pad of the wiring board. In a wiring board mounted with electronic components configured to be electrically connected to the intermediate resin layer provided so as to cover the connection part, and a predetermined specific wavelength provided on the intermediate resin layer And a wavelength conversion layer that emits a light beam having a different wavelength from the incident light beam.

  In the present invention, when the incident light beam having a predetermined specific wavelength is irradiated, a light beam having a wavelength different from the incident light beam is emitted.

  On the other hand, when removing an electronic component, it is necessary to peel off the intermediate resin layer and the wavelength conversion layer and then remove the solder by heating and melting. For this reason, although a part of intermediate resin layer may remain on a wiring board, the wavelength conversion layer arrange | positioned on an intermediate resin layer does not remain. For this reason, even if the incident light is irradiated after the genuine electronic component is replaced with an unauthorized electronic component, the emitted light having a wavelength different from that of the incident light is not emitted.

  In this way, when the incident light beam is irradiated onto the wiring board on which the genuine electronic component is mounted, the light beam having a wavelength different from the incident light beam is emitted, whereas the wiring board after replacement with an unauthorized electronic component is performed. Even if the incident light beam is irradiated, the emitted light beam cannot be observed, so that the fact of illegal exchange can be easily detected.

  Next, the invention according to claim 2 relates to the case where the electronic component is configured by electrically connecting the tip of the pin of the electronic component to the pad provided on the wiring board by solder. is there.

  That is, the invention according to claim 2 is the wiring board in which the electronic component configured by electrically connecting the tip of the pin of the electronic component to the pad provided on the wiring substrate by soldering is provided. And an intermediate resin layer provided on the intermediate resin layer, and a wavelength conversion layer that is provided on the intermediate resin layer and emits a light beam having a wavelength different from the incident light beam having a predetermined wavelength. A wiring board on which electronic components are mounted.

  Also in this case, when removing the electronic component, it is necessary to remove the intermediate resin layer and the wavelength conversion layer, and then remove the solder by heating and melting. For this reason, it is possible to easily detect the fact of illegal exchange by irradiating the incident light and inspecting whether or not the light having a wavelength different from the incident light is emitted.

  The invention according to claim 3 is an invention according to a case where the electronic component is configured by electrically connecting an electrode of the electronic component to a pad provided on the wiring board by solder. In this case, since the connection part between the wiring board pad and the electrode of the electronic component is sandwiched between the wiring board and the electronic component, the connection part should be covered with an intermediate resin layer or a wavelength conversion layer. Is difficult. In this case, since the wiring substrate is usually larger than the electronic component, the periphery of the electronic component connected to the wiring substrate may be covered with the intermediate resin layer and the wavelength conversion layer. Even when the periphery of the electronic component is covered with the intermediate resin layer and the wavelength conversion layer, when the electronic component is illegally removed and replaced, the intermediate resin layer and the wavelength conversion layer are peeled off, and then the solder is removed. Since it is necessary to remove it by heating and melting, it is possible to easily detect the fact of illegal exchange by irradiating the incident light and inspecting whether or not the light having a wavelength different from the incident light is emitted. Can do.

That is, the invention according to claim 3 is a wiring board in which an electronic component configured by electrically connecting an electrode of an electronic component to a pad provided on the wiring board by soldering is mounted.
An intermediate resin layer provided so as to cover the periphery of the electronic component, and a wavelength conversion layer provided on the intermediate resin layer and emitting a light beam having a wavelength different from a predetermined incident light beam having a specific wavelength. A wiring board on which an electronic component is mounted.

Next, the invention according to claim 4 is characterized in that the incident light having the specific wavelength is infrared, and the outgoing light is infrared having a wavelength different from that of the incident light. A wiring board according to any one of the above.

  That is, in the present invention, when the wavelength conversion layer is irradiated with infrared light having a specific wavelength, infrared light having a wavelength different from the incident light is emitted. Such a wavelength conversion layer can be formed, for example, by applying an ink containing a fluorescent substance that is excited by infrared rays. However, such an infrared excited fluorescent substance is a special substance, and other than a dedicated supplier. Is not easy to obtain and is expensive, so it is difficult to forge itself. In addition, since the emitted light cannot be detected with the naked eye, it is difficult to recognize that the wavelength conversion layer has such a function. For this reason, according to the present invention, there is an effect that it is difficult to forge or forge the wavelength conversion layer.

  Next, the invention according to claim 5 is the wiring board according to any one of claims 1 to 4, wherein the intermediate resin layer has a property of being irreversibly discolored by heating.

  According to this invention, for example, after peeling the intermediate resin layer and the wavelength conversion layer from the wiring board, when the solder is heated and melted to remove the genuine electronic component, a part of the intermediate resin layer remains on the wiring board. If so, the residual intermediate resin layer is discolored by heat when melting the solder. Moreover, since this discoloration occurs irreversibly, the discoloration state is maintained as it is even after an illegal electronic component is attached. For this reason, it is possible to detect the fact of unauthorized exchange even with the naked eye.

  Next, the invention according to claim 6 is characterized in that the wavelength conversion layer is in a range of 1 to 10% by volume with respect to the intermediate resin layer. It is a wiring board as described in.

  Next, in the invention described in claim 7, the film thickness of the wavelength conversion layer is between 5% and 10% with respect to the film thickness of the intermediate resin layer. A wiring board according to claim 1.

  Next, the invention according to claim 8 is the wiring board according to any one of claims 1 to 7, wherein the length conversion layer has a pattern shape.

  Next, the invention according to claim 9 is characterized in that the area of the portion where the pattern of the length change layer is formed is in the range of 2 to 15% with respect to the area of the intermediate resin layer. Item 9. The wiring board according to Item 8.

  Next, the invention according to claim 9 is limited to a wiring board to which the technology according to the present invention can be suitably applied, that is, the electronic component is an electronic component for controlling a pachinko machine. The wiring board according to claim 1.

  According to the present invention, when the incident light beam is irradiated onto the wiring board on which the genuine electronic component is mounted, a light beam having a wavelength different from the incident light beam is emitted. On the other hand, the wavelength conversion layer is peeled and removed when replacing with an unauthorized electronic component, and part of the wavelength conversion layer does not remain, so that the emitted light is observed even when irradiated with the incident light. I can't. For this reason, the fact of unauthorized exchange can be easily detected.

Sectional drawing of the principal part of the wiring board which mounted the electronic component which concerns on the 1st Embodiment of this invention Sectional drawing of the principal part of the wiring board which mounted the electronic component which concerns on the 2nd Embodiment of this invention. Sectional drawing of the principal part of the wiring board which mounted the electronic component which concerns on the 3rd Embodiment of this invention. Cross-sectional view of essential parts of a wiring board on which an electronic component according to a comparative example is mounted

  Next, the present invention will be described with reference to the drawings.

  FIG. 1 is a cross-sectional view of a main part of a wiring board on which an electronic component according to the first embodiment of the present invention is mounted.

  That is, an electrical circuit (not shown) is formed on one or both sides of an electrically insulating substrate to form a wiring substrate 1, and an electrical component 2 is mounted on the wiring substrate 1.

  The electrically insulating substrate is well known, and for example, a substrate (so-called glass epoxy substrate) obtained by impregnating a glass fiber fabric or knitted fabric with a thermosetting epoxy resin and curing it can be used. In addition, a method of forming an electric circuit on this electrically insulating substrate is also well known. After a copper foil is laminated on one side or both sides, this copper foil is etched and patterned into a circuit pattern.

  Next, the wiring board 1 is provided with a through hole in the pad portion of the electric circuit, and the inner wall of the through hole is metal-plated. A method of providing a through hole in the wiring substrate 1 and metal plating the inner wall thereof is also well known, and the metal plating can be formed by electroless plating or electroplating after electroless plating.

  And the pin 21 of the electronic component 2 is inserted in this through hole, This pin 21 penetrates the through hole, and the front-end | tip protrudes on the opposite side. This protruding portion is fixed to the pad by solder 3. In the figure, reference numeral 11 denotes a solder resist applied to the wiring board 1.

  This connection portion, that is, the portion fixed by the solder 3 is covered with the intermediate resin layer 4. The intermediate resin layer 4 can be formed of an arbitrary resin, but it is preferable that the intermediate resin layer 4 is formed of a coating film having no self-supporting performance. In this case, if the intermediate resin layer 4 is to be peeled from the wiring board 1, the intermediate resin layer 4 is destroyed and a part thereof remains on the wiring board 1.

  The intermediate resin layer 4 desirably has a property of irreversibly discoloring due to heat generated when the solder 3 is melted. In this case, when the intermediate resin layer 4 is peeled off from the wiring board 1, a part of the resin layer 1 remaining on the wiring board 1 is discolored by heat generated when the solder 3 is melted, and the fact that the solder is melted is displayed. Because it becomes possible to do. For example, it is a material that changes color at 130 ° C. for 10 seconds. Moreover, the material which changes color on condition of 250 degreeC and 5 can also be used.

Such an intermediate resin layer 4 can be formed, for example, by printing or applying an ink to which a resin binder, a color changing agent that changes color by heat, a solvent, and necessary additives are added. About the mixing ratio of the resin binder and the color change agent, 2 parts by weight of the color change agent may be added and mixed with 100 parts by weight of the resin binder.

  As the resin binder, for example, an epoxy resin, an acrylic resin, a urethane resin, a polyethylene resin, a polyamide resin, or the like can be used. Further, an ultraviolet curable resin may be used. Among these, an epoxy resin excellent in heat resistance and metal adhesion can be preferably used.

  Next, examples of such a color changing agent include cobalt-hexamethylenetetramine salt, nickel-hexamethylenetetramine salt, cobalt phosphate / octahydrate, cobalt oxalic acid / potassium / trihydrate, and copper hydroxide. It is done.

The intermediate resin layer 4 desirably has a thickness of 0.5 mm or more. This is because, when peeling, a part of the wiring substrate 1 remains, and the wavelength conversion layer 5 laminated thereon is surely peeled without remaining. The intermediate resin layer 4 may be 3.0 mm or less. Desirably, the thickness is 1.0 to 1.5 mm.

  This intermediate resin layer 4 can be formed by any coating method or printing method. For example, a printing method using PAD or a coating method using a dispenser.

  Next, in the wiring substrate shown in FIG. 1, a wavelength conversion layer 5 is provided on the intermediate resin layer 4. The wavelength conversion layer 5 emits a light beam having a wavelength different from a predetermined incident light beam having a specific wavelength. Infrared rays are desirably used as the incident light having a specific wavelength. Further, it is desirable that the emitted light is also infrared. As the wavelength conversion material, a so-called up-conversion light-emitting material such as an infrared-visible conversion material may be used, or a material that is excited by ultraviolet rays and emits light in the visible light region may be used.

  This wavelength conversion layer 5 can be formed by printing or applying an ink containing a resin binder, a wavelength conversion material, a solvent, and necessary additives. Regarding the mixing ratio of the resin binder and the wavelength conversion material, 2 parts by weight of the wavelength conversion material may be added and mixed with 100 parts by weight of the resin binder.

  Examples of the resin binder that can be used include epoxy resins, acrylic resins, urethane resins, polyethylene resins, polyamide resins, and liquid crystal polymers. Further, an ultraviolet curable resin may be used. Among these, an epoxy resin excellent in heat resistance and metal adhesion can be preferably used.

Further, an infrared excitation phosphor can be used as a wavelength conversion material that emits infrared rays having a wavelength different from that of the infrared rays upon incidence of infrared rays. Examples of such infrared excitation phosphors include dysprosium (Dy) bromide. Further, a material containing gadolinium bromide (Gd) as a base material and containing erbium (Er) ions as a light emitting source and dysprosium ions as an absorbing light source can be used as the infrared excitation phosphor. Ytterbium (Yb) can also be used. The wavelength conversion layer 5 is thinner than the intermediate resin layer 4 and may be provided to a thickness of 2 to 500 μm, for example. This is because when peeling from the wiring substrate 1, it is necessary to peel the entire surface without leaving a part. Preferably, it is 5-20 micrometers.

  This wavelength conversion layer 5 can also be formed by an arbitrary method. That is, a printing method using PAD or a coating method using a dispenser.

The wavelength conversion layer and the intermediate resin layer are preferably formed so as to be in contact with each other. Moreover, it is preferable that a wavelength conversion layer exists in the range of 1-10% of volume ratios with respect to an intermediate | middle resin layer. Moreover, it is more preferable that it is in the range of 3 to 4% by volume ratio. The weight ratio may be converted by specific gravity.
In this way, when the wavelength conversion layer is peeled off once and then re-inked to form the wavelength conversion layer again illegally, the intermediate resin layer and the wavelength conversion layer cannot be separated and peeled off. Since the ink is made in a state where the intermediate resin layer and the wavelength conversion layer are mixed, the concentration of the wavelength conversion material of the re-inked ink becomes lower than the original wavelength conversion layer, and the wavelength conversion layer is formed again. However, detection by the machine becomes impossible.
Moreover, it is preferable that the film thickness of a wavelength conversion layer is between 5 to 10% with respect to the film thickness of an intermediate resin layer. Within this range, mechanical detection can be made difficult when the wavelength conversion layer is formed again after illegally reinking.

The faction conversion layer may be formed in a pattern. Examples of patterns include characters and symbols. In this way, device detection as character and symbol information is possible.
The area of the portion where the pattern of the length change layer is formed is preferably in the range of 2 to 15% with respect to the area of the intermediate resin layer. Within this range, mechanical detection can be made difficult when the wavelength conversion layer is formed again after illegally reinking.

  Next, FIG. 2 is a cross-sectional view of the main part of a wiring board on which an electronic component according to a second embodiment of the present invention is mounted. In this second embodiment, the electronic component is provided on the wiring board. A pad is used that is configured by electrically connecting the tip of the pin 21 of the electronic component 2 with the solder 3 to the pad.

  That is, in the second embodiment, the wiring board 1 has no through hole, and the pin 21 of the electronic component 2 is fixed to the pad by the solder 3. Then, an intermediate resin layer 4 and a wavelength conversion layer 5 are selectively provided at a connection site by the solder 3. In this way, the intermediate resin layer 4 and the wavelength conversion layer 5 can be partially provided only in the connection part.

  Next, FIG. 3 is a cross-sectional view of the main part of the wiring board on which the electronic component 2 according to the third embodiment of the present invention is mounted. In this second embodiment, the electronic component is provided on the wiring board. The pads are formed by electrically connecting the electrodes 22 of the electronic component 2 to the pads by solder 3.

  That is, in the third embodiment, there are no through holes in the wiring board 1 and no pins of the electronic component 2. In this embodiment, the electrodes 22 of the electronic component 2 are directly fixed to the pads of the wiring board 1 by the solder 3. For this reason, the connection portion between the pad and the electrode 22 is sandwiched between the wiring board 1 and the electronic component 2, and it is difficult to cover the connection portion with the intermediate resin layer 4 or the like. Therefore, in this embodiment, instead of the connection part, the periphery of the electronic component 2 is covered with the intermediate resin layer 4, and the wavelength conversion layer 5 is provided on the intermediate resin layer 4. The intermediate resin layer 4 and the wavelength conversion layer 5 are desirably provided over the electronic component 2 and the wiring substrate 1 exposed around the electronic component 2.

  As shown in FIG. 1, after manufacturing a wiring board 1 using a glass epoxy substrate, a through hole is formed in the pad, and a pin 21 of the CPU 2 is inserted into the through hole, and this pin 21 is connected to the pad with solder 3. Fixed and electrically connected.

  Then, an intermediate resin layer 4 was formed by coating so as to cover this connection part. The ink used for the intermediate resin layer 4 is mainly composed of an epoxy resin, a color changer that irreversibly changes to red color by heating at 300 ° C. for 5 seconds, and a mixing ratio of resin: color change agent: Solvent = 7: 1: 3. And the intermediate resin layer 4 was apply | coated so that the dry thickness might be set to 1.5 mm.

  Next, the wavelength conversion layer 5 was formed on the intermediate resin layer 4 by coating. The ink used for the wavelength conversion layer 5 is an epoxy resin, a wavelength conversion material that emits infrared light having a wavelength of 988 μm when irradiated with infrared light having a wavelength of 860 μm, and mainly composed of cyclohexanone. : Solvent = 7: 1: 3. The wavelength conversion layer 5 was applied so that the dry thickness was 10 μm. Thus, a wiring board on which the electronic component according to the example of the present invention was mounted was manufactured.

  Next, for comparison, without applying the intermediate resin layer 4, the wavelength conversion layer 5 is directly applied and formed on the connection portion of the pin 21 of the CPU 2, and the wiring board on which the electronic component according to the comparative example is mounted. Was manufactured (see FIG. 2). In addition, it is the same as that of an Example except having formed the wavelength conversion layer 5 directly on the said connection site | part.

  Then, the wavelength conversion layer 5 and the intermediate resin layer 4 are peeled off from the wiring board of the embodiment to expose the solder 3 at the connection site, and the solder 3 is heated and melted at 300 ° C. for 5 seconds to fix the pin 21. It was pulled out from the through hole. With the CPU 2 thus removed, an infrared ray having a wavelength of 860 μm was irradiated to inspect whether or not an infrared ray having a wavelength of 988 μm was emitted. As a result, this infrared emission could not be detected at all. In addition, it turned out that the peeling surface of the wavelength conversion layer 5 and the intermediate resin layer 4 is colored red, and a part of the intermediate resin layer 4 remains.

Similarly, the wavelength conversion layer 5 was peeled from the wiring board of the comparative example, the solder 3 was heated, and the pins 21 were pulled out from the through holes. Then, when infrared rays having a wavelength of 860 μm were irradiated and the presence or absence of emission of infrared rays having a wavelength of 988 μm was inspected, the emission of the infrared rays could be detected.
As a result, it was found that a part of the wavelength conversion layer 5 remained on the release surface of the wavelength conversion layer 5. This peeled surface is colorless, and it can be seen from the apparatus verification that a part of the intermediate resin layer 4 remains.

  From the above results, it was confirmed that when ink was applied to the connection portion where the pin 21 was fixedly connected with the solder 3, a part of the ink remained even if the ink was peeled off. When this ink has a two-layer structure, when it is peeled, a part of the underlying ink (intermediate resin layer 4) remains, but an overcoat layer (wavelength conversion layer 5) overlaid on the underlying ink. ), It was confirmed that the ink could be completely peeled without remaining a part of the ink. For this reason, according to the present invention, it is possible to accurately and easily inspect whether the wavelength conversion layer 5 is peeled off, and it is possible to inspect the presence / absence of unauthorized replacement of electronic components.

DESCRIPTION OF SYMBOLS 1 Wiring board 11 Solder resist 2 Electronic component 21 Pin 22 Electrode 3 Solder 4 Intermediate resin layer 5 Wavelength conversion layer

Claims (10)

An electronic device configured by inserting a pin of an electronic component into a through hole provided in the wiring board and penetrating the pin, and thus electrically connecting the tip of the pin protruding from the opposite side of the through hole to the pad of the wiring board by soldering In the wiring board with the components mounted,
An intermediate resin layer provided so as to cover the connection portion, and a wavelength conversion layer provided on the intermediate resin layer and emitting a light beam having a wavelength different from a predetermined incident light beam having a specific wavelength. A printed circuit board equipped with characteristic electronic components. In a wiring board on which an electronic component configured by electrically connecting a tip of an electronic component pin to a pad provided on the wiring board by soldering is mounted,
An intermediate resin layer provided so as to cover the connection portion, and a wavelength conversion layer provided on the intermediate resin layer and emitting a light beam having a wavelength different from a predetermined incident light beam having a specific wavelength. A printed circuit board equipped with characteristic electronic components. In a wiring board in which an electronic component configured by electrically connecting an electrode of an electronic component to a pad provided on the wiring board by soldering is mounted,
An intermediate resin layer provided so as to cover the periphery of the electronic component, and a wavelength conversion layer provided on the intermediate resin layer and emitting a light beam having a wavelength different from a predetermined incident light beam having a specific wavelength. A wiring board on which electronic components are mounted.   The wiring board according to claim 1, wherein the incident light beam having the specific wavelength is infrared light, and the outgoing light beam is infrared light having a wavelength different from that of the incident light beam.   The wiring substrate according to claim 1, wherein the intermediate resin layer has a property of being irreversibly discolored by heating.   The wiring substrate according to claim 1, wherein the wavelength conversion layer is in a range of 1 to 10% by volume with respect to the intermediate resin layer.   The thickness of the said wavelength conversion layer is between 5 to 10% with respect to the film thickness of an intermediate | middle resin layer, The wiring board in any one of Claims 1-6 characterized by the above-mentioned.   The wiring board according to claim 1, wherein the length conversion layer has a pattern shape.   9. The wiring board according to claim 8, wherein an area of a portion where the pattern of the length conversion layer is formed is in a range of 2 to 15% with respect to an area of the intermediate resin layer.   The wiring board according to claim 1, wherein the electronic component is a control electronic component for a pachinko machine.