JP2011024621A - Game machine board and game machine board case - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To improve security against fraudulent remodeling of a game machine board by interposing a cover layer to cover the board surface together with electric components between the board surface and a prescribed plate-like member facing the board surface, and inseparably fixing the board and the plate-like member by the cover layer. <P>SOLUTION: The game machine board case 1A includes the board 10 in which prescribed electronic components IC1-IC5 are mounted, and a case between which the board 10 is held and housed. The game machine board case has the cover layer 30 which covers the electronic components IC1-IC5 and the board surface in such a way as visible and unreleasable. The cover layer 30 is interposed between a solder surface 10b and the opposed case inner surface 21a, so that a lower case 21 and the board 10 are inseparably fixed to each other. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a gaming machine board and a gaming machine board case in which the gaming machine board is accommodated, and more particularly to a gaming machine board and a gaming machine board case with improved security against unauthorized modification.

In general, a gaming machine such as a slot machine or a pachinko machine is provided with a plurality of boards involved in game performance.
These boards include a main board, which is a main board that controls the overall gaming machine as well as affects the outcome of the game.
The main board is configured as a computer in which various electronic components such as a CPU, a ROM, and a RAM are arranged on a printed board.
This main board is subject to unauthorized modification in order to influence the outcome of the game. For this purpose, a sealing structure is provided in which the main substrate is sandwiched between two transparent cases and sealed so that the case cannot be opened.

This sealing structure is intended to prevent the main substrate from being tampered with. In general, the joint portion where the cases overlap is sealed with a special screw or the like so that it cannot be opened.
Such a case sealing structure includes, for example, “Pachinko machine board case sealing structure” of Japanese Patent Application Laid-Open No. 2002-126307 (Patent Document 1) and Japanese Patent Application Laid-Open No. 2002-119719 “Board Case of Game Machine”. (Patent Document 2) and the like have been proposed in the past.

JP 2002-126307 A (page 11, FIG. 1, FIG. 5) JP 2002-119719 A (page 8, FIG. 2, FIG. 5) Japanese Patent No. 4032318 (page 3, FIG. 2)

However, the conventional sealing structure also has the following adverse effects.
A general sealing structure can be cut and destroyed with a general-purpose tool such as a nipper to easily release the sealed state.
Such a sealing structure is configured such that the trace remains when opened, but in recent years, the main structure is tampered with by cutting the sealing structure so that no trace of opening remains. There are some cases.
For example, by cutting the sealing structure with a sharp blade etc., opening the case, attaching an illegal ROM etc. to the main board, and then adhering the sealing structure with an adhesive etc. .

In order to combat such unauthorized modification, Patent Document 3 proposes a technique for coating the main substrate itself with a resin.
According to this technology, the substrate surface is covered with a resin coating together with electronic components such as a CPU and a ROM to make unauthorized modification difficult, and the resin coating is peeled off to perform unauthorized modification, and then covered again with the resin coating. However, the discontinuity in the thickness of the joint between the original resin coating and the new resin coating makes it easy to detect that the resin coating has been performed again, leaving traces of unauthorized modification. ing.
However, with this technology, the substrate surface is in an unprotected state exposed to the outside, other than being covered with a resin coating, and on the premise that the resin coating will be peeled off, it is easy to find the trace of modification, Depending on the strength of the resin coating, it was easily peeled off, the effectiveness of the resin coating was lacking, and reliable protection of electronic components could not be achieved.

  The present invention has been proposed in order to solve the above-described problems, and a covering layer that covers the substrate surface together with the electronic component is interposed between the substrate surface and a predetermined plate-like member facing the substrate surface. Moreover, with this coating layer, the substrate and the plate-like member are fixed so as not to be separated, so that the coating layer cannot be directly touched by hand or peeled off, thereby preventing unauthorized modification. The purpose is to provide a board case for gaming machines.

  In order to achieve the above object, a gaming machine board according to the present invention includes a board on which a predetermined electronic component is mounted, a coating layer that covers the board surface together with the electronic part in a visible and non-peelable manner, A predetermined plate-like member facing the substrate surface with a coating layer interposed therebetween, and the substrate and the plate-like member are fixed inseparably by the coating layer.

  In addition, the board case for gaming machines of the present invention is a board case comprising a board on which predetermined electronic components are mounted and a case for holding the board in between. It is as a board | substrate for game machines as described in any one of -11.

  According to the gaming machine board and gaming machine board case of the present invention, the coating layer covering the board surface together with the electronic components is interposed between the board surface and the predetermined plate-like member facing the board surface, and this coating By fixing the substrate and the plate-like member inseparably with each other, security against unauthorized modification can be improved.

It is a schematic perspective view which shows the internal structure of the slot machine which concerns on one Embodiment of this invention. It is a schematic perspective view which shows 1 A of board cases which concern on one Embodiment of the board case for game machines of this invention. It is the cross-sectional perspective view which cut | disconnected board case 1A which concerns on one Embodiment of the board case for game machines of this invention. It is the expansion perspective view which expanded the vicinity of the filling hole of 1A of substrate cases which concern on one Embodiment of the substrate case for game machines of this invention. It is a disassembled perspective view which shows the substrate case 1B which concerns on one Embodiment of the substrate case for game machines of this invention. It is a schematic perspective view which shows the state which coat | covered the substrate case 1B which concerns on one Embodiment of the substrate case for game machines of this invention with the coating layer. It is a disassembled perspective view of the substrate case 1B which concerns on different embodiment. It is an exploded sectional view of substrate case 1B concerning a different embodiment.

Hereinafter, preferred embodiments of a gaming machine board and a gaming machine board case according to the present invention will be described with reference to the drawings.
There are various types of gaming machines such as pachinko machines, slot machines, arrangement balls, and sparrow balls. In this embodiment, the board case for gaming machines of the present invention is applied to a slot machine that uses medals as gaming media. The case will be described with reference to the drawings.

[Slot machine]
FIG. 1 is a schematic perspective view showing an internal configuration of a slot machine to which a board case for gaming machines of the present invention is attached.
As shown in the figure, the slot machine 100 constitutes a spinning type gaming machine that can acquire medals as game media by rotating a plurality of reels 110a, 110b, and 100c.

The slot machine 1 includes a housing 100b that opens on the front side for housing necessary machines, devices, and the like, and a front door 100a that covers the front side of the housing 100b so as to be openable and closable.
The front door 100a is a door body that is attached to the casing 100b of the slot machine 100 through a hinge or the like so as to be opened and closed. The front door 100a has a start lever that starts rotation of each reel 110 related to a game operation, A plurality of operation means such as three stop buttons for stopping the reels 110 are provided to constitute a front portion of the slot machine 100.

In the center of the housing 1b, reels 110a, 110b, and 110c, a motor (not shown) that rotatably supports each reel 110, a sensor that detects a rotational position, and the like are provided.
In addition, a medal payout device 7 that stores and pays out medals is provided at the bottom of the housing 100b.
A substrate case 1A and a substrate case 1B in which a predetermined substrate is accommodated are provided on the upper portion of the housing 100b.

The board case 1A is an example of a board case for gaming machines of the present invention, and houses a so-called sub-board, which is a board that drives a lamp or a speaker to perform a predetermined effect.
The board case 1B is an example of a board case for a gaming machine according to the present invention, and controls each device such as each reel 110 and the medal payout device 7 based on the signal from each operation means described above, thereby providing a slot machine game. A so-called main substrate, which is a substrate that controls the progress of the above, is accommodated.

The slot machine 100 having such a configuration is controlled as follows by these substrates, and the slot machine game proceeds.
First, when a player inserts a medal and the start lever is operated, the main board performs control to rotate each reel 110 and performs internal lottery drawing for bonuses, small roles, etc. Based on the timing of the pressing operation, stop control of each rotating reel 110 is performed so as to stop at a combination of symbols according to the lottery result.

Further, the main board determines a combination of symbols to be stopped and displayed on each reel 110, and controls the medal payout device 7 to pay out a predetermined number of medals when the predetermined symbol combination is obtained. put out.
In addition, in such a slot machine game, the sub board receives a control signal in accordance with the game state from the main board, and in accordance with this control signal, the sub board turns on a lamp such as a speaker and LED. It is driven to perform a predetermined effect.

  The main board and sub board for controlling the progress of such slot machine games are CPU (Central Processing Unit), ROM, RAM and other storage means, I / O interface and other IC components, resistors, capacitors, transistors, etc. Various electronic components are mounted. For example, by rewriting the contents of a program stored in the ROM or replacing the mounted electronic components with different electronic components, game characteristics (for example, in the slot machine 100) Therefore, it is considered that the board is highly likely to be tampered with.

Therefore, each substrate case 1 is provided with a coating layer 30 of the present invention that covers the electronic component together with the electronic component so that the substrate surface is visible and cannot be peeled off. By interposing the case and the substrate in an inseparable manner, the cover layer 30 can be directly touched by hand and cannot be peeled off to protect these substrates from unauthorized modification. It has become.
Hereinafter, the detailed configuration of each substrate case 1 will be described with reference to the drawings.

[Board case]
First, the substrate case 1A will be described with reference to FIGS.
2 is a schematic perspective view showing a board case 1A according to an embodiment of a board case for gaming machines, FIG. 3 is a sectional perspective view of the board case 1A in FIG. 2, and FIG. 4 is a filling hole in FIG. It is the expansion perspective view which expanded the neighborhood.

The substrate case 1A is an example of a substrate 10 that functions as a sub-substrate, a plate-like member of the present invention, and includes a lower case 21 that is formed in a concave shape so as to accommodate the substrate 10, and an upper case (not shown). Yes.
The substrate 10 is a printed circuit board having a component mounting surface 10a on the upper side in the drawing and a solder surface 10b on the lower side in the drawing, and DIP type IC1 to IC4 and a predetermined unique ID can be read on the component mounting surface 10a. IC5 etc. composed of IC tags recorded in the above are mounted.
IC1 to IC4 are electronic components such as a CPU and a ROM, and each pin is soldered to the solder surface 10b. Therefore, these cannot be removed unless the solder is melted from the solder surface 10b using a soldering iron or the like.

The lower case 21 and the upper case are formed in a box shape from an industrial resin material such as colorless and transparent ABS or polycarbonate, and are formed so as to be accommodated with the substrate 10 interposed therebetween.
Specifically, the substrate 10 has the lower case 21 while forming a gap S between the periphery of the substrate 10 and the side surface of the lower case 21 and forming a gap between the solder surface 10b and the case inner surface 21a. The upper case that functions as a lid is accommodated by being closed.

The substrate 10 is an example of a gaming machine substrate of the present invention, and is fixed to the lower case 21 by the coating layer 30 so as not to be separated while being accommodated in the lower case 21.
Specifically, the coating layer 30 is made of a colorless and transparent urethane resin (polyurethane) adhesive formed by mixing and curing two liquids, and a nozzle 40 for injecting the adhesive is inserted from the injection port 11. Then, an adhesive that flows without a gap is filled between the solder surface 20b and the case inner surface 21a, and then completely cured to fix the substrate 10 and the lower case 21 together.
As a result, the solder surface 10b is covered with the lower case 21 in addition to the covering layer 30 interposed between the case inner surface 21a, so that a soldering iron can be applied to each pin of IC1 to IC4. You can't touch. Thereby, since IC1 to IC4 cannot be replaced, the substrate 10 can be protected from unauthorized modification.
In addition, by interposing the coating layer 30 between the case inner surface 21a without a gap, even if the lower case 21 is destroyed, the solder surface 10b is covered with the coating layer 30. Each pin cannot be touched.

  Furthermore, since both cases are transparent and the covering layer 30 is also transparent, the component mounting surface 10a and the solder surface 10b of the substrate 10 are visible from the outside of the case. Even in the event of an accident, it is possible to easily detect mounting of illegal parts or pattern modification.

Furthermore, a concave portion 211 and a convex portion 212 are formed on the inner surface 21a of the lower case.
As a result, the contact area between the coating layer 30 and the lower case inner surface 21a is increased as compared with the case where the lower case inner surface 21a is a flat surface without irregularities, and the fixing force thereof can be increased.
Further, the concave portion 211 is formed in a region corresponding to each pin of IC1 to IC4, and the other print pattern region is a convex portion 212.
That is, the unevenness is formed according to the height of the electronic component existing between the solder surface 10b and the case inner surface 21a. Specifically, the gap is narrower in the pattern region where there is no component between the solder surface 10b and the lower case inner surface 21a than in the region where the component is present.
Thereby, the adhesive force can be increased while the coating layer 30 to be filled is reduced to a small amount.

Further, the coating layer 30 is filled in the gap S between the periphery of the substrate 10 and the side surface of the lower case 21.
As a result, foreign matter cannot be inserted into the solder surface 10b from the gap S, so that the solder surface 10b is reliably protected.

Further, the substrate 10 is formed with a filling hole 13 through which the coating layer 30 filled between the solder surface 20b and the case inner surface 21a protrudes to the outside.
As a result, the periphery of the filling hole 13 comes into contact with the coating layer 30, and the contact area between the coating layer 30 and the substrate 10 can be increased and these can be firmly fixed.

Further, as shown in FIG. 4, the covering layer 30 protruding from the filling hole 13 spreads radially around the filling hole 13 and is cured in a state of covering the component mounting surface 10 a together with the filling hole 13. As a result, the covering layer 30 inserted through the filling hole 13 sandwiches the substrate 10, and the covering layer 30 functions as a rivet for stopping the substrate 10, whereby the substrate 10 is firmly fixed to the lower case 21. Is done.
In addition, the filling holes 13 can be replaced with through holes for conducting both surfaces of the substrate, and it is more effective to form a plurality of the filling holes 13 so that fingers or the like cannot be inserted (for example, 2 mm or less).

Furthermore, the coating layer 30 of the present embodiment covers the component mounting surface 10a.
Specifically, in this embodiment, the coating layer 30 covers the component mounting surface 10a together with the cover 12, IC4, and IC5.
When the coating layer 30 is cured, it is fixed to the component mounting surface 10a together with these components so as not to be peeled off. Thereby, these parts covered with the coating layer 30 cannot be directly contacted, and unauthorized modification can be prevented.

  Further, the cover 12 is covered with the covering layer 30 in a state of including the IC 1. As a result, when the IC 1 is a part such as a ROM that requires an inspection of success or failure of the unauthorized modification, the IC pin can be exposed by destroying the cover, and the recorded contents can be recorded from the IC pin. Can be read. Further, compared with the IC 4 without a cover, the amount and area covered with the covering layer 30 can be reduced, and the IC 1 can be protected while reducing the covering layer 30 to a small amount.

  Further, the IC 5 covered with the coating layer 30 is an IC tag in which a unique ID for specifying the substrate 10 is recorded so as to be readable from the outside. As a result, the IC 5 (IC tag) is covered with the coating layer 30 and cannot be peeled off from the substrate 10, so that the integrity of the IC tag and the substrate 10 can be secured.

As described above, the board case 1A includes the board for gaming machine of the present invention in which the board 10 and the lower case 21 which is an example of the plate-like member are integrally separated by the coating layer 30, so that the solder surface 10b is provided. However, since contact and operation become impossible, electronic components such as IC1 to IC4 cannot be removed, and unauthorized modification can be prevented.
Further, the covering layer 30 covers the component mounting surface 10a together with the electronic components such as IC1, IC4, and IC5, so that not only the electronic components can be removed but also the pattern can be covered. Therefore, the substrate 10 is strongly protected from unauthorized modification.

Next, the substrate case 1B will be described with reference to FIGS.
FIG. 5 is an exploded perspective view showing a board case 1B according to an embodiment of the board case for gaming machines, and FIG. 6 is a schematic perspective view showing a state in which the board case 1B is covered with a coating layer.

The substrate case 1B includes a substrate 10 that functions as a main substrate, an upper case 20, and a lower case 21 that is an example of a plate-like member of the present invention and is formed in a concave shape so as to accommodate the substrate 10. .
The substrate 10 is a printed circuit board having a component mounting surface 10a on the upper side in the drawing and a solder surface 10b on the lower side in the drawing. The component mounting surface 10a includes a DIP type IC 1 covered with a cover 12 and a plurality of connectors. 1-4 are mounted.
The IC 1 is a one-chip CPU with a built-in ROM and RAM, and each pin is soldered with a solder surface 10b. For this reason, the solder surface 10b cannot be removed unless the solder is melted using a soldering iron or the like.

The upper case 20 and the lower case 21 are formed in a box shape from an industrial resin material such as colorless and transparent ABS or polycarbonate, and are formed so as to be accommodated with the substrate 10 interposed therebetween.
The upper case 20 and the lower case 21 are formed with caulking holes 201 and 214 at positions facing each other, and can be opened unless a special resin pin (not shown) is inserted to destroy the resin pin or the surrounding ribs. It is impossible to seal (sealing structure).

The substrate 10 is an example of a gaming machine substrate according to the present invention. As shown in FIG. 6, the substrate 10 is fixed to the lower case 21 by the covering layer 30 so as not to be separated while being accommodated in the lower case 21.
The coating layer 30 is made of a colored transparent urethane resin (polyurethane) adhesive formed by mixing and curing the two liquids. From the inlet 213 formed in the lower case 21, the solder surface 10b and the case inner surface are formed. After the adhesive which flows between 21a is filled with no gap, it is completely cured and the substrate 10 and the lower case 21 are fixed.
As a result, the solder surface 10b is covered with the lower case 21 in addition to the covering layer 30 interposed between the case inner surface 21a, so that the soldering iron can be applied to or contact each pin of the IC1. I can't do that either. Thereby, since IC1 cannot be replaced, the substrate 10 can be protected from unauthorized modification.

Moreover, the coating layer 30 of the present embodiment is colored in a transparent color such as red, blue, or lame.
Thereby, it becomes difficult to create the coating layer 30 of the same color, and it becomes easy to find counterfeits that imitate the substrate case itself.

Furthermore, a concave portion 211 and a convex portion 212 are formed on the inner surface 21a of the lower case. Thereby, the contact area of the coating layer 30 and the lower case inner surface 21a is increased, and the fixing force thereof can be increased.
Further, the concave portion 211 is formed in a region corresponding to the pin of the IC 1, and the other print pattern region is a convex portion 212.
Thereby, the adhesive force can be increased while the coating layer 30 to be filled is reduced to a small amount.

A coating layer 30 is filled in the gap between the periphery of the substrate 10 and the side surface of the lower case 21.
Thereby, since a foreign material cannot be inserted into the solder surface 10b from this gap, the solder surface 10b is reliably protected.
Further, the coating layer 30 interposed between the solder surface 10b and the case inner surface 21a protrudes to the outside through the filling hole 13, and spreads radially around the filling hole 13, and the component mounting surface together with the filling hole 13 It is cured in a state of covering 10a. Thus, the covering layer 30 inserted through the filling hole 13 sandwiches the substrate 10, and the substrate 10 is firmly fixed to the lower case 21.

  Further, the cover 12 is covered with the covering layer 30 in a state of including the IC 1. As a result, when the IC 1 is a part such as a ROM that requires an inspection of success or failure of the unauthorized modification, the IC pin can be exposed by destroying the cover, and the recorded contents can be recorded from the IC pin. Can be read. Further, compared to the case without a cover, the amount and area covered with the covering layer 30 can be reduced, and the IC 1 can be protected while saving the covering layer 30 to a small amount.

As described above, the board case 1B includes the board for the gaming machine of the present invention in which the board 10 and the lower case 21 which is an example of the plate-like member are integrally separated by the coating layer 30, so that the solder surface 10b is provided. However, since it becomes impossible to contact and operate, electronic parts such as IC1 cannot be removed, and unauthorized modification can be prevented.
Further, the covering layer 30 covers the component mounting surface 10a together with the electronic component such as the cover 12 that encloses the IC 1, so that not only the electronic component can be removed, but also the pattern can be covered. As a result, the substrate 10 is strongly protected from unauthorized modification.

Next, different embodiments of the substrate case 1B will be described with reference to FIGS.
7 is an exploded perspective view of the substrate case 1B as viewed from the solder surface 10b side, and FIG. 8 is a cross-sectional view of FIG.
As shown in these drawings, the substrate 10 according to this embodiment is configured such that the plate material 22 is disposed so as to face the substrate 10 and the coating layer 30 is interposed between the solder surface 10b and the plate material 22 so that the substrate 10 and the plate material are disposed. 22 is fixed by the coating layer 30 so as not to be separated.

The plate material 22 is an example of the plate-like member of the present invention, and is made of an industrial resin material such as colorless and transparent ABS or polycarbonate, and has a size that covers all pins and print patterns of electronic components such as IC1 protruding from the solder surface 10b. And is recessed so as to be filled with the covering layer 30.
The coating layer 30 interposed between the plate material 22 and the solder surface 10b is a colored transparent urethane resin (polyurethane) adhesive formed by mixing and curing two liquids as in the above embodiments. The adhesive that flows between the solder surface 10b and the plate material 22 is filled without gap from an injection port (not shown) formed in the substrate 10 and then completely cured.
As a result, the solder surface 10b is covered with the plate material 22 in addition to the covering layer 30 interposed between the plate material 22 and the soldering iron is applied to each pin and print pattern of the electronic component such as the IC1. Neither can contact. As a result, the electronic component cannot be replaced or the print pattern cannot be modified, so that the substrate 10 can be protected from unauthorized modification.
The plate material 22 may be a flat plate without being formed in a concave shape.

Moreover, the recessed part and the convex part are formed in the side facing the solder surface 10b in the board | plate material 22 like each above-mentioned embodiment (not shown). Thereby, the contact area of the coating layer 30 and the board | plate material 22 will increase, and these adhesion forces can be increased.
Further, the concave portion is formed in a region corresponding to a pin of an electronic component such as IC1, and the other printed pattern region is a convex portion.
Thereby, the adhesive force can be increased while the coating layer 30 to be filled is reduced to a small amount.

Further, the substrate 10 integrated with the plate member 22 can be accommodated by being sandwiched between the upper case 20 and the lower case 21 as they are.
Since the upper case 20 and the lower case 21 have a sealing structure that is sealed so that they cannot be opened, the substrate 10 is doubled by the plate member 22 fixed by the covering layer 30, and the upper case 20 and the lower case 21. Protected. Moreover, since the board | substrate 10 can be taken out from the board | substrate case 1B by destroying a sealing structure, the presence or absence of unauthorized modification can be confirmed easily.
In addition, the board | substrate 10, the board | plate material 22, and the lower case 21 can also be integrally fixed so that it cannot be separated by interposing the coating layer 30 between the board | plate material 22 and case inner surface 21a.

  As described above, according to the gaming machine substrate 10 and the gaming machine substrate cases 1A and 1B according to the present embodiment, the covering layer 30 that covers the substrate surfaces 10a and 10b together with the electronic components such as the IC 1 is provided on the plate 22 Or while interposing between the case inner surface 21a that accommodates the substrate 10 and fixing the substrate 10 and the plate member 22 or the case 21 with the coating layer 30 in an inseparable manner, security against unauthorized modification is improved. Can be made.

  The gaming machine board and gaming machine board case of the present invention have been described with reference to the preferred embodiments, but the gaming machine board and gaming machine board case according to the present invention are limited to the above-described embodiments. It goes without saying that various modifications can be made within the scope of the present invention.

  For example, in this embodiment, a part of the component mounting surface 10a is covered with the coating layer 30 together with the electronic component, but the component mounting surface 10a is not covered with the coating layer 30, but the solder surface 10b, the plate material 22 or the lower case. The covering layer 30 may be interposed only between the inner surface 21a. The interposition of the coating layer 30 in this case is nothing other than covering the solder surface 10b as the substrate surface with the coating layer 30 together with the IC pin as the electronic component, and is within the scope of the present invention.

Further, the coating layer 30 is interposed between the solder surface 10b and the plate material 22 or the lower case inner surface 21a. However, the coating layer 30 is interposed between the component mounting surface 10a and the plate material 22 or the upper case inner surface. You can also.
Furthermore, the substrate 10 can be sandwiched between the two plate members 22 and the integrated substrate 10 can be formed in which the covering layer 30 is interposed between each plate member 22 and both surfaces of the substrate 10.
Alternatively, the cover layer 30 may be interposed between the both surfaces of the substrate 10 and the inner surfaces of the upper and lower cases to form an integral substrate case that cannot be opened.

  In this embodiment, the coating layer 30 is a urethane resin adhesive, but a synthetic adhesive such as an acrylic resin adhesive or an epoxy resin adhesive can also be used.

  The present invention can be widely used for gaming machine boards and gaming machine board cases attached to gaming machines.

1A, 1B Board case for gaming machine 10 Board 10a Component mounting surface 10b Solder surface 20 Upper case 21 Lower case 21a Case inner surface 211 Concave portion 212 Convex portion 22 Plate material (plate-like member)
30 coating layer 100 slot machine

Claims (13)

A board on which predetermined electronic components are mounted;
A coating layer covering the substrate surface together with the electronic component so as to be visible and not peelable,
A predetermined plate-like member facing the substrate surface with the covering layer interposed therebetween,
A board for gaming machines, wherein the board and the plate-like member are fixed inseparably by the coating layer.   The board for gaming machines according to claim 1, wherein irregularities are formed in the plate-like member, and the coating layer is filled in the irregularities.   The gaming machine board according to claim 2, wherein the irregularities are formed in accordance with a height of an electronic component existing between the board surface and the plate-like member. A cover member covering a predetermined electronic component;
The gaming machine substrate according to claim 1, wherein the coating layer covers the cover member.   The said board | substrate and / or the said plate-shaped member are equipped with the injection port for inject | pouring the predetermined fluid material which hardens | cures and forms the said coating layer between the said substrate surface and the said plate-shaped member. 5. The gaming machine substrate according to any one of 4 above.   The gaming machine substrate according to any one of claims 1 to 5, wherein the coating layer covers a predetermined electronic component that records unique ID information so as to be readable from the outside. The plate-like member is formed in a concave shape so as to accommodate the substrate,
The board | substrate for game machines as described in any one of Claims 1-6 with which the clearance gap formed between the said board | substrate periphery and the said plate-shaped member side surface was filled with the said coating layer. The substrate is a substrate in which one surface is a mounting surface for electronic components and the other surface is a solder surface,
The gaming machine substrate according to any one of claims 1 to 7, wherein the coating layer is filled between the solder surface and the plate-like member.   The gaming machine substrate according to any one of claims 1 to 8, wherein the coating layer is colored in a predetermined color.   The board | substrate for game machines as described in any one of Claims 1-9 in which the filling hole with which the coating layer interposed between the said board | substrate surface and the said plate-shaped member was filled was formed in the said board | substrate.   The gaming machine substrate according to claim 10, wherein the coating layer is inserted through the filling port, and the both surfaces of the substrate are sandwiched by the coating layer. A board case provided with a board on which predetermined electronic components are mounted and a case for holding the board in between,
A board case for a gaming machine, wherein the board is a board for a gaming machine according to any one of claims 1 to 11.   The board case for gaming machines according to claim 12, wherein the case is a predetermined plate-like member fixed inseparably from the board.

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