JPH10150270A - Manufacture of multilayer printed wiring board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method of manufacturing a multilayer printed wiring board, wherein no plating film is deposited on a film, and the film is easily removed off after a plating process is carried out when plating catalyst is applied to a through-hole after an electronic part housing hole provided in a multilayer board is masked with a film, furthermore a plating film is formed, and then the film is removed off for the formation of a multilayer printed wiring board. SOLUTION: A board equipped with a copper foil 7 located by surrounding the opening edge of an electronic housing hole is used as an outer board, and a method where a multilayer printed wiring board is manufactured comprises a first process where a through-hole 3 is provided in a multilayer board so as to be exposed out of its surface, and a film 8 is formed so as to mask an electronic part housing hole, making the copper film 7 exposed on its periphery, a second process where plating catalyst 11 is applied to the surface of the multilayer board and the inside of the through-hole, and a third process where the copper film 7 coming into contact with the outer surface of the film 8 and the plating catalyst 11 attached to the surface of the film 8 are turned non-conductive through a certain treatment.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

TECHNICAL FIELD The present invention relates to, for example, electronic equipment,
The present invention relates to a method for manufacturing a multilayer printed wiring board used for a device that stores semiconductor chips and chip components such as a pin grid array (PGA), a ball grid array (BGA), and a chip carrier used for electric devices, computers, communication devices, and the like. .

[0002]

2. Description of the Related Art In recent years, electronic parts such as semiconductor chips and chip parts have been reduced in size and weight. Accordingly, multilayer printed wiring boards for mounting electronic components have also been increased in density. Conventionally, ceramic substrates were used as substrates on which semiconductor chips were mounted.However, ceramic substrates were expensive, so organic substrates that could be densified and realized at low prices were used. Multilayer printed wiring boards have been used. In addition, the substrate on which the semiconductor chip is mounted is provided with a storage hole for storing the semiconductor chip and a conductor circuit having a gold film on the surface for bonding or connecting (bonding) with the mounted semiconductor chip. General.

As a method of manufacturing such a multilayer printed wiring board having a storage hole for storing a semiconductor chip or the like, the present inventors have studied a method of masking the storage hole with a film as shown in FIGS. did. This method uses a plurality of organic substrates 1a, 1a,
As shown in FIG. 3 (b), while forming the concave electronic component housing hole 2 where the conductive circuit 4 is exposed at a predetermined position, using the adhesive materials 5 and 1c, Then, after bonding to form a multilayer board 15, as shown in FIG.
A through hole 3 is formed. Next, after attaching a dry film to the whole of both surfaces of the multilayer board 15, the dry film is exposed and developed to remove the dry film facing the through hole 3 and to remove the dry film in the other portions. Is left, the opening end of the electronic component storage hole 2 is masked with a film body 8 called a dry film (FIG. 4D). Next, a plating catalyst 11 (conductive material) such as palladium or carbon was adhered to both surfaces of the multilayer plate 15 and the through holes 3 based on a so-called direct plating method (FIG. 4E).
Thereafter, electroplating is performed to form a plating film 9 in the through-hole 3 (FIG. 5F). Next, the film body 8
(FIG. 5 (g)) is a method of manufacturing a multilayer printed wiring board by removing (dry film).

However, in the method shown in FIGS. 3 to 5,
As shown in FIG. 6, the plating film 9 deposited in the through hole 3 by electroplating also grows on the film body 8, and there is a problem that the removal of the film body 8 becomes difficult. This is because a plating catalyst such as palladium adheres to the film body 8, so that the plating film 9, which should originally be deposited only on the portion not covered by the film body 8, is deposited on the film body 8. It is thought to be.

[0005]

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a method for forming a plurality of organic substrates forming a conductor circuit by using a conductor. While forming the electronic component storage hole where the circuit is exposed at a predetermined position, it is laminated and bonded to form a multilayer board, and then
Form a through hole at a place other than the electronic component storage hole of this multilayer board, and then, with the through hole exposed,
After masking the electronic component storage holes with a film body, apply a plating catalyst to the through-holes, then form a plating film on the through-holes, and then remove the film body to manufacture a multilayer printed wiring board. It is a method of manufacturing a plate, and when forming a plating film on a through hole,
An object of the present invention is to provide a method for manufacturing a multilayer printed wiring board in which a plating film is not deposited on a film body, and therefore, the film body after the plating step can be easily removed.

[0006]

According to a first aspect of the present invention, there is provided a method for manufacturing a multilayer printed wiring board, comprising the steps of laminating and bonding a plurality of organic substrates to form an electronic component housing hole in which a conductive circuit is exposed. Forming a multilayer board provided at a predetermined position, then forming a through hole in a place other than the electronic component housing hole of the multilayer board, and electroplating the through hole to manufacture a multilayer printed wiring board In the method for manufacturing a board, as the outer layer substrate forming the opening end of the electronic component housing hole, at a position around the opening end of the electronic component housing hole, using the outer layer substrate having a copper film, (1) to (5). (1) A step of forming a film body masking the electronic component housing holes by exposing the through holes on the surface of the multilayer board having the through holes formed therein, wherein a copper film is formed around the outer periphery of the film body. (2) a step of depositing a plating catalyst on the surface of the multilayer board and in the through holes; and (3) a copper film in contact with the outer periphery of the film body and a surface of the film body. (4) a step of applying a non-conductive treatment for electrically insulating the deposited plating catalyst from the adhered plating catalyst; (4) a step of forming a metal film on the through-hole by performing electroplating; and (5) a step of removing the film body.

According to a second aspect of the present invention, there is provided a method for manufacturing a multilayer printed wiring board, comprising the steps of:
In the non-conductive treatment in the step (3), the multilayer board immersed in the solution is irradiated with ultrasonic waves to separate the periphery of the film body and the copper film from each other, thereby forming a film body having no plating catalyst attached. The surface is exposed to the peripheral portion of the film body.

According to a third aspect of the present invention, there is provided a method for manufacturing a multilayer printed wiring board, comprising the steps of:
The non-conductive treatment in the step (3) performs soft etching of the copper film, removes the surface of the copper film in contact with the outer periphery of the film, and removes the surface of the film without the plating catalyst from the film. It is characterized in that it is a process of exposing to the peripheral part of the body.

According to a fourth aspect of the present invention, there is provided the method for manufacturing a multilayer printed wiring board according to the third aspect of the invention.
The non-conductive treatment in the step (3) performs soft etching of the copper film, removes the surface of the copper film in contact with the outer periphery of the film body, and irradiates the multilayer board immersed in the solution with ultrasonic waves. Separating the periphery of the film body and the copper film,
The process is characterized in that the surface of the film body to which the plating catalyst is not attached is exposed to the periphery of the film body.

[0010]

Embodiments of the present invention will be described with reference to the drawings.

As shown in FIG. 3A, a plurality of organic substrates 1a, 1b, 1c on which a conductor circuit 4 made of copper is formed.
The electronic component housing holes 2 where the conductor circuits 4 are exposed are laminated and adhered while forming the electronic component housing holes 2 where the conductor circuits 4 are exposed, as shown in FIG. 2 is formed at a predetermined position. As the organic substrate, for example, an epoxy resin glass cloth base copper-clad laminate, a polyimide resin glass cloth base copper-clad laminate, or the like can be used. The organic substrates 1a, 1b, and 1c in this embodiment are provided with openings at substantially central portions thereof, and are bonded to each other through an adhesive material 5 having the openings, so that these openings become electronic. The component storage hole 2 is formed. The outer layer substrates 1 a and 1 c forming the opening end of the electronic component housing hole 2 are provided with a copper film 8 at a position around the opening end of the electronic component housing hole 2. The method for providing the copper film 8 is not particularly limited. For example, a method in which a copper-clad laminate having no circuit formed as an outer layer substrate is used as it is, or an outer layer circuit made of copper (conductor circuit 4) is used. It can be performed by a method of forming the copper film 8 or the like. In this embodiment, the electronic component housing hole 2 has a shape having an open end on both sides, but the present invention can be applied to a case where only one side has an open end.

The electronic component receiving hole 2 of the multilayer board 15 obtained above.
At other locations, through holes 3 are formed as shown in FIG. The through hole 3 can be formed by a conventionally used method, for example, by drilling. Next, after an alkaline release type dry film is attached to both surfaces of the multilayer board 15, the dry film is exposed and developed to remove the dry film in a portion facing the through hole 3. 4D, the opening end of the electronic component storage hole 2 is masked by a film body 8 called a dry film, as shown in FIG. 4D. Here, the film body 8 is formed such that the copper film 7 is exposed on the outer periphery of the film body 8 masking the electronic component housing hole 2. The development of the dry film can be performed using a weakly alkaline material such as sodium carbonate. In the present invention, the film body 8 is not limited to a dry film, and may be any film that is not destroyed in a subsequent step.

Next, as shown in FIG.
The plating catalyst 11 is attached to both surfaces of the substrate 5 and the inside of the through hole 3. Usually, the step of attaching the plating catalyst 11 includes a degreasing step in the through hole 3, a cleaning step of the inner layer circuit surface exposed in the through hole 3 by soft etching or the like, and an adsorption condition in the through hole 3 by charge adjustment. It comprises a conditioning step, a step of attaching the plating catalyst 11, and the like. It is desirable that carbon and palladium as the plating catalyst 11 be attached smoothly. When an alkali peeling type dry film is used as the film body 8 for masking the opening end of the electronic component housing hole 2, the pH of the liquid used in the step of attaching the plating catalyst 11 should be about 10 or less. This is desirable because damage to the dry film is prevented. When a palladium colloid is used as the plating catalyst 11, a component such as tin may be mixed for stabilizing the adsorbing power.

Next, the copper film 7 on the outer periphery of the film body 8
And a non-conductive treatment for electrically insulating the plating catalyst 11 attached to the surface of the film body 8.

As one of the non-conductive treatment methods, the multilayer plate 15 immersed in a solution is irradiated with ultrasonic waves,
Is separated from the copper film 7 to expose the surface of the film body 8 to which the plating catalyst 11 is not attached to the periphery of the film body 8. FIG. 1 schematically shows a state in which the peripheral portion of the film body 8 and the copper film 7 are separated from each other. FIG. 1 is an enlarged view of a portion a of FIG. 4E, in which a gap is formed between the peripheral portion of the film body 8 and the copper film 7 and the film body 8 to which the plating catalyst 11 is not attached. The state where the surface is exposed to the peripheral part of the film body 8 is shown. The solution for immersing the multilayer board 15 may be water, but in order to prevent oxidation of the copper surface, a solution having a desmutting effect such as a sulfuric acid aqueous solution or a hydrochloric acid aqueous solution having a concentration of 5 to 10% by weight is used. Desirably.

As another method of the non-conductive treatment method, the copper film 7 is soft-etched using a soft etching solution to remove the surface portion of the copper film 8 in contact with the outer periphery of the film body 8, and the plating catalyst 11 is removed. There is a method of exposing the surface of the film body 8 to which no is adhered to the periphery of the film body 8. FIG. 2 schematically shows a state in which the peripheral portion of the film body 8 and the copper film 7 are separated from each other. FIG.
FIG. 4E is an enlarged view of a portion a of FIG. 4E, in which the copper film 7 is soft-etched so that the periphery of the film body 8 and the copper film
A state is shown in which a gap is formed between the film bodies 8 and the surface of the film body 8 to which the plating catalyst 11 is not attached is exposed to the periphery of the film body 8. The soft etching solution is not particularly limited, and examples thereof include a sodium persulfate-based soft etching solution and a sulfuric acid-hydrogen peroxide-based soft etching solution.
Organic components such as alcohols and low-molecular-weight organic acids can also be contained in order to deal with oily contaminants on the surface of. Then, through a soft etching process, excess plating catalyst such as palladium or carbon on the copper surface of the inner layer circuit exposed in the through hole is removed, so that the plating film formed by the subsequent electroplating is removed. The effect of improving the adhesion of the inner layer circuit is also achieved.
It is preferable to perform spray cleaning with a water pressure of 0.1 kgf / cm ² or more after the soft etching because the surface of the film body 8 to which the plating catalyst 11 is not adhered can be more efficiently exposed.

In addition, as a method applying the above two non-conductive treatment methods, a copper film is soft-etched to remove a surface portion of the copper film in contact with the outer periphery of the film body and dipped in a solution. There is a method of irradiating the multilayered board with ultrasonic waves to separate the peripheral portion of the film body from the copper film, thereby exposing the surface of the film body to which the plating catalyst does not adhere to the periphery of the film body. Then, in order to easily achieve the separation between the peripheral portion of the film body and the copper film by soft etching, it is preferable to add an organic component to the soft etching solution, particularly, low-molecular-weight compounds such as normal propyl alcohol and isopropyl alcohol. It is desirable to add an organic acid such as alcohol, metasulfonic acid, entsulfonic acid, formic acid, and acetic acid. As for the solution in which the multilayer board is immersed at the time of ultrasonic irradiation after performing soft etching, water may be used as described above, but in order to prevent oxidation of the copper surface, 5 to 5 is used. A solution having a desmutting effect, such as a 10% by weight aqueous solution of sulfuric acid or an aqueous solution of hydrochloric acid, is desirable. In addition, after performing soft etching, by passing a series of steps of irradiating ultrasonic waves to the multilayer board immersed in the solution, excess palladium on the copper surface of the inner layer circuit exposed in the through hole and Since the plating catalyst such as carbon is removed, the effect of improving the adhesion between the plating film and the inner layer circuit by the subsequent electroplating is also achieved.

As described above, after the copper film 7 in contact with the outer periphery of the film body 8 and the plating catalyst 11 attached to the surface of the film body 8 are subjected to a non-conductive treatment for electrically insulating them, Activate the plating catalyst 11 if necessary,
Next, the multilayer board 15 is immersed in an electroplating solution containing copper sulfate or the like, and the plating catalyst 11 in the through hole 3 is energized to perform electroplating, and as shown in FIG. A plating film 9 is formed in the hole 3. The method of supplying electricity to the plating catalyst 11 in the through-hole 3 is not particularly limited, and the plating catalyst 1 in the through-hole 3 may be energized.
An inner layer circuit that is electrically connected to 1 is extended to the end of the multilayer board 15 and the inner layer circuit is exposed at the end of the multilayer board 15 by a counterbore method or the like, or provided on the outer layer substrate 1a or 1c. A copper foil having no circuit formed thereon is used as the copper film 7, and the copper foil is used as a power supply layer to supply electricity to the plating catalyst 11 in the through hole 3 to perform electroplating, and then a circuit is formed on the copper foil. The plating catalyst 11 in the through hole 3 can be energized by a method or the like.

Next, the film body 8 is removed, and FIG.
A multilayer printed wiring board as shown in (g) is obtained. When the film body 8 is an alkali-peelable dry film, the film body 8 is immersed in an alkali solution to form the film body 8.
Can be peeled and removed. Furthermore, for the obtained multilayer printed wiring board, a nickel film having a desired film thickness,
It is also possible to form a gold film on the surface of the conductor circuit 4 by electroplating.

[0020]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described based on embodiments with reference to the drawings.

Example 1 As shown in FIG. 3A, three organic substrates 1a, 1b, 1c and a bonding material 5 each having a conductive circuit 4 formed on a polyimide resin glass cloth base copper-clad laminate. A polyimide resin glass cloth base material prepreg to be used as a prepreg was prepared. Each of the organic substrates 1a, 1b, 1c and the adhesive material 5 is provided with a rectangular hollow portion for forming the electronic component housing hole 2, and the organic substrates and the adhesive material are as shown in FIG. 3 (b). Then, heating and pressurizing were performed, followed by bonding to form a multilayer board 15 in which the electronic component housing holes 2 in which the conductor circuits 4 were exposed at the steps were formed and integrated.
Outer layer substrate 1 forming opening end of electronic component storage hole 2
In a and 1c, the outer conductive circuit 4 made of the copper film 7 was previously formed, and the copper film 7 was present at a position around the opening end of the electronic component housing hole 2.

The electronic component storage hole 2 of the multilayer board 15 obtained above.
As shown in FIG. 4C, through holes 3 were formed by drilling at locations other than the above. Next, an alkali peeling type dry film (manufactured by Nippon Synthetic Chemical Co., Ltd., product number 411Y-50) is adhered to both surfaces of the multilayer board 15, and the dry film is exposed and developed to form a through hole 3. By removing the dry film on the facing portion and leaving the dry film on the other portions, the opening end of the electronic component housing hole 2 is masked with a film body 8 called a dry film, as shown in FIG. I was in the state. Here, the film body 8 was formed so that the copper film 7 was exposed on the outer periphery of the film body 8 masking the electronic component housing hole 2.

Next, as shown in FIG. 4E, a plating catalyst 11 is applied to both surfaces of the multilayer plate 15 and in the through holes 3 using a plating pretreatment liquid having a pH of 10 or less and a liquid temperature of 60 ° C. or less.
Then, organic colloidal palladium was adhered, and then the organic palladium coating the palladium was activated to form a film of the plating catalyst 11. After this,
In a state where the multilayer board 15 is immersed in a 10% by weight aqueous sulfuric acid solution, an ultrasonic irradiation apparatus (manufactured by Sunlex, trade name)
Using CleanRex, product number S-2860E, output 1MHZ), irradiate ultrasonic waves for 10 minutes to separate the peripheral portion of the film body 8 from the copper film 7 and attach the plating catalyst 11 as shown in FIG. The surface of the uncoated film body 8 was exposed to the periphery of the film body 8 to electrically insulate the copper film 7 from the plating catalyst 11 attached to the surface of the film body 8.

Next, the multilayer plate 15 is immersed in an electroplating solution containing copper sulfate or the like, and is energized to perform electroplating. As shown in FIG. A plating film 9 was formed, and then the multilayer body 15 was immersed in an alkaline solution to remove the film body 8 to obtain a multilayer printed wiring board. Further, a nickel film is formed on the exposed conductor circuit 4 of the obtained multilayer printed wiring board by using an electric nickel plating method, and then a gold film is formed by using an electric gold plating method.
A multilayer printed wiring board having a gold layer on the surface of the conductor circuit 4 was obtained.

In the first embodiment, when the plating film 9 is formed in the through hole 3, the plating film 9 does not deposit on the film body 8. Therefore, the removal of the film body 8 after the plating step is not required. Could be done easily.

(Example 2) In the same manner as in Example 1, an electronic component housing hole 2 in which the conductor circuit 4 was exposed at the step was formed to obtain an integrated multilayer board 15. Then, in the same manner as in Example 1, as shown in FIG. 4D, the opening end of the electronic component housing hole 2 is masked with a film body 8 called a dry film. The state was such that the film 7 was exposed. Next, in the same manner as in Example 1, a film of the plating catalyst 11 was formed on both surfaces of the multilayer plate 15 and in the through holes 3 as shown in FIG.

Thereafter, 10% by weight of sodium persulfate was added.
The film adhered to the multilayer plate 15 is soft-etched by immersing the multilayer plate 15 obtained above in a soft etching solution containing 10% by weight of sodium hydrogen sulfate and 10% by weight of metasulfonic acid. As shown in FIG. 2, the periphery of the body 8 and the copper film 7 are separated from each other, and the surface of the film body 8 to which the plating catalyst is not attached is exposed to the periphery of the film body 8. The plating catalyst 11 attached to the surface of the body 8 was electrically insulated. In this case, since the surface of the copper film 7 is etched by the soft etching, the plating catalyst 11 on the copper film 7 is removed, but the plating catalyst on the insulating material in the through hole 3 is removed by the soft etching. I never did.

Next, in the same manner as in Example 1,
5 is immersed in an electroplating solution containing copper sulfate or the like, and is energized to perform electroplating. As shown in FIG.
Then, the film body 8 was removed by immersing the multilayer board 15 in an alkaline solution to obtain a multilayer printed wiring board. Further, a nickel film is formed on the exposed conductor circuit 4 of the obtained multilayer printed wiring board by using an electric nickel plating method, and then a gold film is formed by using an electrogold plating method. A multilayer printed wiring board having a gold layer on the surface was obtained.

In the second embodiment, when the plating film 9 is formed in the through-hole 3, the plating film 9 does not deposit on the film body 8, and therefore, the removal of the film body 8 after the plating step is easy. Could be done.

(Example 3) In the same manner as in Example 1, a multilayer board 15 was obtained in which the electronic component housing holes 2 in which the conductor circuits 4 were exposed at the step portions were formed and integrated. Then, in the same manner as in Example 1, as shown in FIG. 4D, the opening end of the electronic component housing hole 2 is masked with a film body 8 called a dry film. The state was such that the film 7 was exposed. Next, in the same manner as in Example 1, a film of the plating catalyst 11 was formed on both surfaces of the multilayer plate 15 and in the through holes 3 as shown in FIG.

Thereafter, 10% by weight of sodium persulfate was added.
The film adhered to the multilayer plate 15 is soft-etched by immersing the multilayer plate 15 obtained above in a soft etching solution containing 10% by weight of sodium hydrogen sulfate and 10% by weight of metasulfonic acid. The peripheral part of the body 8 was separated from the copper film 7. Furthermore, this multilayer board 15
In a sulfuric acid aqueous solution having a concentration of 10% by weight,
Ultrasonic irradiation equipment (manufactured by Sunlex, trade name: CleanRex,
Using a part number S-2860E (output: 1 MHZ), ultrasonic waves are irradiated for 10 minutes to separate the peripheral portion of the film body 8 from the copper film 7 so that the surface of the film body 8 to which the plating catalyst 11 does not adhere is removed. The copper film 7 was exposed to the periphery of the film body 8 to electrically insulate the plating catalyst 11 attached to the surface of the film body 8.

Next, in the same manner as in Example 1,
5 is immersed in an electroplating solution containing copper sulfate or the like, and is energized to perform electroplating. As shown in FIG.
Then, the film body 8 was removed by immersing the multilayer board 15 in an alkaline solution to obtain a multilayer printed wiring board. Further, a nickel film is formed on the exposed conductor circuit 4 of the obtained multilayer printed wiring board by using an electric nickel plating method, and then a gold film is formed by using an electrogold plating method. A multilayer printed wiring board having a gold layer on the surface was obtained.

In the third embodiment, when the plating film 9 is formed in the through hole 3, the plating film 9 does not deposit on the film body 8, and therefore, the removal of the film body 8 after the plating step is easy. Could be done.

[0034]

According to the method for manufacturing a multilayer printed wiring board of the present invention according to the first to fourth aspects of the present invention, as the outer layer substrate forming the opening end of the electronic component storage hole, the electronic component storage hole opening end is formed. An outer layer substrate provided with a copper film is used in a peripheral position, and a film body for masking the electronic component housing hole is formed so that the copper film is exposed on the outer periphery thereof. Then, after the plating catalyst is attached to the surface of the multilayer board and the inside of the through-hole, the copper film on the outer periphery of the film body is made non-conductive to electrically insulate the plating catalyst attached to the surface of the film body. Perform processing. Therefore, according to the method for manufacturing a multilayer printed wiring board of the invention according to claims 1 to 4, when forming a plating film in the through hole, the plating film is formed on the film body masking the electronic component housing hole. Does not precipitate, and therefore, the film body after the plating step can be easily removed.

[Brief description of the drawings]

FIG. 1 is an enlarged cross-sectional view of a main part, schematically illustrating an embodiment of a method for manufacturing a multilayer printed wiring board according to the present invention.

FIG. 2 is an enlarged cross-sectional view of a main part, schematically illustrating another embodiment of the method for manufacturing a multilayer printed wiring board according to the present invention.

FIG. 3 is a cross-sectional view for modelly explaining each step in a conventional method for manufacturing a multilayer printed wiring board and a method for manufacturing a multilayer printed wiring board according to the present invention.

FIG. 4 is a cross-sectional view schematically illustrating a process following FIG. 3;

FIG. 5 is a cross-sectional view schematically illustrating a step following FIG. 4;

FIG. 6 is a cross-sectional view schematically illustrating a conventional method for manufacturing a multilayer printed wiring board.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1a, 1b, 1c Substrate 2 Electronic component storage hole 3 Through hole 4 Conductor circuit 5 Adhesive material 7 Copper film 8 Film body 9 Plating film 11 Plating catalyst 15 Multilayer board

──────────────────────────────────────────────────の Continuing on the front page (51) Int.Cl. ⁶ Identification symbol FI H05K 3/42 640 H01L 23/12 N (72) Inventor Hiroki Tamiya 1048 Kazuma Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Works Co., Ltd. ( 72) Inventor Junji Kaneko, 1048 Kadoma, Kadoma, Osaka

Claims (4)

[Claims] 1. A method of laminating and bonding a plurality of organic substrates,
Forming a multilayer board having an electronic component storage hole in which a conductor circuit is exposed at a predetermined position, then forming a through hole in a place other than the electronic component storage hole of the multilayer board, and electroplating the through hole. In the method for manufacturing a multilayer printed wiring board, which is applied to produce a multilayer printed wiring board, as an outer layer substrate forming an opening end of the electronic component housing hole, copper is provided at a position around the opening end of the electronic component housing hole. While using a substrate for an outer layer provided with a film, the following (1) to (5)
A method for manufacturing a multilayer printed wiring board, comprising: (1) A step of forming a film body masking the electronic component housing holes by exposing the through holes on the surface of the multilayer board having the through holes formed therein, wherein a copper film is formed around the outer periphery of the film body. (2) a step of depositing a plating catalyst on the surface of the multilayer board and in the through holes; and (3) a copper film in contact with the outer periphery of the film body and a surface of the film body. (4) a step of applying a non-conductive treatment for electrically insulating the deposited plating catalyst from the adhered plating catalyst; (4) a step of forming a metal film on the through-hole by performing electroplating; and (5) a step of removing the film body. 2. The non-conductive treatment in the step (3) is performed by irradiating ultrasonic waves to the multilayer board immersed in the solution to separate a peripheral portion of the film body from the copper film, and to deposit a plating catalyst. 2. The method for manufacturing a multilayer printed wiring board according to claim 1, wherein the process is to expose a surface of the unfinished film body to a peripheral portion of the film body. 3. The non-conductive treatment in the step (3), wherein the copper film is soft-etched to remove a surface portion of the copper film which is in contact with the outer periphery of the film body, and the plating catalyst is not attached thereto. 2. The method for manufacturing a multilayer printed wiring board according to claim 1, wherein the surface of the body is exposed to a peripheral portion of the film body. 4. The non-conductive treatment in the step (3) is such that the copper film is soft-etched to remove the surface portion of the copper film in contact with the outer periphery of the film body and to form a multilayer board immersed in a solution. Irradiating ultrasonic waves, separating the periphery of the film body and the copper film, and exposing the surface of the film body to which the plating catalyst does not adhere to the periphery of the film body, wherein the treatment is performed. 4. The method for producing a multilayer printed wiring board according to 3.