JPH10150126A - Stiffener - Google Patents

Abstract

PROBLEM TO BE SOLVED: To increase the adhesive strength between a stiffener and sealing resin by increasing anchor effect and contact area by a method wherein the sealing resin is infiltrated into microscopic rugged parts and recessed parts provided on the stiffener. SOLUTION: In a stiffener to be used to a semiconductor package in which a resin film, etc., is used as a substrate, at least the part where the stiffener comes in contact with sealing resin has the structure which improves adhesive property. To be concrete, the surface of the above-mentioned part is roughened using a lasting method and an etching method, etc., a circular-shaped, square- shaped or astral-shaped recessed part is formed on the surface of the above- mentioned part, and a slit-like aperture part and a through hole, etc., are formed on the above-mentioned part.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a support plate for an electronic device such as a semiconductor device, and more particularly to a support for a semiconductor package using a thin plastic, TAB tape, FPC or the like as a base material on which a semiconductor chip or other electronic parts are mounted. Stiffener, which is a metal reinforcing plate for stiffeners.

[0002]

2. Description of the Related Art In an electronic device such as a semiconductor device, a flexible substrate or a TAB mounting type thin package is used in order to reduce the size, thickness, or weight of the electronic device itself or various electronic devices in which the device is assembled. As a base material, a resin film made of polyimide or the like having a tape shape or other suitable shape is used. These resin films are generally soft, and when a semiconductor chip or other electronic components are mounted on the film, sufficient strength to support them has not been obtained.

When assembling an electronic device using the above-described resin film into various electronic devices, handling operations such as holding and transporting the electronic device here, assembling, etc. Conventionally, for example, a large number of electronic devices are continuously mounted on a long tape-shaped resin film and handled in a state of being wound up in a reel shape, or continuously mounted as described above. The pieces are separated one by one and held in a plastic carrier or the like for handling.

[0004] However, the reel wound as described above has a curl due to a curl, and if it is forcibly returned, there is a possibility that deformation or cracks may occur. Further, in the case of holding with a plastic carrier or the like as in the latter case, there is a problem that the attaching / detaching operation is troublesome and inefficient.

[0005]

In order to solve such a problem, the present inventor has formed an accommodating portion for an electronic component such as a semiconductor chip at a substantially central portion thereof, and provided at least one surface of the support plate main body with the accommodating portion. There has been proposed a stiffener in which a heat-resistant adhesive layer that can be joined to a substrate made of a resin film or the like is provided. Certainly, the use of the stiffener can reinforce a substrate made of a soft resin film or the like, and can prevent the substrate from warping or curling.

Incidentally, the conventional stiffener is designed with the flatness of the semiconductor package as an essential requirement.
The surface of the stiffener was also smooth. As a result, in resin sealing using a mold resin or a potting resin at the time of assembling the semiconductor device, there is difficulty in adhesion between the sealing resin and the stiffener, and moisture enters the semiconductor device during a semiconductor reliability test. And the problem of insufficient package shear strength.

[0007] The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a stiffener free of the above-mentioned disadvantages.

[0008]

According to the present invention, there is provided a stiffener for a semiconductor package using a resin film or the like as a base material.
At least the structure in which the stiffener is in contact with the sealing resin has a structure for improving the adhesion.

Specifically, blasting, etching,
The surface is roughened by a blackening method or the like, or the surface has a concave portion such as a circle, a triangle, a polygon, or a star, or an epoxy resin layer or a fluororesin layer is formed on the surface in advance. And the like, a slit-shaped opening, a through hole, and the like are formed in the relevant portion.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A stiffener whose surface is roughened by a blast method, an etching method, a blackening method or the like, which is one of specific examples of the present invention, is that the roughened surface is roughened. The sealing resin enters the surface, and the adhesion is increased by the anchor effect.

[0011] In another example, the surface is provided with a concave portion having a round shape, a square shape, a star shape or the like because the sealing resin is wrapped around these concave portions, and the sealing resin and the stiffener are formed. To increase the contact area and the adhesion.

[0012] In another example, the use of an epoxy resin layer, a fluororesin layer, or the like, which is provided on the surface in advance, is due to the adhesive strength between the resin layer and the stiffener, the resin layer and the sealing resin. This is based on the fact that the adhesive strength between the sealing resin and the stiffener is greater than that between the sealing resin and the stiffener.

The use of a stiffener in which a slit-shaped opening, a through-hole or the like is formed in the relevant portion is used because sealing resin is filled in the slit-shaped opening or the through-hole. It is intended to strengthen the bonding with the resin.

As described above, the stiffener of the present invention does not impair the flatness of the stiffener itself, so that there is no problem in assembling the semiconductor device.
In addition, there is no loss of mass productivity.

[0015]

EXAMPLES (Example 1) Alumina particles 500 having a diameter of 60 to 90 μm
g was suspended in 1 liter of water to prepare a polishing slurry.
This slurry is 60 mm wide, 200 mm long and 0.1 mm thick.
Blowing was performed on both surfaces of the copper alloy material at a pressure of 1.25 kg / cm ² for 1 second on both surfaces of the 3 mm copper alloy material.

Next, a thermosetting adhesive tape having a thickness of 0.04 mm is laminated on one side of the blasted copper alloy material,
Thereafter, a stiffener was prepared using a predetermined mold.

Using this stiffener, a tape BGA
Were created. The following reliability tests were performed on the 500 tape BGAs, and all passed, and it was found that the adhesion strength between the sealing resin and the stiffener was good.

[0018] (Example 2) Width 60 mm, length 200 mm, thickness 0.3
pressing a mold at a press pressure of 5Kg / cm ² in the copper alloy material of the mm, depth 0.1mm on one side, Sutifina body portion a recess of each side 5 mm, along the central opening, two at a time per each side Created.

Next, on the surface where no depression is formed, a thickness of 0.
A thermosetting adhesive tape of 04 mm was laminated, and then a stiffener was formed using a predetermined mold.

Using this stiffener, a tape BGA
Were created. The reliability test of the 500 tape BGAs was performed in the same manner as in Example 1.

As a result, all the tapes BGA passed, and it was found that the adhesive strength between the sealing resin and the stiffener was good.

(Embodiment 3) Width 60 mm, length 200 m
m, an epoxy resin is applied to one side of a copper alloy material having a thickness of 0.3 mm, and after drying, a thermosetting adhesive tape having a thickness of 0.04 mm is laminated on a surface not provided with an epoxy resin layer, and then A stiffener was prepared using a predetermined mold.

A tape BGA using this stiffener
Were created. The reliability test of the 500 tape BGAs was performed in the same manner as in Example 1.

As a result, all the tapes BGA passed, and it was found that the adhesive strength between the sealing resin and the stiffener was good.

(Embodiment 4) Width 60 mm, length 200 m
m, 0.04 m thickness on one side of 0.3 mm thick copper alloy material
m of the thermosetting adhesive tape was laminated, and then a stiffener was prepared using a predetermined mold. At this time, slit-shaped openings having a width of 1 mm were provided in the support plate body of the stiffener at intervals of 3 mm, two by two along each of the four sides, so as to be parallel to the respective sides of the central semiconductor housing portion.

Using this stiffener, a tape BGA
Were created. The reliability test of the 500 tape BGAs was performed in the same manner as in Example 1.

As a result, all the tapes BGA passed, and it was found that the adhesive strength between the sealing resin and the stiffener was good.

(Embodiment 5) Width 60 mm, length 200 m
After punching and degreased a copper alloy material having a thickness of 0.3 mm and a thickness of 0.3 mm, the stiffeners were set in a titanium-dedicated jig so that the stiffeners did not contact each other.

The jig was immersed in a blackening treatment solution containing sodium chlorite as a main component at a pH of 13.4 and a temperature of 95 ° C. for 2 minutes. Thereafter, it was washed with water and dried, and a thermosetting adhesive tape having a thickness of 0.04 mm was laminated on one surface thereof to form a stiffener.

Using this stiffener, a tape BGA
Were created. The reliability test of the 500 tape BGAs was performed in the same manner as in Example 1.

As a result, all the tapes BGA passed, and it was found that the adhesive strength between the sealing resin and the stiffener was good.

(Conventional example) 500 tape BGAs were prepared in the same manner as in the embodiment except that the blasting process was not performed.
A reliability test was performed using the 500 pieces in the same manner as in Example 1.

Of the 500 pieces, 150 pieces were defective.

[0034]

According to the method of the present invention, the sealing resin penetrates into fine irregularities and depressions formed in the stiffener, and the adhesion strength between the stiffener and the sealing resin due to an increase in the anchor effect and the contact area. Rises. Further, the stiffener of the present invention is not inferior in mass productivity as compared with the conventional one. Therefore, by using the stiffener of the present invention, a highly reliable semiconductor device can be easily manufactured at low cost.

Claims (5)

[Claims] 1. A stiffener for a semiconductor package using a resin film or the like as a base material, wherein the stiffener has a structure for improving adhesion at least at a portion where the stiffener comes into contact with a sealing resin. Stiffener. 2. The stiffener according to claim 1, wherein the structure for improving the adhesion is a surface roughened by a blast method, an etching method, a blackening treatment method or the like. 3. The stiffener according to claim 1, wherein the structure for improving the adhesion is a concave portion having any one of a round shape, a triangular shape, a polygonal shape, and a star shape provided on the surface. 4. The stiffener according to claim 1, wherein the structure for improving the adhesion is one of an ethoxy resin layer and a fluororesin layer provided on the surface. 5. The stiffener according to claim 1, wherein the structure for improving the adhesion is one of a slit-shaped opening, a through hole, and the like provided in the support plate body.