JPH10149979A - Stage device and aligner using it - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent the slipping of a reticle while a reticle stage is scanned. SOLUTION: A reticle is placed on a reticle stage 3 so as to close the opening 3a of the stage 3 and the bottom face of the reticle is sucked by three Z- reference balls by means of three Z-clamps 10. The X- and Y-direction edges of the reticle are sucked by the vacuum sucking forces of an S-clamp 20 and both Y-clamps 30 by respectively bringing an S-reference ball 50 and both Y- reference balls 60 into contact with the edges. Since the reticle is firmly fixed from three directions of the X-, Y-, and Z-directions, the slipping of the reticle due to the inertia of the reticle can be prevented while the reticle stage 3 is scanned.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor exposure apparatus, and more particularly, to a substrate such as a wafer (hereinafter referred to as "substrate") in which a reticle pattern is limited to an arc-shaped or rectangular band-shaped area.
That. The present invention relates to a stage apparatus of a so-called scanning type exposure apparatus for exposing an entire reticle pattern and transferring the reticle pattern to a substrate by synchronously scanning the reticle and the substrate, and an exposure apparatus using the same.

[0002]

2. Description of the Related Art In a so-called scanning type exposure apparatus for transferring an entire reticle pattern onto a substrate by synchronously scanning an original reticle and a substrate, the scanning speed of the reticle and the substrate is controlled with extremely high accuracy and stably. There is a need for a stage device that can do this.

FIG. 12 shows a stage device according to a conventional example, which comprises a flat guide 102 fixed on a base (not shown) and a predetermined scanning direction (Y-axis direction) along the guide 102. A reticle stage 103 which is reciprocally movable, a pair of linear motor stators 104 and 105 provided integrally with a base on both sides of the reticle stage 103 along a traveling path thereof, and a reticle stage 1.
03 and a pair of linear motor movers 106 and 107 provided integrally with each other, and linear motor stators 104 and 105 and linear motor movers 106 and 10 are provided.
Reference numeral 7 denotes a pair of linear motors each of which accelerates and decelerates the reticle stage 103 in the scanning direction. Reticle stage 103 is an air slide (not shown) (hydrostatic bearing device)
To guide 102 without contact.

[0004] Each linear motor stator 104, 105,
Coil 104 arranged in series along guide 102
a, 105a, a yoke supporting the same, and a coil base 104
b, 105b, and the linear motor movers 106, 1
07 is the coil 104a, 105a and the coil base 104
Move the gap between b and 105b. As shown in FIG. 15, each of the linear motor movers 106 and 107 has a magnet holder 106 fixed to each side edge of the reticle stage 103.
a, 107a and the magnets 106b, 1 held by them.
07b. When a drive current is supplied from a power supply (not shown) to the coils 104a and 105a and they are excited, a thrust is generated between the linear motor movers 106 and 107 and the reticle stage 103 is accelerated or decelerated.

On reticle stage 103, reticle R
_The wafer is held by a wafer stage 203 (see FIG. 13) below it, and the wafer stage 203 has a drive unit similar to that of the reticle stage 103, and is controlled similarly. The band-like exposure light L ₀ (see FIG. 14) applied to a part of the reticle R ₀ forms an image on a wafer by a projection optical system 205 supported by a frame 204, and exposes the band-like region to form a reticle pattern. Transfer a portion.

[0006] Each exposure cycle of the scanning type exposure apparatus is to transfer the entire reticle pattern onto the wafer by synchronizing to driving a reticle stage 103 and wafer stage 203 relative to the belt-like exposure light L _0, While the reticle stage 103 and the wafer stage 203 are running, their positions are detected by the laser interferometers 108 and 208, respectively, and fed back to the drive unit. The acceleration / deceleration of the reticle stage 103 by the linear motor and the speed control during exposure are performed as follows.

As shown in a plan view of FIG. 14, for example, the reticle stage 103 is located at the left end in the scanning direction, and the center O ₀ of the width of the reticle R _{0 in} the scanning direction is the acceleration start position P _1.
When the linear motor is positioned at the acceleration position, the acceleration by the rightward thrust shown in the drawing is started, and when the center O ₀ of the reticle R ₀ reaches the acceleration end position P ₂ , the acceleration is stopped. It only functions to control the scanning speed of the stage 103 to be constant. When the center O ₀ of the reticle R ₀ reaches the deceleration start position P ₃ deceleration by thrust shown left of the linear motor is started, the reticle stage 103 when the center O ₀ of the reticle R ₀ has reached the deceleration end position P ₄ Is stopped.

In such an acceleration / deceleration cycle, the reticle stage 103 travels rightward in the figure, so that the center O ₀ of the reticle R ₀ reaches the acceleration end position P ₂ and at the same time, the exposure light L ₀ reaches the right end of the reticle pattern in the figure. incident been exposed is started, the exposure of the entire surface of the reticle pattern when the center O ₀ of the reticle R ₀ has reached the deceleration start position P ₃ is completed. During exposure of reticle R ₀ , that is, while the reticle pattern travels across exposure light L ₀ , reticle stage 103 is controlled at a constant scanning speed, and in synchronization with this, scanning speed of wafer stage 203 is similarly controlled. Is done. The relative position between the wafer and the reticle R ₀ at the start of exposure is strictly controlled, and the wafer being exposed and the reticle R ₀ are strictly controlled.
The speed ratio of ₀ is controlled so as to exactly match the reduction magnification of the projection optical system 205 between the two, and after the exposure, both are appropriately decelerated.

As shown in FIG. 15, reticle R ₀ is mounted on reticle stage 103 so as to cover opening 103 a of reticle stage 103, and a peripheral portion of reticle R ₀ is provided on reticle stage 103. Hole 1
The reticle stage 103 is attracted to the surface of the reticle stage 103 by the vacuum attraction force generated in the long groove 103c via the third groove 103b. Each through-hole 103b is connected to a vacuum pump (not shown) via a nipple provided on the back side of reticle stage 103.

That is, the reticle R ₀ on the reticle stage 103 is suction-held on the reticle stage 103 only by the vacuum suction force acting on the back surface of the peripheral portion.

[0011]

However, according to the above-mentioned prior art, as described above, the reticle is suction-held on the front surface of the reticle stage only by the vacuum suction force acting on the back surface (lower surface). Therefore, the force for holding the reticle stably on the reticle stage during scanning of the reticle stage is insufficient, and the reticle may shift during exposure to deteriorate the transfer accuracy.

More specifically, the force for holding the reticle at a fixed position on the reticle stage is due to the frictional force between the reticle attracted to the reticle stage by the vacuum suction force and the peripheral portion of the opening of the reticle stage. If the acceleration force for accelerating the reticle stage in the scanning direction (Y-axis direction) or the opposite direction is large and the inertia of the reticle exceeds the frictional force, the reticle is displaced with respect to the reticle stage, and the transfer accuracy is reduced. It causes deterioration.

During exposure, the reticle stage is scanned at a scanning speed that is four to five times faster than the wafer stage, so that the reticle tends to receive a large acceleration force. In recent years, it has been desired to increase the scanning speed of a reticle stage or a wafer stage in order to improve the productivity of an exposure apparatus. As these scanning speeds increase, the acceleration force applied to the reticle becomes about 1 to 2 G. Reach However, it is difficult to stably hold the reticle against an acceleration force exceeding 1 G only by the frictional force due to the vacuum suction force. In particular, since alignment marks and the like used for alignment with the wafer are provided at the peripheral edge of the reticle, it is difficult to increase the contact area between the reticle and the reticle stage to increase the frictional force.

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned unsolved problems of the prior art, and has been described in connection with a stage in which a plate-like body such as a reticle is not likely to be displaced during driving of a moving stage such as a reticle stage. It is an object of the present invention to provide an apparatus and an exposure apparatus using the same.

[0015]

In order to achieve the above object, a stage apparatus according to the present invention comprises a moving stage which is moved in a predetermined direction by a driving means, and a lower surface of a plate-like body is attracted to the moving stage. It is characterized by having suction means, restraining means for restraining the edge of the plate-like body, and fixing means for fixing the restraining means to the moving stage.

Preferably, the suction means is configured to suction the plate-like body to at least three reference spheres held on the moving stage.

It is preferable that a second suction means for suctioning the edge of the plate-like body to the restraining means is provided.

[0018]

The lower surface of a plate such as a reticle is attracted to the moving stage by a suction means, and the edge of the plate is brought into contact with a reference sphere or the like to restrain the plate. Prevent the body from shifting.

If the edge of the plate is sucked by the restraining means by the second suction means, the plate can be firmly fixed on the moving stage. Even when the moving stage is moved in the opposite direction, there is no possibility that the plate-like body will shift.

By mounting such a stage device on a scanning type exposure apparatus, the reticle can be stably held on the reticle stage, and the reticle can be prevented from shifting during exposure.
As a result, the transfer accuracy of the scanning type exposure apparatus can be improved, which can greatly contribute to an increase in productivity due to a high speed.

[0021]

Embodiments of the present invention will be described with reference to the drawings.

FIG. 1 shows a stage device according to an embodiment, which comprises a flat guide 2 fixed on a base 1 and a reciprocating movement in the scanning direction (Y-axis direction) along the guide 2. Reticle stage 3 which is a free moving stage
A pair of linear motor stators 4 and 5 disposed integrally with the base 1 on both sides thereof along the traveling path of the reticle stage 3, and a pair of linear motor stators respectively provided on both side surfaces of the reticle stage 3. The linear motor stators 4, 5 and the linear motor movers 6, 7 constitute a pair of linear motors as driving means for accelerating and decelerating the reticle stage 3 in the scanning direction, respectively. . The reticle stage 3 is guided in a non-contact manner by the guide 2 by an air slide (hydrostatic bearing device) not shown.

Each of the linear motor stators 4 and 5 includes a guide 2
The linear motor movers 6, 7 are composed of a plurality of coils 4a, 5a, a yoke for supporting the coils 4a, 5a and a coil base 4b, 5b. Move through the gap between. As shown in FIG. 2, the linear motor movers 6 and 7
And magnets 6b, 7b held by these magnet holders 6a, 7a integral with the respective side edges. Coils 4a, 5
When a drive current is supplied from a power source (not shown) to a and they are excited, a thrust is generated between the linear motor movers 6 and 7, and the reticle stage 3 is accelerated or decelerated.

A reticle R ₁ (indicated by a broken line in FIG. 2), which is a plate-like body, is held by suction on the reticle stage 3, and a wafer, which is a substrate, is held below the reticle R ₁ by a wafer stage. Also reticle stage 3
And a similar driving unit, and are similarly controlled. A band-like exposure light applied to a part of the reticle R ₁ from a light source (not shown) serving as an exposure unit forms an image on a wafer by a projection optical system in the same manner as in the conventional example, and exposes the band-like area to form a part of the reticle pattern. Transcribe

By moving the reticle stage 3 and the wafer stage synchronously, the entire reticle pattern is transferred to the wafer. During this time, the positions of the reticle stage 3 and the wafer stage are respectively detected by the laser interferometer and fed back to the drive unit. Acceleration and deceleration of the reticle stage 3 by the linear motor and speed control during exposure are the same as in the conventional example.

[0026] The reticle R ₁ has three Z clamp 1 is adsorption means for adsorbing the lower surface of the reticle R ₁ (back surface)
0, and X clamp 20 is a second adsorption means for adsorbing the edge of the X-axis direction of the reticle R _1, a second adsorption to adsorb edge portion of the Y-axis direction of the reticle R ₁ (scanning direction) The reticle stage 3 is stably sucked and held on the reticle stage 3 by a pair of Y clamps 30 as means.

The reticle R on the reticle stage 3
Each Z clamp 10 of _1, X clamp 20, positioning for both Y clamp 30, respectively, as shown in FIGS. 2 and 3, and three Z reference ball 40 which abuts against the lower surface of the reticle R ₁ , and X reference ball 50 is restraint means that contacts in the X-axis direction of the edge of the reticle R ₁ (reference sphere), restraining means is brought into contact with the Y-axis direction of the end edge of the reticle R ₁ (reference sphere ) Is performed by a pair of Y reference spheres 60.

Each Z clamp 10 is mounted on the reticle stage 3
Body block 11 which is fixed to the back surface of the body with screws or the like
(See FIG. 4), an exhaust nipple 12 (see FIG. 1) connected to the internal pipe from the side, and a main body block 11
Has a pair of welding bellows 13 projecting upward (Z-axis direction) from the figure, each of the welding bellows 13 communicates with the internal piping of the main body block 11, and an opening end of each of the welding bellows 13 has a fixing ring 13a. The seal member 14 is fixed via the. When the sealing material 14 is brought into contact with the back surface of the reticle R ₁ and the nipple 12 of each Z clamp 10 is connected to a vacuum pump (not shown) to exhaust the welding bellows 13, the reticle R ₁ is adsorbed by the sealing material 14 and the reticle R ₁ Is generated on the Z reference ball 40.

Each Z clamp 10 is mounted on the reticle stage 3
U formed in pairs at three positions on the periphery of the opening 3a
Each welding bellows 13 from shaped groove 3b is protruded on the upper surface of the reticle stage 3, is opposed sealing member 14 of the open end of the welding bellows 13 to the lower surface of the peripheral portion of the reticle R _1.

Projection 3c projecting between each pair of U-shaped grooves 3b
Supports a magnet holder 41 that holds the Z reference ball 40 in a freely rotatable and stable position. As shown in FIG. 8, the magnet holder 41 has a non-magnetic block 41a having a cross-shaped cross section and four bar-shaped magnets 41b held at four corners thereof. The non-magnetic block 41a has a magnetic plate 41c. The reticle stage 3 is placed on the protrusion 3 c of the opening 3 a of the reticle stage 3. The four bar-shaped magnets 41b are so-called quadrupole magnets, and are Z reference spheres 40 made of a magnetic material.
And the magnetic circuit passing through the magnetic plate 41c has a total potential of Z at the center of the non-magnetic block 41a.
It is configured to be most stable when the reference sphere 40 is located. That is, the Z reference sphere 40 is stably held at the center of the magnet holder 41 by the magnetic attractive force of the quadrupole magnet. Since no mechanical restraining means is required, the Z reference sphere 40 can be freely rotated on the magnet holder 41 in any direction.

As shown in FIG. 9, the X clamp 20 includes a main body block 21 slidable on the surface of the reticle stage 3, a nipple 22 for exhaust connected from the side surface to an internal pipe, and a main body block 21. Has a pair of welding bellows 23 projecting laterally (X-axis direction) from the figure, each of the welding bellows 23 communicates with the internal piping of the main body block 21, and an opening end of each of the welding bellows 23 has a fixing ring 23 a. The seal member 24 is fixed via the. When the sealing material 24 is brought into contact with the edge of the reticle R _{1 in} the X-axis direction and the nipple 22 of the X clamp 20 is connected to a vacuum pump (not shown) to exhaust the welding bellows 23, the edge of the reticle R ₁ adsorbed to, a vacuum suction force is generated which urges the reticle R ₁ in the X reference ball 50.

The main body block 21 is a magnetic material and has a projection 21a projecting between the two welding bellows 23. The projection 21a holds the X reference sphere 50 in a freely rotatable and stable position. The magnet holder 51 is supported. The magnet holder 51 includes a non-magnetic block 51a having a cross-shaped cross section and four bar-shaped magnets 51 held at four corners thereof.
b, and the nonmagnetic block 51 a is fixed to the protrusion 21 a of the main body block 21. The four rod-shaped magnets 51b are so-called quadrupole magnets, a magnetic circuit passing through an X reference sphere 50 made of a magnetic material, and a main body block 21 made of a magnetic material.
The total potential of the magnetic circuit passing through the
It is configured to be most stable when the X reference sphere 50 is located at the center of 1a. That is, the X reference sphere 50 is stably held at the center of the magnet holder 51 by the magnetic attraction of the quadrupole magnet. Since no mechanical restraint is required, the X reference sphere 50 can be freely rotated on the magnet holder 51 in any direction.

The main body block 21 of the X clamp 20 is made of a magnetic material as described above, and as shown in FIG. 7, the magnetic attraction force of a magnet chuck 25 as fixing means embedded in the reticle stage 3 causes the reticle stage 3 to move. Fixed on top. One end of the main body block 21 is
6 is coupled to the free end of a parallel leaf spring mechanism 27 that is cantilevered. When the magnet chuck 25 is not operated, the main body block 21 is supported by the parallel leaf spring mechanism 27 in a slidable state slightly floating above the upper surface of the magnet chuck 25. The parallel leaf spring mechanism 27 is designed to have low rigidity in a direction perpendicular to the reticle stage 3 (Z-axis direction) and high rigidity in a horizontal direction (XY directions). When the magnetic attraction force is generated, the main body block 21 is attracted to the magnet chuck 25 against the elastic force of the parallel leaf spring mechanism 27, and as a result, the X clamp 20 is fixed to the reticle stage 3. I have.

The X movable body 26 is reciprocally movable in the X axis direction along an X guide 28 fixed on the reticle stage 3, and the X movable body 26 is moved in the X axis direction by an actuator (not shown). This is configured across X clamp 20 so as to advance and retreat toward the edge of the reticle R _1.

Each Y clamp 30 is, as shown in FIG.
It has a main body block 31 slidable on the surface of the reticle stage 3, an exhaust nipple 32 connected to an internal pipe from a side surface thereof, and two pairs of welding bellows 33 projecting from the main body block 31 in the Y-axis direction. And each welding bellows 3
3 communicates with the internal piping of the main body block 31, and a fixing ring 33 a (FIG.
(See FIG. 3). The sealing member 34 abuts on the Y-axis direction of the end edge of the reticle R _1, each Y
When the welding bellows 33 is evacuated by connecting the nipple 32 of the clamp 30 to a vacuum pump (not shown), the reticle R ₁
Edge of is adsorbed by the sealing material 34, vacuum suction force for attracting thereto is brought into close contact with the reticle R ₁ in the Y reference ball 60 is generated.

The main body block 31 is made of a magnetic material and has a projection 31a projecting between two pairs of welding bellows 33. The projection 31a allows the Y reference ball 60 to rotate freely and stably at a fixed position. The holding magnet holder 61 is supported. Like the magnet holder 51 of the X clamp 20, the magnet holder 61 has a non-magnetic block having a cross-shaped cross section and four bar-shaped magnets held at four corners thereof. It is fixed to the protrusion 31a of the main body block 31. The four bar magnets are so-called 4
When the total potential of the magnetic circuit passing through the Y reference sphere 60 made of a magnetic material as a pole magnet and the magnetic circuit passing through the main body block 31 which is a magnetic material is when the Y reference sphere 60 is located at the center of the non-magnetic block. It is configured to be most stable. That is, the Y reference sphere 60 is stably held at the center of the magnet holder 61 by the magnetic attraction of the quadrupole magnet. Since no mechanical restraining means is required, the Y reference ball 60 can be freely rotated on the magnet holder 61 in any direction.

The main body block 31 of each Y clamp 30 is
As described above, the magnetic chuck is fixed on the reticle stage 3 by the magnetic attraction of the magnet chuck 35 embedded in the reticle stage 3. Each Y clamp 30
One end of the main body block 31 is coupled to a free end of a parallel leaf spring mechanism 37 (see FIG. 5) that is cantilevered by the Y movable body 36. When the magnet chuck 35 is not operated, the main body block 31 is supported by the parallel leaf spring mechanism 37 so as to slightly float from the upper surface of the magnet chuck 35. The parallel leaf spring mechanism 37 is designed to have low rigidity in a direction perpendicular to the reticle stage 3 (Z-axis direction) and high rigidity in a horizontal direction (XY directions).
As will be described later, when a magnetic attraction force of the magnet chuck 35 is generated, the main body block 31 is attracted to the magnet chuck 35 against the elastic force of the parallel leaf spring mechanism 37, and as a result, the Y clamp 30 is fixed to the reticle stage 3. It is configured to be.

The Y movable body 36 is reciprocally movable in the Y-axis direction along a Y guide 38 provided on the reticle stage 3, and the Y movable body 36 is moved in the Y-axis direction by an actuator (not shown). This is composed of the Y clamp 30 overall so as to advance and retreat toward the edge of the reticle R _1.

Each magnet chuck 35 has three
It has a total of nine magnet units 35a arranged in a row,
As shown in FIG. 6, each magnet unit 35a includes an alnico magnet 351 magnetized in the thickness direction, a magnetic member having a U-shaped cross section including a pair of yokes 352 and 353 sandwiching the magnet, and one yoke 353. Coil 3 wrapped around the bottom
And a resin 3 around each magnet unit 35a.
55 is integrated with the reticle stage 3. The magnetic attraction of each alnico magnet 351 is offset by energizing the coil 354 of each magnet unit 35a.

That is, when the magnet chuck 35 is energized, the magnetic attraction force that has attracted the Y clamp 30 to the reticle stage 3 is released, and the entire Y clamp 30 is moved to the Y position.
It can be moved back and forth in the axial direction. When power is turned off,
The Y clamp 30 is attracted to the reticle stage 3 and firmly fixed by magnetic attraction.

The magnet net chuck 25 for attracting the X clamp 20 also has three magnet units 25a configured in the same manner as described above, and functions similarly. Y clamp 30
Compared to magnetic chuck 35 for attracting that the small number of magnet units 25a, when accelerating the reticle stage 3 in the above exposure cycle in the Y-axis direction, since the reticle R ₁ is likely to deviate in the Y-axis direction by inertia This is because a large magnetic attraction force is required for the magnet chuck 35 of the Y clamp 30 and there is no possibility that such a large inertia occurs in the X-axis direction.

Next, the step of transporting the reticle R ₁ above the reticle stage 3 by the transport hand, transferring the reticle R ₁ to the reticle stage 3, and positioning the reticle R ₁ on the reticle stage 3 by magnetic attraction and vacuum attraction. Will be described.

First, the reticle stage 3 is moved to the reticle exchange position and is put on standby. Transport hand is reticle R
The upper surface of the reticle ₁ is sucked and transported above the reticle stage 3. The transport hand is lowered to bring the lower surface of the reticle R ₁ into contact with each Z reference ball 40. Releasing the reticle R ₁ and then releasing the adsorption of the transport hand retracts the conveying hand.

When the transfer hand starts to move downward, the X clamp 20 and both Y clamps 30 are connected to the reticle R _1.
Have retreated to a location where they will not hit The evacuation is performed using the magnet chucks 25 of the X clamp 20 and the Y clamps 30,
This is performed by releasing the magnetic attraction force by energizing 35 and retracting the X movable body 26 and each Y movable body 36 by the aforementioned actuators.

When the reticle R ₁ is delivered to the Z reference sphere 40, the welding bellows 13 of each Z clamp 10 is evacuated to generate a vacuum suction force for sucking the lower surface of the reticle R _{1 in} the Z-axis direction. Each welding bellows 13 is designed so that it can be shifted laterally by about several mm with a small resistance, so that the reticle R ₁ is supported on three Z reference spheres 40 within a range of several mm in diameter. Can be considered as

The vacuum suction force of each Z-clamp 40 is not used for clamping the reticle R ₁ alone as in the conventional example, but is applied to the Z-axis by urging the reticle R ₁ against the Z reference sphere 50. Since suction is performed for positioning in the direction, a strong suction force unlike the conventional example is not required.

Subsequently, the X clamp 20 and both Y clamps 3
Start evacuation of zero. The X clamp 20 and both Y clamp 30 at the time is not a vacuum suction force is generated because the retreated position not exposed to the reticle R _1.

[0048] In this state, the X clamp 20 and both Y clamp 30 is advanced in the X-axis direction and the Y-axis direction by the aforementioned actuator, the sealing member 24, 34 of each weld bellows 23 and 33 of the reticle R ₁ end Touch the edge.
Thus sealing member 24, 34 a vacuum suction force is generated by the X clamp 20, Y clamp 30 when in contact with the edge of the reticle R _1, thereby, the edge is X reference ball 50 of the reticle R _1, both The reticle R is in close contact with the Y reference sphere 60
₁ is attracted to the X clamp 20 and both Y clamps 30. At this time, it is preferable to detect whether or not a vacuum suction force is generated by monitoring the pressure of the exhaust system of each of the welding bellows 23, 33.

After the edges of the reticle R ₁ are attracted to the X clamp 20 and the Y clamps 30 in this manner, the displacement of the reticle R ₁ with respect to a predetermined reference position is measured by a reticle alignment scope (not shown). The position of the X clamp 20 and the Y clamp 30 is corrected by feeding back to the actuator described above. Reticle R ₁
After confirming that the positional deviation of
The currents in the clamps 20 and the magnet chucks 25 and 35 of each Y clamp 30 are gradually reduced to zero. The magnet chucks 25 and 35 generate a magnetic attraction force for attracting the main body blocks 21 and 31 of the X clamp 20 and the Y clamps 30 by stopping the energization. Body block 21,
31 is attracted to the magnet chuck 25 and 35 against the elastic force of the parallel plate spring mechanism 27 and 37, as a result, the reticle R ₁ is firmly fixed to the XY direction on the reticle stage 3.

During exposure, the reticle stage 3 scans, causing a large inertia to be applied to the reticle R ₁ in the Y-axis direction (scanning direction), and the reticle R ₁ may shift on the reticle stage 3. clamping force by it must be configured to stably hold the reticle R ₁ against the above inertia. Therefore, to set the magnetic attraction force P ₂ of the vacuum suction force P ₁ and the magnet chuck 35 both Y clamp 30 as follows.

[0051] _{P 1> γ × α ..................... (} 1) P 2 × f> γ × α ............... (2) where, gamma: the mass of the reticle R ₁ alpha: reticle R ₁ F: Coefficient of friction between reticle R ₁ and reticle stage 3 When reticle stage 3 scans in the Y-axis direction (+ Y), reticle R ₁ is moved by Y reference sphere 60 of each Y clamp 30. since the result and press, vacuum suction force P ₁ of the Y clamp 30 is unnecessary. Therefore, each Y clamp 3
0 to not shift on magnetic chuck 35, the frictional force by the magnetic attraction force P ₂ of the magnetic chuck 35 is sufficient to set to be larger than the inertia of the reticle R _1. That is, only the condition represented by the equation (2) needs to be satisfied.

However, when the reticle stage 3 scans in the direction opposite to the Y-axis direction (−Y), the magnetic attraction of each Y clamp 30 results in pulling the reticle R _1. P ₁ is the reticle R ₁
Inertia smaller than the Y clamp 30 is likely away from reticle R _1. Therefore, it must be set so as to satisfy the condition represented by Expression (1). Further, in order to prevent each Y clamp 30 from shifting on the magnet chuck 35, it is necessary to satisfy the condition represented by the expression (2) as described above. That is, it is necessary to satisfy both Expression (1) and Expression (2).

Magnet chuck 35 of Y clamp 30
To increase the frictional force by the magnetic attraction force P ₂ is
The contact area between the magnet chuck 35 and the main block 31 of the Y clamp 30 may be increased. In the case where the side end of the reticle is sucked from the back surface as in the conventional example, it is difficult to generate a large clamping force because the space for the alignment mark and the like must be avoided and the contact area is limited. Magnet chuck 35 of clamp 30
Is arranged on the side of the reticle mounting surface of the reticle stage 3, so that if the Y clamp 30 is enlarged, the contact area can be increased and the frictional force can be sufficiently increased.

In addition, in general, since the residual magnetic flux density of an alnico magnet reaches 1 to 1.3 T, the magnetic flux density of the alnico magnet is 4 per cm ^2.
A magnetic attractive force of up to 6 kgf can be generated. On the other hand, the vacuum suction force was 1 k / cm ^{2 at} 760 mHg.
Since gf is the limit, it is extremely difficult to stably hold the reticle only by the vacuum attraction force as in the conventional example.

[0055] Thus, in both Y clamp 30 is sufficiently large clamping force and (frictional force) both magnetic attraction by the vacuum suction force, the reticle R ₁ example 1
Even if the acceleration is performed to about 2G, the clamp can be firmly performed so that there is no possibility that a positional shift occurs during scanning.

According to the present embodiment, the transfer accuracy of the exposure apparatus can be greatly improved by stably holding the reticle during exposure and preventing its displacement. Further, since the acceleration force of the reticle can be greatly increased, the scanning speed of the reticle or the wafer can be increased, and the productivity of the exposure apparatus can be improved.

After the end of the exposure cycle, the reticle stage 3 is moved to the reticle transfer position, and the X clamp 20 and the magnet chucks 25 of both Y clamps 30 are moved.
By energizing 35, these magnetic attractive forces are released. Subsequently, after the evacuation of the welding bellows 23 and 33 is stopped to release the vacuum suction force, the actuators of the movable bodies 26 and 36 of the X clamp 20 and the Y clamps 30 are driven in reverse to rotate the X clamp 20 and the both clamps. the Y clamp 30 is retracted from the edge of the reticle R _1. Furthermore, performing unloading of the reticle R ₁ by the conveying hand to release the vacuum suction force of each Z clamp 10.

Next, an embodiment of a method of manufacturing a semiconductor device using the above-described exposure apparatus will be described. FIG. 10 shows a manufacturing flow of a semiconductor device (a semiconductor chip such as an IC or an LSI, or a liquid crystal panel or a CCD). In step 1 (circuit design), the circuit of the semiconductor device is designed. Step 2 is a process for making a mask on the basis of the circuit pattern design. In step 3 (wafer manufacture), a wafer is manufactured using a material such as silicon.
Step 4 (wafer process) is called a pre-process, and an actual circuit is formed on the wafer by lithography using the prepared mask and wafer. Step 5
(Assembly) is called a post-process, and is a process of forming a semiconductor chip using the wafer produced in Step 4, and includes an assembly process (dicing, bonding),
It includes steps such as a packaging step (chip encapsulation). In step 6 (inspection), inspections such as an operation confirmation test and a durability test of the semiconductor device manufactured in step 5 are performed. Through these steps, a semiconductor device is completed and shipped (step 7).

FIG. 11 shows a detailed flow of the wafer process. Step 11 (oxidation) oxidizes the wafer's surface. Step 12 (CVD) forms an insulating film on the wafer surface. Step 13 (electrode formation) forms electrodes on the wafer by vapor deposition. In step 14 (ion implantation), ions are implanted into the wafer. Step 1
In 5 (resist processing), a photosensitive agent is applied to the wafer. Step 16 (exposure) uses the above-described exposure apparatus to print and expose the circuit pattern of the mask onto the wafer. Step 17 (development) develops the exposed wafer. In step 18 (etching), portions other than the developed resist image are removed. In step 19 (resist stripping), unnecessary resist after etching is removed. By repeating these steps, multiple circuit patterns are formed on the wafer. By using the manufacturing method of this embodiment, it is possible to manufacture a highly integrated semiconductor device, which has been conventionally difficult to manufacture.

[0060]

Since the present invention is configured as described above, it has the following effects.

It is possible to stably hold the reticle or the like on the moving stage such as the reticle stage or the like, and to prevent the reticle or the like from shifting during driving of the stage. In particular, in a scanning type exposure apparatus, transfer accuracy can be greatly improved by preventing displacement of a reticle during exposure. Further, by increasing the speed of the reticle stage and the wafer stage, the productivity of the exposure apparatus can be greatly improved.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a stage device according to one embodiment.

FIG. 2 is a partial plan view showing a main part of the apparatus of FIG.

FIG. 3 is an enlarged partial plan view showing a central portion of FIG. 2 in an enlarged manner.

FIG. 4 is a sectional view taken along line AA of FIG. 3;

FIG. 5 is a partial side view showing a main part of the apparatus of FIG. 1;

6 is a schematic sectional view showing the device of FIG. 5 in a sectional view.

FIG. 7 is a plan view showing a magnet chuck of the apparatus of FIG.

8 shows a Z-clamp of the device of FIG. 1, wherein (a)
FIG. 2 is a perspective view of the same, and FIG. 2B is an exploded perspective view showing the state of FIG.

9 shows an X-clamp of the device of FIG. 1, wherein (a)
FIG. 2 is a perspective view of the same, and FIG. 2B is an exploded perspective view showing the state of FIG.

FIG. 10 is a flowchart showing a semiconductor manufacturing process.

FIG. 11 is a flowchart showing a wafer process.

FIG. 12 is a perspective view showing a conventional example.

FIG. 13 is an elevational view showing the entire exposure apparatus.

FIG. 14 is a diagram for explaining scanning by the apparatus in FIG. 12;

FIG. 15 is a plan view showing a main part of the device of FIG.

[Explanation of symbols]

 Reference Signs List 1 base 2 guide 3 reticle stage 4,5 linear motor stator 6,7 linear motor mover 10 Z clamp 20 X clamp 25,35 magnet chuck 30 Y clamp 40 Z reference sphere 50 X reference sphere 60 Y reference sphere

Claims (9)

[Claims] 1. A moving stage that is moved in a predetermined direction by a driving unit, an adsorbing unit that adsorbs a lower surface of a plate to the moving stage, a constraining unit that constrains an edge of the plate, and the constraining unit. A stage apparatus having fixing means for fixing a means to the moving stage. 2. The stage apparatus according to claim 1, wherein the suction means is configured to suck the plate-like body onto at least three reference spheres held on the moving stage. 3. A second device for adsorbing an edge of a plate-like body to a restraining means.
2. The suction means of claim 1, further comprising:
Or the stage device according to 2. 4. The stage apparatus according to claim 1, wherein the fixing means is capable of changing a fixing position of the restraining means with respect to the moving stage. 5. The stage apparatus according to claim 1, wherein the fixing means is configured to attract the restraining means to the moving stage by magnetic attraction. 6. The stage apparatus according to claim 5, wherein the fixing means is configured to cancel the magnetic attraction by energization. 7. The stage apparatus according to claim 1, wherein the restraining means has at least one reference sphere abutting on an edge of the plate-like body. 8. Each of the suction means has a welding bellows exhausted by the exhaust means, and a sealing material provided at an opening end thereof.
The stage device according to the item. 9. A stage apparatus according to claim 1, further comprising an exposure unit, wherein the plate-like body is a reticle, and the exposure unit is configured to expose the substrate through the reticle. An exposure apparatus comprising: