200842512 九、發明說明 【發明所屬之技術領域】 本發明係相關於用以定位物體的裝置。裝置可被用於 例如曝光設備中。本發明亦相關於具有此裝置的曝光設 備。 【先前技術】 掃描曝光設備通常具有移動光罩的平台裝置。已有建 議平台裝置的驅動機構以提局曝光設備的生產量。 圖13A圖示日本專利先行公開號碼2004-07963 9中所 建議的平台裝置。光罩平台104具有光罩1〇3置放在其上 且在掃描方向（Y方向）移動。將線性電動機設置在光罩 平台1 0 4的兩側上。線性電動機包括發動機1 〇 5，其固定 在光罩平台104的兩側上且各個具有永久磁鐵；及定子 1 〇6，其固定至基座（未圖示）且各個具有複數線圈。 此外，將推斥發動機107設置在其移動方向之光罩平 台1 04的前和後側，及將推斥定子11 0設置在光罩平台 104的移動衝程之兩端。推斥發動機107和推斥定子110 具有永久磁鐵，藉以可使用推斥發動機1 07的永久磁鐵和 推斥定子110的永久磁鐵之間所產生的推斥力來使光罩平 台104加速或減速。 圖1 3B圖示推斥發動機107和推斥定子110。推斥定 子1 1 〇包括一對永久磁鐵1 1 2，此對永久磁鐵被配置成其 中一永久磁鐵的N極面對另一永久磁鐵的S極；和軛鐵 -4- 200842512 1 1 3，其使磁通能夠經由橫向側在此對永久石1 循環。該推斥發動機107具有永久磁鐵109 機1 07爲在點線所指出的位置時，永久磁鐵 和永久磁鐵112的其中之一彼此面對，反. 109的同性極和永久磁鐵112的其中另一個 使用永久磁鐵112及109之間的推斥力， 104的移動衝程之任一端將力施加到光罩平 此種組配，在防止線圈（1 0 6 )由於驅動線 加熱的同時還可驅動光罩平台1 04。 在藉由來自永久磁鐵的推斥力將力施加 組配中，當產生推斥力時，磁通明顯散射和 尤其是，具有高加速度的平台裝置會產生大 因此，會吸引設置在平台四周的磁性物質。 在許多例子中，會將量測感測器和處理 台裝置四周。若這些組件和支撐這些組件的 通吸引，則會降低平台的定位準確性和置放 體之處理準確性。尤其是，曝光設備具有照 投影光學系統等配置在平台裝置四周。若這 構件受到磁力吸引，則會降低曝光準確性。 【發明內容】 因此，本發明的實施例可設置使用磁鐵 使平台加速或減速，並且當磁鐵產生推斥力 漏洩到周圍及/或影響毗連組件之裝置。 :鐵112之間 。當推斥發動 1 0 9的同性極 之，永久磁鐵 亦彼此面對。 可從光罩平台 台104 。利用 [生電動機而被 到平台之此種 漏洩到周圍。 的漏洩磁通， 單元配置在平 構件被漏洩磁 在平台上的物 明光學系統、 些系統的支撐 的的推斥力來 時可降低磁通 -5- 200842512 根據本發明的觀點，裝置包括一平台；一力施加單 元，被組配成施加磁性推斥力.至平台，該力施加單元包括 第一磁鐵，其設置在平台中；和第二磁鐵，其設置在平台 之移動衝程的一端以面對第一磁鐵；一驅動單元，被組配 成在移動衝程內驅動平台；一磁通加強單元，被組配成加 強第二磁鐵的磁通；及一磁蔽，被組配成遮蔽第二磁鐵的 磁通。 從下面參考附圖的例示實施例之說明將能夠更明白本 發明的其他特徵。 【實施方式】 第一實施例 圖1A爲根據本發明的第一實施例之平台裝置的平面 圖。此實施例圖示具有原圖置放在其上且在曝光設備中移 動之例示平台裝置。然而，除了曝光設備，此種平台裝置 亦可被應用到其他種類的設備，且可具有諸如水等欲定位 的物體來取代原圖光罩。 平台裝置包括平台4，其在置放原圖3在其上的同時 移動；引導2，其透過空氣軸承14引導平台4;及線性電 動機（驅動單元）23，其在Y方向驅動平台4(下面，” 移動方向“表示Y方向）。引導2被固定至基座1且在X-Y平面中具有引導面。依據平台所需的定位準確性可以其 他種類的軸承來取代空氣軸承1 4。以固定至平台4的夾盤 (未圖示）支托原圖3。夾盤可藉由利用例如機械箝制、 -6- 200842512 真空吸引、或靜電引力來支托原圖。 再者，可將微運動平台設置在平台4上，及可將原圖 3置放在微運動平台上。在此例中，可相對平台4細微驅 動微運動平台以高度準確地定位原圖3。 線性電動機包括發動器5，其固定在平台4的兩側尙 且各個具有永久磁鐵；定子6，其周定到基座1，各個包 含複數線圏。將線圈沿著移動方向配置，且經由支撐部位 固定至基座1。發動機5的永久磁鐵被配置成利用其間的 間隔以非接觸的方式面對線圈。當通過線圈時，來自永久 磁鐵的磁通產生流經線圏的電流，藉以在移動衝程內於Y 方向驅動平台4。日本專利先行公開號碼2004-79639揭示 線性電動機的此種組配，因此，省略其細節。需注意的 是’驅動單元並不侷限於線性電動機，可以是其他種類的 驅動單元。鑑於準確性，可使用能夠以非接觸方式驅動平 台的電磁致動器。 使用干涉儀量測平台4的位置。將反射鏡1 5設置在 平台4上。從平台4外面提供的光源發出量測光到反射鏡 1 5。使來自反射鏡1 5的反射光與參考光相互干擾，因此 能夠準確地量測平台4的位置。 接著，將參考圖1 B說明藉由使用來自永久磁鐵的推 斥力以施加力到平台4之力施加單元。力施加單元包括推 斥發動機7和推斥定子10。各個推斥發動機7具有永久磁 鐵9(第一磁鐵）；及支撐部位8，在平台4中支撐永久 磁鐵9。各個推斥定子10具有一對永久磁鐵12a及12b 200842512 (第二磁鐵）；及軛鐵11及13，其使永久磁鐵12a及 1 2b產生的磁通能夠經由橫向側循環。圖3圖示軛鐵1】及 13的細節。如圖3所示，藉由設置軛鐵1 1及13 (磁通加 強單元）’可形成磁性電路（在箭頭所示的方向），及可 加強在永久磁鐵1 2a及1 2b之間流動的磁通。因此，可增 加力施加單元所產生的推斥力。 將推斥發動機7配置在移動方向之平台4的前和後 側。將推斥定子10配置在移動方向之遠離平台4的位 置。尤其是，將推斥定子10設置在平台4的移動衝程之 兩端中。當在移動方向驅動平台4時，在平台4的衝程之 一或兩端的附近，以非接觸方式將永久磁鐵9的其中之一 插入在對應的一對永久磁鐵12a及12b之間。 永久磁鐵9具有板形形狀且垂直磁化。在此實施例 中，永久磁鐵9是永久磁鐵9的上表面是N極而其下表面 是S極之永久磁鐵。永久磁鐵12a及12b亦具有板形形 狀，及垂直磁化（在Z方向）。永久磁鐵12a及12b是被 磁化成永久磁鐵9及1 2a的同性極彼此面對，而永久磁鐵 9及12b的同性極彼此面對。也就是說，將永久磁鐵12a 及12b配置成上永久磁鐵12a的下表面是N極，而下永久 磁鐵12b的上表面是S極。 利用此種組配，在永久磁鐵9和永久磁鐵1 2a之間及 在永久磁鐵9和永久磁鐵12b之間產生磁性推斥力，因 此，可將Y方向中的加速度或減速度力施加到平台4。因 爲產生加速度或減速度力的方向與永久磁鐵9、12a、及 -8 - 200842512 12b的磁化方向垂直，所以即使平台4移動仍可在寬廣的 區域中產生推斥力。再者，因爲將永久磁鐵9插入在永久 磁鐵12a及12b之間，所以可抵消Z方向中所產生的推斥 力。 當平台4位在衝程的一端時，在永久磁鐵12a及12b 之間將永久磁鐵9插入到圖1 B的點線所指出之位置。此 時，推斥發動機7接收箭頭所指出的方向之推斥力。當推 斥發動機7從點線所指出的位置移動在1 B的箭頭所指的 方向時，推斥力減少。當推斥發動機7距離推斥定子10 夠遠時，推斥力變得實際上是零。在推斥力變成實際上是 零之前，若將平台4配置成加速到最大速度，則因爲平台 4未與引導2接觸，所以平台4以最初速度移動到衝程的 相對端。平台4的動能會被保存下來直到推斥發動機7和 推斥定子1〇在衝程的相對端產生力爲止，因此，以等同 圖1B所示的量之量將永久磁鐵9在衝程的相對端插入於 永久磁鐵12a及12b之間且停止。雖然可將空氣軸承14 所產生的減速度作用或空氣阻力施加到平台4，但是可使 用線性電動機23使平台4的速度保持恆定。然後，以推 斥力再次加速平台4。使平台4加速或減速，如上述一般 往復。因爲力施加單元只產生小力，所以可明顯降低驅動 線性電動機23所產生的熱。 在藉由使用永久磁鐵9、12a、及12b所產生的推斥力 使平台加速或減速之此種組配中，當產生推斥力時，磁通 會漏洩到周圍。尤其是，具有高加速度的平台裝置會產生 -9- 200842512 大的漏洩磁通，因此，會吸引設置在平台四周的磁性物 質。 曝光設備通常在支撐複數透鏡當作投影光學系統2 1 之鏡身部分中利用磁性物質。若鏡身的磁性物質被吸引朝 向平台，則會降低曝光準確性。除了鏡身的例子之外，照 明光學系統、量測感測器等亦會遭受同樣的問題。 爲了解決此問題，此實施例設置磁蔽1 6。磁蔽1 6降 低從磁鐵漏洩到周圍的磁通。下面將詳細說明磁蔽1 6。 將磁蔽1 6設置在引導2上以圍住推斥定子1 〇。磁蔽 1 6被配置在平台4的移動衝程之兩端。將非磁性構件1 7 設置在磁蔽1 6和推斥定子1 0之間。由非磁性構件1 7支 撐推斥定子10。另一選擇是，可獨立於磁蔽16之外來支 撐推斥定子1 〇，及在其間提供間隙。磁蔽1 6的材料可具 有高磁導率，及例如可以是鐵酸鹽磁體。 可將磁蔽16配置在力施加單元和不受從力施加單元 漏洩的磁通影響之構件間。尤其是，可將磁蔽1 6配置成 圍在力施加單元的周圍。不受磁通影響的構件可以例如是 在曝光設備中支撐投影光學系統2 1之鏡身。 因爲將磁蔽1 6設置在推斥定子1 0中，所以平台（發 動機）4不需要大磁蔽。此可防止平台4重量增加。 圖4A及4B更詳細圖解說明磁蔽16的長度。圖4A 及4B爲當在圖1 A之方向IV觀看時的平台裝置圖。 圖4A圖解位在移動衝程的一端之平台4，及圖4B圖 解位在相對端的平台4。磁蔽1 6可大於移動衝程。在此實 -10- 200842512 施例中，磁蔽1 6的尺寸被決定如下：200842512 IX. Description of the Invention [Technical Field of the Invention] The present invention relates to a device for positioning an object. The device can be used, for example, in an exposure device. The invention is also related to an exposure apparatus having such a device. [Prior Art] Scanning exposure devices typically have a platform device that moves the reticle. A drive mechanism for the platform device has been proposed to increase the throughput of the exposure device. Fig. 13A illustrates a platform apparatus proposed in Japanese Patent Laid-Open Publication No. 2004-07963. The mask stage 104 has a photomask 1〇3 placed thereon and moved in the scanning direction (Y direction). A linear motor is placed on both sides of the reticle platform 104. The linear motor includes an engine 1 〇 5 that is fixed to both sides of the reticle stage 104 and each has a permanent magnet; and a stator 1 〇 6 that is fixed to a pedestal (not shown) and each has a plurality of coils. Further, the ejector engine 107 is disposed on the front and rear sides of the reticle stage 104 in the moving direction thereof, and the repulsion stator 110 is disposed at both ends of the moving stroke of the reticle stage 104. The repeller engine 107 and the repeller stator 110 have permanent magnets for accelerating or decelerating the reticle stage 104 using the repulsive force generated between the permanent magnet of the repeller engine 107 and the permanent magnet of the repulsion stator 110. FIG. 1B illustrates the repulsion engine 107 and the repeller stator 110. The repeller stator 1 1 〇 includes a pair of permanent magnets 1 1 2 , the pair of permanent magnets being configured such that the N pole of one permanent magnet faces the S pole of the other permanent magnet; and the yoke -4- 200842512 1 1 3, It enables the magnetic flux to circulate on the permanent stone 1 via the lateral side. The repeller engine 107 has a permanent magnet 109. When the machine 107 is in the position indicated by the dotted line, one of the permanent magnet and the permanent magnet 112 faces each other, and the opposite of the 109 and the permanent magnet 112 Using the repulsive force between the permanent magnets 112 and 109, either end of the moving stroke of 104 applies a force to the reticle flat assembly, which prevents the coil (1 0 6 ) from driving the reticle while heating the drive line Platform 1 04. In the force application by the repulsive force from the permanent magnet, when the repulsive force is generated, the magnetic flux is significantly scattered and, in particular, the platform device having a high acceleration is generated, thereby attracting the magnetic substance disposed around the platform. . In many cases, the sensor and the processing station will be measured around. If these components and the support of these components are attracted, the positioning accuracy of the platform and the processing accuracy of the placement body are reduced. In particular, the exposure apparatus is disposed around the platform unit with a projection optical system or the like. If this component is magnetically attracted, the exposure accuracy will be reduced. SUMMARY OF THE INVENTION Accordingly, embodiments of the present invention may be provided with means for accelerating or decelerating a platform using a magnet and for leaking a repulsive force to the surroundings and/or affecting the adjacent components. : Iron between 112. When the repellers launch the 1 0 9 isotropic poles, the permanent magnets also face each other. Available from the reticle platform table 104. This is leaked to the surroundings by the [electric motor]. Leakage flux, the unit is configured to reduce flux when the flat member is leaked magnetically on the platform's optical system, and the repulsive force of the support of the system-5-200842512. According to the present invention, the device includes a platform a force applying unit configured to apply a magnetic repulsive force to the platform, the force applying unit including a first magnet disposed in the platform; and a second magnet disposed at one end of the moving stroke of the platform to face a first magnet; a driving unit configured to drive the platform during the moving stroke; a flux reinforcing unit configured to strengthen the magnetic flux of the second magnet; and a magnetic shield configured to shield the second magnet Magnetic flux. Further features of the present invention will become apparent from the following description of exemplary embodiments illustrated in the drawings. [Embodiment] First Embodiment Fig. 1A is a plan view of a stage apparatus according to a first embodiment of the present invention. This embodiment illustrates an exemplary platform device having an original image placed thereon and moving in an exposure apparatus. However, in addition to the exposure apparatus, such a platform apparatus can be applied to other kinds of equipment, and can have an object to be positioned such as water instead of the original mask. The platform device comprises a platform 4 that moves while the original image 3 is placed thereon; a guide 2 that guides the platform 4 through the air bearing 14; and a linear motor (drive unit) 23 that drives the platform 4 in the Y direction (below , "Moving direction" means Y direction). The guide 2 is fixed to the base 1 and has a guide surface in the X-Y plane. The air bearing 14 can be replaced by other types of bearings depending on the positioning accuracy required by the platform. The original drawing 3 is supported by a chuck (not shown) fixed to the platform 4. The chuck can support the original image by, for example, mechanical clamping, -6-200842512 vacuum suction, or electrostatic attraction. Furthermore, the micro motion platform can be placed on the platform 4, and the original image 3 can be placed on the micro motion platform. In this example, the micro-motion platform can be subtly driven relative to the platform 4 to position the original image 3 with high accuracy. The linear motor includes an actuator 5 fixed to both sides of the platform 4 and each having a permanent magnet; a stator 6 circumferentially fixed to the base 1, each comprising a plurality of turns. The coil is arranged along the moving direction and fixed to the susceptor 1 via the support portion. The permanent magnet of the engine 5 is configured to face the coil in a non-contact manner with a space therebetween. When passing through the coil, the magnetic flux from the permanent magnet generates a current flowing through the coil, thereby driving the stage 4 in the Y direction during the moving stroke. Japanese Patent Laid-Open Publication No. 2004-79639 discloses such an assembly of a linear motor, and therefore, details thereof are omitted. It should be noted that the 'drive unit is not limited to linear motors, but can be other types of drive units. In view of accuracy, an electromagnetic actuator capable of driving the platform in a non-contact manner can be used. The position of the platform 4 is measured using an interferometer. A mirror 15 is placed on the platform 4. Light is metered from the source provided outside the platform 4 to the mirror 15 . The reflected light from the mirror 15 interferes with the reference light, so that the position of the stage 4 can be accurately measured. Next, a force applying unit that applies a force to the stage 4 by using a repulsive force from the permanent magnet will be described with reference to Fig. 1B. The force applying unit includes a repelling engine 7 and a repeller stator 10. Each of the repeller engines 7 has a permanent magnet 9 (first magnet); and a support portion 8 which supports the permanent magnet 9 in the stage 4. Each of the repeller stators 10 has a pair of permanent magnets 12a and 12b 200842512 (second magnet); and yokes 11 and 13 which allow the magnetic flux generated by the permanent magnets 12a and 12b to circulate through the lateral sides. Figure 3 illustrates the details of the yokes 1 and 13. As shown in FIG. 3, a magnetic circuit (in the direction indicated by the arrow) can be formed by providing the yokes 1 1 and 13 (magnetic flux reinforcing unit), and the flow between the permanent magnets 1 2a and 1 2b can be enhanced. Magnetic flux. Therefore, the repulsive force generated by the force applying unit can be increased. The repulsion engine 7 is disposed on the front and rear sides of the platform 4 in the moving direction. The repulsion stator 10 is disposed at a position away from the platform 4 in the moving direction. In particular, the repeller stator 10 is disposed in both ends of the moving stroke of the stage 4. When the stage 4 is driven in the moving direction, one of the permanent magnets 9 is inserted between the corresponding pair of permanent magnets 12a and 12b in a non-contact manner in the vicinity of one or both ends of the stroke of the stage 4. The permanent magnet 9 has a plate shape and is perpendicularly magnetized. In this embodiment, the permanent magnet 9 is a permanent magnet in which the upper surface of the permanent magnet 9 is an N pole and the lower surface thereof is an S pole. The permanent magnets 12a and 12b also have a plate shape and a perpendicular magnetization (in the Z direction). The permanent magnets 12a and 12b are magnetized to form the permanent magnets 9 and 12a, and the isotropic poles of the permanent magnets 9 and 12b face each other, and the isotropic poles of the permanent magnets 9 and 12b face each other. That is, the permanent magnets 12a and 12b are disposed such that the lower surface of the upper permanent magnet 12a is the N pole, and the upper surface of the lower permanent magnet 12b is the S pole. With this combination, a magnetic repulsive force is generated between the permanent magnet 9 and the permanent magnet 12a and between the permanent magnet 9 and the permanent magnet 12b, so that acceleration or deceleration force in the Y direction can be applied to the stage 4 . Since the direction in which the acceleration or deceleration force is generated is perpendicular to the magnetization directions of the permanent magnets 9, 12a, and -8 - 200842512 12b, the repulsive force can be generated in a wide area even if the stage 4 is moved. Further, since the permanent magnet 9 is inserted between the permanent magnets 12a and 12b, the repulsive force generated in the Z direction can be canceled. When the platform 4 is at one end of the stroke, the permanent magnet 9 is inserted between the permanent magnets 12a and 12b to the position indicated by the dotted line of Fig. 1B. At this time, the repeller engine 7 receives the repulsive force in the direction indicated by the arrow. When the repulsing engine 7 is moved from the position indicated by the dotted line in the direction indicated by the arrow of 1 B, the repulsive force is reduced. When the repeller engine 7 is far enough away from the repeller stator 10, the repulsion force becomes virtually zero. Before the repulsive force becomes virtually zero, if the platform 4 is configured to accelerate to the maximum speed, the platform 4 moves to the opposite end of the stroke at the initial speed because the platform 4 is not in contact with the guide 2. The kinetic energy of the platform 4 is saved until the repeller engine 7 and the repeller stator 1 产生 generate a force at the opposite end of the stroke, and therefore, the permanent magnet 9 is inserted at the opposite end of the stroke in an amount equivalent to that shown in Fig. 1B. Between the permanent magnets 12a and 12b and stopped. Although the deceleration effect or air resistance generated by the air bearing 14 can be applied to the stage 4, the linear motor 23 can be used to keep the speed of the stage 4 constant. Then, the platform 4 is accelerated again with repulsive force. The platform 4 is accelerated or decelerated, generally reciprocating as described above. Since the force applying unit generates only a small force, the heat generated by the driving linear motor 23 can be remarkably reduced. In such a combination in which the platform is accelerated or decelerated by using the repulsive force generated by the permanent magnets 9, 12a, and 12b, when a repulsive force is generated, the magnetic flux leaks to the surroundings. In particular, a platform unit with high acceleration produces a large leakage flux of -9- 200842512, thus attracting magnetic materials placed around the platform. The exposure apparatus generally utilizes a magnetic substance in supporting a plurality of lenses as a body portion of the projection optical system 2 1 . If the magnetic material of the mirror body is attracted toward the platform, the exposure accuracy will be reduced. In addition to the example of the lens body, the illumination optical system, the measurement sensor, and the like suffer from the same problem. In order to solve this problem, this embodiment sets the magnetic shield 16. Magnetic shielding 16 reduces the leakage from the magnet to the surrounding magnetic flux. The magnetic shield 16 will be described in detail below. A magnetic shield 16 is placed on the guide 2 to enclose the repeller stator 1 〇. The magnetic shield 16 is disposed at both ends of the moving stroke of the stage 4. The non-magnetic member 17 is disposed between the magnetic shield 16 and the repeller stator 10. The stator 10 is retracted by the non-magnetic member 17 support. Alternatively, the stator 1 推 can be supported independently of the magnetic shield 16 and a gap can be provided therebetween. The material of the magnetic shield 16 may have a high magnetic permeability and may be, for example, a ferrite magnet. The magnetic shield 16 can be disposed between the force applying unit and the member that is not affected by the magnetic flux leaking from the force applying unit. In particular, the magnetic shield 16 can be arranged to surround the force applying unit. The member that is not affected by the magnetic flux may be, for example, a mirror body that supports the projection optical system 21 in the exposure apparatus. Since the magnetic shield 16 is placed in the repeller stator 10, the platform (engine) 4 does not require a large magnetic shield. This prevents the weight of the platform 4 from increasing. 4A and 4B illustrate the length of the magnetic shield 16 in more detail. 4A and 4B are diagrams of the platform apparatus when viewed in the direction IV of Fig. 1A. Figure 4A illustrates the platform 4 positioned at one end of the moving stroke, and Figure 4B illustrates the platform 4 positioned at the opposite end. The magnetic shield 16 can be larger than the moving stroke. In this example -10- 200842512, the size of the magnetic shield 16 is determined as follows:
A>B 其中A是Y方向中的磁蔽16之長度’及B是Y方向中的 平台4之最大移動距離和γ方向中的永久磁鐵9之長度的 總和。Y方向中之平台4的最大移動距離是當平台4從移 動衝程的一端移動到相對端時之移動距離。利用磁蔽1 6 的此配置，磁蔽1 6亦可遮蔽僅由推斥發動機7的永久磁 鐵9所產生之磁通。 當推斥發動機7被插入到推斥定子10或從推斥定子 10抽出時，推斥發動機7和推斥定子10之間的距離改 變，及漏洩磁通的量會因此不斷改變。此外，當平台4移 動時，推斥發動機7相對於磁蔽1 6移動，及通過磁蔽16 之推斥發動機7所產生的磁通會改變。由於這些變化，磁 蔽1 6產生渦流，及加熱磁蔽1 6。而且，產生渦流的位置 會隨平台4移動而改變。 該渦流導致的熱可在用於量測平台4之位置的干涉儀 的量測光路徑中，產生波動而導致量測誤差，且該熱可導 致該平台4的熱變形而降低該平台4的定位準確性。 當作解決渦流的對策，例如，此實施例中設置冷卻磁 蔽1 6的冷卻系統。圖5A爲冷卻系統圖。將冷卻系統設置 在磁蔽1 6中，及冷卻系統包括通道1 8，使流體冷卻劑能 夠經由此循環；供應埠1 9 a，將冷卻劑經由此供應到通道 -11 - 200842512 1 8，及還原埠19b，經由此從通道1 8還原冷卻劑。通道 1 8可以是形成在磁蔽1 6中的溝槽，或可以是設置在磁蔽 16中的凹處，或設置在其表面上的管道。供應埠19a及還 原璋1 9b可以是複數。在此例中，複數通道可被設置從供 應埠到還原璋具有統一的流動阻力。 需注意的是，通道1 8、供應埠1 9a、及還原埠1 9b的 形狀並不侷限於圖5A及5B所示者，可適當設計形狀以有 效率地還原磁蔽1 6的熱。 因爲將冷卻系統設置在磁蔽1 6中，所以可降低產生 在磁蔽1 6中之渦流所導致的熱。當將磁蔽1 6設置在推斥 定子1 〇時此種組配尤其有效。這是因爲渦流係不僅由於 發生在推斥發動機7和推斥定子1 0之間產生力時的磁通 變化，並且也由於發生在推斥發動機7相對於磁蔽1 6移 動時的磁通變化。 當作解決渦流的另一對策，此實施例中的磁蔽1 6具 有疊層結構。圖6爲磁蔽的疊層結構之立體圖。尤其是， 磁蔽1 6具有複數構件。在平行於推斥發動機7的永久磁 鐵9和推斥定子1 〇的永久磁鐵1 2a及1 2b之相對側的方 向（平行於X-Y平面的方向），和在垂直於平台4的移動 方向（圖6箭頭所表示之方向，或γ方向）之方向（X方 向）疊層這些構件。 利用磁蔽1 6的疊層結構，可降低所產生的渦流量。 當作解決渦流的另一對策，此實施例中之磁蔽1 6的 材料具有高電阻。再者，磁蔽1 6的材料可如上述具有高 -12- 200842512 磁導率以當作磁蔽。例如，材料可以是鐵酸鹽磁體，或金 屬接合模塑（MIM )構件。可實施這些對策的一或多個。 在此實施例中，雖然力施加單元具有將永久磁鐵9插 入在一對永久磁鐵12a及12b之間的例示組配，但是並不 侷限於此。此外，雖然可將力施加單元設置在平台的兩 端，但是也可將力施加單元只設置在平台兩端的其中之 一。尤其是，只要力施加單元包括耦合到平台的第一磁 鐵；和設置在平台的移動衝程之一端的第二磁鐵以面對此 端中的第一磁鐵，且被組配成藉由使用第一和第二磁鐵之 間所產生的推斥力來施加力到平台，可利用任何組配。 第二實施例 圖7C爲根據第二實施例的平台裝置圖。雖然第一實 施例中只在推斥定子1 0中設置磁蔽，但是第二實施例將 磁蔽設置在推斥定子1 0和推斥發動機7二者中。此處將 不說明第二實施例與第一實施例類似的部分。 在第二實施例中，因爲將磁蔽1 6設置在推斥定子1 0 中，所以由磁蔽1 6遮蔽推斥發動機7和推斥定子1 0之間 所產生的力所導致之主要磁通。如此，設置在推斥發動機 7的磁蔽20不需要很大。 將此種磁蔽添加到第一實施例中的推斥發動機7，但 是用於推斥發動機7的磁蔽適合具有如圖7C所示一般的 大移動衝程之組配。下面說明移動衝程。 在圖7A中，Y方向中之平台4的最大移動距離B大 -13- 200842512 於從平台4的移動衝程之端部到中心的距離C/2。 在此例中，若將如第一實施例之設置在衝程的兩端中 之各個磁蔽16的長度A增加到大於最大移動距離B (在 圖7B中，增加磁蔽16的其中之一的長度），然後兩磁蔽 1 6會彼此千擾。在曝光設備的光罩平台之例子中，以大體 上在平台的移動衝程之中心的曝光光線照射置放在平台上 的光罩。在此例中，若磁蔽1 6的長度大於從移動衝程的 端部到中心之距離C/2，則會阻隔曝光光線。 因此，如圖7C所示，磁蔽1 6的長度A小於從移動衝 程的端部到中心之距離C/2。 因爲在此實施例中將磁蔽20設置在推斥發動機7，所 以若將推斥發動機7的永久磁鐵9移動到磁蔽1 6的外 面，則永久磁鐵9的磁通影響周圍較小。 具體而言，磁蔽20被配置成圍住設置在平台4中的 永久磁鐵9。可將磁蔽2 0設置在永久磁鐵9和不受永久磁 鐵9的磁力吸引之構件（例如、鏡身）間，尤其是，可配 置成圍住永久磁鐵9的周圍。 雖然磁蔽20產生渦流，但是以類似第一實施例的方 式可降低熱的影響。 第三實施例 圖8爲根據第三實施例的平台裝置之俯視平面圖。圖 9爲圖8的方向IX所觀看之正面正視圖。雖然在第一和 第二實施例中將推斥定子10和磁蔽16設置在引導2的兩 -14- 200842512 端’但是在第三實施例將推斥定子1 0和磁蔽1 6配置在可 沿著軸移動之配衡質量22的兩端。此處不說明類似第一 和第二實施例之第三實施例的組配。 在平台裝置中，將具有原圖3置放在其上的平台4可 移動式支撐在基座1上。以設置在基座1的上表面和平台 4的下表面之間的空氣軸承14支撐平台4。將施加加速度 或減速度力到平台4的推斥定子10固定到配衡質量 22。 將推斥定子10配置在配衡質量 22的衝程之兩端的每一 個中。配衡質量 22可沿著軸移動。由設置在基座1的上 表面和配衡質量22的下表面之間的空氣軸承1 4支撐配 衡質量22。因爲推斥定子1〇固定到可沿著軸移動的配衡 質量 22，故因爲驅動平台4的作用力，所以推斥定子10 在相對於推斥發動機7的方向之方向移動。因此，驅動具 有推斥定子10固定在其上的配衡質量 22抵消當以使用 磁性推斥加速度的高加速度來驅動平台4時所產生之作用 力。將磁蔽16設置在配衡質量 22上以圍住推斥定子 1 〇。將磁蔽1 6配置在配衡質量 22的兩端。 如上述，可將磁蔽1 6應用到配衡質量組配，此配衡 質量組配被用於即使以使甩磁性推斥加速度單元的高加速 度來驅動平台4時，仍可防止整個裝置受到由於抵消傳送 到基座1的作用力而導致的振動。 利用此實施例，可藉由在配衡質量 22的兩端上配置 推斥定子1 〇和磁蔽1 6來降低當產生推斥力時漏洩到周圍 的磁通。 -15- 200842512 使用平台裝置的曝光設備之例示實施例 接著，將說明使用上述實施例的平台裝置之曝光設備 的例示實施例。如圖1 〇所示，曝光設備包括照明裝置 201、具有光罩置放在其上之光罩平台202、投影光學系統 203、及具有晶圓置放在其上之晶圓平台204。藉由使用步 進和重複法或步進和掃描法的曝光，曝光設備投影來自光 罩的電路圖型到晶圓上。 照明裝置20 1具有光源部位和照明光學系統，且照明 具有電路圖型形成在其上的光罩。光源部位利用例如雷射 當作光源。雷射可以是具有波長約193 nm的A rF準分子雷 射、具有波長約24 8nm的KrF準分子雷射、或具有波長約 1 5 3nm的F2準分子雷射。雷射並不侷限於準分子雷射， 亦可使用 YAG雷射和其他種類的雷射。也不限制雷射數 目。在使用此種雷射當作光源的例子中，可使用將雷射光 '源發出的平行光束整形成想要的光束形狀之光束整形光學 系統’和將相干雷射光束轉換成不相干光束之不相干光學 系統。可被用於光源部位的光源並不侷限於雷射，亦可使 用諸如一或多個水銀燈泡或氙燈泡等燈泡。 該照明光學系統，照明一光罩且該系統包含一透鏡、 一鏡子、一光積分器、一孔徑光闌等。 投影光學系統203可以是只包括複數透鏡元件之光學 系統’包括複數透鏡元件和至少一凹面鏡之光學系統（反 射折射式光學系統）、包括複數透鏡元件和諸如基諾形式 -16- 200842512 等至少一繞射光學元件之光學系統，或只包括複數鏡子之 光學系統。 可例如由線性電動機移動光罩平台202和晶圓平台 204 〇 當使用步進和掃描法時，光罩平台202和晶圓平台 2 04彼此同時移動。此外，將致動器設置在光罩平台202 和晶圓平台204的至少其中之一上以定位有關晶圓的光罩 之圖型。 可使用上述曝光設備製造半導體裝置，諸如半導體積 體電路、微機器、和像具有微圖型的薄膜磁頭之裝置。 使用曝光設備的裝置製造法 參考圖1 1及1 2說明使用上述曝光設備的裝置製造法 之例示實施例。圖1 1爲製造裝置的處理之流程圖（例 如，像ICs及LSis的半導體晶片、LCDs、和CCDs)。在 此實施例中’說明半導體晶片的製造方法。 在步驟 S 1 (電路設計）中，設計半導體晶片的電 路。在步驟S2(遮罩製造）中，在所設計的電路圖型中 製造一或多個遮罩。在步驟S3 (晶圓製造）中，晶圓係 由諸如砍等材料所形成。在稱作前端處理之步驟s 4 (晶 圓處理）中’使用上述曝光設備，以遮罩和晶圓，藉由微 影法將實際電路形成在晶圓上。在稱作後端處理之步驟 S 5 (裝配）中，從步驟S4製造的晶圓形成半導體晶片。 此處理包括裝配處理（晶圓切割和接合）、封裝處理（晶 -17- 200842512 圓密封）等。在步驟S6 (檢測）中’測試步驟S5所製造 的半導體晶片，如測試操作和耐久性。因此’經由上述處 理完成半導體晶片，然後裝運（步驟S7 )。 圖1 2爲特別說明步驟S 4的晶圓處理之流程圖。在子 步驟 S1 1 (氧化）中，氧化晶圓的表面。在子步驟 S12 (CVD )中，將絕緣膜形成在晶圓的表面上。在子步驟 S 1 3 (電極形成）中，以沈積將電極形成在晶圓上。在子 步驟S14(離子佈植）中，將離子佈植在晶圓中。在子步 驟S 1 5 (抗蝕處理）中，將光敏劑塗敷到晶圓。在子步驟 S 1 6 (曝光）中，經由使用曝光設備的曝光將遮罩的電路 圖型投影到晶圓上。在子步驟S17(顯影）中，顯影曝光 的抗蝕劑。在子步驟S 1 8 (飩刻）中，蝕刻掉除了顯影抗 蝕影像之外的部分。在子步驟S 1 9 (抗蝕劑移除）中，去 除鈾刻後變得不需要的抗飩劑。藉由重複這些步驟，可在 晶圓上形成多層電路圖型。 利用藉由使用磁鐵的推斥力使平台加速或減速之平台 裝置’當磁鐵產生推斥力時，可防止磁通漏洩到周圍，因 此可防止周圍組件受到漏洩磁通影響。 儘管已參考例示實施例說明本發明，但是應明白本發 明並不侷限於所揭示的例示實施例。下面的申請專利範圍 之範疇與最廣義的解釋一致以包含所有修正、同等結構、 和功能。 【圖式簡單說明】 -18- 200842512 圖1A及1B爲根據第一實施例的平台裝置圖。 圖2爲平台裝置的側面正視圖。 圖3爲推斥定子的磁性電路圖。 圖4A及4B爲移動衝程的長度和磁蔽的長度之間的關 係圖。 _ 圖5 A及5B爲磁蔽的冷卻機構圖。 圖6爲磁蔽的疊層結構之立體圖。 φ 圖7A至7C爲根據第二實施例之移動衝程的長度和磁 蔽的長度之間的關係圖。 圖8爲根據第三實施例之具有配衡質量的平台裝置之 平面圖。 圖9爲圖8之具有配衡質量的平台裝置的正面正視 圖。 圖10爲使用平台裝置的曝光設備圖。 圖11爲使用曝光設備製造裝置之處理的流程圖。 • 圖1 2爲圖1 1所示之流程圖的步驟S 4中之水處理的 流程圖。 圖13A及13B爲已知裝置圖。 【主要元件符號說明】 1 :基座 2 :引導 3 :原圖 4 :平台 - 19- 200842512 5 :發動器 6 :定子 7 :推斥發動機 8 :支撐部位 9 :永久磁鐵 1 〇 :推斥定子 1 1 :軛鐵 1 2 :永久磁鐵 1 2 a ··永久磁鐵 1 2 b :永久磁鐵 1 3 :軛鐵 14 :空氣軸承 1 5 :反射鏡 1 6 :磁蔽 1 7 :非磁性構件 18 :通道 19a :供應埠 1 9 b :還原埠 2 0 :磁蔽 2 1 :投影光學系統 22 :配衡質量 2 3 :線性電動機 103 :光罩 104 :光罩平台 -20- 200842512 :發動機 :定子 :推斥發動機 :永久磁鐵 :推斥定子 :永久磁鐵 :軛鐵 :照明裝置 :光罩平台 _·投影光學系統 •晶圓平台A > B where A is the length of the magnetic shield 16 in the Y direction and B is the sum of the maximum moving distance of the stage 4 in the Y direction and the length of the permanent magnet 9 in the γ direction. The maximum moving distance of the platform 4 in the Y direction is the moving distance when the platform 4 is moved from one end of the moving stroke to the opposite end. With this configuration of the magnetic shield 16 , the magnetic shield 16 can also shield the magnetic flux generated only by the permanent magnet 9 of the repeller engine 7. When the repeller engine 7 is inserted into or withdrawn from the repeller stator 10, the distance between the repeller engine 7 and the repeller stator 10 changes, and the amount of leakage flux is thus constantly changed. In addition, as the platform 4 moves, the repeller engine 7 moves relative to the magnetic shield 16 and the magnetic flux generated by the repeller engine 7 through the magnetic shield 16 changes. Due to these changes, the magnetic shield 16 generates eddy currents and heats the magnetic shields 16. Moreover, the position at which the eddy current is generated changes as the platform 4 moves. The heat caused by the eddy current may cause fluctuations in the measurement light path of the interferometer used to measure the position of the platform 4, resulting in measurement errors, and the heat may cause thermal deformation of the platform 4 to lower the platform 4 Positioning accuracy. As a countermeasure against the eddy current, for example, a cooling system for cooling the magnetic shield 16 is provided in this embodiment. Figure 5A is a diagram of a cooling system. The cooling system is disposed in the magnetic shield 16 and the cooling system includes a passage 18 through which the fluid coolant can be circulated; the supply 埠1 9 a, through which the coolant is supplied to the passage -11 - 200842512 1 8, and The crucible 19b is reduced, via which the coolant is reduced from the channel 18. The passage 18 may be a groove formed in the magnetic shield 16, or may be a recess provided in the magnetic shield 16, or a pipe provided on the surface thereof. Supply 埠19a and reduction 璋1 9b can be plural. In this case, the plurality of channels can be set to have uniform flow resistance from the supply to the reduction. It is to be noted that the shape of the channel 18, the supply 埠1 9a, and the reduction 埠1 9b is not limited to those shown in Figs. 5A and 5B, and the shape can be appropriately designed to efficiently reduce the heat of the magnetic shield 16. Since the cooling system is disposed in the magnetic shield 16, the heat generated by the eddy current generated in the magnetic shield 16 can be reduced. This combination is particularly effective when the magnetic shield 16 is placed on the repeller stator 1 〇. This is because the eddy current system not only changes the magnetic flux when the force is generated between the repeller engine 7 and the repeller stator 10, but also because of the magnetic flux change occurring when the repeller engine 7 moves relative to the magnetic shield 16. . As another countermeasure against the eddy current, the magnetic shield 16 in this embodiment has a laminated structure. Figure 6 is a perspective view of a laminated structure of magnetic shielding. In particular, the magnetic shield 16 has a plurality of components. In a direction parallel to the opposite side of the permanent magnet 9 of the repeller engine 7 and the permanent magnets 1 2a and 1 2b of the repulsion stator 1 ( (direction parallel to the XY plane), and in a direction perpendicular to the movement of the stage 4 (Fig. These members are laminated in the direction indicated by the arrow or in the direction of the gamma direction (X direction). With the laminated structure of the magnetic shield 16, the eddy current generated can be reduced. As another countermeasure against the eddy current, the material of the magnetic shield 16 in this embodiment has a high electrical resistance. Further, the material of the magnetic shield 16 can have a magnetic permeability of -12-200842512 as described above to serve as a magnetic shield. For example, the material can be a ferrite magnet or a metal bond molding (MIM) member. One or more of these countermeasures can be implemented. In this embodiment, although the force applying unit has an exemplary combination of inserting the permanent magnet 9 between the pair of permanent magnets 12a and 12b, it is not limited thereto. Further, although the force applying unit may be disposed at both ends of the platform, the force applying unit may be disposed only at one of both ends of the platform. In particular, as long as the force applying unit includes a first magnet coupled to the platform; and a second magnet disposed at one end of the moving stroke of the platform to face the first magnet in the end, and is assembled to use the first The repulsive force generated between the second magnet and the second magnet applies force to the platform, and any combination can be utilized. Second Embodiment Fig. 7C is a diagram of a platform apparatus according to a second embodiment. Although the magnetic shield is provided only in the repulsion stator 10 in the first embodiment, the second embodiment places the magnetic shield in both the repeller stator 10 and the repeller engine 7. Portions of the second embodiment that are similar to the first embodiment will not be described here. In the second embodiment, since the magnetic shield 16 is disposed in the repeller stator 10, the main magnetic force caused by the force generated between the repeller engine 7 and the repeller stator 10 is shielded by the magnetic shield 16. through. Thus, the magnetic shield 20 disposed on the repeller engine 7 does not need to be large. Such a magnetic shield is added to the repeller engine 7 in the first embodiment, but the magnetic shield for urging the engine 7 is adapted to have a combination of a large moving stroke as shown in Fig. 7C. The movement stroke will be described below. In Fig. 7A, the maximum moving distance B of the platform 4 in the Y direction is -13 - 200842512 at a distance C/2 from the end of the moving stroke of the platform 4 to the center. In this example, if the length A of each of the magnetic shields 16 disposed at both ends of the stroke as in the first embodiment is increased to be greater than the maximum moving distance B (in FIG. 7B, one of the magnetic shields 16 is added). Length), then two magnetic shields 1 6 will be interfering with each other. In the example of a reticle stage of an exposure apparatus, the reticle placed on the platform is illuminated by exposure light that is substantially at the center of the moving stroke of the platform. In this case, if the length of the magnetic shield 16 is greater than the distance C/2 from the end of the moving stroke to the center, the exposure light is blocked. Therefore, as shown in Fig. 7C, the length A of the magnetic shield 16 is smaller than the distance C/2 from the end of the moving stroke to the center. Since the magnetic shield 20 is disposed in the repeller engine 7 in this embodiment, if the permanent magnet 9 of the repulsion engine 7 is moved to the outside of the magnetic shield 16, the magnetic flux of the permanent magnet 9 affects the circumference. Specifically, the magnetic shield 20 is configured to enclose the permanent magnet 9 disposed in the platform 4. The magnetic shield 20 can be disposed between the permanent magnet 9 and a member (e.g., the mirror body) that is not attracted by the magnetic force of the permanent magnet 9, and in particular, can be disposed to surround the periphery of the permanent magnet 9. Although the magnetic shield 20 generates eddy currents, the effect of heat can be reduced in a manner similar to the first embodiment. THIRD EMBODIMENT Fig. 8 is a top plan view of a stage apparatus according to a third embodiment. Figure 9 is a front elevational view of the direction IX of Figure 8 as viewed. Although the repeller stator 10 and the magnetic shield 16 are disposed at the two-14-200842512 ends of the guide 2 in the first and second embodiments, the repeller stator 10 and the magnetic shield 16 are disposed in the third embodiment. Both ends of the mass 22 can be calibrated along the axis. The assembly similar to the third embodiment of the first and second embodiments is not explained here. In the platform unit, the platform 4 on which the original Fig. 3 is placed is movably supported on the base 1. The platform 4 is supported by an air bearing 14 disposed between the upper surface of the base 1 and the lower surface of the platform 4. The repeller stator 10, to which an acceleration or deceleration force is applied, is fixed to the tared mass 22. The repeller stator 10 is disposed in each of both ends of the stroke of the tared mass 22. The tared mass 22 can be moved along the axis. The balance mass 22 is supported by an air bearing 14 disposed between the upper surface of the base 1 and the lower surface of the balance mass 22. Since the repeller stator 1 is fixed to the taring mass 22 which is movable along the axis, the repeller stator 10 is moved in the direction with respect to the direction of the repulsion engine 7 because of the urging force of the driving platform 4. Therefore, the yoke mass 22 on which the repeller stator 10 is fixed is driven to counteract the force generated when the platform 4 is driven at a high acceleration using the magnetic repulsion acceleration. The magnetic shield 16 is placed on the tared mass 22 to enclose the repeller stator 1 〇. The magnetic shield 16 is placed at both ends of the tared mass 22. As described above, the magnetic shield 16 can be applied to the tared mass assembly, which is used to prevent the entire device from being received even when the platform 4 is driven at a high acceleration that causes the neodymium to repel the acceleration unit. The vibration due to the force transmitted to the susceptor 1 is cancelled. With this embodiment, the magnetic flux leaking to the surroundings when the repulsive force is generated can be reduced by arranging the repulsion stator 1 〇 and the magnetic shield 16 at both ends of the tared mass 22. -15- 200842512 Illustrative Embodiment of Exposure Apparatus Using Platform Apparatus Next, an illustrative embodiment of an exposure apparatus using the stage apparatus of the above embodiment will be explained. As shown in FIG. 1, the exposure apparatus includes a lighting device 201, a mask platform 202 having a photomask placed thereon, a projection optical system 203, and a wafer platform 204 having wafers placed thereon. The exposure device projects the circuit pattern from the reticle onto the wafer by exposure using step and repeat methods or step and scan methods. The illumination device 20 1 has a light source portion and an illumination optical system, and the illumination has a photomask on which the circuit pattern is formed. The light source portion uses, for example, a laser as a light source. The laser may be an ArF excimer laser having a wavelength of about 193 nm, a KrF excimer laser having a wavelength of about 24 nm, or an F2 excimer laser having a wavelength of about 153 nm. Lasers are not limited to excimer lasers, but YAG lasers and other types of lasers can also be used. Nor does it limit the number of lasers. In the case of using such a laser as a light source, a beam shaping optical system for shaping a parallel beam of a source of laser light into a desired beam shape and converting the coherent laser beam into an incoherent beam may be used. Coherent optical system. The light source that can be used for the light source portion is not limited to laser light, and a light bulb such as one or more mercury bulbs or xenon bulbs can also be used. The illumination optical system illuminates a reticle and the system includes a lens, a mirror, an optical integrator, an aperture stop, and the like. The projection optical system 203 may be an optical system including only a plurality of lens elements, an optical system including a plurality of lens elements and at least one concave mirror (a catadioptric optical system), a plurality of lens elements, and at least one winding such as a Gino form-16-200842512. An optical system that projects an optical component, or an optical system that includes only a plurality of mirrors. The reticle stage 202 and the wafer platform 204 can be moved, for example, by a linear motor. When the step and scan method is used, the reticle stage 202 and the wafer platform 228 move simultaneously with each other. Additionally, an actuator is disposed on at least one of the reticle stage 202 and the wafer platform 204 to position a pattern of reticle associated with the wafer. A semiconductor device such as a semiconductor integrated circuit, a micromachine, and a device like a thin film magnetic head having a micro pattern can be manufactured using the above exposure apparatus. Apparatus Manufacturing Method Using Exposure Apparatus An exemplary embodiment of a device manufacturing method using the above exposure apparatus will be described with reference to Figs. Figure 11 is a flow diagram of the process of manufacturing a device (e.g., semiconductor wafers such as ICs and LSis, LCDs, and CCDs). In this embodiment, a method of manufacturing a semiconductor wafer will be described. In step S1 (circuit design), a circuit of a semiconductor wafer is designed. In step S2 (mask manufacturing), one or more masks are fabricated in the designed circuit pattern. In step S3 (wafer fabrication), the wafer is formed of a material such as dicing. In the step s 4 (crystal processing) called front-end processing, the actual circuit is formed on the wafer by the lithography method using the above-described exposure apparatus to mask and the wafer. In a step S 5 (assembly) called back end processing, a semiconductor wafer is formed from the wafer manufactured in step S4. This processing includes assembly processing (wafer cutting and bonding), encapsulation processing (crystal -17- 200842512 round seal), and the like. The semiconductor wafer fabricated in step S5 is tested in step S6 (detection), such as test operation and durability. Therefore, the semiconductor wafer is completed through the above processing, and then shipped (step S7). Figure 12 is a flow chart specifically illustrating the wafer processing of step S4. In sub-step S1 1 (oxidation), the surface of the wafer is oxidized. In sub-step S12 (CVD), an insulating film is formed on the surface of the wafer. In sub-step S 13 (electrode formation), electrodes are formed on the wafer by deposition. In sub-step S14 (ion implantation), ions are implanted in the wafer. In substep S15 (resist treatment), a photosensitizer is applied to the wafer. In sub-step S16 (exposure), the circuit pattern of the mask is projected onto the wafer via exposure using an exposure apparatus. In sub-step S17 (development), the exposed resist is developed. In sub-step S 18 (etching), portions other than the developed resist image are etched away. In sub-step S19 (resist removal), the anti-caries agent which becomes unnecessary after uranium engraving is removed. By repeating these steps, a multilayer circuit pattern can be formed on the wafer. The platform device that accelerates or decelerates the platform by using the repulsive force of the magnet prevents the magnetic flux from leaking to the surroundings when the repulsive force is generated by the magnet, thereby preventing the surrounding components from being affected by the leakage magnetic flux. Although the present invention has been described with reference to the embodiments thereof, it is understood that the invention is not limited to the illustrated embodiments. The scope of the following patent claims is to be accorded the broadest interpretation of the invention, including all modifications, equivalent structures, and functions. BRIEF DESCRIPTION OF THE DRAWINGS -18- 200842512 FIGS. 1A and 1B are diagrams of a platform device according to a first embodiment. Figure 2 is a side elevational view of the platform unit. Figure 3 is a magnetic circuit diagram of the repulsion stator. 4A and 4B are diagrams showing the relationship between the length of the moving stroke and the length of the magnetic shield. _ Figure 5 A and 5B are diagrams of the cooling mechanism of the magnetic shield. Figure 6 is a perspective view of a laminated structure of magnetic shielding. φ Figs. 7A to 7C are diagrams showing the relationship between the length of the moving stroke and the length of the magnetic shield according to the second embodiment. Figure 8 is a plan view of a platform apparatus having a tared quality according to a third embodiment. Figure 9 is a front elevational view of the platform apparatus of Figure 8 having a tared mass. Figure 10 is a diagram of an exposure apparatus using a platform device. Figure 11 is a flow chart showing the process of manufacturing an apparatus using an exposure apparatus. • Figure 12 is a flow chart of the water treatment in step S 4 of the flow chart shown in Figure 11. 13A and 13B are diagrams of known devices. [Main component symbol description] 1 : Base 2 : Guide 3 : Original Figure 4 : Platform - 19- 200842512 5 : Actuator 6 : Stator 7 : Repulsive engine 8 : Supporting part 9 : Permanent magnet 1 〇 : Repelling the stator 1 1 : yoke 1 2 : permanent magnet 1 2 a · permanent magnet 1 2 b : permanent magnet 1 3 : yoke 14 : air bearing 1 5 : mirror 1 6 : magnetic shield 1 7 : non-magnetic member 18 : Channel 19a: supply 埠1 9 b: reduction 埠 2 0 : magnetic shielding 2 1 : projection optical system 22 : tared quality 2 3 : linear motor 103 : reticle 104 : reticle platform -20 - 200842512 : engine: stator: Repulsion engine: permanent magnet: repellent stator: permanent magnet: yoke: lighting device: reticle platform _· projection optical system • wafer platform