JPH10135161A5 - - Google Patents

Info

Publication number
JPH10135161A5
JPH10135161A5 JP1996288243A JP28824396A JPH10135161A5 JP H10135161 A5 JPH10135161 A5 JP H10135161A5 JP 1996288243 A JP1996288243 A JP 1996288243A JP 28824396 A JP28824396 A JP 28824396A JP H10135161 A5 JPH10135161 A5 JP H10135161A5
Authority
JP
Japan
Prior art keywords
polishing
wafer
polished surface
oxide film
cleaning
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1996288243A
Other languages
English (en)
Japanese (ja)
Other versions
JPH10135161A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP28824396A priority Critical patent/JPH10135161A/ja
Priority claimed from JP28824396A external-priority patent/JPH10135161A/ja
Publication of JPH10135161A publication Critical patent/JPH10135161A/ja
Publication of JPH10135161A5 publication Critical patent/JPH10135161A5/ja
Pending legal-status Critical Current

Links

JP28824396A 1996-10-30 1996-10-30 ウエーハの研磨方法 Pending JPH10135161A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP28824396A JPH10135161A (ja) 1996-10-30 1996-10-30 ウエーハの研磨方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP28824396A JPH10135161A (ja) 1996-10-30 1996-10-30 ウエーハの研磨方法

Publications (2)

Publication Number Publication Date
JPH10135161A JPH10135161A (ja) 1998-05-22
JPH10135161A5 true JPH10135161A5 (https=) 2004-08-26

Family

ID=17727695

Family Applications (1)

Application Number Title Priority Date Filing Date
JP28824396A Pending JPH10135161A (ja) 1996-10-30 1996-10-30 ウエーハの研磨方法

Country Status (1)

Country Link
JP (1) JPH10135161A (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19842709A1 (de) * 1998-09-17 2000-03-30 Siemens Ag Polierflüssigkeit zum Polieren von Bauelementen, vorzugsweise Wafern, insbesondere zum Chemisch-Mechanischen Polieren derartiger Bauelemente
JP4294816B2 (ja) * 1999-11-11 2009-07-15 スピードファム株式会社 シリコンウエハの表面処理方法，無臭シリコンウエハ製造方法，シリコンウエハの酸化膜形成方法，酸化シリコンウエハ製造方法，酸素活性種雰囲気形成装置，及び平坦化処理システム
JP2001196339A (ja) * 2000-01-11 2001-07-19 Ind Technol Res Inst オンラインのｃｍｐ後洗浄方法
TW479289B (en) * 2001-04-24 2002-03-11 United Microelectronics Corp Method to remove contaminant on wafer surface after chemical mechanical polishing
JP2005166925A (ja) * 2003-12-02 2005-06-23 Tokyo Seimitsu Co Ltd ウェーハ加工方法およびウェーハ加工装置
JP5622445B2 (ja) * 2010-06-10 2014-11-12 ラピスセミコンダクタ株式会社 研削方法及び研削装置
JP5641401B2 (ja) * 2010-07-26 2014-12-17 三菱化学株式会社 Ｉｉｉ族窒化物結晶基板の製造方法

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