JPH1012537A - Rinsing apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a rinsing apparatus, capable of easily feeding required amt. of a rinsing liq. onto the surface of a work of optional size. SOLUTION: An apparatus for rinsing the surface of a work B with a rinsing liq. L fed on this surface comprises a rotating means A for rotating the work B mounted thereon at specified speed, nozzle means C which is fixed at a specified angle with respect to the work B and has a nozzle hole of a specified diameter for jetting the rinsing liq. L onto the surface of the work B and flow rate control means D for controlling the flow rate of the liq. L to be jetted from the nozzle hole of the means C per unit time, according to the size of the work B.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a rinsing apparatus, and more particularly to a rinsing apparatus, and more particularly, to a surface of an object to be processed such as a semiconductor wafer, a glass substrate for a photomask, a glass substrate for a disk, a resin substrate for a disk, and a lens for glasses. The present invention relates to a rinsing device that discharges and rinses a rinsing liquid (hereinafter, referred to as a “rinse liquid”).

[0002]

2. Description of the Related Art Conventionally, a rinsing liquid has been discharged onto the surface of an object to be processed such as a semiconductor wafer, a glass substrate for a photomask, a glass substrate for a disk, a resin substrate for a disk, a lens for eyeglasses, and the like. Rinsing has been performed, and various rinsing devices have been proposed.

As such a conventional rinsing device, for example, a rinsing device as shown in FIG. 1 is known.

In FIG. 1, reference numeral 10 denotes an object to be processed such as a semiconductor wafer, and the object to be processed 10 is mounted on an object mounting table 12 installed in a rinsing bath (not shown). Will be placed and fixed. The workpiece mounting table 12 is supported by a rotation support shaft 16 connected to a rotation shaft of a motor 14, and is rotatable at a predetermined speed by the motor 14.

[0005] Above the workpiece 10, a nozzle 1 for discharging a rinsing liquid L toward the surface of the workpiece 10 is provided.
8 are fixedly installed in a predetermined direction.

The operation of the above configuration for rinsing the workpiece 10 such as a semiconductor substrate will be described.

First, the object to be processed 10 is previously placed on the object to be mounted 12 and fixed, and the motor 14 is rotated at a predetermined speed. Next, the rinsing liquid L is supplied from the nozzle 18.
Rinsing is performed by discharging at a constant flow rate toward the surface of the cleaning object 10 (see FIG. 2).

Thus, the surface of the workpiece 10 can be rinsed by the action of the rinsing liquid discharged from the nozzle 18.

[0009]

However, in the above-mentioned conventional rinsing apparatus, the rinsing liquid is fixed to the surface of the workpiece 10 rotated at a predetermined speed by the motor 14 by the nozzle 18 whose direction is fixed. Is discharged at a constant flow rate, so that when the shape of the processing object 10 is large, there is a problem that the range in which the rinsing liquid is supplied to the entire surface of the processing object 10 tends to be narrow.

In order to solve these problems, as shown in FIG. 3, the angle α of the nozzle 18 for discharging the rinsing liquid onto the surface of the processing object 10 is adjusted, or the nozzle 18 is moved in parallel by a distance W. Alternatively, it has been proposed to increase the number of nozzles 18, but there is a new problem that the mechanical structure is complicated and the cost is increased.

The present invention has been made in view of the above-mentioned various problems of the prior art, and has as its object to reduce the required amount of the surface of an object to be treated of an arbitrary size. It is an object of the present invention to provide a rinsing device capable of easily supplying a rinsing liquid.

[0012]

In order to achieve the above object, a rinsing apparatus according to the present invention comprises a rinsing apparatus for discharging a rinsing liquid onto a surface of a processing object to rinse the surface of the processing object. A processing object rotating means for mounting the processing object and rotating at a predetermined speed, and a predetermined diameter fixed to a predetermined angle with respect to the processing object and discharging a rinsing liquid onto the surface of the processing object Nozzle means having a discharge port, and flow rate control means for controlling a flow rate of a rinsing liquid discharged from the discharge port of the nozzle means per unit time, wherein the flow rate control means The flow rate of the rinsing liquid per unit time is controlled in accordance with the size of the rinsing liquid.

The flow rate control means may change the flow rate by increasing or decreasing the flow rate stepwise, or may change the flow rate by increasing or decreasing the flow rate smoothly.

Further, the flow rate control means may repeatedly increase and decrease the flow rate at a predetermined cycle to change the flow rate.

Here, the rinsing device according to the present invention will be described in more detail. The rinsing device according to the present invention provides a unit time of the rinsing liquid to be discharged if the diameter of the rinsing liquid discharge port of the nozzle means is constant. If you increase the flow rate per
The focus is on the point that the discharge pressure is increased and the rinse liquid can be discharged further away.

That is, as shown in FIG. 4A, when a large workpiece B (for example, an 8-inch wafer) is placed on the workpiece rotating means A and rinsed, the nozzle means C is used.
When the flow rate of the rinsing liquid L discharged from the discharge port per unit time is controlled by the flow rate control means D as shown in FIG. The position where the rinsing liquid L of the processing object B is discharged is changed to “outer edge →
By moving from the intermediate portion to the center portion, the entire large workpiece B can be rinsed.

As shown in FIG. 5A, when a medium-sized workpiece B '(for example, a 6-inch wafer) is placed on the workpiece rotating means A and rinsed, the nozzle means is used. When the flow rate of the rinsing liquid L discharged from the discharge port of C per unit time is controlled by the flow rate control means D as shown in FIG. The position where the rinsing liquid L of the processing object B ′ is discharged moves from “peripheral part → inside”, so that the entire medium-sized processing object B ′ can be rinsed.

Further, as shown in FIG. 6A, when a small workpiece B '(for example, a 4-inch wafer) is mounted on the workpiece rotating means A for rinsing, the nozzle means is used. If the flow rate of the rinsing liquid L discharged from the discharge port C per unit time is controlled by the flow rate control means D as shown in FIG. The rinsing liquid L is discharged to the entirety of B ″, and the entire small workpiece B ″ can be rinsed.

Also, as shown in FIGS. 4 (b), 5 (b) and 6 (b), instead of changing the flow rate stepwise, as shown in FIG. The flow rate may be changed so that the rinse liquid discharge position is smoothly changed, and the flow rate change is repeated. When the repetition period of the flow rate change is shortened, the rinsing liquid discharged from the discharge port of the nozzle means is subjected to vibration, so that rinsing can be performed more effectively.

[0020]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of a rinsing device according to the present invention will be described below in detail with reference to the drawings.

FIG. 8 is a schematic structural explanatory view showing an example of an embodiment of a rinsing device according to the present invention. The same components as those shown in FIG. 1 have the same reference numerals as those used in FIG. , The detailed description thereof will be omitted.

In this rinsing apparatus, the microcomputer 20 controls the flow rate of the rinsing liquid L discharged from the nozzle 18 having a predetermined diameter for discharging the rinsing liquid L per unit time. Has been made.

Further, the rinsing device is used to
5 and the change in the flow rate of the rinsing liquid L discharged from the discharge port of the nozzle 18 are stepwise (FIG. 4B, FIG.
(B) and FIG. 6 (b)) and an operator group 22 for inputting selection of smoothing or smoothing (see FIG. 7) and inputting the number of repetitions of the flow rate change of the rinsing liquid L. ,
D / A converter 24 that converts a digital signal output from microcomputer 20 into an analog signal and outputs the analog signal
And a valve 26 for variably controlling the flow rate of the rinsing liquid L discharged from the discharge port of the nozzle 18 based on the digital signal output from the D / A converter 24.

The memory of the microcomputer 20 stores a table referred to for controlling the flow rate of the rinsing liquid L discharged from the discharge port of the nozzle 18.

That is, in this rinsing apparatus, under the control of the microcomputer 20, the input of the size of the workpiece 10 and the change in the flow rate of the rinsing liquid L discharged from the discharge port of the nozzle 18 are stepwise (FIG. 4 (b), FIG. 5 (b) and FIG. 6 (b)) or the selection of smoothing (see FIG. 7) and the input of the number of repetitions of the flow rate change of the rinsing liquid L are operated. When performed by operating the child group 22,
A table is selected according to the input data, and the valve 26 is opened and closed according to the selected table. By opening and closing the valve 26, the flow rate of the rinse liquid L discharged from the nozzle 18 is changed.

FIG. 9 shows that the size of the object 10 to be processed is large and the flow rate of the rinsing liquid L discharged from the discharge port of the nozzle 18 changes stepwise (FIGS. 4 (b), 5 (b) and 5). FIG.
(See (b)).

FIG. 10 shows an example in which the size of the processing object 10 is medium and the change in the flow rate of the rinsing liquid L discharged from the discharge port of the nozzle 18 is smooth (see FIG. 7). ing. Here, in FIG. 10, the variable time is a time required for a flow rate change indicated by a symbol T in FIG. 7, and the flow rate change of the rinse liquid L discharged from the discharge port of the nozzle 18 is smooth (see FIG. 7). Only set for tables in certain cases.

If the number of repetitions of the change of the flow rate of the rinsing liquid L is plural, the change of the flow rate shown in the table is repeated according to the number of times.

[0029]

Since the present invention is configured as described above, it has an excellent effect that a required amount of a rinsing liquid can be easily supplied to the surface of an object of an arbitrary size. Play.

[Brief description of the drawings]

FIG. 1 is a schematic configuration explanatory view showing an example of a conventional rinsing device.

FIG. 2 is a graph showing a relationship between a flow rate of a rinsing liquid and time in a conventional rinsing device.

FIG. 3 is an explanatory diagram for explaining a problem of a conventional rinsing device.

4A and 4B are explanatory diagrams for illustrating a change in a flow rate of a rinsing liquid according to the present invention for a large object to be processed; FIG. 4A is an explanatory diagram illustrating a change in a flow rate of a rinsing liquid over time; )
Is a graph showing the relationship between the flow rate of the rinsing liquid and time.

5A and 5B are explanatory diagrams showing a change in a flow rate of a rinsing liquid according to the present invention for a medium-sized workpiece; FIG. 5A is an explanatory view showing a change in a flow rate of a rinsing liquid over time; )
Is a graph showing the relationship between the flow rate of the rinsing liquid and time.

FIGS. 6A and 6B are explanatory diagrams illustrating a flow rate of a rinsing liquid according to the present invention for a small object to be processed; FIG. 6A is an explanatory diagram illustrating a flow rate of a rinsing liquid; It is a graph which shows the relationship with time.

FIG. 7 is a graph showing a relationship between the flow rate of the rinsing liquid and the time when the flow rate of the rinsing liquid is smoothly changed.

FIG. 8 is a schematic structural explanatory view showing an example of an embodiment of a rinsing device according to the present invention.

FIG. 9 is an explanatory diagram schematically showing an example of a table in a case where the size of an object to be processed is large and a flow rate change of a rinsing liquid discharged from a discharge port of a nozzle is stepwise.

FIG. 10 is an explanatory diagram schematically showing an example of a table in a case where the size of an object to be processed is a medium size and a change in a flow rate of a rinse liquid discharged from a discharge port of a nozzle is smooth;

[Explanation of symbols]

 A Workpiece rotating means B Workpiece C Nozzle means D Flow rate control means L Rinse liquid 10 Workpiece 12 Workpiece installation stand 14 Motor 16 Rotation support shaft 18 Nozzle 20 Microcomputer 22 Operator group 24 D / A Transducer 26 valve

Claims (4)

[Claims] 1. A rinsing liquid is discharged onto the surface of an object to be processed,
A rinsing device for rinsing the surface of the workpiece; a workpiece rotating means for mounting the workpiece and rotating at a predetermined speed; fixing the workpiece at a predetermined angle with respect to the workpiece; Nozzle means having a discharge port of a predetermined diameter for discharging a rinsing liquid on the surface of the processing object, and a flow control means for controlling a flow rate per unit time of the rinsing liquid discharged from the discharge port of the nozzle means. A rinsing apparatus, wherein the flow rate control means controls a flow rate of a rinsing liquid per unit time according to a size of the processing object. 2. The rinsing device according to claim 1, wherein the flow control unit changes the flow by increasing or decreasing the flow in a stepwise manner. 3. The rinsing apparatus according to claim 1, wherein the flow rate control means changes the flow rate by smoothly increasing or decreasing the flow rate. 4. The rinsing device according to claim 2, wherein the flow control means repeatedly increases and decreases the flow rate at a predetermined cycle to change the flow rate.