JPH10121236A - Magnetron sputtering method, magnetron sputtering device and magnet unit used therefor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a magnetron sputtering method using a magnet unit capable of easily attaching and detaching magnets and thus capable of easily correcting the arrangement of the magnets, to provide a magnetron sputtering device and to provide a magnet unit used for the sputtering device. SOLUTION: Magnets 14 and 14' arranged in a magnet unit are plurally present as pieces, the magnet thrusted into each pore 13 having dimension larger than the shape equal to each piece in a porous type magnet holder 12 are held by a yoke placed on the base and magnetic force and is furthermore brought into facial contact with the inside wall of the pore by the resiliency against the magnet arranged at the adjacent pore, and, even if the magnet unit is inverted, the magnets do not fall. On the other hand, in the case the magnet which is desired to be taken out from the surface of the magnet unit is joined with the other magnet and it is pulled out while they are pulled against by the magnetic force with each other, only the desired magnet can easily be taken out.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a magnetron sputtering method for forming a thin film on a substrate in a vacuum, a magnetron sputtering apparatus, and a magnet unit used in the magnetron sputtering apparatus.

[0002]

FIG. 6 is a diagram of a conventional magnetron sputtering apparatus having a magnet unit outside a sputtering chamber. 6, reference numeral 50 denotes a sputtering chamber; 51, a target disposed in the sputtering chamber 50; 52, a backing plate for holding the target 51; 53, an earth shield disposed around the target 51; An insulating material that insulates the chamber 50, 55 is a water cooling mechanism that cools the backing plate 52, 56 is a magnet unit, 57 is a high-frequency power supply that supplies high-frequency power to the target 51, 58 is a belt, and 59 rotates the magnet unit 56. It is a motor, and the rotation shaft of the motor 59 and the rotation shaft of the magnet unit 56 are connected by the belt 58. 60 is a pump for evacuating the sputtering chamber 50, 61 is a supply source of a reactive gas for sputtering such as argon, 62 is a substrate disposed in the sputtering chamber 50 so as to face the target 51, and 63 is a substrate 62. It is a substrate holder to hold.

[0003] Such a magnetron sputtering apparatus has an advantage that the sputtering rate is 10 to 30 times higher than that of a sputtering apparatus that does not use the action of a magnetic field. However, this advantage has the disadvantage that the target material surface is eroded inhomogeneously in accordance with the magnetic field distribution on the sputtered material surface. As a result, the thickness distribution of the deposited film becomes non-uniform as well as the target material surface is eroded in a non-uniform manner. Depending on the depth of the eroded portion, only about 30% of the target material is sputtered, but the life will end.

Conventionally, as shown in FIGS. 7A and 7B, most of a magnet of a magnet unit mounted on a sputtering apparatus has a circular shape corresponding to a target shape.
Alternatively, the magnets or the magnet groups 22, 22 'manufactured in an arbitrary shape on the surface of the yoke 21 are held at arbitrary positions by an adhesive on the surface of the yoke 21. At this time, the yoke 21 is made of a magnetic material in order to shield the influence of the magnetic field on the back surface and at the same time increase the magnetic field intensity on the front surface.

[0005]

In recent years, there has been an increasing movement to control the magnetic field distribution for the purpose of improving the accuracy of the film thickness variation, improving the utilization efficiency of the target material, and increasing the rate of the target material. The shape is becoming complicated. However, even if the magnet arrangement is determined and a magnet unit is created, a desired magnetic field distribution cannot be obtained in many cases.
At this time, if the magnet is held by the adhesive force of the adhesive as in the conventional magnet unit, it is difficult to correct the magnet. An object of the present invention is to use a magnetron sputtering method, a magnetron sputtering apparatus, and a magnetron sputtering apparatus having a magnet unit suitable for obtaining a complicated magnetic field distribution, in which the method of attaching and detaching the magnet is easy and the magnet arrangement is easy to correct. A magnet unit is provided.

[0006]

In order to achieve the above object, the present invention is configured as follows. According to the magnet unit according to the first aspect of the present invention, in the magnet unit disposed on the back side of the target without limiting the inside and outside of the sputtering chamber of the magnetron sputtering apparatus in which the target and the substrate are arranged facing each other in the sputtering chamber,
A plurality of magnets, a yoke made of a magnetic material,
The magnet is inserted into the hole, and the magnet is inserted into the hole, and the magnet is inserted into the yoke by the magnet. And a porous magnet holder which is detachably held and held in the hole.

According to a second aspect of the present invention, in the first aspect, the magnet holder is non-magnetic, and is made of a material selected from duralumin, aluminum, copper, synthetic resin, and ceramic. Can also be configured. According to the third aspect of the present invention, in the first or second aspect, each of the individual pieces and each of the holes of the magnet may be configured to have the same shape.
According to a fourth aspect of the present invention, in any one of the first to third aspects, each hole of the porous magnet holder is
It may be configured to be arranged at regular intervals in at least one direction. According to a fifth aspect of the present invention, in any one of the first to third aspects, the holes of the porous magnet holder may be arranged in a staggered manner. According to a sixth aspect of the present invention, the first
In any one of the above aspects, the magnet includes an N-pole magnet and an S-pole magnet, and at least one hole is interposed between the N-pole magnet and the S-pole magnet to form a hole in the magnet holder. It can also be configured to be arranged. According to the magnetron sputtering apparatus of the seventh aspect of the present invention, the magnetron sputtering apparatus can be configured to include the magnet unit of any one of the first to sixth aspects.

According to the magnetron sputtering method of the eighth aspect of the present invention, the target and the substrate are arranged in the sputtering chamber so as to face each other, and the magnet unit is arranged on the back side of the target without limiting the inside and outside of the sputtering chamber. The unit is configured such that a porous magnet holder is arranged on a surface of a yoke made of a magnetic material, and the magnet holder has holes each having a size equal to or larger than each individual piece of a plurality of magnets. Into a magnetron sputtering method using a sputtering apparatus, the magnet is inserted into the hole of the magnet holder,
The magnet is detachably held on the yoke by the magnetic force of each of the magnets, held in the hole, and then magnetron sputtering is performed.

According to a ninth aspect of the present invention, in the above-mentioned eighth aspect, when the arrangement of the magnet is changed, the magnet is taken out from the hole of the magnet holder, and the magnet is inserted into another hole, and each magnet is inserted. The magnet may be replaced by holding the magnet detachably on the yoke by the magnetic force of the magnet and holding the magnet in the hole.

The magnetron sputtering method of the present invention,
According to the magnetron sputtering device and the magnet unit, each magnet is held in each hole of the porous magnet holder having each hole having a shape equal to or larger than the above-described magnet, and ,
The attachment and detachment of each magnet becomes easy, and the correction of the magnet arrangement becomes easy. Therefore, when a desired magnetic field distribution cannot be obtained or when it is desired to change the magnet arrangement for other reasons, it is possible to easily remove the magnet once arranged and to relocate it to another place, and a complicated magnetic field can be obtained. A magnet unit suitable for distribution can be provided. In the above aspect of the present invention, if the size and shape of each magnet and each hole are unified, the magnet can be freely held in the hole at an arbitrary position in addition to the above-described effects. Furthermore, in the above aspect of the present invention, if the positions of the holes of the magnet holder are uniformly provided at regular intervals such as a parallel shape, a staggered shape, and a concentric shape, the degree of freedom of the magnet arrangement becomes large and the management becomes easy. . In particular, in the case of the staggered shape, the magnets can be arranged most densely, so that the magnetic field strength can be improved, and the above effects can be exhibited together.

[0011]

Embodiments of the present invention will be described with reference to the drawings. 1 and 2 are a plan view and a side view of a magnet unit of the magnetron sputtering apparatus according to the embodiment for performing the magnetron sputtering method according to the embodiment of the present invention. Figures 1 and 2
In the figure, 11 is a yoke, 12 is a non-magnetic porous magnet holder supported by the yoke 11, 13 is a number of through holes formed in the magnet holder 12, and 14 and 14 'are in the through holes 13 of the magnet holder 12. These are N-pole and S-pole magnets arranged. Here, the yoke 11 is made of a magnetic material for shielding the influence of the magnetic field on the back surface of the magnet unit and at the same time increasing the magnetic field strength on the front surface. The magnet holder 12 is preferably made of a non-magnetic material. The material of the magnet holder 12 is appropriately selected from duralumin, aluminum, copper, synthetic resin, and ceramic in the case of a non-magnetic material. Magnet holder 1
The second material may be a magnetic material.

As an example of the present embodiment, the yoke 1
1 is made of iron, the magnet holder 12 is made of duralumin, and the magnets 14 and 14 'are made of neodymium-made neodymium magnets (including Nd, Fe, and B), and have a diameter of 8 mm and a height of 8 mm. Use a cylindrical shape.
The shapes of the through holes 13 of the magnet holder 12 are all the same, and the diameter φ8
mm and a height of 8 mm. The arrangement is 9m pitch
m staggered over the entire surface. Here, the yoke 11 and the magnet holder 12 were joined, and magnets 14 and 14 'were arranged in the holes 13 of the magnet holder 12 as shown in FIGS. The through-hole 13 in which the magnets 14 and 14 'are not arranged remains a hole. At this time, as shown in FIG.
The 4 ′ yoke-side back surface is held by the magnetic force F _{1 on} the surface of the yoke 11 exposed at the base of each through-hole 13, and the magnets 14, 1 of the same polarity disposed in the adjacent holes 13.
4 'has an inner wall surface contact of the through-hole 13 by the repulsive force F ₂ between the magnet 14 and 14 even if the magnet unit upside down' will not fall. When the magnets 14, 14 ′ are held by the yoke 11 with a sufficiently large holding force, the magnets 14, 14 ′ need not be in surface contact with the inner wall of the through hole 13.

When removing the magnets 14 and 14 ', as shown in FIG.
Since the magnet 14 'is not bonded with an adhesive or the like as in the prior art, another magnet 20 held by another magnet 20 is joined to the magnet 14, 14' to be taken out from the surface of the magnet unit and attracted by the mutual magnetic force. While pulling out, it is easy and desired magnet 14,1
Only 4 'can be taken out. For example, S pole magnet 1
When it is desired to take out 4 ′ from the through hole 13, the S pole magnet 14 ′ is large enough to attract the S pole magnet 14 ′ to be taken out against the repulsive force acting from the S pole magnet 14 ′ adjacent to the S pole magnet 14 ′. S-pole magnet 1 to take out N-pole magnet with magnetic force
4 ', the S-pole magnet holder 14' and the N-pole magnet 14 are attracted by magnetic force to repel the adjacent S-pole magnet 14 'and hold the S-pole magnet 14' and the yoke 11 to be taken out. By overcoming the force, the S pole magnet 14 'to be taken out can be taken out. At this time, for example, a magnet extracting unit facing the magnet unit holding the magnets 14 and 14 'is arranged, and the extracting unit is opposed to each of the magnets 14 and 14' of the magnet unit of the present embodiment. And a plurality of magnets 20 or 14 'each having a pole opposite to the pole of the plurality of magnets 14 or 14' to be taken out of the magnet unit of the present embodiment.
, A plurality of magnets 14 or 14 'may be simultaneously taken out as shown in FIG. vice versa,
When installing or re-installing the magnet 14 or 14 ′, the magnet 14 or 14 ′ is aligned with the through hole 13 at the position where the magnet 14 or 14 ′ is to be installed, and the magnet 14 or 14 ′ is securely inserted into the through hole 13 simply by pushing. Can hold.

In the magnet unit obtained by the above embodiment, when the vertical component of the magnetic field at the target material surface position 30 mm away from the surface is zero, all the horizontal components of the magnetic field exceed 300 G (Gauss). Was. In the example of this embodiment, iron is used as the material of the yoke 11, duralumin is used as the material of the magnet holder 12, and neodymium is used as the magnets 14 and 14 '. However, the present invention is not limited to this. Further, the shapes of the magnets 14 and 14 'and the through hole 13 are not limited to these.

The arrangement of the magnets 14 and 14 'is not limited to that shown in FIG. The magnet unit of FIG. 1 is adapted to a circular substrate. As an example, the N-pole magnet 14 is disposed in a substantially
The pole magnet 14 'is arranged in a substantially C shape, and a magnetic field is generated between the N pole magnet 14 and the S pole magnet 14' at the time of sputtering, and corresponds to a gap shape between the N pole magnet 14 and the S pole magnet 14 '. The electrons circulate around a closed loop-shaped part. N pole magnet 1
Regardless of the 4 or S pole magnet 14 ', by arranging the magnets of the poles arranged on the outer periphery of the magnet unit in a substantially closed loop shape, it is possible to prevent the circulating electrons from being scattered and to improve the sputtering efficiency. It is preferable because it is possible. Also, by arranging the N-pole magnet 14 not only in an annular shape on the outer peripheral portion of the circular magnet unit but also in a radial direction toward the center side, the N-pole magnet 14 and the S-pole A magnetic field is formed between the magnet and the magnet 14 'to form a path in which electrons circulate, so that sputtering can be efficiently performed not only on the outer peripheral side but also on the central side of the target. Since the magnet unit is rotated as described in the conventional device, symmetry does not particularly matter in the arrangement of the magnets. Also,
For example, the S-pole magnet 14 ′ has a substantially C-shape in which all the S-pole magnets 14 ′ are arranged also on the inner part in order to increase the magnetic field strength. Instead of arranging the magnet 14 ′ of the inner part, the magnet 14 ′ may be arranged in a substantially C-shaped frame shape. As described above, in the present embodiment, for example, one magnet can be inserted into and removed from one through-hole to finely adjust the magnetic field strength.

FIG. 1 shows an example of an arrangement of magnet units applied to a circular target. FIG. 5 shows a magnet unit 32 according to another embodiment of the present invention applied to a rectangular target. In FIG. 5, the rectangular magnet unit 32 reciprocates along the longitudinal direction of the rectangular target 37 instead of rotating with respect to the target. This magnet unit 3
2, the arrangement of the magnets 34, 34 '
A pole magnet 34 is arranged, and an S pole magnet 34 ′ is arranged inside the N pole magnet 34 in a shape substantially similar to the arrangement shape of the N pole magnet 34. The arrangement direction of the two magnets 34, 34 'is
There is no portion parallel to the moving direction of No. 2 to increase the sputtering efficiency. In the case where the thickness of the thin film formed on the substrate is required to be uniform, the magnet may be symmetrical with respect to a center line passing through the center of the rectangular magnet unit 32 in the longitudinal direction and perpendicular to the longitudinal direction. Preferably, 34, 34 'are arranged. Further, the magnets 14 of the magnet holder 13,
The hole 13 in which the 14 'is arranged is not limited to a through hole in which the surface of the yoke 111 is exposed to the magnets 14 and 14'.
If the magnetic force of the magnets 14 and 14 'penetrates and exerts a holding force enough to hold the magnet between the yoke 11 and the yoke 11, there is a bottom portion, and the magnets 14 and 14' are passed through the bottom portion. You may make it oppose the yoke 11.

According to the above configuration of the present embodiment, the porous magnet having the through holes 13, 33 in which the magnets 14, 14 ', 34, 34' have the same shape or a larger size. Each through hole 13 of the holders 12 and 32,
It is configured to be detachably held in the inside 33 by magnetic force. Therefore, when a desired magnetic field distribution cannot be obtained or when it is desired to change the magnet arrangement for other reasons, it is easy to remove the magnets 14, 14 ′, 34, 34 ′ that have been arranged once and to relocate them to another place. Can be done. In addition, each magnet 14, 14 ', 34,
34 'and the through holes 13 of the magnet holders 12, 32,
If the size and shape of 33 are unified, the magnets 14, 14 ', 34, 34' of arbitrary poles can be freely held in the through holes 13, 33 at any position. Furthermore, the through holes 1 of the magnet holders 12 and 32
If the positions of 3, 33 are uniformly provided at regular intervals in at least one direction, for example, in a parallel shape, a staggered shape, a concentric shape, etc., the degree of freedom of magnet arrangement is increased, and management becomes easy. . In particular, in the staggered arrangement, the magnets 14, 14 ', 34, 34' can be arranged most densely, so that the magnetic field strength can be improved.

[Brief description of the drawings]

FIG. 1 is a plan view of a magnet unit of a sputtering apparatus according to an embodiment of the present invention.

FIG. 2 is a sectional side view of the magnet unit of FIG. 1;

FIG. 3 is an explanatory view of a state where a magnet is held in a hole of a magnet holder of the magnet unit of FIG. 1;

FIG. 4 is an explanatory diagram in a case where a magnet held in a hole of the magnet holder is taken out.

FIG. 5 is a plan view of a magnet unit of a sputtering apparatus according to another embodiment of the present invention.

FIG. 6 is a schematic view of a conventional sputtering apparatus.

FIGS. 7A and 7B are diagrams illustrating examples of arrangement of magnet units of the conventional sputtering apparatus.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 11 Yoke 12, 32 Magnet holder 13, 33 Hole made in magnet holder 14, 14 ', 34, 34' Magnet 21 Yoke 22 Magnet 37 Substrate

Claims (9)

[Claims] A magnet unit disposed on the back side of the target without limiting the inside and outside of the sputtering chamber of the magnetron sputtering apparatus in which the target and the substrate are arranged facing each other in the sputtering chamber; 34 '), a yoke (11) made of a magnetic material, and holes (13, 33) arranged on the surface of the yoke and having a size equal to or greater than the size of each piece of the magnet.
And a porous magnet holder (12, 32) for inserting the magnet into the hole, detachably holding the magnet on the yoke by the magnetic force of the magnet, and holding the magnet in the hole. A magnet unit characterized in that: 2. The magnet holder is non-magnetic,
The magnet unit according to claim 1, wherein the magnet unit is made of a material selected from duralumin, aluminum, copper, synthetic resin, and ceramic. 3. The magnet (14, 14 ', 34,
The magnet unit according to claim 1 or 2, wherein each of the individual pieces and each of the holes (34 ') have the same shape. 4. Each hole of the porous magnet holder is
The magnet unit according to any one of claims 1 to 3, wherein the magnet unit is arranged at regular intervals in at least one direction. 5. The magnet unit according to claim 1, wherein the holes of the porous magnet holder are arranged in a staggered manner. 6. The N-pole magnet (1)
4, 34) and S-pole magnets (14 ', 34'), and at least one hole is interposed between the N-pole magnet and the S-pole magnet so as to be disposed in the hole of the magnet holder. The magnet unit according to claim 1. 7. A magnetron sputtering apparatus comprising the magnet unit according to claim 1. 8. A target and a substrate are arranged in the sputtering chamber so as to face each other, and a magnet unit is arranged on the back side of the target without limiting the inside and outside of the sputtering chamber, and the magnet unit is made of a yoke made of a magnetic material. A porous magnet holder (12, 32) is arranged on the surface of the magnet, and the magnet holder comprises a plurality of magnets (14, 14 ',
34, 34 ') by a magnetron sputtering method using a sputter device configured to have each hole (13, 33) having a size equal to or greater than the shape of each individual piece, Wherein the magnet is detachably held in the yoke by the magnetic force of each magnet and held in the hole, and then magnetron sputtering is performed. . 9. When changing the arrangement of the magnet,
Take out the magnet from the hole of the magnet holder,
9. The magnet according to claim 8, wherein the magnet is inserted into another hole, the magnet is detachably held on the yoke by the magnetic force of each magnet, and the magnet is replaced by holding the magnet in the hole. Magnetron sputtering method.