JPH10121232A - Sputtering target - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent the sputtering of a backing plate by providing a protective material of an electrical insulating substance or the one of the quality same as that of the target on the surface of a backing plate as the joint of target blocks. SOLUTION: Plural target blocks 1 are joined to a backing plate 2 by using an adhesive 3 to form a split joining type sputtering target. The upper face of the backing plate 2 as the joint of the target blocks 1 is provided with a protective plate 4 composed of an electrical insulating substance or of a metallic material of the quality same as that of the target. The size of the protective plate 4 is regulated to the one in which the backing plate 2 does not expose from the butt joint face of the target plate 1, and, ordinarily, a sheet material or sheet like one with 5 to 30mm width is used. Furthermore, the thickness of the protective plate 4 is regulated to the one in which the backing plate does not expose in the process of sputtering, and it is ordinarily regulated to <=50μm. In this way, the availability of the target improves.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a sputtering target for a sputtering apparatus for forming a thin film. More particularly, the present invention relates to a split-joining type sputtering target used by combining a plurality of split targets and joining them to a backing plate.

[0002]

2. Description of the Related Art Conventionally, a magnetron type sputtering apparatus has been widely used as a method for forming a thin film on a substrate. The magnetron type sputtering apparatus introduces an inert gas, for example, a rare gas such as Ar gas into a vacuum chamber, applies a negative potential to the target to generate a glow discharge, and uses the Ar ⁺ ions generated in the vacuum chamber as a target. This is a film forming apparatus in which a target is sputtered by collision, and particles to be sputtered are formed (deposited) on a substrate (on an anode) provided facing the target to form a thin film.

In a magnetron sputtering apparatus, a metallic material target is usually attached to a backing plate (mainly made of copper, Al, SUS, etc.) with an adhesive (In, In).
Sn, etc.). With the recent increase in the area of the coating material, the sputtering equipment has become larger and larger, and the sputtering target used for it has also become larger.The target is divided as the target becomes larger, and the divided blocks are placed on the backing plate. In this case, a split junction type target that is arranged in a tile shape and adhered has been adopted.

[0004]

When sputtering is performed using a split junction type target, if sputtering is continued, the backing plate of the base is exposed at the junction of the target block due to the progress of erosion of the target material. There is a concern that the substrate may be sputtered. For this reason, a type that prevents the exposure of the base by overlapping the target block at an angle is used (see FIGS. 2 and 3). But,
Even if such measures were taken, it was not a sufficient solution.

[0005]

SUMMARY OF THE INVENTION In view of the above-mentioned problems of the split junction type target, the present inventors have found that the underlying backing plate material at the joining portion of the target block is not exposed, and that the backing plate is sputtered. As a result of intensive studies on a split-connection type target having no structure, it was found that the problem could be solved by forming a special joint at the joint between the target blocks, and the present invention was completed. The gist of the present invention is:
In a split-joining type sputtering target in which a plurality of target blocks are joined to a backing plate with an adhesive, a protective material made of an electrically insulating substance or a metal material of the same quality as the target is provided on the upper surface of the backing plate at the joint between the target blocks. A split junction type sputtering target is provided. Hereinafter, an example of the present invention will be described with reference to the drawings.

FIGS. 1 to 3 show an example of a split junction type sputtering target of the present invention, wherein 1 is a target block, 2 is a backing plate, and 3 is an adhesive used for joining the target block and the backing plate. Agent 4 indicates a protective material. Various metal materials are selected for the target block 1 depending on the type of film quality to be formed on the substrate by sputtering.
The type of the metal is not particularly limited. For example, Al, Ti, V, Cr, Mn, Fe, Co, Ni, C
u, Zn, Ge, Zr, Nb, Mo, Ru, Rh, P
d, Ag, Hf, Ta, W, Re, Os, Ir, Pt,
Examples include metals such as Au and Th, nonmetals such as C, Si, Se, Te, and Ge, and compounds thereof. The target blocks 1 to be joined on the backing plate 2 may be joined together by joining a plurality of target blocks 1 of the same type (the same metal material) or different types (different metal materials). The target block 1 may be joined and joined on the backing plate 2.

The backing plate 2 is made of a material having a high thermal conductivity, for example, pure copper, an alloy of copper and zinc, nickel, manganese or the like, stainless steel or the like. The shape of the backing plate 2 is not particularly limited, but generally a square or round shape is suitably used. Adhesive (bonding material)
As 3, a low melting point metal such as indium or tin, an alloy such as solder, a brazing material, a resin, or the like is used. As the protective material 4, inorganic electric insulating materials such as glass, porcelain plate and ceramics plate, which are hardly sputtered, and organic electric insulating materials such as heat-resistant resin sheets such as Teflon and polyimide are preferably used. However, a metal material of the same quality as the target which causes few problems even if sputtered may be used.

The size of the protective material 4 is not particularly limited as long as the size of the backing plate 2 is not exposed from the jointing surface of the target block.
Usually, a plate or sheet having a width of 5 to 30 mm is used. The thickness of the protective material 4 is not particularly limited as long as the backing plate 2 is not exposed to the surface during sputtering, but is usually 50 μm or more, preferably 100 μm to 1000 μm. Also,
As shown in the figure, the mounting structure of the backing plate 2
, Embedded between the target blocks (FIG. 1), interposed between the target blocks (FIG. 2), and interposed between the target block 1 and the backing plate 2 (FIG. 3). The attachment of the protection member 4 to the upper surface of the backing plate is usually performed with an adhesive or a screw. In this case, an adhesive or a screw made of an electrically insulating material, for example, an adhesive made of an alumina paste or the like, a screw made of a ceramic, or a screw made of a metal material of the same quality as the target is preferably used. In addition to the mounting means using an adhesive, a screw, or the like, a means may be used in which the electrically insulating substance is made into a liquid state, applied, solidified, and covered.

[0009]

【Example】

Example 1 Two target blocks each having a size of 130 mm × 300 mm (thickness: 6 mm) were joined, and a size of 150 mm × 650 mm was connected.
(Thickness 10 mm) was bonded to a copper backing plate with the structure shown in FIG.
mm). In addition, the protective material 4 used glass 10 mm in width and 1 mm in thickness. Indium was used as a bonding material (adhesive).
When a sputtering film was formed using the above-mentioned split junction type target, the underlying backing plate was no longer exposed. In the conventional case, only about 50% of the target could be used. Efficiency improved.

[Brief description of the drawings]

FIG. 1 is a longitudinal sectional view showing an example of a target of the present invention.

FIG. 2 is a longitudinal sectional view showing an example of the target of the present invention.

FIG. 3 is a longitudinal sectional view showing an example of the target of the present invention.

[Explanation of symbols]

 1 Target block 2 Backing plate 3 Adhesive 4 Protection plate

Claims (1)

[Claims] 1. A split bonding type sputtering target in which a plurality of target blocks are bonded to a backing plate with an adhesive, an electrically insulating substance or a metal material of the same quality as the target is formed on the upper surface of the backing plate at the joint between the target blocks. A split junction type sputtering target characterized by comprising a protective material comprising: