JPH10121173A - Aluminum alloy clad plate for high capacity magnetic disk substrate excellent in plating property and blistering resistance and its production - Google Patents

Aluminum alloy clad plate for high capacity magnetic disk substrate excellent in plating property and blistering resistance and its production

Info

Publication number
JPH10121173A
JPH10121173A JP27796196A JP27796196A JPH10121173A JP H10121173 A JPH10121173 A JP H10121173A JP 27796196 A JP27796196 A JP 27796196A JP 27796196 A JP27796196 A JP 27796196A JP H10121173 A JPH10121173 A JP H10121173A
Authority
JP
Japan
Prior art keywords
aluminum alloy
magnetic disk
clad plate
disk substrate
core material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP27796196A
Other languages
Japanese (ja)
Inventor
Kenichi Ogura
健一 小倉
Yoichiro Totsugi
洋一郎 戸次
Yoshinari Kubo
嘉成 久保
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Furukawa Electric Co Ltd
Original Assignee
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Priority to JP27796196A priority Critical patent/JPH10121173A/en
Publication of JPH10121173A publication Critical patent/JPH10121173A/en
Pending legal-status Critical Current

Links

Abstract

PROBLEM TO BE SOLVED: To produce a low-cost aluminum alloy clad plate for a magnetic disk substrate excellent in adhesion, surface smoothness, surface quality and corrosion resistance, capable of forming a substrate plating layer free from the generation of blustering an annealing stage and free from the generation of difference in level between a core material and a surface material at the time of etching. SOLUTION: In an aluminum alloy clad plate for a high capacity magnetic disk substrate in which one side of both sides of an aluminum alloy core material are clad with a surface material, the compsn. of the surface material is composed of the one contg., by weight 0.01 to 0.15% Cu and 0.05 to 2.0% Zn, contg. one or two kinds among <=2.0% Mg, 0.01 to 0.5% Mn,. 0.01 to 0.3% Cr, 0.01 to 0.12% Zr and 0.01 to 0.05% Ni, contg., as impurity elements, <=0.05% Si, <=0.05% Fe and <=0.02% Ti and contg. other inevitable impurity elements respectively by <=0.02%, and the balance Al.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、密着性、表面平滑
性、表面品質、耐食性に優れ、焼鈍工程で膨れを生じな
い下地めっき層を形成でき、エッチング時に芯材と皮材
間に段差が生じない、低コストの高容量磁気ディスク基
板用アルミニウム合金クラッド板およびその製造方法に
関する。
The present invention relates to an undercoating layer which is excellent in adhesion, surface smoothness, surface quality, and corrosion resistance and which does not swell during the annealing step. The present invention relates to a low-cost, low-cost aluminum alloy clad plate for a high-capacity magnetic disk substrate and a method of manufacturing the same.

【0002】[0002]

【従来の技術】近年、磁気ディスクには、マルチメディ
ア等のニーズから大容量化および高密度化が求められて
おり、磁気ディスクの1ビット当たりの磁気領域は益々
微細化され、また磁気ヘッドと磁気ディスクとの間隔も
狭まる傾向にある。このような磁気ディスクに用いられ
る基板には次の特性が要求されている。非熱処理型
(非析出硬化型)の軽合金からなり、各種の加工および
使用時の高速回転に耐える十分な強度を有すること、
研磨によりマイクロピット等のない良好な鏡面が得られ
ること、下地めっき後の表面が平滑でマイクロピット
等の欠陥が生じないこと、下地めっき層の密着性が良
いこと。
2. Description of the Related Art In recent years, a magnetic disk has been required to have a large capacity and a high density due to needs of multimedia and the like, and a magnetic area per bit of the magnetic disk has been further miniaturized. The distance from the magnetic disk also tends to decrease. Substrates used for such magnetic disks are required to have the following characteristics. It is made of a non-heat-treated (non-precipitation hardened) light alloy and has sufficient strength to withstand high speed rotation during various processing and use.
A good mirror surface free of micropits and the like can be obtained by polishing, the surface after the base plating is smooth and no defects such as micropits are generated, and the adhesion of the base plating layer is good.

【0003】従来、磁気ディスク用基板には、マイクロ
ピット等の原因になるFeやSi等の不純物元素を規定した
JIS-A-5086合金が用いられている。そして、この基板
は、半連続鋳造法で得た鋳塊(スラブ)を熱間圧延し、
次いで焼鈍を交えながら冷間圧延し、圧延材を円板状に
打抜き、この円板状体に、前処理として切削、研削、研
磨、脱脂、エッチング、ジンケート処理を施し、次いで
下地処理としてNi-P等の硬質非磁性金属の無電解めっき
とポリッシングを施した後、 Co-Ni-P合金等の磁性体を
スパッタリングして製造されている。
Conventionally, a magnetic disk substrate is provided with impurity elements such as Fe and Si which cause micropits or the like.
JIS-A-5086 alloy is used. And this substrate is hot rolled ingot (slab) obtained by semi-continuous casting method,
Next, cold rolling is performed while annealing is performed, and the rolled material is punched into a disc shape. This disc shape is subjected to cutting, grinding, polishing, degreasing, etching, zincate treatment as a pretreatment, and then Ni- as a base treatment. It is manufactured by subjecting a hard non-magnetic metal such as P to electroless plating and polishing, and then sputtering a magnetic material such as a Co-Ni-P alloy.

【0004】しかし、前記JIS-A-5086合金製基板は無電
解めっき後の表面の平滑性が十分でない。即ち、切削、
研削、研磨、ジンケート処理等の前処理の際に、金属間
化合物が突出して残存したり金属間化合物が脱落したり
して、下地めっき後のディスクの極表層にノジュール
(半球状の突起)やマイクロピットが発生する。前記ノ
ジュールは磁気ヘッドと衝突してヘッドクラッシュの原
因になり、マイクロピットは電気的エラーの原因にな
る。このため、磁気ディスクの表面品質の向上には、ア
ルミニウム合金基板中の金属間化合物の個数や大きさを
低減する対策が講じられてきたが、必ずしも十分な効果
が得られていない。他にも種々の対策が講じられている
が、いずれも処理工程が複雑で、製造コストが高いもの
である。なお、ノジュールの発生原因には、 Al-Fe系金
属間化合物等が表層に突出し、この突出部がめっきされ
てノジュールになる場合や、小さな凹部にジンケートが
凸状に優先成長し、この凸部がめっきされてノジュール
になる場合等がある。
However, the JIS-A-5086 alloy substrate has insufficient surface smoothness after electroless plating. That is, cutting,
During pretreatment such as grinding, polishing, and zincate treatment, the intermetallic compound protrudes and remains or the intermetallic compound falls off, causing nodules (hemispherical protrusions) or Micro pits occur. The nodules collide with the magnetic head and cause a head crash, and the micro pits cause an electrical error. Therefore, to improve the surface quality of the magnetic disk, measures have been taken to reduce the number and size of the intermetallic compounds in the aluminum alloy substrate, but a sufficient effect has not always been obtained. Various other measures have been taken, but all have complicated processing steps and high manufacturing costs. The nodules may be caused by an Al-Fe intermetallic compound or the like protruding into the surface layer and this protruding portion being plated to form a nodule, or zincate growing preferentially in a small concave portion in a convex shape. May be plated to form nodules.

【0005】また、最近、高強度化を目的として、芯材
に時効硬化型アルミニウム合金のAl-Mg-Zn系合金 (7000
系合金) を使用し、この芯材にめっき性が良好な皮材と
してAl-Mg系合金 (5000系合金) をクラッドしたものが
開発されている(特開平5-9633号公報および特開平 5-4
3970号公報)。しかし、このクラッド板は、芯材にZnを
多量に(通常4wt%以上) 含む7000系合金を使用している
ため、芯材と皮材の電位差が大きく、ジンケート処理前
のエッチング工程で芯材が優先的に溶解し皮材との間に
段差が生じることがある。段差が大きくなると、磁気デ
ィスクをシャフトに装填する際に段差部分が引掛かり皮
材が剥離することがある。また芯材と皮材の組成を適正
に組合わせないと圧延圧接で十分な接合強度が得られな
い場合がある。
Recently, for the purpose of increasing the strength, an Al-Mg-Zn alloy (7000) of an age hardening type aluminum alloy has been used as a core material.
(Alkali-based alloys) and clad Al-Mg-based alloys (5000-based alloys) as a skin material having good plating properties on this core material have been developed (JP-A-5-9633 and JP-A-5-9633). -Four
No. 3970). However, since this clad plate uses a 7000 series alloy containing a large amount of Zn (usually 4 wt% or more) as the core material, the potential difference between the core material and the skin material is large, and the core material is used in the etching process before zincate treatment. May be preferentially dissolved and a step may occur with the skin material. When the step is large, the step may be caught when the magnetic disk is loaded on the shaft, and the skin material may peel off. Further, if the compositions of the core material and the skin material are not properly combined, sufficient bonding strength may not be obtained by rolling welding.

【0006】このようなことから、本発明者等は、合金
元素の種類とその添加量を制御して欠陥の少ない下地め
っき層(無電解Ni-P合金めっき層)が得られる磁気ディ
スク基板用アルミニウム合金クラッド板を提案した(特
開平2-97639 号公報)。この磁気ディスク基板用アルミ
ニウム合金クラッド板は既に実用化され、高い評価を得
ている。
[0006] From the above, the present inventors have proposed a method for a magnetic disk substrate in which an underlying plating layer (electroless Ni-P alloy plating layer) with few defects can be obtained by controlling the type and addition amount of alloying elements. An aluminum alloy clad plate was proposed (Japanese Patent Laid-Open No. 2-97639). This aluminum alloy clad plate for a magnetic disk substrate has already been put to practical use and has been highly evaluated.

【0007】[0007]

【発明が解決しようとする課題】ところで、磁気ディス
クは年々高容量化の傾向にあり、近年では2GB/枚以
上の記憶容量が要求されている。このような高容量化の
方法には、磁気ヘッドの浮上高さ(グライドハイト)を
低くすることが考えられている。しかし、現用の基板で
は、前述のように、下地めっき後の表裏面にノジュール
やマイクロピットを生じることがある。このノジュール
やマイクロピットの影響はグライドハイトが低くなる程
大きくなるという問題がある。ノジュールやマイクロピ
ットの低減には、SiやFeなどの不純物元素の少ない高純
度地金を使用する方法が考えられるが、高純度地金 (9
9.99wt%純度) は通常のもの(99.9wt%純度) に較べて格
段に高価で、またその量も限られるという問題がある。
また強度も十分ではない。
The capacity of magnetic disks has been increasing year by year, and in recent years, a storage capacity of 2 GB / sheet or more has been required. To increase the capacity, it is considered to reduce the flying height (glide height) of the magnetic head. However, in the current substrate, as described above, nodules and micro pits may be formed on the front and back surfaces after the base plating. There is a problem that the influence of the nodules and micro pits increases as the glide height decreases. In order to reduce nodules and micropits, a method using a high-purity metal with few impurity elements such as Si and Fe can be considered.
(9.99wt% purity) is much more expensive than the usual one (99.9wt% purity), and its amount is limited.
Also, the strength is not enough.

【0008】このようなことから、本発明者等は、前記
マイクロピットとノジュールの低減を目的として、種々
調査検討を行った。その結果、金属間化合物の中では M
g2Si金属間化合物と Al-Fe系金属間化合物とが、他のも
のに較べてサイズが大きいこと、従って Al-Fe系金属間
化合物と Mg2Si金属間化合物の数を減らすか、その大き
さを小さくすることにより、マイクロピットやノジュー
ルを大幅に低減できること、また、この Al-Fe系金属間
化合物と Mg2Si金属間化合物は自然電位がマトリックス
よりも高い(貴な)ため、マトリックスの自然電位をよ
り高くして、両者の自然電位差を小さくすることにより
マイクロピットやノジュールを低減できることを見出
し、これを先に特許出願した(特願平8-258607号) 。
[0008] From the above, the present inventors have conducted various investigations and studies for the purpose of reducing the micropits and nodules. As a result, among intermetallic compounds, M
g 2 Si intermetallic compound and Al-Fe intermetallic compound are larger in size than others, thus reducing the number of Al-Fe intermetallic compound and Mg 2 Si intermetallic compound, By reducing the size, micropits and nodules can be significantly reduced. In addition, since the Al-Fe intermetallic compound and the Mg 2 Si intermetallic compound have a higher (noble) spontaneous potential than the matrix, It has been found that micropits and nodules can be reduced by increasing the natural potential of the sample and reducing the natural potential difference between the two, and applied for a patent earlier (Japanese Patent Application No. 8-258607).

【0009】さらに、磁気ディスク基板の耐食性も重要
な特性の一つであるが、従来のものは十分とは言えなか
った。本発明者等は種々の検討の結果、この耐食性を低
下させている原因として基板の耐食性と共にめっき皮膜
中の微小欠陥も大きく影響することを明らかにした。ま
た、前記ノジュールと同様にヘッドクラッシュを起こす
恐れがある表面欠陥として膨れが挙げられる。この膨れ
は、板材を打抜いた後やメディア(磁性体)をスパッタ
する前に基板用材料に打痕等をつけたような場合、この
部分に局部的に残留応力の高い領域が形成され、その後
の焼鈍工程で残留応力が開放される際に発生する。検討
の結果、この膨れは素材強度と相関があることが分かっ
た。素材強度に大きく寄与する合金元素としてMgが挙げ
られ、このMgの含有量に比例して膨れが生じ易くなる。
Mgを含む合金はMgが酸素や水素と結合し易い為水素ガス
量が多くなり易いこと等もその一因と考えられる。しか
し従来のディスク基板用アルミニウム合金材では強度、
切削性、研削性等の観点からMgを4wt% 程度含有した50
00系材料が使用されており、膨れに関しては大きな改善
は期待できなかった。またMgを含有しないか少量含有し
た強度の低いアルミニウム合金を皮材に用いたクラッド
板が提案されているが(特開昭63−319142号公報および
特開昭63−319143号公報)いずれも組成が不適当なため
切削性や研削性に劣るものである。
Further, the corrosion resistance of the magnetic disk substrate is one of the important characteristics, but the conventional one is not satisfactory. As a result of various studies, the present inventors have clarified that as a cause of reducing the corrosion resistance, not only the corrosion resistance of the substrate but also the minute defects in the plating film have a great effect. In addition, blisters are a surface defect that may cause a head crash similarly to the nodule. This swelling occurs when a dent or the like is made on the substrate material after punching the plate material or before sputtering the medium (magnetic material), and a region having a locally high residual stress is formed in this portion, It occurs when the residual stress is released in the subsequent annealing step. As a result of examination, it was found that this swelling had a correlation with the material strength. Mg is an alloy element that greatly contributes to the material strength, and swelling is likely to occur in proportion to the content of Mg.
It is also considered that the alloy containing Mg tends to increase the amount of hydrogen gas because Mg is easily bonded to oxygen and hydrogen. However, the strength,
50 containing about 4wt% Mg from the viewpoint of machinability, grindability, etc.
Since a 00-based material was used, no significant improvement could be expected with regard to blistering. A clad plate using a low-strength aluminum alloy containing no or a small amount of Mg as a skin material has also been proposed (JP-A-63-319142 and JP-A-63-319143). However, it is inferior in cutability and grindability due to inappropriateness.

【0010】本発明は前記課題に鑑み種々検討の結果、
下地めっき層(無電解Ni-P合金めっき層)の密着性や表
面平滑性は、前処理のジンケート皮膜を薄く均一に且つ
緻密に付着させること、素材の結晶粒を微細にするこ
と、微量添加元素によりマトリックスの金属間化合物に
対する電位差を制御することにより改善されること、ま
たこれらを組み合わせると相乗効果が得られることなど
を知見し、さらに研究を進めて本発明を完成させるに至
った。なお、下地めっき層の表面平滑性と表面品質が向
上すると耐食性が高まり、また前記電位差を制御する微
量添加元素は下地めっき層の微小欠陥も低減する。本発
明は、密着性、表面平滑性、表面品質、耐食性に優れ、
焼鈍工程で膨れを生じない下地めっき層を形成でき、エ
ッチング時に芯材と皮材間に段差が生じない、低コスト
の磁気ディスク基板用アルミニウム合金クラッド板およ
びその製造方法の提供を目的とする。
The present invention has been made in view of the above problems, and as a result of various studies,
The adhesion and surface smoothness of the base plating layer (electroless Ni-P alloy plating layer) can be adjusted by applying a thin and uniform pre-treatment zincate film, making the crystal grains of the material fine, and adding a small amount. They have found that improvement can be achieved by controlling the potential difference between the matrix and the intermetallic compound by an element, and that a synergistic effect can be obtained by combining them, and further research has led to the completion of the present invention. When the surface smoothness and the surface quality of the base plating layer are improved, the corrosion resistance is increased, and the trace addition element for controlling the potential difference also reduces the minute defect of the base plating layer. The present invention is excellent in adhesion, surface smoothness, surface quality, corrosion resistance,
It is an object of the present invention to provide a low-cost aluminum alloy clad plate for a magnetic disk substrate and a method for producing the same, which can form a base plating layer that does not cause swelling in an annealing step and does not generate a step between a core material and a skin material during etching.

【0011】[0011]

【課題を解決するための手段】請求項1記載の発明は、
アルミニウム合金芯材の片面または両面に皮材がクラッ
ドされた高容量磁気ディスク基板用アルミニウム合金ク
ラッド板において、前記皮材の組成がCu0.01〜0.15wt%
、Zn0.05〜2.0wt%を含有し、Mg2.0wt%以下、Mn0.01〜
0.5wt%、Cr0.01〜0.3wt%、Zr0.01〜0.12wt% 、Ni0.01〜
0.05wt% のうち1種または2種以上と、不純物元素とし
てSi 0.05wt%以下、Fe 0.05wt%以下、Ti0.02wt% 以下、
およびその他の不可避不純物元素を各々 0.02wt%以下含
有し、残部がAlからなることを特徴とするめっき性と耐
膨れ性に優れた高容量磁気ディスク基板用アルミニウム
合金クラッド板である。
According to the first aspect of the present invention,
In an aluminum alloy clad plate for a high-capacity magnetic disk substrate having a clad clad on one or both sides of an aluminum alloy core, the composition of the clad is Cu 0.01 to 0.15 wt%.
, Zn 0.05-2.0 wt%, Mg 2.0 wt% or less, Mn 0.01-
0.5wt%, Cr0.01 ~ 0.3wt%, Zr0.01 ~ 0.12wt%, Ni0.01 ~
One or two or more of 0.05 wt%, as an impurity element, Si 0.05 wt% or less, Fe 0.05 wt% or less, Ti0.02 wt% or less,
And an aluminum alloy clad plate for a high capacity magnetic disk substrate having excellent plating properties and swelling resistance, characterized by containing 0.02 wt% or less of each of the other unavoidable impurity elements and the balance being Al.

【0012】請求項2記載の発明は、前記芯材が、少な
くともZn3.0wt%未満含有し、残部がAlと不可避不純物元
素からなることを特徴とする請求項1記載のめっき性と
耐膨れ性に優れた高容量磁気ディスク基板用アルミニウ
ム合金クラッド板である。
According to a second aspect of the present invention, the core material contains at least less than 3.0 wt% of Zn, and the balance is composed of Al and an unavoidable impurity element. This is an aluminum alloy clad plate for a high capacity magnetic disk substrate with excellent performance.

【0013】請求項3記載の発明は、下記式で示される
芯材のF値 (Fb)と皮材のF値 (Fs)との比 [Fb/Fs]
が 0.6以上であることを特徴とする請求項1、2のいず
れかに記載のめっき性と耐膨れ性に優れた高容量磁気デ
ィスク基板用アルミニウム合金クラッド板である。 F=Si+Fe+2Cu +2Mn +3Mg +0.5Zn(式中Si,Fe,Cu,M
n,Mg,Zr は各々のwt%)。
According to a third aspect of the present invention, the ratio [Fb / Fs] of the F value (Fb) of the core material and the F value (Fs) of the skin material represented by the following formula:
3. The aluminum alloy clad plate for a high-capacity magnetic disk substrate according to any one of claims 1 and 2, wherein the aluminum alloy clad plate has excellent plating properties and swelling resistance. F = Si + Fe + 2Cu + 2Mn + 3Mg + 0.5Zn (where Si, Fe, Cu, M
n, Mg, and Zr are wt% of each).

【0014】請求項4記載の発明は、アルミニウム合金
芯材の片面または両面に皮材をクラッドした複合素材
に、熱間圧延、冷間圧延、最終焼鈍を施す高容量磁気デ
ィスク基板用アルミニウム合金クラッド板の製造方法に
おいて、熱間圧延後の冷却、冷間圧延途中の中間焼鈍後
の冷却、および最終焼鈍後の冷却を、それぞれ 240〜15
0 ℃間で30〜600 ℃/hr の速度で行い、冷間圧延を、 2
0%以上の圧延率で3回以上、全圧延率 60%以上の条件で
行うことを特徴とする請求項3記載の高容量磁気ディス
ク基板用アルミニウム合金クラッド板の製造方法であ
る。
According to a fourth aspect of the present invention, there is provided an aluminum alloy clad for a high-capacity magnetic disk substrate, which comprises subjecting a composite material in which a cladding material is clad on one or both sides of an aluminum alloy core material to hot rolling, cold rolling and final annealing. In the sheet manufacturing method, cooling after hot rolling, cooling after intermediate annealing during cold rolling, and cooling after final annealing are each 240 to 15 times.
0 ° C at a rate of 30-600 ° C / hr.
4. The method for producing an aluminum alloy clad plate for a high-capacity magnetic disk substrate according to claim 3, wherein the rolling is performed three times or more at a rolling rate of 0% or more and at a total rolling rate of 60% or more.

【0015】[0015]

【発明の実施の形態】先ず、皮材の合金元素について説
明する。Cuは適量添加するとジンケート処理時のAl溶解
量を減少させ、さらにジンケート皮膜を薄く均一に且つ
緻密に付着させ、その後の下地めっき層の表面平滑性を
高めるとともに、めっき層の微小欠陥を減少させ、重要
特性の耐食性が改善される。Cuの含有量を0.01〜0.15wt
% に規定した理由は、 0.01wt%未満ではその効果が十分
に得られず、 0.15wt%を超えると皮材自体の耐食性が著
しく低下するためである。皮材自体の耐食性が低下する
とジンケート処理皮膜が不均一に形成され下地めっき層
の密着性や表面平滑性が低下する。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS First, alloy elements of a skin material will be described. When an appropriate amount of Cu is added, it reduces the amount of Al dissolved during zincate treatment, furthermore, makes the zincate film thin and uniform and densely adheres, increases the surface smoothness of the underlying plating layer, and reduces fine defects in the plating layer. The important properties of corrosion resistance are improved. Cu content 0.01 ~ 0.15wt
The reason for specifying% is that if the content is less than 0.01% by weight, the effect is not sufficiently obtained, and if it exceeds 0.15% by weight, the corrosion resistance of the skin material itself is significantly reduced. When the corrosion resistance of the skin material itself is reduced, the zincate treatment film is formed unevenly, and the adhesion and the surface smoothness of the base plating layer are reduced.

【0016】Znはジンケート処理時のAl溶解量を減少さ
せ、その後の下地めっきにおいてめっき層表面を平滑に
する。その含有量を0.05〜2.0wt%に規定した理由は、
0.05wt%未満ではその効果が十分に得られず、2.0wt%を
超えると圧延加工性および耐食性が低下するためであ
る。耐食性が低下するとジンケート処理が不均一になさ
れ下地めっき層の密着性や表面平滑性が低下する。
Zn reduces the amount of Al dissolved during zincate treatment, and smoothes the surface of the plating layer in the subsequent base plating. The reason for defining the content to be 0.05 to 2.0 wt% is as follows:
If the content is less than 0.05 wt%, the effect cannot be sufficiently obtained, and if the content exceeds 2.0 wt%, the rolling workability and the corrosion resistance deteriorate. When the corrosion resistance decreases, the zincate treatment becomes uneven, and the adhesion and surface smoothness of the base plating layer decrease.

【0017】Mgは強度向上に寄与し、また切削性と研削
性を改善して表面品質を高める。しかしMg添加により強
度が上昇すると焼鈍工程で下地めっき層に膨れが生じ易
くなる。この膨れは、前述のように、板材を打抜いた後
やメディア( 磁性体) をスパッタする前に打痕をつけた
場合等に局部的に残留応力の高い領域が形成され、その
後の焼鈍工程で残留応力が開放される際に発生する。そ
のためMg含有量は2.0wt%以下に規定する。Mg含有量の低
減又はMgを添加しないことによる切削性や研削性の低下
は、Mn、Cr、Zr、Ni等の遷移元素を適量添加して補う。
Mn、Cr、Zr、Niは鋳造時や焼鈍時に微小な金属間化合物
を生成して再結晶組織を微細にする。これにより基板の
切削性や研削性が改善され、また下地めっき層の密着性
が向上する。前記Mn、Cr、Zr、Niの含有量をそれぞれ0.
01〜0.5wt%、0.01〜0.3wt%、0.01〜0.12wt% 、0.01〜0.
05wt% に規定した理由は、下限未満では各々その効果が
十分に得られず、上限を超えるといずれも粗大な金属間
化合物が生成し、この金属間化合物がエッチング時、ジ
ンケート処理時、切削加工や研削加工時に脱落してピッ
ト欠陥となるためである。これら元素の中でMn、Cr、Zr
は単独で添加しても十分その効果が得られるが、複数を
添加することによりさらに大きな効果が得られる。
[0017] Mg contributes to the improvement of the strength, and also improves the machinability and grindability to enhance the surface quality. However, if the strength is increased by the addition of Mg, the base plating layer is likely to swell in the annealing step. As described above, as described above, a region having a high residual stress is locally formed when a dent is made after punching a plate material or before sputtering a medium (magnetic material), and the subsequent annealing step Occurs when the residual stress is released. Therefore, the Mg content is specified to be 2.0 wt% or less. The decrease in the machinability and grindability due to the reduction in the Mg content or the absence of Mg is compensated for by adding an appropriate amount of transition elements such as Mn, Cr, Zr, and Ni.
Mn, Cr, Zr, and Ni generate minute intermetallic compounds during casting and annealing to make the recrystallized structure fine. Thereby, the cutting and grinding properties of the substrate are improved, and the adhesion of the base plating layer is improved. The content of each of Mn, Cr, Zr, and Ni is set to 0.
01-0.5wt%, 0.01-0.3wt%, 0.01-0.12wt%, 0.01-0.
The reason specified in 05wt% is that below the lower limit, each effect is not sufficiently obtained, and above the upper limit, coarse intermetallic compounds are formed in all cases, and this intermetallic compound is etched, zincate treated, and cut. This is because they may fall off during grinding and become pit defects. Among these elements, Mn, Cr, Zr
The effect can be sufficiently obtained by adding singly, however, a further effect can be obtained by adding a plurality of them.

【0018】Si、Fe、TiはAlマトリックス中には殆ど固
溶せず、金属間化合物として存在する。各々その含有量
の上限を規定したのは、その量が多いとAl−Fe系、 Mg2
Si等の粗大な金属間化合物が多数生成し、基板の切削加
工や研削加工時、ジンケート処理時等にピット欠陥とな
り易いためである。他の不可避的不純物元素(例えばN
i、B 等)は、各々0.02wt% 以下であれば本発明のクラ
ッド板の特性に影響しない。
Si, Fe and Ti hardly form a solid solution in the Al matrix and exist as intermetallic compounds. The upper limit of each content was specified because, if the amount is large, Al-Fe based, Mg 2
This is because a large number of coarse intermetallic compounds such as Si are generated and are likely to become pit defects at the time of cutting or grinding a substrate, at the time of zincate treatment, or the like. Other unavoidable impurity elements (eg, N
i, B, etc.) do not affect the characteristics of the clad plate of the present invention if each is 0.02 wt% or less.

【0019】次に、芯材の合金元素について説明する。
Znは芯材の電位を卑にする。Znの含有量は3.0wt%未満が
望ましい。Znが3.0wt%以上含有されると、皮材との電位
差が大きくなり過ぎ、下地めっき前に行うエッチング工
程で芯材が優先的に溶解し、皮材との境界に段差が生じ
たり、極端な場合は芯材と皮材とが剥離することがあ
る。
Next, the alloying elements of the core material will be described.
Zn makes the potential of the core material base. The Zn content is desirably less than 3.0 wt%. If Zn is contained in an amount of 3.0 wt% or more, the potential difference with the skin material becomes too large, and the core material is preferentially dissolved in the etching step performed before the base plating, and a step occurs at the boundary with the skin material, or extreme In such a case, the core material and the skin material may peel off.

【0020】本発明において、皮材と芯材をクラッドす
るには種々の方法が適用できる。例えば、通常ブレージ
ングシートの製造等に使用される圧延圧接法がある。こ
の圧延圧接法は、皮材と芯材の合わせ材に、熱間圧延、
冷間圧延、最終焼鈍を施して行われる。前記圧延圧接法
では、F=Si+Fe+ 2Cu+ 2Mn+ 3Mg+0.5Zn(式中Si,F
e,Cu,Mn,Mg,Zn は各々のwt%)の式で表される芯材のF値
(Fb)と皮材のF値 (Fs)の比[Fb/Fs]を 0.6以上に
すれば接合が良好になされる。比 [Fb/Fs]が 0.6を下
回った場合は熱間圧延時に芯材が優先的に圧延されて皮
材が十分に圧延されなくなり、接合強度が不足すること
がある。前記比 [Fb/Fs]が 0.6以上の場合でもラミネ
ーションを起こすことがあるので、前記比は 1.0以上が
特に望ましい。
In the present invention, various methods can be applied to clad the skin material and the core material. For example, there is a rolling pressure welding method usually used for manufacturing a brazing sheet. This rolling pressure welding method uses hot rolling,
Cold rolling and final annealing are performed. In the rolling pressure welding method, F = Si + Fe + 2Cu + 2Mn + 3Mg + 0.5Zn (where Si, F
e, Cu, Mn, Mg, Zn are each wt%) F value of core material expressed by the formula
If the ratio [Fb / Fs] of (Fb) to the F value (Fs) of the skin material is 0.6 or more, good joining can be achieved. When the ratio [Fb / Fs] is less than 0.6, the core material is preferentially rolled during hot rolling, so that the skin material is not sufficiently rolled and the bonding strength may be insufficient. Since lamination may occur even when the ratio [Fb / Fs] is 0.6 or more, the ratio is particularly preferably 1.0 or more.

【0021】本発明のアルミニウム合金クラッド板は、
芯材に皮材をクラッドしたものなので、地金純度を上げ
てマイクロピットやノジュール等の欠陥を低減させる場
合、高純度地金は、表面欠陥が問題となる皮材にのみ用
いれば良く、芯材には前記組成を満足する範囲で安価な
低純度地金を用いることができる。従って、製造コスト
を総合的に低減できる。
The aluminum alloy clad plate of the present invention comprises:
Since the core material is clad with a skin material, when increasing the purity of the metal to reduce defects such as micropits and nodules, high-purity metal only needs to be used for the skin material where surface defects are a problem. As the material, an inexpensive low-purity metal can be used as long as the above composition is satisfied. Therefore, the manufacturing cost can be reduced comprehensively.

【0022】前記圧延圧接法での皮材の片面当たりのク
ラッド率{ [皮材の厚さ/(芯材の厚さ+皮材の厚さ)]×
100%}は 30%以下であることが望ましい。これはクラッ
ド率が 30%を超えると、皮材と芯材の界面に圧接時に発
生する剪断力が弱まり、十分な接合強度が得られなくな
るためである。
Clad ratio per side of skin material in the above-mentioned rolling pressure welding method 圧 [Thickness of skin material / (thickness of core material + thickness of skin material)] ×
100%} is preferably 30% or less. This is because, when the cladding ratio exceeds 30%, the shearing force generated at the time of pressing against the interface between the skin material and the core material is weakened, and sufficient bonding strength cannot be obtained.

【0023】本発明では、前記熱間圧延後の冷却、冷間
加工途中で行う中間焼鈍後の冷却、最終焼鈍後の冷却を
それぞれ 240〜150 ℃間で30〜600 ℃/hr の速度で行う
ことが望ましい。これは 240℃を超える温度では Mg2Si
は析出せず、 150℃未満でも問題ない。冷却速度が30℃
/hr 未満では Mg2Siの析出量が多くなり、 600℃/hrを
超えると熱ひずみが発生して基板の平坦度が低下するた
めである。ここで、皮材と芯材を接合するための熱間圧
延温度は、圧延が可能な温度に加熱して行えば良く、特
に限定しない。しかし圧延する素材の結晶粒径の粗大化
および溶融等の問題を考慮すると 350〜 550℃の範囲が
望ましい。
In the present invention, the cooling after the hot rolling, the cooling after the intermediate annealing performed during the cold working, and the cooling after the final annealing are performed at a speed of 30 to 600 ° C./hr at 240 to 150 ° C., respectively. It is desirable. This is because Mg 2 Si
Does not precipitate, and there is no problem even at temperatures lower than 150 ° C. Cooling rate is 30 ℃
If it is less than / hr, the amount of Mg 2 Si deposited increases, and if it exceeds 600 ° C / hr, thermal strain occurs and the flatness of the substrate decreases. Here, the hot rolling temperature for joining the skin material and the core material may be heated to a temperature at which rolling can be performed, and is not particularly limited. However, considering the problem of coarsening and melting of the crystal grain size of the material to be rolled, the range of 350 to 550 ° C is desirable.

【0024】本発明では、冷間圧延での1回の圧延率を
20%以上とし、この冷間圧延を3回以上施し、且つ全圧
延率を 60%以上とするのが望ましい。この条件であれば
表面欠陥、特にノジュールの原因となる Al-Fe系金属間
化合物が十分に粉砕される。
In the present invention, the rolling reduction in one cold rolling is
Preferably, the cold rolling is performed three times or more, and the total rolling ratio is 60% or more. Under these conditions, Al-Fe intermetallic compounds that cause surface defects, particularly nodules, are sufficiently pulverized.

【0025】本発明のクラッド板を圧延圧接法で製造す
るにあたり、皮材は半連続鋳造法で得た鋳塊を均質化処
理したのち、熱間圧延して所定寸法の板材とする。この
時の均質化処理や熱間圧延の温度条件は、皮材の組成に
応じて最適に選定する。但し、圧延温度が高すぎると鋳
塊の結晶粒が粗大化したり、極端な場合は溶融したりす
る。圧延温度が低すぎると変形抵抗が大きくなり圧延で
きなくなる。これらを加味して均質化処理温度または熱
間圧延の開始温度は 350〜550 ℃が望ましい。熱間圧延
後の板材を硝酸や苛性ソーダ等で素洗いすると、熱間圧
延で生成した酸化層が除去され、後の芯材との圧接が良
好になされる。
In producing the clad sheet of the present invention by the rolling pressure welding method, the skin material is obtained by homogenizing an ingot obtained by a semi-continuous casting method and then hot rolling to a sheet material having a predetermined size. The temperature conditions for the homogenization and hot rolling at this time are optimally selected according to the composition of the skin material. However, if the rolling temperature is too high, the crystal grains of the ingot become coarse, and in extreme cases, they melt. If the rolling temperature is too low, the deformation resistance increases and rolling cannot be performed. Taking these factors into consideration, the homogenization treatment temperature or the hot rolling start temperature is desirably 350 to 550 ° C. When the sheet material after hot rolling is washed with nitric acid, caustic soda, or the like, an oxide layer generated by hot rolling is removed, and good pressure contact with the core material is performed.

【0026】芯材は半連続鋳造法により鋳塊を作製し、
この鋳塊に皮材を被せる。この芯材用鋳塊は均質化処理
後、皮材を被せる側を面削しておくと内部組織が均一に
なるとともに、表面の酸化層が除去され圧接が良好にな
される。均質化処理温度は皮材の場合と同じ 350〜550
℃が望ましい。熱間圧延で接合されたクラッド板は、冷
間圧延と焼鈍により所定板厚に仕上げられる。
The core material is made into an ingot by a semi-continuous casting method,
The ingot is covered with a skin material. After the homogenization treatment, the side of the ingot for core material which is covered with the skin material is chamfered, so that the internal structure becomes uniform, and the oxidized layer on the surface is removed, so that good pressure welding is achieved. Homogenization treatment temperature is the same as that for leather 350 to 550
C is desirable. The clad plate joined by hot rolling is finished to a predetermined thickness by cold rolling and annealing.

【0027】本発明において、皮材に含まれる金属間化
合物は、径を10μm以下にするのが望ましい。それは、
10μm以下の金属間化合物が脱落して生じたピットは、
無電解めっきやめっき後の研削加工でかなり小さくなる
が、10μmを超える金属間化合物が脱落して生じたピッ
トは最終的に欠陥として残る確率が高いためである。
In the present invention, the diameter of the intermetallic compound contained in the skin material is desirably 10 μm or less. that is,
The pits formed by dropping the intermetallic compound of 10 μm or less are
The reason for this is that although the size of the pit is considerably reduced by electroless plating or grinding after plating, pits formed by dropping an intermetallic compound exceeding 10 μm are likely to ultimately remain as defects.

【0028】[0028]

【実施例】以下に本発明を実施例により詳細に説明す
る。 (実施例1)表1に示す組成の皮材および芯材を用い
て、クラッド率 10%の片面合わせ材を作製し、この合わ
せ材を 500℃に再熱後、厚さ2.30mmに熱間圧延し、次い
で厚さ0.82mmに冷間圧延した。次にこの冷間圧延材を所
定の寸法に切断し、その後素洗いしてクラッド板とし
た。
The present invention will be described below in detail with reference to examples. (Example 1) Using a skin material and a core material having the compositions shown in Table 1, a single-sided mating material having a cladding ratio of 10% was produced, and this mating material was reheated to 500 ° C and then hot-rolled to a thickness of 2.30 mm. Rolled and then cold rolled to a thickness of 0.82 mm. Next, the cold-rolled material was cut into a predetermined size, and then unwashed to obtain a clad plate.

【0029】前記皮材と芯材の製造方法、合わせ材の熱
間圧延、冷間圧延、素洗い条件の詳細を下記に示す。 皮材の製造方法:厚さ30mmの鋳塊を両面 5mmづつ切削
して厚さ20mmにし、これを均質化処理(450℃×2hr + 5
20℃×2hr)した後、熱間圧延(圧延開始温度 470℃、終
了温度 230℃、冷却速度50℃/hr)して厚さ 5mmの板材と
し、この板材を所定の寸法に切断して、素洗い〔湯洗→
3%硝酸デスマット(1分) →5%苛性ソーダ(5分) →3%硝酸
デスマット(1分) →湯洗〕する。 芯材の製造方法:厚さ60mmの鋳塊を均質化処理(450℃
×2hr + 520℃×2hr)後、両面10mmづつ切削して厚さ40
mmにする。前記皮材または芯材の鋳造は、所定組成に調
整された合金溶湯を、脱ガス、沈静処理後フィルターで
ろ過したのち行った。 合わせ材の熱間圧延:再熱温度 500℃、圧延開始温度
470℃、コイル巻上げ温度 260℃、冷却速度50℃/hr 、
熱間圧延後板厚 2.30mm。 合わせ材の冷間圧延:1パス目 1.60mm(圧下率30%)、
2 パス目1.12mm(圧下率30%)、3パス目0.82mm( 圧下率
27%)、トータル圧下率64% 。 合わせ材の素洗い:皮材の素洗いと同じ。
The details of the method for producing the skin material and the core material and the conditions for hot rolling, cold rolling and unwashing of the combined material are shown below. Production method of skin material: 30mm thick ingot is cut into 5mm by 5mm on both sides to 20mm thickness and homogenized (450 ℃ × 2hr + 5
After performing 20 ° C x 2 hours), hot rolling (rolling start temperature 470 ° C, end temperature 230 ° C, cooling rate 50 ° C / hr) to make a 5mm thick plate, cut this plate into predetermined dimensions, Unwashed [hot water →
3% nitric acid desmut (1 minute) → 5% caustic soda (5 minutes) → 3% nitric acid desmut (1 minute) → Hot water]. Manufacturing method of core material: Homogenize 60mm thick ingot (450 ℃)
× 2hr + 520 ℃ × 2hr), then cut both sides 10mm each, thickness 40
mm. The casting of the skin material or the core material was performed after filtering the molten alloy adjusted to a predetermined composition with a filter after degassing and calming treatment. Hot rolling of laminated material: reheating temperature 500 ℃, rolling start temperature
470 ℃, coil winding temperature 260 ℃, cooling rate 50 ℃ / hr,
2.30mm thickness after hot rolling. Cold rolling of laminated material: 1.60 mm in the first pass (30% reduction),
1.12mm at second pass (30% rolling reduction), 0.82mm at third pass (rolling reduction)
27%), total reduction 64%. Unwashing of laminated material: Same as unwashing of skin material.

【0030】次に、前記クラッド板から外径96mm、内径
24mmのドーナツ板を打抜き、これを340℃で4時間焼鈍
した後、50℃/hr の冷却速度で冷却し、さらにグライン
ディング加工を行った。その後、下記手順により表面処
理と無電解めっきを行った。即ち、アセトンで脱脂→5%
NaOH水溶液(40℃)に30秒間浸漬してエッチング→30%H
NO3水溶液(室温)で30秒間デスマット→アーブ302ZN
(商品名、奥野製薬)を用いてダブルジンケート処理→ナ
イクラッド719(商品名、奥野製薬) を用いてNi-Pを17μ
m厚さに無電解めっき、仕上げ研磨:羽布研磨、研磨量
4μm。
Next, an outer diameter of 96 mm and an inner diameter of 96 mm
A 24 mm donut plate was punched out, annealed at 340 ° C. for 4 hours, cooled at a cooling rate of 50 ° C./hr, and further subjected to grinding. Thereafter, surface treatment and electroless plating were performed according to the following procedure. That is, degreasing with acetone → 5%
Etching by immersing in NaOH aqueous solution (40 ° C) for 30 seconds → 30% H
Desmut with NO 3 aqueous solution (room temperature) for 30 seconds → ARB 302ZN
(Trade name, Okuno Pharmaceutical Co., Ltd.) Double zincate treatment → Ni-P 17μ using Niclad 719 (trade name, Okuno Pharmaceutical Co., Ltd.)
Electroless plating to a thickness of m, finish polishing: lapping, polishing amount 4 μm.

【0031】前記仕上げ研磨後のドーナツ板について
(イ)端面の性状、 (ロ)めっき皮膜の密着性、 (ハ)表面平
滑性、 (ニ)表面欠陥、 (ホ)耐食性、 (ヘ)耐膨れ性を調査
した。 (イ)端面の性状は、端面に段差が生じたものを×、段差
が無く健全な端面のものを○として評価した。 (ロ)めっき皮膜の密着性は、 50mm2のサンプルを切り出
して 400℃の温度に30分間加熱し、加熱後直ちに水冷し
て素地とNi-P合金めっき層の熱膨脹差による剥離または
膨れを調べた。剥離や膨れの無いものを○、僅かに生じ
たものを△、多数生じたものを×と評価した。 (ハ)表面平滑性は、下地めっき層の研磨後の表面粗度を
万能表面粗さ計SE−3H(小坂研究所製)により測定
し、JIS-B-0601に規定されている中心線粗さRa(μ
m)を4点測定し、その平均値で表した。 (ニ)表面欠陥は、ピットまたはノジュール等の欠陥の大
きさが最大径で3μm以上のものを×、3μm未満のも
のを○と評価した。 (ホ)耐食性は、耐塩酸性テスト(1規定の塩酸溶液中に
室温にて24時間浸漬)により評価した。めっき皮膜に剥
離や膨れが生じなかったものを○、僅かに生じたものを
△、多数生じたものを×と評価した。 (ヘ)耐膨れ性は、グラインディング後の基板の任意の箇
所にビッカース硬度計で5Kgfの荷重を掛けて圧痕をつ
け、その後 270℃で1時間焼鈍し、圧痕をつけた部分の
膨れの高さを前記万能表面粗さ測定した。膨れの高さが
0.5μm以下を合格レベルと判定した。結果を表1〜3
に示す。表にはクラッド可否も併記した。
Donut plate after finish polishing
(B) The properties of the end face, (b) the adhesion of the plating film, (c) the surface smoothness, (d) the surface defects, (e) the corrosion resistance, and (f) the swelling resistance were investigated. (A) The properties of the end face were evaluated as x when a step was formed on the end face and as ○ when the end face was healthy without any step. (B) To determine the adhesion of the plating film, cut out a 50 mm 2 sample, heat it to a temperature of 400 ° C for 30 minutes, and immediately cool it with water, and then examine the peeling or swelling of the substrate and Ni-P alloy plating layer due to the difference in thermal expansion. Was. A sample without peeling or swelling was evaluated as ○, a sample slightly generated was evaluated as △, and a sample generated many times was evaluated as ×. (C) The surface smoothness was measured by measuring the surface roughness of the ground plating layer after polishing with a universal surface roughness meter SE-3H (manufactured by Kosaka Laboratories) and measuring the center line roughness specified in JIS-B-0601. Sa Ra (μ
m) was measured at four points and represented by the average value. (D) Surface defects were evaluated as x when the maximum size of defects such as pits or nodules was 3 µm or more, and evaluated as o when the size was less than 3 µm. (E) The corrosion resistance was evaluated by a hydrochloric acid resistance test (immersion in a 1N hydrochloric acid solution at room temperature for 24 hours). When the peeling or swelling did not occur in the plating film, it was evaluated as ○, when it slightly occurred, as Δ, and when many occurred, it was evaluated as ×. (F) The swelling resistance is determined by applying a load of 5 Kgf with a Vickers hardness tester to any part of the substrate after grinding to form an indentation, and then annealing at 270 ° C. for 1 hour, thereby increasing the degree of swelling at the indented part. The universal surface roughness was measured. The height of the blister is
0.5 μm or less was judged as a pass level. The results are shown in Tables 1 to 3.
Shown in The table also shows whether cladding is possible.

【0032】[0032]

【表1】 [Table 1]

【0033】[0033]

【表2】 [Table 2]

【0034】[0034]

【表3】 [Table 3]

【0035】表1〜3より明らかなように、本発明例の
No.1〜12は、端面に段差がなく、下地めっき層の密着性
に優れ、表面が平滑であり、表面欠陥がなく、耐食性に
優れ、膨れが生じることもなかった。これに対し、比較
例のNo.13 は皮材にSiが、 No.14は皮材にFeが、No.24
は皮材にTiがそれぞれ多量に含有されているため、いず
れも粗大な金属間化合物が多数生成し、また表面欠陥も
生じた。No.15は皮材にMg,Mn,Cr,Zr,Niのいずれもが含
有されていないため切削性や研削性が低下し、それに伴
い耐食性が低下し、また下地めっき層の密着性も低下し
た。表面も粗面となった。No.16は皮材にMn,Ni が、No.
23 は皮材にZrがそれぞれ多く含有されているため粗大
な金属間化合物が形成され、表面品質、耐食性、密着性
が低下した。No.17は皮材にCuが含有されていないため
ジンケート処理が不均一になされ、密着性に劣った。N
o.18は皮材にCuが多量に含有されているため皮材自体の
耐食性が低下し、表面が著しく粗面となり、密着性も低
下した。また芯材にZnが多量に含有されているためエッ
チング工程で芯材が多量に溶解して端面に断差が生じ
た。No.19は皮材にMgが多く含有されているため焼鈍工
程で大きな膨れが生じた。No.20は皮材にCrとNiが多量
に含有されているため粗大な金属間化合物が生成して表
面に欠陥が生じた。また密着性が低下し、表面が粗面と
なった。No.21は皮材のZn含有量が少ないため、またNo.
22 は多いため、いずれもジンケート処理が不均一にな
され、密着性が低下した。No.25は比 [Fb/Fs]が 0.6
未満のため芯材と皮材の接合が不十分であった。
As is clear from Tables 1 to 3, the present invention
Nos. 1 to 12 had no step on the end face, excellent adhesion of the underlying plating layer, a smooth surface, no surface defects, excellent corrosion resistance, and no swelling. On the other hand, No. 13 of the comparative example had Si as the skin material, No. 14 had Fe as the skin material, and No. 24
Since the skin material contained a large amount of Ti in each case, many coarse intermetallic compounds were generated, and surface defects also occurred. In No. 15, the skin material does not contain any of Mg, Mn, Cr, Zr, and Ni, so the machinability and grindability are reduced, the corrosion resistance is reduced, and the adhesion of the base plating layer is also reduced. did. The surface became rough. No. 16 has Mn and Ni as the skin material, but No.
In No. 23, a large amount of Zr was contained in the skin material, so that coarse intermetallic compounds were formed, and the surface quality, corrosion resistance, and adhesion were reduced. In No. 17, since the skin material did not contain Cu, the zincate treatment was uneven and the adhesion was poor. N
In o.18, since the skin material contained a large amount of Cu, the corrosion resistance of the skin material itself was reduced, the surface became extremely rough, and the adhesion was also reduced. In addition, since a large amount of Zn was contained in the core material, a large amount of the core material was dissolved in the etching step, resulting in a difference in the end face. In No. 19, a large amount of Mg was contained in the skin material, and large swelling occurred in the annealing step. In No.20, a large amount of Cr and Ni were contained in the skin material, so that coarse intermetallic compounds were formed and defects occurred on the surface. In addition, the adhesion was reduced and the surface became rough. No. 21 has a low Zn content in the skin material.
Since there were many of them, the zincate treatment was uneven and the adhesion was lowered. No.25 has a ratio [Fb / Fs] of 0.6
Therefore, the bonding between the core material and the skin material was insufficient.

【0036】(実施例2)表1に示す本発明合金の合金
No.1と比較材の合金No.15 の皮材及び芯材を用いて合わ
せ材を作製し、この合わせ材を 500℃に再熱後、圧延開
始温度 470℃で種々の厚さに熱間圧延し、次いで0.82mm
に冷間圧延した。次にこの冷間圧延材を所定の寸法に切
断して、素洗いしてクラッド板を製造した。熱間圧延で
のコイル巻上げ温度、冷却速度、板厚、冷間圧延での圧
延率、中間焼鈍条件は種々に変化させた。前記素洗いは
実施例1と同じ方法により行った。また芯材と皮材の製
造も実施例1と同じ方法により行った。次いで、前記ク
ラッド板から外径96mm、内径24mmのドーナツ板を打抜
き、これを 340℃で4時間焼鈍した後、20℃/hr の冷却
速度で冷却し、更にグラインディング加工を行った。そ
の後、実施例1と同じ手順により表面処理と無電解めっ
きを行ったものについて、下記の品質評価を行った。 グラインディング加工したドーナツ板の評価 Mg2Si:走査式電子顕微鏡(SEM)にて3mm2の視野で
の個数を計測した。 5μmを超えるものが20個/mm2以下
が合格レベルである。 Al-Fe系金属間化合物:SEMにて3mm2の視野での個数
を計測した。 5μmを超えるものが10個/mm2以下が合格
レベルである。
Example 2 Alloys of the alloys of the present invention shown in Table 1
A laminated material was prepared using the skin material and core material of No. 1 and the alloy No. 15 of the comparative material, and after reheating this laminated material to 500 ° C, hot rolling was started at 470 ° C to various thicknesses. Rolling, then 0.82mm
Was cold rolled. Next, the cold-rolled material was cut into a predetermined size and washed with a light to produce a clad plate. The coil winding temperature, cooling rate, plate thickness, cold rolling reduction ratio, and intermediate annealing conditions in hot rolling were variously changed. The unwashing was performed in the same manner as in Example 1. The production of the core material and the skin material was performed in the same manner as in Example 1. Next, a donut plate having an outer diameter of 96 mm and an inner diameter of 24 mm was punched from the clad plate, annealed at 340 ° C for 4 hours, cooled at a cooling rate of 20 ° C / hr, and further subjected to grinding. After that, the following quality evaluation was performed on those subjected to surface treatment and electroless plating according to the same procedure as in Example 1. Evaluation of the donut plate after the grinding process Mg 2 Si: The number in a field of view of 3 mm 2 was measured with a scanning electron microscope (SEM). Those exceeding 5 μm are 20 / mm 2 or less as acceptable levels. Al-Fe-based intermetallic compound: The number in a visual field of 3 mm 2 was measured by SEM. Those exceeding 5 μm are 10 / mm 2 or less as acceptable levels.

【0037】下地めっき後のドーナツ板の評価 マイクロピット:光学顕微鏡にて3mm2の視野での個数を
計測した。 5個未満の場合A、 5個以上15個未満の場合
B、15個以上25個未満の場合C、25個以上の場合Dと表
示した。 ノジュール:光学顕微鏡にて3mm2の視野での個数を計測
した。10μmを超えるものが 5個未満の場合A、 5個以
上15個未満の場合B、15個以上25個未満の場合C、25個
以上の場合Dと表示した。
Evaluation of donut plate after base plating Micro pits: The number in a visual field of 3 mm 2 was measured with an optical microscope. When the number is less than 5, A is indicated, when 5 or more is less than 15, B is indicated, when 15 or more is less than 25, C is indicated, and when 25 or more is indicated, D. Nodule: The number in a visual field of 3 mm 2 was counted with an optical microscope. The case where the number exceeding 10 μm is less than 5 is indicated as A, the case where the number is 5 or more and less than 15 is B, the case where the number is 15 or more and less than 25, and the case where the number is 25 or more.

【0038】エッチング後のドーナツ板の評価 端面での段差の有無を調べた。段差が無く健全な端面の
場合は○、段差が生じた場合は×と表示した。最後にマ
イクロピット、ノジュール、端面性状を総合的に見てA
〜Eの5段階評価を行った。A、B、Cは合格レベル、
×は不合格、製造不可は━で表示した。結果を、製造条
件を併記して表4に示す。
Evaluation of Donut Plate After Etching The presence or absence of a step at the end face was examined. In the case of a healthy end face without a step, it was indicated by ○, and in the case of a step, × was indicated. Finally, the micro pits, nodules, and the properties of the end face are comprehensively evaluated.
To E were evaluated in five steps. A, B, C are acceptable levels,
X indicates rejection, and production failure indicates ━. The results are shown in Table 4 together with the production conditions.

【0039】[0039]

【表4】 [Table 4]

【0040】表4より明らかなように、本発明例品(試
料No.26 〜30)はいずれもマイクロピットやノジュール
が少なく、端面の性状が良好で、総合的に見て全て合格
レベルにあった。なお、試料No.34 は熱間圧延後と最終
焼鈍後の冷却速度が遅くまた合計圧延率が低かったた
め、他より大サイズのマイクロピットやノジュールが増
加した。 他方、試料 No.31〜34は合金組成が本発明の
範囲を外れているため、製造条件によっては Mg2Siや A
l-Fe系などの5μm以上の化合物の少ないものもある
が、いずれも大サイズのマイクロピットまたはノジュー
ルが多数発生して、総合的に見て全てが不合格となっ
た。
As is clear from Table 4, all of the products of the present invention (samples Nos. 26 to 30) had few micropits and nodules, and had good end face properties. Was. In sample No. 34, the cooling rates after hot rolling and after final annealing were slow and the total rolling ratio was low, so that micropits and nodules having a larger size than the others increased. On the other hand, since the sample No.31~34 is the alloy composition is out of scope of the present invention, depending on production conditions Mg 2 Si and A
Some of the compounds, such as l-Fe-based compounds, had a small content of 5 μm or more, but all of them generated many large-sized micropits or nodules, and all were rejected as a whole.

【0041】[0041]

【発明の効果】以上に述べたように、本発明によれば、
密着性、表面平滑性、表面品質、耐食性に優れ、焼鈍工
程で膨れを生じない下地めっき層を形成でき、エッチン
グ時に芯材と皮材間に段差が生じない、低コストの磁気
ディスク基板用アルミニウム合金クラッド板が得られ、
メディアが良好に被覆される。また芯材に低純度Alを使
用でき安価である。さらに圧延圧接法により容易に製造
できる。依って工業上顕著な効果を奏する。
As described above, according to the present invention,
Low cost aluminum for magnetic disk substrates with excellent adhesion, surface smoothness, surface quality, and corrosion resistance, capable of forming a base plating layer that does not cause swelling during the annealing process, does not generate a step between the core material and the skin material during etching An alloy clad plate is obtained,
The media is well coated. In addition, low-purity Al can be used for the core material, and it is inexpensive. Furthermore, it can be easily manufactured by the rolling pressure welding method. Therefore, there is an industrially significant effect.

─────────────────────────────────────────────────────
────────────────────────────────────────────────── ───

【手続補正書】[Procedure amendment]

【提出日】平成9年4月8日[Submission date] April 8, 1997

【手続補正1】[Procedure amendment 1]

【補正対象書類名】明細書[Document name to be amended] Statement

【補正対象項目名】0032[Correction target item name] 0032

【補正方法】変更[Correction method] Change

【補正内容】[Correction contents]

【0032】[0032]

【表1】 [Table 1]

【手続補正2】[Procedure amendment 2]

【補正対象書類名】明細書[Document name to be amended] Statement

【補正対象項目名】0033[Correction target item name] 0033

【補正方法】変更[Correction method] Change

【補正内容】[Correction contents]

【0033】[0033]

【表2】 [Table 2]

フロントページの続き (51)Int.Cl.6 識別記号 FI G11B 5/84 G11B 5/84 Z // C22F 1/00 627 C22F 1/00 627 661 661D 685 685Z 686 686A 692 692A 694 694A G11B 5/62 G11B 5/62 Continuation of the front page (51) Int.Cl. 6 identification code FI G11B 5/84 G11B 5/84 Z // C22F 1/00 627 C22F 1/00 627 661 661D 685 685Z 686 686A 692 692A 694 694A G11B 5/62 G11B 5/62

Claims (4)

【特許請求の範囲】[Claims] 【請求項1】 アルミニウム合金芯材の片面または両面
に皮材がクラッドされた高容量磁気ディスク基板用アル
ミニウム合金クラッド板において、前記皮材の組成がCu
0.01〜0.15wt% 、Zn0.05〜2.0wt%を含有し、Mg2.0wt%以
下、Mn0.01〜0.5wt%、Cr0.01〜0.3wt%、Zr0.01〜0.12wt
% 、Ni0.01〜0.05wt% のうち1種または2種以上と、不
純物元素としてSi 0.05wt%以下、Fe 0.05wt%以下、Ti0.
02wt%以下、およびその他の不可避不純物元素を各々 0.
02wt%以下含有し、残部がAlからなることを特徴とする
めっき性と耐膨れ性に優れた高容量磁気ディスク基板用
アルミニウム合金クラッド板。
An aluminum alloy clad plate for a high-capacity magnetic disk substrate in which a skin material is clad on one or both sides of an aluminum alloy core material, wherein the skin material has a composition of Cu
0.01 ~ 0.15wt%, Zn0.05 ~ 2.0wt%, Mg2.0wt% or less, Mn0.01 ~ 0.5wt%, Cr0.01 ~ 0.3wt%, Zr0.01 ~ 0.12wt
%, Ni 0.01 to 0.05 wt%, one or more of Ni, and 0.05 wt% or less of Si, 0.05 wt% or less of Fe, Ti0.
02 wt% or less and other unavoidable impurity elements
Aluminum alloy clad plate for high-capacity magnetic disk substrates with excellent plating properties and swelling resistance, containing up to 02 wt% and the balance being Al.
【請求項2】 前記芯材が、少なくともZn3.0wt%未満含
有し、残部がAlと不可避不純物元素からなることを特徴
とする請求項1記載のめっき性と耐膨れ性に優れた高容
量磁気ディスク基板用アルミニウム合金クラッド板。
2. The high-capacity magnetic material according to claim 1, wherein said core material contains at least less than 3.0 wt% of Zn, and the balance consists of Al and unavoidable impurity elements. Aluminum alloy clad plate for disk substrate.
【請求項3】 下記式で示される芯材のF値 (Fb)と皮
材のF値 (Fs)との比 [Fb/Fs]が 0.6以上であること
を特徴とする請求項1、2のいずれかに記載のめっき性
と耐膨れ性に優れた高容量磁気ディスク基板用アルミニ
ウム合金クラッド板。 F=Si+Fe+2Cu +2Mn +3Mg +0.5Zn(式中Si,Fe,Cu,M
n,Mg,Zr は各々のwt%)。
3. The ratio [Fb / Fs] of the F value (Fb) of the core material and the F value (Fs) of the skin material represented by the following formula, which is 0.6 or more: An aluminum alloy clad plate for a high-capacity magnetic disk substrate excellent in plating properties and swelling resistance according to any one of the above. F = Si + Fe + 2Cu + 2Mn + 3Mg + 0.5Zn (where Si, Fe, Cu, M
n, Mg, and Zr are wt% of each).
【請求項4】 アルミニウム合金芯材の片面または両面
に皮材をクラッドした複合素材に、熱間圧延、冷間圧
延、最終焼鈍を施す高容量磁気ディスク基板用アルミニ
ウム合金クラッド板の製造方法において、熱間圧延後の
冷却、冷間圧延途中の中間焼鈍後の冷却、および最終焼
鈍後の冷却を、それぞれ 240〜150 ℃間で30〜600 ℃/h
r の速度で行い、冷間圧延を、 20%以上の圧延率で3回
以上、全圧延率 60%以上の条件で行うことを特徴とする
請求項3記載の高容量磁気ディスク基板用アルミニウム
合金クラッド板の製造方法。
4. A method for producing an aluminum alloy clad plate for a high-capacity magnetic disk substrate, comprising subjecting a composite material in which a cladding material is clad on one or both surfaces of an aluminum alloy core material to hot rolling, cold rolling and final annealing. Cooling after hot rolling, cooling after intermediate annealing during cold rolling, and cooling after final annealing are performed at 240 to 150 ° C and 30 to 600 ° C / h, respectively.
4. The aluminum alloy for a high-capacity magnetic disk substrate according to claim 3, wherein the cold rolling is performed at a rolling rate of 20% or more at least three times, and the total rolling rate is 60% or more. Manufacturing method of clad plate.
JP27796196A 1996-10-21 1996-10-21 Aluminum alloy clad plate for high capacity magnetic disk substrate excellent in plating property and blistering resistance and its production Pending JPH10121173A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP27796196A JPH10121173A (en) 1996-10-21 1996-10-21 Aluminum alloy clad plate for high capacity magnetic disk substrate excellent in plating property and blistering resistance and its production

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP27796196A JPH10121173A (en) 1996-10-21 1996-10-21 Aluminum alloy clad plate for high capacity magnetic disk substrate excellent in plating property and blistering resistance and its production

Publications (1)

Publication Number Publication Date
JPH10121173A true JPH10121173A (en) 1998-05-12

Family

ID=17590694

Family Applications (1)

Application Number Title Priority Date Filing Date
JP27796196A Pending JPH10121173A (en) 1996-10-21 1996-10-21 Aluminum alloy clad plate for high capacity magnetic disk substrate excellent in plating property and blistering resistance and its production

Country Status (1)

Country Link
JP (1) JPH10121173A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1762636A1 (en) * 2005-09-07 2007-03-14 Alcan Technology &amp; Management Ltd. Plating process of a profil made of an aluminium alloy
WO2008107000A1 (en) * 2007-03-08 2008-09-12 Alcan Technology & Management Ltd. Method for plating an aluminum alloy profile
CN110373576A (en) * 2019-08-07 2019-10-25 安庆市泽烨新材料技术推广服务有限公司 A kind of cable Al-alloy and preparation method thereof
JP2020107383A (en) * 2018-12-28 2020-07-09 昭和電工株式会社 Substrate for magnetic recording medium, magnetic recording medium, hard disk drive
JP2020107382A (en) * 2018-12-28 2020-07-09 昭和電工株式会社 Substrate for magnetic recording medium, magnetic recording medium, hard disk drive

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1762636A1 (en) * 2005-09-07 2007-03-14 Alcan Technology &amp; Management Ltd. Plating process of a profil made of an aluminium alloy
WO2008107000A1 (en) * 2007-03-08 2008-09-12 Alcan Technology & Management Ltd. Method for plating an aluminum alloy profile
JP2020107383A (en) * 2018-12-28 2020-07-09 昭和電工株式会社 Substrate for magnetic recording medium, magnetic recording medium, hard disk drive
JP2020107382A (en) * 2018-12-28 2020-07-09 昭和電工株式会社 Substrate for magnetic recording medium, magnetic recording medium, hard disk drive
CN110373576A (en) * 2019-08-07 2019-10-25 安庆市泽烨新材料技术推广服务有限公司 A kind of cable Al-alloy and preparation method thereof

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