JPH10119034A - Fixing holder for slicing semiconductor crystal ingot - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent a cut-in portion from being broken at the time of cutting-in with a rotating wire cutter, cutter blades or the like by molding thermosetting resin/glass fiber composite molding material such as a glass fiber reinforced phenolic resin molding material. SOLUTION: A fixing holder for slicing a semiconductor crystal ingot is produced by molding a phenolic resin/glass fiber composite molding material prepared by mainly compounding 100-250 pts.wt. of glass fiber with 100 pts.wt. of phenolic resin as a thermosetting resin. As a result, since this fixing holder for slicing has high rigidity but is not brittle and has an excellent mechanical strength, the breakage at the cutting-in part of the fixing holder hardly occurs at the slicing of an ingot and the fixed holder is excellent in heat resistance. Further, since the molding of this holder is easy, holders corresponding to the sizes of ingots can be molded from the same material.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a fixing support for slicing a wafer slice from a semiconductor crystal ingot.

[0002]

2. Description of the Related Art Conventionally, when slicing a wafer slice from a semiconductor crystal ingot, the ingot is mounted on a fixed support, fixed with an adhesive or the like, and is rotated at a high speed along a cutting direction by a wire cutter or a cutter blade. Sliced to a predetermined thickness.

Hitherto, a support made of graphite material has been used as an ingot fixing support when slicing a semiconductor crystal ingot. A fixed support made of graphite material is brittle and has a drawback in strength, and a reinforcing material such as a glass plate is used in combination with the fixed support. The use of such reinforcements has the disadvantage of increasing costs.
In addition, when manufacturing an ingot fixing support from a lump of graphite, there is also a disadvantage that the cost is increased since the ingot is individually cut out in accordance with the size, that is, the diameter, of the ingot.

[0004] When slicing a semiconductor crystal ingot, the ingot is mounted on a fixed support and sliced by a rotating blade into individual sections. In addition, the ingot is placed on a fixed support and fixed with an adhesive or the like, and several tens to several sheets are simultaneously cut by a wire cutter or the like that rotates at a high speed while the sliced wafer slices are fixed to the fixed support and stand. One hundred pieces are cut including the fixing support, and then the adhesive and the like are removed to separate individual wafer sections from the fixing support. However, conventionally used fixing supports made of graphite material are fragile because they have low strength, especially low rigidity, and are fragile, and the cut portions of the fixing supports are damaged, and other sections where sliced sections stand side by side May damage the surface of the sliced section.

[0005]

SUMMARY OF THE INVENTION In view of the above circumstances, the present invention provides a fixed support for an ingot slice, which is strong enough to prevent the cut portion from being damaged when it is cut by a rotating wire cutter, cutter blade, or the like. To provide tools.

[0006]

The present inventors have conducted various studies on the above-mentioned problems from various viewpoints, and as a result, it has been found that molding with a thermosetting resin / glass fiber composite molding material such as a glass fiber reinforced phenol resin molding material. It has been found that the fixed support for ingot slices can achieve the initial purpose.

The fixing support for ingot slices according to the present invention has high rigidity, is not brittle, and has excellent mechanical strength as compared with a conventional support made of graphite material. In addition, the molding process is easy, and the respective fixing supports corresponding to the diameter of the ingot can be easily formed from the same material by compression molding or the like, so that the quality is stable and the cost is low.

[0008]

BEST MODE FOR CARRYING OUT THE INVENTION As a thermosetting resin constituting a composite molding material for forming a fixing support for slicing a semiconductor crystal ingot of the present invention, a phenolic resin, an unsaturated polyester resin, a diallyl phthalate resin and the like are used. However, the case where a phenolic resin is used as the thermosetting resin will be specifically described below.

That is, it is produced by molding a phenolic resin / glass fiber composite molding material in which 100 to 250 parts by weight of glass fiber is blended as a main component with 100 parts by weight of a phenolic resin.

Further, 100 to 250 parts by weight of glass fiber is blended with 100 parts by weight of phenolic resin, and a phenolic resin / glass fiber composite molding material containing an inorganic and / or organic filler is formed. It is manufactured by doing.

The compounding amount of the glass fiber in the composite molding material used in the present invention is usually 100 to 250 parts by weight based on 100 parts by weight of the phenolic resin. Preferably 150 parts per 100 parts by weight of the phenolic resin
２００200 parts by weight.

If the amount of the glass fiber is less than 100 parts by weight, the reinforcing effect of imparting the desired mechanical strength cannot be obtained, which is not preferable. If the amount exceeds 250 parts by weight, there is a problem in moldability as a molding material, which is not preferable.

The glass fiber in the composite molding material used in the present invention is chopped strand, milled glass, etc., and generally has a fiber length of 1 mm to 6 mm, preferably 3 mm to 6 mm, and a fiber diameter of 5 μm to 16 μm, preferably 6 μm. １３13 μm. The glass fibers used are those converged with a normal silica-based converging agent. Further, glass-based reinforcing materials such as glass flakes and glass beads can also be used partially.

Further, the phenolic resin / glass fiber composite molding material of the present invention can contain various inorganic and / or organic fillers. As the inorganic and / or organic filler, fillers used in conventional phenolic resin / glass fiber composite molding materials can be used.

Examples of the inorganic fillers include clay fillers, diatomaceous earth, silica fillers such as hydrated silicon, mica, titanium oxide, and calcium carbonate. Examples of the organic filler include natural fibers such as wood flour, cotton cloth chips and cotton flour. In addition, a curing agent and a curing accelerator are appropriately used.

These inorganic and / or organic fillers are usually used in an amount of 5 to 100 parts by weight of the phenolic resin.
50 parts by weight, preferably 10 to 30 parts by weight are blended. If the amount of the inorganic and / or organic filler is more than 50 parts by weight, the mechanical properties, especially the physical properties such as rigidity and toughness may be impaired, which is not preferable.

The phenolic resin in the present invention is a resin obtained by reacting a phenol such as phenol, cresol, xylenol, alkylphenol and resorcinol with an aldehyde such as formaldehyde, polaformaldehyde, acetaldehyde, fulleral or cyclic formal. And a modified phenolic resin obtained by co-condensing such a phenolic resin with an epoxy resin, an amino resin, an allyl resin, an aromatic hydrocarbon aldehyde resin, a urethane resin or a silicone resin. As the phenolic resin, both novolak type and resol type are used, and these can be used in combination. In the case of a novolak type phenolic resin, hexamethylenetetramine is usually used as a curing agent. In the case of a resole type phenolic resin, such a curing agent is generally not particularly required.

Further, the phenolic resin / glass fiber composite molding material used in the present invention may contain, if necessary, known flame retardants, flame retardant auxiliaries, pigments, dyes, release agents and the like. Can be.

The case of the phenolic resin / glass fiber composite molding material has been described above, but the glass fiber composite molding material using an unsaturated polyester resin or diallyl phthalate resin as the thermosetting resin also has high rigidity and mechanical properties. It is excellent in strength and is suitable as a material for molding a fixing support for slicing as in the case of the phenolic resin / glass fiber composite molding material, and can be used similarly. The glass fiber is used in the same amount as in the case of the phenol resin.

When an unsaturated polyester resin or diallyl phthalate resin is used, a known crosslinking agent or curing agent (catalyst) is used as required.

The thermosetting resin / glass fiber composite molding material used in the present invention comprises the above-mentioned thermosetting resin, glass fiber and inorganic and / or organic fillers, and, if desired, a flame retardant and a flame retardant. A fuel aid, a pigment, a dye, a release agent, etc. are added and mixed. Rolls, a kneader, a high-speed stirring mixer such as a Henschel mixer, kneading with a kneading machine such as an extruder, followed by pulverization or granulation, It is obtained by pelletizing.

The fixing support for ingot slices of the present invention can be formed by transfer molding and compression molding using the above-mentioned thermosetting resin / glass fiber composite molding material by using a mold suitable for the size of the target ingot and the like. It is easily manufactured by molding processing such as injection molding. The molding temperature, molding time, and the like depend on the type of the resin to be used and the like, but conditions and the like suitable for each molding means are employed.
For example, in the case of phenolic resin, in the case of compression molding, it depends on the size of the molded product, but it is 20 to 40 at 140 to 170 ° C.
There are minutes.

[0023]

The present invention will be specifically described below with reference to examples.

Example 1 (1) 100 parts by weight of novolak type phenol resin, 200 parts by weight of glass fiber (aminosilane-treated chopped strand, fiber length 3 mm, fiber diameter 13 μm), 12% by weight of hardener (hexamine) (based on phenol resin) ) And 1.5% by weight (based on the whole) of other additives were mixed, kneaded and pulverized to prepare a glass fiber reinforced phenolic resin composite molding material (1).

(2) Novolak type phenolic resin 100
Parts by weight, glass fiber (aminosilane treated chopped strand, fiber length 3 mm, fiber diameter 13 μm) 200 parts by weight, inorganic filler (silica-alumina type) 10 parts by weight, curing agent (hexamine) 12% by weight (based on phenol resin) ) And 1.5% by weight (based on the whole) of other additives were mixed, kneaded and pulverized to prepare a glass fiber reinforced phenolic resin composite molding material (2).

The above-mentioned composite molding material (1) was filled in a predetermined molding die, and compression-molded at a temperature of 145 ° C. for about 30 minutes to form a fixed support for an 8-inch ingot slice. A silicon wafer cutting ingot was fixed to this support, and 200 wafer sections were cut out with a high-speed rotating wire cutter. Almost no breakage of the wire cutter cut portion of the fixed support was recognized.

Example 2 Using the composite molding material (1) prepared in Example 1, compression molding was performed at a temperature of 150 ° C. for 25 minutes using a predetermined molding die to form a 6-inch ingot slice fixed support. did. A silicon wafer cutting ingot was fixed to this support, and 200 wafer sections were cut out with a high-speed rotating wire cutter. Almost no breakage of the wire cutter cut portion of the fixed support was recognized.

Comparative Example 1 A silicon wafer cutting ingot was fixed to a 6-inch ingot slicing fixing support manufactured by cutting from graphite, and a wafer section was cut out in the same manner as in Example 1. A part of the cut portion of the wire cutter of the fixed support was damaged.

Example 3 The composite molding material (2) prepared in Example 1 was compression-molded at a temperature of 150 ° C. for 25 minutes with a predetermined molding die to form a 6-inch ingot slice fixed support. did. A silicon wafer cutting ingot was fixed to this support, and 200 wafer sections were cut out with a high-speed rotating wire cutter. Almost no breakage of the wire cutter cut portion of the fixed support was recognized.

[0030]

The fixing support for slicing a semiconductor crystal ingot according to the present invention has high rigidity, is not brittle, and has excellent mechanical strength. Therefore, when the ingot is sliced, the cut portion of the fixing support is damaged. Are hardly recognized, and the heat resistance is excellent. In addition, it is possible to easily form the respective supporting tools corresponding to the size of the ingot from the same material.

Claims (4)

[Claims] 1. A fixing support for slicing a semiconductor crystal ingot obtained by molding a thermosetting resin / glass fiber composite molding material. 2. The fixing support for slicing according to claim 1, comprising a thermosetting resin / glass fiber composite molding material obtained by mixing 100 to 250 parts by weight of glass fiber with 100 parts by weight of thermosetting resin. 3. A thermosetting resin / glass fiber composite molding material comprising 100 to 250 parts by weight of glass fiber mixed with 100 parts by weight of thermosetting resin and further containing an inorganic and / or organic filler. Item 7. A fixed support for slicing according to Item 1. 4. The slice fixing support according to claim 1, wherein the thermosetting resin is a phenolic resin, an unsaturated polyester resin, or a diallyl phthalate resin.