JPH0468020A - Phenolic resin molding material - Google Patents
Phenolic resin molding materialInfo
- Publication number
- JPH0468020A JPH0468020A JP18030190A JP18030190A JPH0468020A JP H0468020 A JPH0468020 A JP H0468020A JP 18030190 A JP18030190 A JP 18030190A JP 18030190 A JP18030190 A JP 18030190A JP H0468020 A JPH0468020 A JP H0468020A
- Authority
- JP
- Japan
- Prior art keywords
- phenolic resin
- molding material
- epoxy resin
- resin
- resin molding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000005011 phenolic resin Substances 0.000 title claims abstract description 24
- 229920001568 phenolic resin Polymers 0.000 title claims abstract description 19
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 title claims abstract description 18
- 239000012778 molding material Substances 0.000 title claims abstract description 16
- 239000004850 liquid epoxy resins (LERs) Substances 0.000 claims abstract description 8
- 239000003822 epoxy resin Substances 0.000 abstract description 6
- 229920000647 polyepoxide Polymers 0.000 abstract description 6
- 239000000945 filler Substances 0.000 abstract description 3
- 239000003795 chemical substances by application Substances 0.000 abstract description 2
- 239000003086 colorant Substances 0.000 abstract description 2
- 239000003365 glass fiber Substances 0.000 abstract description 2
- 239000000463 material Substances 0.000 abstract description 2
- 238000002156 mixing Methods 0.000 abstract description 2
- 239000000203 mixture Substances 0.000 abstract description 2
- 229920003987 resole Polymers 0.000 abstract description 2
- 239000004094 surface-active agent Substances 0.000 abstract description 2
- 230000002787 reinforcement Effects 0.000 abstract 2
- STMDPCBYJCIZOD-UHFFFAOYSA-N 2-(2,4-dinitroanilino)-4-methylpentanoic acid Chemical compound CC(C)CC(C(O)=O)NC1=CC=C([N+]([O-])=O)C=C1[N+]([O-])=O STMDPCBYJCIZOD-UHFFFAOYSA-N 0.000 abstract 1
- 238000000465 moulding Methods 0.000 description 4
- 239000000835 fiber Substances 0.000 description 3
- -1 glycidyl ester Chemical class 0.000 description 3
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- 238000010344 co-firing Methods 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 229920003986 novolac Polymers 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 239000004202 carbamide Substances 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 229910052570 clay Inorganic materials 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000012779 reinforcing material Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
Landscapes
- Manufacture Of Macromolecular Shaped Articles (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は自動車部品用、電気機械部品用、ＯＡ事務機部
品用、電子部品用、音響機器部品用、熱器具部品用、食
器用等に用いられるシート状のフェノール樹脂成形材料
に関するものである。[Detailed Description of the Invention] [Field of Industrial Application] The present invention is applicable to automobile parts, electromechanical parts, OA office machine parts, electronic parts, audio equipment parts, heating appliance parts, tableware, etc. The present invention relates to a sheet-shaped phenolic resin molding material used.
従来、シート状のフェノール樹脂成形材料は、低分子量
のフェノール樹脂からなる低粘度樹脂を用いているが、
揮発分が多いので成形時にフクレを発生しやすく成形に
は制約が伴っていた。Conventionally, sheet-shaped phenolic resin molding materials use low-viscosity resins made of low-molecular-weight phenolic resins.
Since it contains a large amount of volatile matter, it tends to cause blisters during molding, which limits molding.
従来の技術で述べたように、従来のシート状フェノール
樹脂成形材料の成形性はよくない。本発明は従来の技術
における上述の問題点に鑑みてなされたもので、その目
的とするところは成形性に優れたシート状のフェノール
樹脂成形材料を提供することにある。As described in the prior art section, the moldability of conventional sheet-like phenolic resin molding materials is poor. The present invention has been made in view of the above-mentioned problems in the prior art, and its object is to provide a sheet-shaped phenolic resin molding material with excellent moldability.
本発明は液状エポキシ樹脂を含有したことを特徴とする
シート状のフェノール樹脂成形材料のため、低分子量フ
ェノール樹脂を用いることなく、通常のフェノール樹脂
を用いることができ、液状エポキシ樹脂によって低粘度
化することができ、成形時にはフェノール樹脂のフェノ
ール性水酸基とエポキシ基とが反応するため揮発分が増
加することもなくなり成形性を向上させることができた
もので、以下本発明の詳細な説明する。Since the present invention is a sheet-like phenolic resin molding material that contains a liquid epoxy resin, it is possible to use a normal phenol resin without using a low molecular weight phenol resin, and the liquid epoxy resin has a low viscosity. Since the phenolic hydroxyl group and epoxy group of the phenol resin react during molding, the volatile content does not increase and moldability can be improved.The present invention will be described in detail below.
本発明に用いる液状エポキシ樹脂は、ビスフェノールＡ
型エポキシ樹脂、ノボラック型エポキシ樹脂、ハロゲン
化エポキシ樹脂、グリシジルエステル型エポキシ樹脂、
グリシジルエーテル型エポキシ樹脂等のようにエポキシ
樹−脂全般の液状エポキシ樹脂を用いることができる。The liquid epoxy resin used in the present invention is bisphenol A
type epoxy resin, novolac type epoxy resin, halogenated epoxy resin, glycidyl ester type epoxy resin,
Any liquid epoxy resin such as glycidyl ether type epoxy resin can be used.
液状エポキシ樹脂の量はフェノール樹脂１００重量部（
以下単に部と記す）に対し５〜１００部であることが好
ましい。即ち５部未満では成形性が向上し難く、１００
部をこえると、成形材料生産性が低下する傾向にあるか
らである。The amount of liquid epoxy resin is 100 parts by weight of phenolic resin (
The amount is preferably 5 to 100 parts. That is, if it is less than 5 parts, it is difficult to improve the moldability;
This is because when the temperature exceeds 50%, the productivity of the molding material tends to decrease.
フェノール樹脂としてはフェノール、クレゾール等のフ
ェノール系化合物とホルムアルデヒド等のアルデヒド化
合物とからなるノボラック型、レゾール型のフェノール
樹脂でメラミン変性、ユリア変性等の変性物であっても
よい。補強材としてはガラス繊維、合成樹脂繊維、炭素
繊維、セラミック繊維、天然繊維等を用いることができ
る。充填剤としては炭酸カルシウム、クレー、シリカ、
タルク、水酸化アルミニウム等の無機粉末充填剤を必要
に応じて添加することができる。必要に応じて添加され
る硬化剤、着色剤、離型剤、界面活性剤等については特
に限定するものではなく、フェノール樹脂成形材料に用
いられるものをそのまま用いることができ、これら配合
材料を混合、混焼後シート状にしてフェノール樹脂成形
材料を得るものである。The phenol resin may be a novolac type or resol type phenol resin consisting of a phenol compound such as phenol or cresol and an aldehyde compound such as formaldehyde, and may be a modified product such as melamine modification or urea modification. As the reinforcing material, glass fiber, synthetic resin fiber, carbon fiber, ceramic fiber, natural fiber, etc. can be used. Fillers include calcium carbonate, clay, silica,
Inorganic powder fillers such as talc and aluminum hydroxide can be added as necessary. There are no particular limitations on the curing agent, coloring agent, mold release agent, surfactant, etc. that are added as necessary, and those used for phenolic resin molding materials can be used as they are, and these compounded materials can be mixed. After co-firing, the phenolic resin molding material is formed into a sheet.
以下本発明を実施例にもとづいて説明する。The present invention will be explained below based on examples.
実施例１乃至３と比較例
第１表の配合表にもとづいて配合、混焼、シート化して
フェノール樹脂成形材料を得、該成形材料を成形圧力２
００ ｋｇ／ｃ１ｉ！、金型温度１６０°Ｃで５分間圧
縮成形して成形品を得た。A phenolic resin molding material was obtained by blending, co-firing, and sheeting based on the formulation table of Examples 1 to 3 and Comparative Example Table 1, and the molding material was molded at a molding pressure of 2
00 kg/c1i! A molded product was obtained by compression molding for 5 minutes at a mold temperature of 160°C.
第 １ 表
重量部
実施例１乃至３と比較例のフェノール樹脂成形材料の性
能は第２表のようである。Table 1: Part by Weight The performance of the phenolic resin molding materials of Examples 1 to 3 and Comparative Example is as shown in Table 2.
第
表
〔発明の効果〕
本発明は上述した如く構成されている。特許請求の範囲
に記載した構成を有するフェノール樹脂成形材料におい
ては成形性が向上する効果がある。Table 1 [Effects of the Invention] The present invention is constructed as described above. The phenolic resin molding material having the structure described in the claims has the effect of improving moldability.
Claims (1)
ート状のフェノール樹脂成形材料。(1) A sheet-shaped phenolic resin molding material characterized by containing a liquid epoxy resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18030190A JPH0468020A (en) | 1990-07-06 | 1990-07-06 | Phenolic resin molding material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18030190A JPH0468020A (en) | 1990-07-06 | 1990-07-06 | Phenolic resin molding material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0468020A true JPH0468020A (en) | 1992-03-03 |
Family
ID=16080813
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18030190A Pending JPH0468020A (en) | 1990-07-06 | 1990-07-06 | Phenolic resin molding material |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0468020A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5395915A (en) * | 1992-02-27 | 1995-03-07 | Mitsui Toatsu Chemicals, Inc. | Method for simultaneous preparation of bisphenol F and novolak phenol resins |
| CN114031892A (en) * | 2021-12-08 | 2022-02-11 | 连云港英格达电子科技有限公司 | Special glass fiber composite reinforced material for high-end electric tool commutator and preparation method thereof |
-
1990
- 1990-07-06 JP JP18030190A patent/JPH0468020A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5395915A (en) * | 1992-02-27 | 1995-03-07 | Mitsui Toatsu Chemicals, Inc. | Method for simultaneous preparation of bisphenol F and novolak phenol resins |
| CN114031892A (en) * | 2021-12-08 | 2022-02-11 | 连云港英格达电子科技有限公司 | Special glass fiber composite reinforced material for high-end electric tool commutator and preparation method thereof |
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