JP2001049079A - Phenolic resin composition and its preparation - Google Patents

Phenolic resin composition and its preparation

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Publication number
JP2001049079A
JP2001049079A JP22140299A JP22140299A JP2001049079A JP 2001049079 A JP2001049079 A JP 2001049079A JP 22140299 A JP22140299 A JP 22140299A JP 22140299 A JP22140299 A JP 22140299A JP 2001049079 A JP2001049079 A JP 2001049079A
Authority
JP
Japan
Prior art keywords
phenolic resin
resin composition
parts
aromatic hydrocarbon
silicone gel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP22140299A
Other languages
Japanese (ja)
Inventor
Shinichi Ozeki
真一 大関
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Durez Co Ltd
Original Assignee
Sumitomo Durez Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Durez Co Ltd filed Critical Sumitomo Durez Co Ltd
Priority to JP22140299A priority Critical patent/JP2001049079A/en
Publication of JP2001049079A publication Critical patent/JP2001049079A/en
Pending legal-status Critical Current

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  • Compositions Of Macromolecular Compounds (AREA)

Abstract

PROBLEM TO BE SOLVED: To improve tenacity, vibration absorbing properties, flexibility and heat resistance by compounding a silicone gel based on an addition reaction type silicone having a specific penetration and an aromatic hydrocarbon-modified phenolic resin. SOLUTION: A vinyl group-containing dimethylpolysiloxane and a polymethylhydrogensiloxane are heated in the presence of a catalyst thereby effecting a hydrosilylation reaction to give a silicone gel (A) based on an addition reaction type silicone having a penetration of 10-300 (JIS K 2530-1976, under a load of 50 g). The component A in an amount of 1-50 pts.wt. and 100 pts.wt. of an aromatic hydrocarbon-modified phenolic resin (B) obtained by polycondensation of a phenolic compound with an aromatic hydrocarbon are fed to a pressure kneader and kneaded at 50-150 deg.C to give a phenolic resin composition. This phenolic resin composition can include 3-20 pts.wt., based on 100 pts.wt. of the component B, of a curing agent.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、靭性、振動吸収
性、柔軟性に優れ、且つ良好な耐熱性を有するフェノー
ル樹脂組成物に関し、特に、靱性、耐熱性に優れる成形
品や、鳴き特性、振動吸収性、耐摩耗性、耐フェード性
に優れる摩擦材等を得るために用いられるバインダーと
して好適なフェノール樹脂組成物に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a phenolic resin composition having excellent toughness, vibration absorption and flexibility, and having good heat resistance. The present invention relates to a phenol resin composition suitable as a binder used for obtaining a friction material having excellent vibration absorption, abrasion resistance and fade resistance.

【0002】[0002]

【従来の技術】フェノール樹脂は優れた機械的特性、電
気特性、耐熱性及び接着性などを有するバインダーであ
る反面、その成形品は靭性、振動吸収性において欠点を
持っている。このような諸性能を改善するため変性フェ
ノール樹脂の研究が盛んに行われており、油変性フェノ
ール樹脂、カシュー変性フェノール樹脂、エポキシ変性
フェノール樹脂、メラミン変性フェノール樹脂などが検
討され、一部実用に供されている。しかし、これらの変
性フェノール樹脂では、靭性、振動吸収性の面で未だ十
分とはいえない。
2. Description of the Related Art Phenol resins are binders having excellent mechanical properties, electrical properties, heat resistance and adhesiveness, but molded articles have drawbacks in toughness and vibration absorption. In order to improve such performances, research on modified phenolic resins has been actively conducted, and oil-modified phenolic resins, cashew-modified phenolic resins, epoxy-modified phenolic resins, melamine-modified phenolic resins, etc. have been studied, and some of them have been put into practical use. Has been provided. However, these modified phenolic resins are not yet sufficient in terms of toughness and vibration absorption.

【0003】柔軟性、振動吸収性をさらに改良するため
に、これらの特性に比較的優れる各種ゴム変性フェノー
ル樹脂が検討されているが、ゴムそのものに耐熱性が乏
しく、摩擦材用途の場合、熱履歴により鳴きが発生する
という問題があった。そこで、特開平8−86326号
公報にあるように、耐熱性に優れるシリコーンゲルを用
いて柔軟性、振動吸収性、耐熱性の改良が実施された例
がある。しかし、この例では、マトリックス樹脂となる
フェノール樹脂の耐熱性が十分でなく、更に厳しい使用
環境においては熱履歴により強度劣化が生じるという問
題があった。
[0003] In order to further improve the flexibility and vibration absorption, various rubber-modified phenol resins having relatively excellent properties have been studied. There was a problem that squealing occurred due to history. Therefore, as disclosed in JP-A-8-86326, there is an example in which a silicone gel having excellent heat resistance is used to improve flexibility, vibration absorption, and heat resistance. However, in this example, there is a problem that the heat resistance of the phenol resin serving as the matrix resin is not sufficient, and the strength deteriorates due to the heat history in a more severe use environment.

【0004】[0004]

【発明が解決しようとする課題】本発明は、フェノール
樹脂のこのような問題点を解決するために種々検討の結
果完成したもので、その目的とするところは靭性、振動
吸収性、柔軟性に優れ、且つ良好な耐熱性を有するフェ
ノール樹脂組成物を提供することにある。
SUMMARY OF THE INVENTION The present invention has been completed as a result of various studies to solve such problems of the phenolic resin, and its object is to improve toughness, vibration absorption and flexibility. An object of the present invention is to provide a phenol resin composition which is excellent and has good heat resistance.

【0005】[0005]

【課題を解決するための手段】本発明は、特定のシリコ
ーンゲル、及びフェノール類と芳香族炭化水素とアルデ
ヒド類とを重縮合して得られた芳香族炭化水素変性フェ
ノール樹脂(以下、単に芳香族炭化水素変性フェノール
樹脂という)がこれらの特性に大きく影響することを見
出し、本発明を完成するに至ったものである。即ち、本
発明は、針入度(JIS K 2530−1976−50
g荷重)(以下、単に針入度という)10〜300であ
る付加反応型シリコーンをベースとしたシリコーンゲ
ル、及び芳香族炭化水素変性フェノール樹脂を必須成分
として含有することを特徴とするフェノール樹脂組成物
に関するものである。
DISCLOSURE OF THE INVENTION The present invention relates to a specific silicone gel and an aromatic hydrocarbon-modified phenolic resin obtained by polycondensing phenols, aromatic hydrocarbons and aldehydes (hereinafter simply referred to as aromatic resins). Group (which is referred to as a phenol resin modified with an aromatic hydrocarbon) greatly affects these properties, and the present invention has been completed. That is, the present invention relates to a penetration (JIS K 2530-1976-50).
g load) (hereinafter simply referred to as penetration), a phenolic resin composition comprising an addition-reaction-type silicone-based silicone gel having an average of 10 to 300, and an aromatic hydrocarbon-modified phenolic resin as essential components. It is about things.

【0006】以下、本発明について具体的に説明する。
シリコーンゲルは、一般的には、ビニル基含有ジメチル
ポリシロキサンとポリメチルハイドロジェンシロキサン
に触媒を加え、加熱してヒドロシリル化反応により得ら
れる。このような針入度が10〜300のシリコーンゲ
ルは適度な柔軟性を持ち、耐衝撃性、振動吸収性に優れ
ていて、常温から高温に至るまで広い温度域でこれらの
特性を失わない。より好ましくは、シリコーンゲルの針
入度が100〜200である。針入度が10より小さい
と柔軟性が小さく、耐衝撃性、振動吸収性が十分でな
く、300より大きいと柔らか過ぎて、強度が十分でな
い。本発明の組成物はこのようなシリコーンゲルを、芳
香族炭化水素変性フェノール樹脂中に均一に分散混合す
ることにより得られる。
Hereinafter, the present invention will be described specifically.
The silicone gel is generally obtained by adding a catalyst to vinyl group-containing dimethylpolysiloxane and polymethylhydrogensiloxane, heating and subjecting to a hydrosilylation reaction. Such a silicone gel having a penetration of 10 to 300 has appropriate flexibility, excellent impact resistance and vibration absorption, and does not lose these properties in a wide temperature range from room temperature to high temperature. More preferably, the penetration of the silicone gel is 100 to 200. If the penetration is less than 10, the flexibility is low, the impact resistance and the vibration absorption are not sufficient, and if it is more than 300, it is too soft and the strength is not sufficient. The composition of the present invention can be obtained by uniformly dispersing and mixing such a silicone gel in an aromatic hydrocarbon-modified phenol resin.

【0007】このようにして得られたフェノール樹脂組
成物は、芳香族炭化水素変性フェノール樹脂の持つ耐熱
性とともに、シリコーンゲルのもつ優れた柔軟性、振動
吸収性が発現し、且つこれらの相乗効果により熱履歴後
の強度、柔軟性を高く維持することが可能になる。シリ
コーンゲルを、芳香族炭化水素変性フェノール樹脂中に
均一に分散混合せしめる方法は、予め反応が完結した前
記重縮合物中にシリコーンゲルを均一に分散混合させる
もので、通常のフェノール樹脂反応釜内で混合させても
よく、加圧式混練機で加圧下で混練せしめるものでもよ
い。しかし、シリコーンゲルは、前記重縮合物との相溶
性がよくなく、溶剤に不溶であり、高融点であるため、
通常のフェノール樹脂反応釜内で均一に分散させにくい
ことから、加圧式混練機を用いることが望ましい。即
ち、所定量の前記重縮合物及びシリコーンゲルを加圧式
混練機に仕込み、加圧下で混練せしめるものである。混
練時の温度は、芳香族炭化水素変性フェノール樹脂が溶
融する温度であればよく、特に限定されないが、通常は
混練の容易さから50〜150℃、特に70〜130℃
の温度範囲が適当である。加圧式混練機としては、ロー
ル式混練機、加圧ニーダー、二軸押出機、単軸押出機な
どが適当である。加圧式混練機を用いることにより、シ
リコーンゲルを芳香族炭化水素変性フェノール樹脂中に
均一に分散させることが可能となる。
The phenolic resin composition thus obtained exhibits the heat resistance of the aromatic hydrocarbon-modified phenolic resin, the excellent flexibility and vibration absorption of the silicone gel, and a synergistic effect of these. This makes it possible to maintain high strength and flexibility after heat history. A method of uniformly dispersing and mixing a silicone gel in an aromatic hydrocarbon-modified phenol resin is to uniformly disperse and mix the silicone gel in the polycondensate in which the reaction has been completed in advance. And kneading under pressure by a pressure kneader. However, the silicone gel has poor compatibility with the polycondensate, is insoluble in a solvent, and has a high melting point.
It is desirable to use a pressure-type kneader because it is difficult to uniformly disperse it in a normal phenol resin reactor. That is, a predetermined amount of the polycondensate and the silicone gel are charged into a pressure-type kneader and kneaded under pressure. The temperature at the time of kneading is not particularly limited as long as it is a temperature at which the aromatic hydrocarbon-modified phenol resin is melted, but is usually 50 to 150 ° C., particularly 70 to 130 ° C. from the ease of kneading.
Is appropriate. As the pressure-type kneader, a roll-type kneader, a pressure kneader, a twin-screw extruder, a single-screw extruder and the like are suitable. By using a pressurized kneader, it becomes possible to uniformly disperse the silicone gel in the aromatic hydrocarbon-modified phenolic resin.

【0008】芳香族炭化水素変性フェノール樹脂を製造
するために使用するフェノール類は、フェノール、クレ
ゾール、キシレノール、エチルフェノール、プロピルフ
ェノール、カテコール、レゾルシン、ハイドロキノン、
ビスフェノールAなどであり、これらを単独または2種
類以上組合わせて使用してもよい。芳香族炭化水素とし
ては、ベンゼン、トルエン、キシレン、メシチレン等、
あるいは、これら芳香族炭化水素とアルデヒド類とを予
め反応させて得た樹脂を使用することができる。また、
パラキシレングリコールジメチルエーテル、パラキシレ
ングリコール、メタキシレングリコールジメチルエーテ
ル、メタキシレングリコール、オルソキシレングリコー
ルジメチルエーテル、オルソキシレングリコール等の芳
香族炭化水素グリコール又はそのアルキルエーテルを用
いることも可能である。
[0008] Phenols used for producing aromatic hydrocarbon-modified phenolic resins include phenol, cresol, xylenol, ethylphenol, propylphenol, catechol, resorcinol, hydroquinone,
Bisphenol A and the like may be used alone or in combination of two or more. As the aromatic hydrocarbon, benzene, toluene, xylene, mesitylene, etc.
Alternatively, a resin obtained by previously reacting these aromatic hydrocarbons with aldehydes can be used. Also,
It is also possible to use aromatic hydrocarbon glycols such as para-xylene glycol dimethyl ether, para-xylene glycol, meta-xylene glycol dimethyl ether, meta-xylene glycol, ortho-xylene glycol dimethyl ether, and ortho-xylene glycol, or alkyl ethers thereof.

【0009】また、アルデヒド類としては、ホルムアル
デヒドまたはホルムアルデヒドを生成する化合物、ベン
ズアルデヒド等のアルデヒド類を併用することも可能で
ある。フェノール類と芳香族炭化水素樹脂とを反応する
際の触媒としては、酢酸亜鉛等の金属塩類、蓚酸、塩
酸、硫酸、ジエチル硫酸、パラトルエンスルホン酸等の
酸類を単独または2種類以上併用して使用できる。
Further, as the aldehydes, it is possible to use formaldehyde or a compound capable of forming formaldehyde, or an aldehyde such as benzaldehyde. As a catalyst for reacting a phenol with an aromatic hydrocarbon resin, metal salts such as zinc acetate, oxalic acid, hydrochloric acid, sulfuric acid, diethyl sulfuric acid, acids such as paratoluenesulfonic acid alone or in combination of two or more kinds Can be used.

【0010】本発明の芳香族炭化水素変性フェノール樹
脂としては、フェノール類と芳香族炭化水素・アルデヒ
ド重縮合物を反応させたもの、フェノール類とキシレン
グリコール類のみを反応させたもの、フェノール類とア
ルデヒド類と芳香族炭化水素変性を反応させたものであ
る。また、フェノール類とアルデヒド類との重縮合物と
芳香族炭化水素変性フェノール・ホルムアルデヒド重縮
合物とを混合したものでもよい。
The aromatic hydrocarbon-modified phenolic resins of the present invention include those obtained by reacting phenols with polycondensates of aromatic hydrocarbons and aldehydes, those obtained by reacting only phenols and xylene glycols, and those obtained by reacting phenols with phenols. It is obtained by reacting aldehydes with aromatic hydrocarbon modification. Further, a mixture of a polycondensate of a phenol and an aldehyde and a polycondensate of an aromatic hydrocarbon-modified phenol / formaldehyde may be used.

【0011】本発明のフェノール樹脂組成物におけるシ
リコーンゲル含有量は、フェノール類と芳香族炭化水素
との重縮合物又はフェノール類と芳香族炭化水素とアル
デヒド類との重縮合物100重量部に対し、通常1〜5
0重量部であり、好ましくは3〜20重量部である。1
重量部未満では、樹脂の十分な柔軟性、振動吸収性が得
られず、50重量部を超えると樹脂の硬化が遅くなり、
成形品の成形時間が長くなると共にバインダー力が小さ
くなり、実用的ではない。3〜20重量部の範囲で特に
優れた柔軟性、振動吸収性を有し、熱履歴後の強度を高
く維持することができる。
The silicone gel content of the phenolic resin composition of the present invention is based on 100 parts by weight of a polycondensate of a phenol and an aromatic hydrocarbon or a polycondensate of a phenol, an aromatic hydrocarbon and an aldehyde. , Usually 1-5
0 parts by weight, preferably 3 to 20 parts by weight. 1
If the amount is less than 10 parts by weight, sufficient flexibility and vibration absorption of the resin cannot be obtained.
As the molding time of the molded article becomes longer, the binder force becomes smaller, which is not practical. In the range of 3 to 20 parts by weight, it has particularly excellent flexibility and vibration absorption, and can maintain high strength after heat history.

【0012】フェノール樹脂組成物の硬化剤としては必
要に応じて各種の2官能以上のエポキシ化合物、イソシ
アネート類及びホルムアルデヒド系樹脂やヘキサメチレ
ンテトラミンを用いることが出来るが、硬化性、耐熱性
の面からヘキサメチレンテトラミンが好ましい。ヘキサ
メチレンテトラミンの添加量はフェノール類と芳香族炭
化水素とアルデヒド類との重縮合物100重量部に対し
て3〜20重量部の範囲で使用可能であり、好ましくは
7〜17重量部である。3重量部未満では樹脂の硬化が
不十分になり、また、20重量部を超えるとヘキサメチ
レンテトラミンの分解ガスが成形品にふくれ、亀裂など
を発生させる。
As the curing agent for the phenolic resin composition, various epoxy compounds having two or more functionalities, isocyanates, formaldehyde resins and hexamethylenetetramine can be used as necessary, but from the viewpoint of curability and heat resistance. Hexamethylenetetramine is preferred. Hexamethylenetetramine can be used in an amount of 3 to 20 parts by weight, preferably 7 to 17 parts by weight, per 100 parts by weight of the polycondensate of phenols, aromatic hydrocarbons and aldehydes. . If the amount is less than 3 parts by weight, the resin will be insufficiently cured.

【0013】本発明のフェノール樹脂組成物の用途とし
ては、成形材料用素材、有機繊維粘結剤、ゴム配合剤、
研磨材用粘結剤、摩擦材用粘結剤、ゴム配合剤、無機繊
維粘結剤、電子電気部品被覆剤、摺動部材粘結剤、エポ
キシ樹脂原料及びエポキシ樹脂硬化剤などが挙げられ
る。
The phenolic resin composition of the present invention can be used as a material for a molding material, an organic fiber binder, a rubber compounding agent,
Examples of the binder include a binder for abrasives, a binder for friction materials, a rubber compounding agent, a binder for inorganic fibers, a coating agent for electronic and electrical parts, a binder for sliding members, an epoxy resin raw material, and an epoxy resin curing agent.

【0014】[0014]

【実施例】以下、本発明を実施例により説明する。しか
し本発明はこれらの実施例によって限定されるものでは
ない。また、実施例及び比較例に記載されている「部」
及び「%」は、すべて「重量部」及び「重量%」を示
す。
The present invention will be described below with reference to examples. However, the present invention is not limited by these examples. Further, “parts” described in Examples and Comparative Examples
And "%" all indicate "parts by weight" and "% by weight".

【0015】実施例1 撹拌装置、還流冷却器及び温度計を備えた反応装置にフ
ェノール1000部、キシレン・ホルムアルデヒド樹脂
900部及び酢酸亜鉛10部、パラトルエンスルホン酸
2部を仕込後、徐々に昇温し温度が100℃に達してか
ら240分間還流反応を行った。内温が110℃に達す
るまで常圧脱水を行い、次いで真空脱水を行い、系内の
温度が160℃まで昇温したところで、内容物を反応器
より取出して常温で固形のフェノール・キシレン・ホル
ムアルデヒド重縮合物(以下、キシレン変性フェノール
樹脂という)1700部を得た。
Example 1 A reactor equipped with a stirrer, a reflux condenser and a thermometer was charged with 1000 parts of phenol, 900 parts of xylene / formaldehyde resin, 10 parts of zinc acetate, and 2 parts of paratoluenesulfonic acid, and then gradually raised. After the temperature reached 100 ° C., a reflux reaction was performed for 240 minutes. Dehydration at normal pressure is performed until the internal temperature reaches 110 ° C, and then vacuum dehydration is performed. When the temperature in the system rises to 160 ° C, the contents are taken out of the reactor and solid phenol / xylene / formaldehyde is formed at normal temperature. 1,700 parts of a polycondensate (hereinafter referred to as a xylene-modified phenol resin) were obtained.

【0016】次にこのキシレン変性フェノール樹脂10
00部を溶融混練機に仕込み、150℃に昇温、溶融さ
せた。シリコーンゲル((株)シーゲル製αGEL、針
入度160)50部を加え、シリコーンゲルが均一に分
散するのを確認し、更に30分の混練を行い、加圧ニー
ダーより取出して常温で固形のフェノール樹脂組成物1
030部を得た。更に得られた固形のフェノール樹脂組
成物1000部に対してヘキサメチレンテトラミン11
0部を加え、粉砕し、粉末のフェノール樹脂組成物10
97部を得た。
Next, the xylene-modified phenolic resin 10
00 parts were charged into a melt kneader, heated to 150 ° C. and melted. 50 parts of silicone gel (αGEL manufactured by Seagel Co., Ltd., penetration 160) was added, and it was confirmed that the silicone gel was uniformly dispersed. The mixture was further kneaded for 30 minutes, removed from the pressure kneader, and solidified at room temperature. Phenol resin composition 1
030 parts were obtained. Further, hexamethylenetetramine 11 was added to 1000 parts of the obtained solid phenol resin composition.
0 parts, pulverized, and powdered phenolic resin composition 10
97 parts were obtained.

【0017】実施例2 実施例1と同様の反応装置にフェノール1000部、キ
シレン・ホルムアルデヒド樹脂を600部及びパラトル
エンスルホン酸2部を仕込後、徐々に昇温し温度が10
0℃に達してから120分間還流反応を行った。次いで
酢酸亜鉛10部、37%ホルムアルデヒドを270部を
仕込み120分間還流反応を行った後、実施例1と同様
に反応させ常温で固形のキシレン変性フェノール樹脂1
300部を得た。以下実施例1と同様にシリコーンゲル
の添加、混練、粉砕し、粉末のフェノール樹脂組成物1
097部を得た。
Example 2 A similar reactor as in Example 1 was charged with 1000 parts of phenol, 600 parts of xylene / formaldehyde resin and 2 parts of p-toluenesulfonic acid, and the temperature was gradually increased to 10 parts.
After reaching 0 ° C., a reflux reaction was performed for 120 minutes. Subsequently, 10 parts of zinc acetate and 270 parts of 37% formaldehyde were charged and a reflux reaction was carried out for 120 minutes. Thereafter, the reaction was carried out in the same manner as in Example 1 and solid xylene-modified phenol resin 1 at room temperature
300 parts were obtained. Thereafter, a silicone gel was added, kneaded, and pulverized in the same manner as in Example 1 to obtain a powdered phenol resin composition 1.
097 parts were obtained.

【0018】実施例3 実施例1と同様にして得られたキシレン変性フェノール
樹脂との重縮合物1000部に対して、シリコーンゲル
((株)シーゲル製αGEL、針入度160)の仕込量
を100部とした以外は、実施例1と同様に混練し、常
温で固形のフェノール樹脂組成物1030部を得た。以
下実施例1と同様に粉砕し、粉末のフェノール樹脂組成
物1097部を得た。
Example 3 The charge amount of silicone gel (αGEL manufactured by C-Gel Co., Ltd., penetration 160) with respect to 1000 parts of a polycondensate with a xylene-modified phenol resin obtained in the same manner as in Example 1 Kneading was carried out in the same manner as in Example 1 except that the amount was changed to 100 parts, to obtain 1030 parts of a phenol resin composition which was solid at ordinary temperature. Thereafter, pulverization was carried out in the same manner as in Example 1 to obtain 1097 parts of a powdery phenol resin composition.

【0019】比較例1 ノボラック型フェノール樹脂(住友デュレズ(株)製P
R−53195)1000部にヘキサメチレンテトラミ
ン110部を加え、粉砕し、粉末のフェノール樹脂組成
物1099部を得た。
Comparative Example 1 Novolak type phenolic resin (manufactured by Sumitomo Durez Co., Ltd.)
R-53195) To 1000 parts of 110 parts of hexamethylenetetramine was added and pulverized to obtain 1099 parts of a powdery phenol resin composition.

【0020】比較例2 加圧ニーダーにノボラック型フェノール樹脂(住友デュ
レズ(株)製PR−53195)1000部を仕込み、
150℃に昇温、溶融させた。シリコーンゲル((株)
シーゲル製αGEL、針入度160)50部を加え、シ
リコーンゲルが均一に分散するのを確認し、更に30分
の混練を行い、加圧ニーダーより取出して常温で固形の
フェノール樹脂組成物1030部を得た。更に得られた
固形のフェノール樹脂組成物1000部に対してヘキサ
メチレンテトラミン110部を加え、粉砕し、粉末のフ
ェノール樹脂組成物1097部を得た。
Comparative Example 2 A pressure kneader was charged with 1000 parts of a novolak type phenol resin (PR-53195, manufactured by Sumitomo Durez Co., Ltd.).
The temperature was raised to 150 ° C. and melted. Silicone gel (Co., Ltd.)
50 parts of αGEL made by Siegel, penetration 160) was added, and it was confirmed that the silicone gel was uniformly dispersed. The mixture was further kneaded for 30 minutes, taken out from the pressure kneader, and 1030 parts of a phenol resin composition which was solid at room temperature. I got Further, 110 parts of hexamethylenetetramine was added to 1000 parts of the obtained solid phenol resin composition, and pulverized to obtain 1097 parts of a powdered phenol resin composition.

【0021】比較例3 撹拌装置、還流冷却器及び温度計を備えた反応装置にフ
ェノール1000部、キシレン・ホルムアルデヒド樹脂
900部及び酢酸亜鉛10部、パラトルエンスルホン酸
2部を仕込後、徐々に昇温し温度が100℃に達してか
ら240分間還流反応を行った。内温が110℃に達す
るまで常圧脱水を行い、次いで真空脱水を行い、系内の
温度が160℃まで昇温したところで、内容物を反応器
より取出して常温で固形のキシレン変性フェノール樹脂
1700部を得た。更にこのキシレン変性フェノール樹
脂1000部に対してヘキサメチレンテトラミン110
部を加え、粉砕し、粉末のフェノール樹脂組成物109
7部を得た。
Comparative Example 3 1000 parts of phenol, 900 parts of xylene / formaldehyde resin, 10 parts of zinc acetate and 2 parts of paratoluenesulfonic acid were charged into a reactor equipped with a stirrer, a reflux condenser and a thermometer, and then gradually raised. After the temperature reached 100 ° C., a reflux reaction was performed for 240 minutes. Dehydration under normal pressure was performed until the internal temperature reached 110 ° C., and then vacuum dehydration was performed. When the temperature in the system was raised to 160 ° C., the contents were taken out of the reactor and solid xylene-modified phenol resin 1700 at normal temperature was obtained. Got a part. Further, hexamethylenetetramine 110 was added to 1000 parts of the xylene-modified phenol resin.
Parts, and pulverized to obtain a powdered phenol resin composition 109.
7 parts were obtained.

【0022】実施例1〜3及び比較例1〜3で得られた
6種類の粉末のフェノール樹脂組成物について、以下に
示す配合割合で仕込み混合した。 配合物 配合量(重量%) フェノール樹脂組成物 10 アラミド繊維 5 炭酸カルシウム 45硫酸バリウム 40
Obtained in Examples 1-3 and Comparative Examples 1-3
For the six types of powdered phenolic resin compositions,
The mixing was performed at the indicated mixing ratio. Compounding amount (% by weight) Phenolic resin composition 10 aramid fiber 5 calcium carbonate 45Barium sulfate 40

【0023】この配合物を温度160℃、圧力200k
g/cm2 で10分間成形し、150×150×20m
mの成形品を得た。また、得られた成形品を180℃で
8時間焼成して、成形品のロックウェル硬度、及び動電
形振動試験装置(IMV型,VS−2000A−10
0)による振動加速度を測定した。更に、常態曲げ強
度、及び熱履歴後の曲げ強度を測定した。これらの結果
を表1に示す。
[0023] This composition is heated at a temperature of 160 ° C and a pressure of 200k.
g / cm 2 for 10 minutes, 150 × 150 × 20m
m was obtained. The obtained molded product was fired at 180 ° C. for 8 hours, and the Rockwell hardness of the molded product and an electrokinetic vibration test device (IMV type, VS-2000A-10) were used.
The vibration acceleration according to 0) was measured. Further, the normal bending strength and the bending strength after heat history were measured. Table 1 shows the results.

【0024】 表1 評価結果 実施例 比較例 1 2 3 1 2 3 ロックウェル硬度(HRS) 76 74 69 84 76 83 振動加速度 (G) 28 27 23 46 28 45 常態曲げ強度 (MPa) 37 37 38 37 38 36 熱履歴後の曲げ強度(MPa) 350℃×2時間処理後 28 25 29 16 20 27 350℃×8時間処理後 22 17 21 8 12 22 Table 1 Example of evaluation results Comparative Example 1 2 3 1 2 3 Rockwell hardness (HRS) 76 74 69 84 76 83 Vibration acceleration (G) 28 27 23 46 28 45 Normal bending strength (MPa) 37 37 38 37 38 36 Flexural strength after heat history (MPa) After treatment at 350 ° C x 2 hours 28 25 29 16 20 27 After treatment at 350 ° C x 8 hours 22 17 21 8 12 22

【0025】実施例1、2、3は、ロックウェル硬度が
低く、柔軟性に優れていることがわかる。また、振動加
速度が小さい。これは固有振動域における共振が小さい
事を示しており、振動吸収性に優れることが明らかであ
る。また、常態曲げ強度に対する熱履歴後曲げ強度の低
下が小さく、耐熱性に優れることがわかる。一方、比較
例1は硬度が高く、振動加速度が高いことから、柔軟
性、振動吸収性に劣る。また、常態曲げ強度に対する熱
履歴後曲げ強度の低下が大きく、耐熱性に劣る。比較例
2については、硬度が低く、振動加速度が低いことか
ら、柔軟性、振動吸収性に優れる。常態曲げ強度に対す
る熱履歴後曲げ強度は、比較例1ほどではないものの、
強度低下が大きく、耐熱性に劣る。また、比較例3は、
常態曲げ強度に対する熱履歴後曲げ強度の低下が小さ
く、耐熱性に優れる。一方で、硬度が高く、振動加速度
が高いことから、柔軟性、振動吸収性に劣る。
Examples 1, 2, and 3 show that Rockwell hardness is low and flexibility is excellent. Also, the vibration acceleration is small. This indicates that resonance in the natural vibration region is small, and it is clear that the vibration absorption is excellent. Further, it can be seen that the decrease in the bending strength after the thermal history with respect to the normal bending strength is small and the heat resistance is excellent. On the other hand, Comparative Example 1 is inferior in flexibility and vibration absorption because of high hardness and high vibration acceleration. In addition, the bending strength after thermal hysteresis is greatly reduced with respect to the normal bending strength, and the heat resistance is poor. Comparative Example 2 is excellent in flexibility and vibration absorption because the hardness is low and the vibration acceleration is low. Although the bending strength after thermal history with respect to the normal bending strength is not as high as that of Comparative Example 1,
Significant decrease in strength and poor heat resistance. Comparative Example 3
The decrease in bending strength after thermal history with respect to normal bending strength is small, and the heat resistance is excellent. On the other hand, since the hardness is high and the vibration acceleration is high, flexibility and vibration absorption are poor.

【0026】[0026]

【発明の効果】以上の実施例からも明らかなように、本
発明の方法により得られたフェノール樹脂組成物は、柔
軟性、振動吸収性、耐熱性に優れる。従って、本発明に
よるフェノール樹脂組成物を用いることにより、靱性に
優れた成形品や、鳴き特性、振動吸収性、耐摩耗性に優
れた摩擦材等を得ることを可能にする。
As is clear from the above examples, the phenolic resin composition obtained by the method of the present invention is excellent in flexibility, vibration absorption and heat resistance. Therefore, by using the phenolic resin composition according to the present invention, it is possible to obtain a molded article excellent in toughness, a friction material excellent in squealing characteristics, vibration absorption, and wear resistance.

───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.7 識別記号 FI テーマコート゛(参考) (C08L 65/00 83:04) ──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. 7 Identification symbol FI theme coat ゛ (Reference) (C08L 65/00 83:04)

Claims (4)

【特許請求の範囲】[Claims] 【請求項1】 針入度(JIS K 2530−1976
−50g荷重)が10〜300である付加反応型シリコ
ーンをベースとしたシリコーンゲル、及びフェノール類
と芳香族炭化水素とを重縮合して得られた芳香族炭化水
素変性フェノール樹脂を必須成分として含有することを
特徴とするフェノール樹脂組成物。
1. Penetration (JIS K 2530-1976)
As an essential component, a silicone gel based on an addition-reaction type silicone having a weight of -50 g) of 10 to 300, and an aromatic hydrocarbon-modified phenol resin obtained by polycondensing phenols and aromatic hydrocarbons are contained. A phenolic resin composition characterized in that:
【請求項2】 針入度(JIS K 2530−1976
−50g荷重)が10〜300である付加反応型シリコ
ーンをベースとしたシリコーンゲル、及びフェノール類
と芳香族炭化水素とアルデヒド類とを重縮合して得られ
た芳香族炭化水素変性フェノール樹脂を必須成分として
含有することを特徴とする請求項1記載のフェノール樹
脂組成物。
2. Penetration (JIS K 2530-1976)
A silicone gel based on an addition-reaction type silicone having a weight of -50 g) of 10 to 300, and an aromatic hydrocarbon-modified phenol resin obtained by polycondensing phenols, aromatic hydrocarbons and aldehydes are essential. The phenolic resin composition according to claim 1, which is contained as a component.
【請求項3】 芳香族炭化水素がベンゼン、トルエン、
キシレン、メシチレンから選ばれた1種以上である請求
項1または2記載のフェノール樹脂組成物。
3. The aromatic hydrocarbon is benzene, toluene,
3. The phenolic resin composition according to claim 1, which is at least one selected from xylene and mesitylene.
【請求項4】 シリコーンゲルを芳香族炭化水素変性フ
ェノール樹脂に加圧式混練機を用いて混練することを特
徴とする請求項1、2または3記載のフェノール樹脂組
成物の製造方法。
4. The method for producing a phenolic resin composition according to claim 1, wherein the silicone gel is kneaded with the aromatic hydrocarbon-modified phenolic resin using a pressure kneader.
JP22140299A 1999-08-04 1999-08-04 Phenolic resin composition and its preparation Pending JP2001049079A (en)

Priority Applications (1)

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Publications (1)

Publication Number Publication Date
JP2001049079A true JP2001049079A (en) 2001-02-20

Family

ID=16766199

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Country Status (1)

Country Link
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111534043A (en) * 2020-05-29 2020-08-14 安徽百维新材料有限公司 Thermal insulation board with good thermal stability
CN111574809A (en) * 2020-05-29 2020-08-25 安徽百维新材料有限公司 High-temperature-resistant modified phenolic resin thermal insulation material

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111534043A (en) * 2020-05-29 2020-08-14 安徽百维新材料有限公司 Thermal insulation board with good thermal stability
CN111574809A (en) * 2020-05-29 2020-08-25 安徽百维新材料有限公司 High-temperature-resistant modified phenolic resin thermal insulation material

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