JPH10112453A - Substrate processor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To treat both sides of a substrate properly without occupying much space in a vertical direction by providing a rotary motor provided with a rotator having a hollow part whose central part is opened and a stator having a hollow part whose central part is opened concentrically with the rotator and a substrate holding means which holds a substrate to a rotator. SOLUTION: A hollow part 2a of a rotator in formed in a central part of a rotary motor 1 provided with a ring-like rotator 2 with the hollow part 2a in which an opening is shaped in a central part thereof and a ring-like stator 3 which is provided concentrically with the rotator 2 and has a hollow part in which an opening is shaped in a central part thereof. The rotator 2 is provided with three or more substrate holding members 10 and an outer circumferential end part of a substrate W is held by the substrate holding member at three or more places. Both sides of the substrate W are cleaned by rotating the held substrate W around a rotation center J and jetting and supplying cleaning solution to both sides of the susstrate W from nozzles 21, 22.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate processing apparatus for rotating a substrate and performing a predetermined process such as a cleaning process or a resist coating process on the substrate.

[0002]

2. Description of the Related Art In a conventional substrate processing apparatus of this type, generally, a motor is operatively connected to a rotating shaft that is vertically rotatable and provided with a substrate holding mechanism at an upper end of the rotating shaft. It is configured. The substrate holding mechanism is provided with a vacuum suction hole in the spin base to vacuum suction the lower surface (usually the back surface) of the substrate, or provided with three or more substrate holding pins near the peripheral end of the spin base. There is one that holds the outer peripheral end of the substrate at three or more places.

In this conventional apparatus, a substrate is held by a substrate holding mechanism, and the rotational force of a motor is transmitted to a rotating shaft, whereby the substrate is rotated together with the rotating shaft and the substrate holding mechanism around the central axis of the rotating shaft. You. Then, a predetermined process such as a cleaning process or a resist coating process is performed on the substrate.

[0004]

However, the prior art having such a structure has the following problems. In the configuration of the conventional apparatus, there is a problem that a motor, a rotating shaft, and the like are arranged on the lower surface side of the substrate, and a space is taken in a vertical direction. Also, a member on the lower surface side of the substrate such as a motor becomes an obstacle, and it is difficult or impossible to perform processing on the lower surface of the substrate. That is, the conventional apparatus has a problem that processing can be performed on one side of the substrate, and processing on both sides cannot be performed or is difficult.

[0005] The present invention has been made in view of such circumstances, and has as its object to provide a substrate processing apparatus which does not take up space in the vertical direction and which can suitably perform processing on both surfaces of a substrate. I do.

[0006]

The present invention has the following configuration in order to achieve the above object. That is, an invention according to claim 1 is a substrate processing apparatus for performing a predetermined process on a substrate by rotating the substrate, wherein the rotor has a hollow portion having an open central portion, and the rotor is concentric with the rotor. And a rotating motor provided with a stator having a hollow portion with an open central portion, and substrate holding means provided on the rotor for holding a substrate.

According to a second aspect of the present invention, in the substrate processing apparatus of the first aspect, the rotor is supported by a static pressure gas bearing with respect to a stator of the rotary motor. Things.

According to a third aspect of the present invention, in the substrate processing apparatus according to the first or second aspect, the size of the hollow portion formed at the center of the rotary motor is equal to the size of the substrate holding means. The rotating motor is characterized in that the rotating motor is configured to be equal to or larger than a circle drawn by the end of the substrate farthest from the rotation center of the substrate when the held substrate is rotated.

[0009]

The operation of the present invention is as follows. According to the first aspect of the present invention, the substrate is held by the substrate holding means provided on the rotor of the rotary motor, and the rotor is rotated with respect to the stator provided concentrically with the rotor. Thus, the substrate is rotated together with the substrate holding means. And
A predetermined process is performed on this substrate.

[0010] The rotor of the rotary motor has a hollow portion with an open central portion, and the stator also has a hollow portion with an open central portion. Thus, for example, if the rotor is arranged inside the stator to form a rotation motor, a hollow portion (of the rotor) is formed in the center of the rotation motor, while the stator is arranged inside the rotor. When the rotary motor is configured as described above, a hollow portion (of the stator) is formed at the center of the rotary motor. That is, the rotary motor has a hollow portion with an open central portion.

The substrate holding means is provided on a rotor of a rotary motor having a hollow portion and holds the substrate.
A motor and the like are arranged on the lower surface side of the substrate unlike the conventional device, and the space is not taken up in the vertical direction.

Therefore, for example, when the substrate is held above the rotary motor, there is no obstacle such as a motor on the lower surface side (rotary motor side) of the substrate held by the substrate holding means. Since a hollow portion is formed, the surface can be processed from the hollow portion of the rotary motor. Of course, there is no obstacle on the upper surface side (opposite to the rotary motor) of the substrate held by the substrate holding means, so that the surface can be processed freely. That is, according to the first aspect of the present invention, it is possible to preferably perform processing on both surfaces of the substrate.
Also, when holding the substrate under the rotating motor,
Similarly, it is possible to suitably perform processing on both surfaces of the substrate.

According to the second aspect of the present invention, since the bearing of the rotor with respect to the stator is a static pressure gas bearing, the frictional resistance with respect to the stator during rotation of the rotor can be reduced, and the rotor can be rotated at high speed. Can be done. Also,
When the processing on the substrate is performed using a chemical, there is a concern that the chemical flows into the gap between the stator and the rotor, and the stator and the rotor are corroded by the chemical. If the bearing is a static pressure gas bearing, the gas supplied to the gap between the stator and the rotor will blow out from the gap,
It is possible to prevent the chemical solution from flowing into the gap.

According to a third aspect of the present invention, the size of the hollow portion formed at the center of the rotary motor is the farthest from the center of rotation of the substrate when the substrate held by the substrate holding means is rotated. The rotary motor is configured so that the edge of the substrate is equal to or larger than the circle drawn. The substrate held by the substrate holding means is rotated within a rotation circle having a radius between a rotation center of the substrate and an end of the substrate farthest from the rotation center. Therefore, by making the size of the hollow portion formed at the center of the rotating motor equal to or larger than the rotating circle, when processing is performed on the surface of the substrate on the rotating motor side, the entire surface thereof is treated. Process. Therefore, for example, brush cleaning can be performed on both surfaces of the substrate.

If the hollow portion of the rotary motor is larger than the rotary circle, the substrate can be held in the hollow portion of the rotary motor. For example, if the rotor is arranged inside the stator and the substrate holding means is provided from the inner peripheral surface of the hollow part of the rotor toward the center of the hollow part of the rotor, the inside of the hollow part of the rotary motor (rotor) is provided. Can hold the substrate. When the substrate is held in the hollow portion of the rotary motor in this manner, the height of the substrate processing apparatus can be reduced as compared with the case where the substrate is held above or below the rotary motor. Even when the substrate is held in the hollow portion of the rotary motor, the upper and lower sides of the substrate are opened, so that there is no problem in performing the processing on both surfaces of the substrate.

[0016]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a longitudinal sectional view showing a configuration of a substrate processing apparatus according to one embodiment of the present invention, and FIG. 2 is a plan view thereof. In this embodiment, a substrate cleaning apparatus for performing a cleaning process on a substrate (semiconductor wafer) is taken as an example.

Reference numeral 1 in the drawing denotes a rotation motor for rotating the held substrate W. This rotary motor 1
A ring-shaped rotor 2 having a hollow portion 2a having an open central portion, and a hollow portion having a central portion opened outside the rotor 2 concentrically with the rotor 2 (the hollow portion of the rotor 2) A ring-shaped stator 3 having a portion 2a and a hollow portion including the rotor 2) is fixedly provided. A ring-shaped convex portion 2b is formed on the outer peripheral surface of the rotor 2, while a ring-shaped concave portion 3a is formed on the inner peripheral surface of the stator 3, and the convex portion 2 b of the rotor 2 It is fitted in the recess 3a. A permanent magnet 4 is provided inside the protrusion 2 b of the rotor 2 in a ring shape. The stator 3 includes a coil 5 having the permanent magnet 4
And is provided in a ring shape so as to face the.

The permanent magnet 4 and the coil 5 are, for example, as shown in FIG.
It is configured as shown in FIG. The permanent magnet 4 is provided in a ring shape such that the polarity is inverted at predetermined angles (90 ° in the drawing) around the rotation center J. This permanent magnet 4
, A plurality of coils 5 are arranged in a ring shape. Each coil 5 is configured to be able to reverse the polarity by individually switching the direction in which current flows. Each coil 5 is divided into a plurality (four in the figure) of coil blocks 5a at predetermined angles (90 ° in the figure) about the rotation center J, and
The control is performed in units of the coil block 5a. The coil 5 constituting each coil block 5a has the same polarity by making the direction of current flow the same, and the adjacent coil blocks 5a have opposite polarities. Then, for example, as shown in FIG. 3B, by sequentially switching the polarity of each coil 5 so that the coil block 5a moves clockwise,
The permanent magnet 4 is rotated clockwise. Conversely, by sequentially switching the polarity of each coil 5 so that the coil block 5a moves counterclockwise, the permanent magnet 4 is rotated counterclockwise. By controlling each coil 5 in this manner, the rotor 2 can be rotated around the rotation center J with respect to the stator 3.

As described above, the ring-shaped rotor 2 having a hollow portion having an opening at the center and the hollow portion provided concentrically with the rotor 2 and having an opening at the center are provided. When the rotary motor 1 is configured to include the ring-shaped stator 3, a hollow portion (the hollow portion 2 a of the rotor) is formed in the center of the rotary motor 1.

The stator 3 is provided with a gas buffer 6 connected to a supply source (not shown) of a gas such as air or an inert gas (nitrogen gas or the like). A gas is supplied to a gap 8 between the rotor 2 and the stator 3 via a supply path 7, and the rotor 2 is supported on the stator 3 by a static pressure gas bearing.

The bearing of the rotor 2 with respect to the stator 3 may be constituted by a dynamic pressure bearing using a bearing or the like. In the case of a dynamic pressure bearing, however, the bearing of the rotor 2 with respect to the stator 3 is compared with a hydrostatic gas bearing. Since the frictional resistance during rotation increases, it is difficult to realize high-speed rotation. Also, the substrate W
When a chemical solution is used for the treatment of the hydrodynamic bearing, the chemical solution may flow into the gap 8 between the stator 3 and the rotor 2. Must be applied, and the top of the production will be overturned. On the other hand, in the case of the static pressure gas bearing, members such as bearings are not necessary, and the gas supplied to the gap 8 blows out from the gap 8 to the outside. Inflow can also be prevented. Therefore, in the case of rotating at a high speed or in the case of using a chemical solution for processing the substrate W,
It is preferable that the bearing of the rotor 2 with respect to the stator 3 be constituted by a static pressure gas bearing rather than a dynamic pressure bearing.

Further, a Hall element 9 is provided in the stator 3 so as to face the lower surface of the permanent magnet 4. Since the Hall element 9 can determine the strength and polarity of the magnetic force lines, the permanent magnet 4 can be determined based on the output voltage from the Hall element 9.
Can be detected. Therefore, by using the Hall element 9 as a position sensor, the rotating rotor 2 can be stopped at a predetermined stop position. If the Hall elements 9 are provided at a plurality of positions, the rotating rotor 2 can be stopped at a plurality of stop positions.

The rotor 2 is provided with three or more (three in the figure) substrate holding members 10. The outer peripheral edge of the substrate W is held at three or more positions by these substrate holding members 10, and the rotation of the rotor 2 with respect to the stator 3 causes the substrate W
Is rotated around the rotation center J.

The substrate holding member 10 is configured to take a state of holding the substrate W and a state of releasing the holding. This switching can be realized by, for example, the following configuration.

FIGS. 4 and 5 are views showing the structure of an example of a mechanism for holding and releasing the substrate by the substrate holding member.

Each of the substrate holding members 10 has a base end connected to a tip end of the swing arm 11. By swinging the swing arm 11 between the solid line and the two-dot chain line shown in FIG. 4A, the state of holding the substrate W and the state of canceling the holding are switched. That is, in the state of the solid line in the figure, the outer peripheral end of the substrate W is held at three places by the constricted portion 10a at the distal end of each substrate holding member 10. On the other hand, in the state of the two-dot chain line in the figure, each substrate holding member 10 separates from the substrate W and releases the holding of the substrate W.

The swing of the swing arm 11 is realized by the following configuration. As shown in FIGS. 4A and 5, each swing arm 11 has a cylindrical member 1 at its base end.
2 are connected. Each tubular member 12 is rotatably supported by the rotor 2. A rotor 13 is inserted into a hollow portion of each tubular member 12 so as to be able to move up and down. At the upper end of each rotor 13 is provided a stopper 13a for restricting the lowering. The lower end of each rotor 13 is fixed to one ring-shaped member 14 so that each rotor 13 is moved up and down in synchronization with the elevating and lowering of the ring-shaped member 14. Below the ring-shaped member 14, a tip 15a of the swinging member 15 is arranged. The distal end of the rod 16a of the air cylinder 16 is connected to the proximal end 15b of the swing member 15, and the proximal end 15b of the swing member 15
Is raised and lowered, and the tip 15a of the swinging member 15 is lowered and raised. When the distal end 15a of the swinging member 15 is lowered, the rotor 13 is lowered with respect to each cylindrical member 12 by the weight of the ring-shaped member 14 and each rotor 13 as shown by a solid line in FIG. Have been. On the other hand, the swing member 15
Is raised, the ring-shaped member 14 is pushed up by the distal end 15a of the swinging member 15, and each rotor 13 is raised in synchronization with each cylindrical member 12.

Each rotor 13 is provided with a groove cam 13b as shown in FIG. As shown in FIG.
Each cylindrical member 12 has a pin 12a protruding inward,
The pin 12a is engaged with the groove cam 13b of the rotor 13. The rod 16a of the air cylinder 16 is contracted,
In a state where each rotor 13 is lowered with respect to each cylindrical member 12, each substrate holding member 10 holds the outer peripheral end of the substrate W at three places as shown by solid lines in FIGS. I have.
When the rod 16a of the air cylinder 16 is extended and each rotor 13 is raised with respect to each cylindrical member 12, the pin 12a of each cylindrical member 12 traces the groove cam 13b of each rotor 13. Each of the cylindrical members 12 is rotated about a vertical axis with respect to each of the rotors 13, whereby each of the swing arms 11 is swung by the rotation, and as shown by a two-dot chain line in FIG. The hold is released. In addition, since each rotor 13 is fixed to the ring-shaped member 14, only the elevating operation is performed without rotating.

FIGS. 4 and 5 show each substrate holding member 10.
FIG. 3 shows an example of a mechanism for holding and releasing the substrate W by the substrate holding member 10 in a configuration other than the above.
And release thereof. Further, the configuration of the substrate holding member 10 is not limited to that of the embodiment.

The size of the hollow portion (the hollow portion 2a of the rotor 2) formed at the center of the rotary motor 1 is such that when the substrate W held by each substrate holding member 10 is rotated. Is configured to be equal to or larger than the circle drawn by the end of the substrate W farthest from the rotation center J of the substrate W. The held substrate W is the rotation center J of the substrate W.
And the end of the substrate W farthest from the rotation center J. For example, FIG.
As shown in (a), a circular substrate W such as a semiconductor wafer
Is rotated around the center CJ of the substrate W, the rotation circle becomes the outer periphery of the circular substrate W. As shown in FIG. 6B, when a rectangular substrate W such as a glass substrate for a liquid crystal display is rotated around the center CJ of the substrate W, the rotation circle becomes a circle indicated by a chain line in the figure. In this embodiment, the rotor 2 and the stator 3 are configured such that the size of the hollow portion formed at the center of the rotary motor 1 is equal to or larger than the rotating circle.

The surface of the rotor 2 (including the surface of the convex portion 2b), the surface of the stator 3 (including the surface of the concave portion 3a),
The surface and the like of the substrate holding member 10 are coated with a chemical resistant material such as silicon carbide (SiC) or a fluororesin, and are configured to prevent corrosion by a chemical solution used in a cleaning process on the substrate W. doing.

Nozzles 21 and 22 are provided above and below the substrate W held by each substrate holding member 10 to supply a cleaning liquid such as a chemical solution or pure water toward the upper and lower surfaces of the substrate W. .

The nozzle 21 above the substrate W is moved by a moving mechanism (not shown) to a processing position above the center (rotation center J) of the upper surface (usually the front surface) of the substrate W (a position indicated by a solid line in FIG. It is configured to be movable between a retracted position (a position indicated by a two-dot chain line in the figure) on the outer periphery of W.

The nozzle 22 below the substrate W is fixedly installed so as to spray and supply the cleaning liquid toward the center of the lower surface (usually, the rear surface) of the substrate W.

Next, the operation of the apparatus having the above configuration will be described.
When the outer peripheral edge of the substrate W before processing is held by each substrate holding member 10, the nozzle 21 is moved from the retracted position to the processing position. Then, gas is supplied to the gap 8 between the stator 3 and the rotor 2, the rotor 2 is rotated with respect to the stator 3, and the held substrate W is rotated around the rotation center J,
The cleaning liquid is jetted and supplied to both surfaces of the substrate W from the nozzles 21 and 22 to perform the cleaning process on both surfaces of the substrate W. In an apparatus for cleaning a chemical solution, first, the nozzles 21 and 22 are used.
Then, a chemical solution is sprayed and supplied to both surfaces of the substrate W to perform chemical cleaning, and then, pure water is sprayed and supplied to both surfaces of the substrate W from the nozzles 21 and 22 to perform rinsing cleaning such as washing away the chemical solution. In an apparatus that simply performs pure water cleaning, pure water is jetted and supplied to both surfaces of the substrate W from the nozzles 21 and 22 to perform substrate cleaning with pure water.

When a predetermined cleaning time has elapsed, the nozzle 2
The supply of the cleaning liquid from the nozzles 1 and 22 is stopped, the rotation of the substrate W is continued, the cleaning liquid adhering to the substrate W is shaken off, and the substrate W is dried.

When the substrate W is dried after a predetermined drying time has elapsed since the supply of the cleaning liquid from the nozzles 21 and 22 is stopped, the rotation of the rotor 2 with respect to the stator 3 is stopped, and the rotation of the substrate W is stopped. Stop. Then, the nozzle 21 is moved from the processing position to the retreat position, and each substrate holding member 10 is moved.
Is released, and the processed substrate W is carried out.

According to the above-described apparatus, since there is no obstacle above the held substrate W, the upper surface (usually the front surface) of the substrate W can be cleaned without any trouble. The hollow portion (the hollow portion 2 of the rotor 2)
a) is formed, and since the rotation axis and the spin base of the conventional device are not provided below the substrate W, as shown in FIG. Can be cleaned without any trouble.

Further, as in the above-described embodiment, the size of the hollow portion of the rotary motor 1 is adjusted by the rotation circle of the substrate W (FIG. 6).
The same or larger than that of the substrate W
Can be easily applied to the entire lower surface.

For example, in cleaning using a brush, a cleaning liquid is usually supplied to the surface of the substrate W while rotating the substrate W,
The brush (the brush itself is also rotated) is reciprocated in the radial direction of the substrate W between the rotation center and the outer periphery of the substrate W while the brush bristles abut or slightly float on the surface of the rotating substrate W. Then, the entire surface of the substrate W is cleaned with a brush. According to the above embodiment, such a brush cleaning can be performed on the lower surface of the substrate W as well as the upper surface of the substrate W without any trouble.

Further, while the substrate W is being rotated, the ultrasonic nozzle is reciprocated in the radial direction of the substrate W between the rotation center and the outer periphery of the substrate W, and the cleaning liquid to which the ultrasonic wave is added is applied to the rotating substrate W. In the case where the ultrasonic cleaning is performed on the entire surface of the substrate W by spraying, the ultrasonic cleaning can be performed on both surfaces of the substrate W according to the above-described apparatus.

Note that, as shown in FIG.
The size of the hollow portion is determined by the rotation circle of the substrate W (see FIG. 6).
It may be smaller. In such a case, as shown by the solid line in FIG. 7, the arrangement position of the nozzle 22 is adjusted so that the cleaning liquid jetted and supplied from the nozzle 22 does not interfere with the rotor 2, or as shown in FIG. As shown by the dotted line,
The nozzle 22 may be arranged so as to jet and supply the cleaning liquid in the vertical direction toward the rotation center on the lower surface of the substrate W.

The rotary motor 1 of the above embodiment has the stator 3 arranged concentrically outside the rotor 2. Conversely, the rotor 2 is mounted outside the stator 3. The rotary motor 1 may be configured by being arranged in a core shape. However, in a configuration in which the rotor 2 is disposed outside the stator 3,
Generally, the rotor 2 is larger than the stator 3,
A sufficient torque for rotating the rotor 2 cannot be obtained, so that it is difficult to rotate the rotor 2 (substrate W) at high speed. Therefore, it is preferable that the rotary motor 1 is configured by arranging the stator 3 concentrically outside the rotor 2 as in the above embodiment.

Further, in the above embodiment, the substrate W is held above the rotary motor 1, but as shown in FIG. 8, the substrate W is held below the rotary motor 1. Is also good.

Furthermore, since the rotor 2 and the stator 3 of the rotary motor 1 only need to have a hollow portion having an open central portion, the rotor 2 and the stator 3 may be cylindrical. When the rotary motor 1 is composed of the cylindrical rotor 2 and the stator 3, the cleaning liquid is injected and supplied to the surface of the substrate W on the rotary motor 1 side through a hollow portion formed at the center of the rotary motor 1. It becomes difficult to perform processing such as cleaning processing. Therefore, as in the above embodiment, it is preferable that the rotor 2 and the stator 3 have a thin ring shape. Also,
As described above, when the rotating motor 1 is configured by the thin ring-shaped rotor 2 and the stator 3, the rotating motor 1 is reduced in thickness. If a substrate processing apparatus is configured using such a thin rotating motor 1, The height of the device can be reduced, and the degree of freedom in the height direction of the device increases, for example, the devices can be easily stacked in the vertical direction.

Further, as shown in FIG. 9, the rotor 2 is disposed inside the stator 3 to constitute the rotary motor 1, and the size of the hollow portion of the rotary motor 1 is determined by the rotation circle ( If each substrate holding member 10 is provided on the inner peripheral surface of the rotor 2, the substrate W can be held in the hollow portion of the rotary motor 1 (the hollow portion 2 a of the rotor 2). Becomes possible. Even in such a configuration, the upper and lower sides of the held substrate W are open, so that the upper and lower surfaces of the held substrate W can be processed. The height of the substrate processing apparatus thus configured can be further reduced as compared with a substrate processing apparatus configured to hold the substrate W above or below the rotary motor 1.

In the above embodiment, the case where the substrate W is subjected to the cleaning process has been described as an example. However, for example, a resist solution is discharged onto the surface of the substrate W while the substrate W is being rotated, so-called spin coating is performed. A resist coating process for forming a resist film on the surface of the substrate W by the method is performed on the surface of the substrate W, and pure water or the like is supplied to the back surface of the substrate W so that the mist of the resist liquid flows around the back surface of the substrate W A so-called back rinsing process for preventing the substrate W from adhering to the back surface of the substrate W is performed.
The present invention can also be realized with a simple configuration when applied to the back surface of the device.

Further, the present invention can be applied to an apparatus for performing other substrate processing.

[0049]

As is apparent from the above description, according to the first aspect of the present invention, a rotating motor for rotating a substrate is provided with a rotor having a hollow portion having an opening at a central portion. Since the stator and the stator are provided concentrically, a hollow portion is formed at the center of the rotary motor. In addition, since the substrate holding means for holding the substrate is provided on the rotor of the rotary motor and configured to hold the substrate, a motor or the like is arranged on the lower surface side of the substrate as in the conventional device, so that the space is vertically set. I do not take it. Also, since there is no obstacle on the surface of the held substrate opposite to the rotation motor side, the processing can be performed freely, and the surface of the held substrate on the rotation motor side can be processed by the motor. The processing can be performed from the hollow portion of the rotary motor without any obstacle such as the above, and the processing can be suitably performed on both surfaces of the substrate.

According to the second aspect of the present invention, since the bearing of the rotor with respect to the stator is constituted by the hydrostatic gas bearing, the rotation of the rotor with respect to the stator can be reduced rather than by the dynamic pressure bearing such as a bearing. Friction resistance can be reduced,
The rotor (substrate) can be rotated at a higher speed.
In addition, when a chemical is used in the processing for the substrate, it is possible to prevent the chemical from flowing into the gap between the stator and the rotor.

According to the third aspect of the present invention, the size of the hollow portion formed at the center of the rotary motor is the smallest from the center of rotation of the substrate when the substrate held by the substrate holding means is rotated. Since the rotary motor is configured so as to be equal to or larger than the circle drawn by the edge of the distant substrate, it is possible to suitably perform processing on both surfaces of the held substrate. Further, the substrate can be held in the hollow portion of the rotor, and the height of the substrate processing apparatus can be reduced as compared with the case where the substrate is held above or below the rotary motor.

[Brief description of the drawings]

FIG. 1 is a longitudinal sectional view illustrating a configuration of a substrate processing apparatus according to an embodiment of the present invention.

FIG. 2 is a plan view of the embodiment device of FIG. 1;

FIG. 3 is a diagram illustrating a configuration of an example of a permanent magnet provided in a rotor and a coil provided in a stator;

FIG. 4 is a diagram showing a configuration of an example of a mechanism for holding and releasing a substrate by a substrate holding member.

FIG. 5 is a diagram showing a configuration of an example of a mechanism for holding and releasing a substrate by a substrate holding member.

FIG. 6 is a diagram for explaining a rotating circle when a substrate is rotated.

FIG. 7 is a diagram showing a configuration of a modification in which the hollow portion of the rotary motor is reduced.

FIG. 8 is a diagram showing a configuration of a modification in which a substrate is held below a rotary motor.

FIG. 9 is a view showing a configuration of a modification in which a substrate is held in a hollow portion of a rotary motor.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Rotary motor 2 Rotor 3 Stator 7 Gas supply path 8 Gap between rotor and stator 10 Substrate holding members 21 and 22 Cleaning liquid supply nozzle W Substrate

Claims (3)

[Claims] 1. A substrate processing apparatus for rotating a substrate to perform a predetermined process on the substrate, comprising: a rotor having a hollow portion having an open central portion; A substrate processing apparatus, comprising: a rotation motor including a stator having a hollow portion with an opening; and substrate holding means provided on the rotor and holding a substrate. 2. The substrate processing apparatus according to claim 1, wherein the rotor is supported by a static pressure gas bearing with respect to a stator of the rotary motor. 3. The substrate processing apparatus according to claim 1, wherein the size of the hollow formed in the center of the rotary motor is such that the size of the hollow held in the substrate holding means is increased. A substrate processing apparatus, wherein the rotation motor is configured to be equal to or larger than a circle drawn by an end of the substrate farthest from the rotation center of the substrate.